CN114168507A - CAN compatible circuit - Google Patents
CAN compatible circuit Download PDFInfo
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- CN114168507A CN114168507A CN202010945034.3A CN202010945034A CN114168507A CN 114168507 A CN114168507 A CN 114168507A CN 202010945034 A CN202010945034 A CN 202010945034A CN 114168507 A CN114168507 A CN 114168507A
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- 238000003466 welding Methods 0.000 claims abstract description 7
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000033772 system development Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000002618 waking effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
The present invention provides a CAN-compatible circuit, comprising: a chip pad having a plurality of pins; a first type of resistor comprising N1At least one resistor in the first type of resistor is connected to a first voltage; a second type of resistance comprising N2At least one resistor in the second type of resistor is connected to a second voltage; n resistance pads connected to one end of each of the first and second resistors, respectively, wherein the CAN compatible circuit is applied to the first communication mode, so that the chip pad is welded with the first CAN chip and connected to N pins of the first CAN chip1The pins are welded with the resistance welding discs connected to the first type of resistors; when the CAN compatible circuit is applied to the second communication mode, the chip bonding pad is welded with the second CAN chip and is connected with N in a plurality of pins of the second CAN chip2Each pin is soldered to a resistor pad connected to a resistor of the second type. The circuit provided by the invention is compatible with different CAN communication types.
Description
Technical Field
The invention relates to circuit control and circuit design, in particular to a CAN compatible circuit.
Background
At present, an Electric Power Steering (EPS) controller of an automobile generally selects an HS (high speed) CAN or a CAN wakeup (having a function of waking up a circuit board controller through a CAN chip) communication type for circuit diagram and circuit board design according to specific application requirements.
The existing Controller only supports a CAN (Controller Area Network) communication type, a schematic diagram and a circuit board need to be designed respectively according to different design requirements, circuit signal integrity needs to be evaluated again after the circuit board is redesigned, corresponding electromagnetic compatibility tests need to be evaluated again, and system development and maintenance cost is increased.
Disclosure of Invention
The present invention is directed to overcoming the above-mentioned problems associated with the related art, and providing a CAN-compliant circuit that overcomes, at least in part, one or more of the problems due to the limitations and disadvantages of the related art.
According to an aspect of the present invention, there is provided a CAN-compliant circuit including:
a chip pad having a plurality of pins;
a first type of resistor comprising N1At least one resistor of the first type is connected to a first voltage, N1Is an integer of 1 or more;
a second type of resistance comprising N2A resistor, at least one of the second resistors being connected to a second voltage, N2Is an integer of 1 or more;
n resistor pads respectively connected to one end of each of the first and second resistors, where N is N1And N2And N is greater than or equal to 2, wherein,
when the CAN compatible circuit is applied to a first mode, the chip bonding pad is welded with a first CAN chip and is connected with N in a plurality of pins of the first CAN chip1The pins are welded with the resistance welding plates connected to the first resistors;
when the CAN compatible circuit is applied to the second mode, the chip bonding pad is welded with the second CAN chip and is connected with N in the plurality of pins of the second CAN chip2Resistance welding of pins to said second type of resistorAnd (5) welding the disc.
In some embodiments of the invention, the first CAN chip has M1A pin, the second CAN chip has M2A pin, M1And M2Is a positive integer, and M2Greater than M1The number of the pins of the chip bonding pad is M2And (4) respectively.
In some embodiments of the present invention, the first type of resistor includes a second resistor and a fifth resistor, wherein another terminal of the second resistor is connected to the first voltage, and another terminal of the fifth resistor is grounded.
In some embodiments of the invention, the second resistor is connected to the first voltage through a first node, which is also connected to ground through a second capacitor.
In some embodiments of the invention, the first CAN chip is an HS CAN chip.
In some embodiments of the present invention, the second type of resistor includes a first resistor, a third resistor and a fourth resistor, wherein the other end of the first resistor is connected to the second voltage, the other end of the third resistor is connected to the micro control unit, and the other end of the fourth resistor is connected to the second voltage.
In some embodiments of the present invention, one end of the first resistor is further grounded through the first capacitor.
In some embodiments of the invention, the second CAN chip is a CAN wake-up chip.
In some embodiments of the present invention, the second resistor and the third resistor are connected to the same pin.
In some embodiments of the present invention, the fourth resistor and the fifth resistor are connected to the same pin.
Compared with the prior art, the invention has the advantages that:
the invention connects the first voltage and the second voltage through the first resistor and the second resistor respectively, thereby providing two voltage sources of V1 and V2 as an I/O power supply mode; using a plurality of resistors for jumping signals as peripheral components, and welding or suspending the corresponding peripheral components on the circuit board according to the applied communication type and the welded chip; therefore, design and experimental verification resources are saved, and development cost is reduced.
Drawings
The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
Fig. 1 shows a circuit diagram of a CAN-compliant circuit according to an embodiment of the invention.
Fig. 2 shows a circuit board schematic of a CAN-compliant circuit according to an embodiment of the invention.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Furthermore, the drawings are merely schematic illustrations of the invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.
The present invention provides a CAN-compliant circuit, which is described below with reference to fig. 1 and 2. Fig. 1 shows a circuit diagram of a CAN-compliant circuit according to an embodiment of the invention. Fig. 2 shows a circuit board schematic of a CAN-compliant circuit according to an embodiment of the invention.
In various embodiments of the present invention, the CAN-compatible circuit provided by the present invention is mainly applied to HS CAN or CAN wake-up mode. The CAN compatible circuit comprises a chip bonding pad U1 with a plurality of pins, a first type of resistor, a second type of resistor and N resistor bonding pads (resistor bonding pads for connecting the resistors and the pins).
The chip pad U1 is used to access either the first CAN chip or the second CAN chip. The first CAThe N chip may have M1A pin, the second CAN chip may have M2A pin, M1And M2Is a positive integer, and M2Greater than M1The number of the pins of the chip bonding pad is M2And (4) respectively. In particular, the first CAN chip may be an HS CAN chip. The second CAN chip may be a CAN wake-up chip. Thus, an HS CAN chip typically includes 8 pins. The CAN wake-up chip typically includes 14 pins. Thus, the chip pad U1 may have 14 pins arranged. In some embodiments, the model number of the HS CAN chip may be TJA 1051; the model of the CAN wake-up chip may be TJA1145, which is not limited in the present invention, and other models or other vendors provide the HS CAN chip for implementing the HS CAN function and the CAN wake-up chip for implementing the CAN wake-up function, which are all within the protection scope of the present invention.
Specifically, in the present embodiment, 14 pins of the arrangement of the chip pad U1 may be numbered sequentially as 1 to 14. The 14 pins of the CAN wake-up chip may also be numbered sequentially 1 to 14. And the serial number of the pin of the chip bonding pad U1 is correspondingly consistent with that of the CAN awakening chip, and the chip bonding pad U1 and the CAN awakening chip are connected according to the corresponding relation. The 14 pins of the CAN awakening chip are a first pin (TXD), a second pin (GND), a third pin (VCC), a fourth pin (RXD), a fifth pin (VIO), a sixth pin (SDO), a seventh pin (INH), an eighth pin (SCK), a ninth pin (WAKE), a tenth pin (BAT), an eleventh pin (SDI), a twelfth pin (CANL), a thirteenth pin (CANH) and a fourteenth pin (SCSN), and each pin has a corresponding function. The 8 pins of the HS CAN chip may be numbered sequentially from 1 to 8. However, the pin numbers of the 8 pins of the HS CAN chip are not identical to the pin number of the chip pad U1. Specifically, 8 pins of the HS CAN chip are a first pin (TXD), a second pin (GND), a third pin (VCC), a fourth pin (RXD), a fifth pin (VIO), a sixth pin (CANL), a seventh pin (CANH), and an eighth pin (INH). The first pin to the fourth pin of the HS CAN chip are consistent with the first pin to the fourth pin in the pin serial numbers of the chip bonding pad U1, and CAN be connected according to the corresponding relation. The fifth pin of the HS CAN chip corresponds to the eleventh pin of the chip pad U1, the sixth pin of the HS CAN chip corresponds to the twelfth pin of the chip pad U1, the seventh pin of the HS CAN chip corresponds to the thirteenth pin of the chip pad U1, and the eighth pin of the HS CAN chip corresponds to the fourteenth pin of the chip pad U1, and CAN be connected according to the corresponding relationship.
The first type of resistance may include N1And a resistor. At least one resistor of the first type of resistor is connected to a first voltage, N1Is an integer of 1 or more. Specifically, in the present embodiment, N1Is 2. The first type of resistor includes a second resistor R02 and a fifth resistor R05. One end of the second resistor R02 is connected with the corresponding resistor pad, and the other end of the second resistor R02 is connected to the first voltage V1. One end of the fifth resistor R05 is connected with the corresponding resistor pad, and the other end of the fifth resistor R05 is grounded. The second resistor R02 and the fifth resistor R05 play a role of jumper connection. Specifically, the second resistor R02 is connected to the first voltage V1 through a first node, and the first node V1 is also connected to ground through a second capacitor C02 to perform a filtering function.
The second type of resistance may include N2And a resistor. At least one resistor of the second type of resistor is connected to a second voltage, N2Is an integer of 1 or more. Specifically, in the present embodiment, N2Is 3. The second type of resistor comprises a first resistor R01, a third resistor R03 and a fourth resistor R04. One end of the first resistor R01 is connected with the corresponding resistor pad, and the other end of the first resistor R01 is connected with the second voltage V2. One end of the third resistor R03 is connected with the corresponding resistor pad, and the other end of the third resistor R03 is connected with a Micro Control Unit (MCU). One end of the fourth resistor R04 is connected to the corresponding resistor pad, and the other end of the fourth resistor R04 is connected to the second voltage V2. The first resistor R01, the third resistor R03 and the fourth resistor R04 are connected in a jumper manner. Specifically, one end of the first resistor R01 connected to the corresponding resistor pad is also grounded through the first capacitor C01 to perform a filtering function.
N resistance pads are respectively connected to one end of each of the first type of resistors and the second type of resistors, and N is N1And N2And N is greater than or equal to 2. In this embodiment, N is 5.
The CAN-compliant circuit, when applied in a first mode (e.g., HS CAN), causes the die pad to bond a first CAN chip (e.g., HS CAN chip) and causes a connection to N of a plurality of pins of the first CAN chip1A pin is soldered to a resistor pad connected to the first type of resistor. In the present embodiment, the resistor pad connected to the second resistor R02 is soldered to the fifth pin (eleventh pin of U1) of the HS CAN; a resistor pad connected to the fifth resistor R05 is soldered to the eighth pin of the HS CAN (the fourteenth pin of U1).
When the CAN compatible circuit is applied to a second mode (such as CAN wakeup), the chip bonding pad is welded with a second CAN chip (such as a CAN wakeup chip) and is connected with N of a plurality of pins of the second CAN chip2A pin is soldered to a resistor pad connected to the second type of resistor. In the embodiment, a resistor pad connected with the first resistor R01 is welded with a fifth pin (a fifth pin of U1) of the CAN wake-up chip; a resistor pad connected with the third resistor R03 is welded with an eleventh pin (an eleventh pin of U1) of the CAN wakeup chip; and a resistor pad connected with the fourth resistor R04 is welded with a fourteenth pin (a fourteenth pin of U1) of the CAN wakeup chip. Thus, the second resistor R02 and the third resistor R03 are connected to the same pin of U1. The fourth resistor R04 and the fifth resistor R05 are connected to the same pin of U1.
The foregoing is merely an exemplary description of various implementations of the invention and is not intended to be limiting thereof.
Compared with the prior art, the invention has the advantages that:
the invention connects the first voltage and the second voltage through the first resistor and the second resistor respectively, thereby providing two voltage sources of V1 and V2 as an I/O power supply mode; using a plurality of resistors for jumping signals as peripheral components, and welding or suspending the corresponding peripheral components on the circuit board according to the applied communication mode and the welded chip; therefore, design and experimental verification resources are saved, and development cost is reduced.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (10)
1. A CAN-compliant circuit, comprising:
a chip pad having a plurality of pins;
a first type of resistor comprising N1At least one resistor of the first type is connected to a first voltage, N1Is an integer of 1 or more;
a second type of resistance comprising N2A resistor, at least one of the second resistors being connected to a second voltage, N2Is an integer of 1 or more;
n resistor pads respectively connected to one end of each of the first and second resistors, where N is N1And N2And N is greater than or equal to 2, wherein,
when the CAN compatible circuit is applied to a first mode, the chip bonding pad is welded with a first CAN chip and is connected with N in a plurality of pins of the first CAN chip1The pins are welded with the resistance welding plates connected to the first resistors;
when the CAN compatible circuit is applied to the second mode, the chip bonding pad is welded with the second CAN chip and is connected with N in the plurality of pins of the second CAN chip2A pin is soldered to a resistor pad connected to the second type of resistor.
2. The CAN-compliant circuit of claim 1 wherein the first CAN isThe chip has M1A pin, the second CAN chip has M2A pin, M1And M2Is a positive integer, and M2Greater than M1The number of the pins of the chip bonding pad is M2And (4) respectively.
3. The CAN-compliant circuit of claim 1, wherein the first type of resistor comprises a second resistor and a fifth resistor, wherein the second resistor has another terminal connected to the first voltage and the fifth resistor has another terminal connected to ground.
4. The CAN-compliant circuit of claim 3 wherein the second resistor is connected to the first voltage through a first node, the first node also being connected to ground through a second capacitor.
5. The CAN-compliant circuit of claim 3 wherein the first CAN chip is an HS CAN chip.
6. The CAN-compliant circuit of claim 3 wherein the second type of resistor comprises a first resistor, a third resistor, and a fourth resistor, wherein the other terminal of the first resistor is coupled to the second voltage, the other terminal of the third resistor is coupled to a micro-control unit, and the other terminal of the fourth resistor is coupled to the second voltage.
7. The CAN-compliant circuit of claim 6 wherein said first resistor has one end further connected to ground through a first capacitor.
8. The CAN-compatible circuit of claim 6, wherein the second CAN chip is a CAN wakeup chip.
9. The CAN-compliant circuit of claim 7 wherein the second resistor and the third resistor are connected to the same pin.
10. The CAN-compliant circuit of claim 7 wherein the fourth resistor and the fifth resistor are connected to the same pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010945034.3A CN114168507B (en) | 2020-09-10 | 2020-09-10 | CAN compatible circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010945034.3A CN114168507B (en) | 2020-09-10 | 2020-09-10 | CAN compatible circuit |
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| Publication Number | Publication Date |
|---|---|
| CN114168507A true CN114168507A (en) | 2022-03-11 |
| CN114168507B CN114168507B (en) | 2023-12-05 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7872346B1 (en) * | 2007-12-03 | 2011-01-18 | Xilinx, Inc. | Power plane and land pad feature to prevent human metal electrostatic discharge damage |
| CN207117649U (en) * | 2017-09-16 | 2018-03-16 | 锦州辽晶电子科技有限公司 | CAN isolated transceiver |
| CN108556632A (en) * | 2018-06-10 | 2018-09-21 | 重庆三三电器股份有限公司 | A kind of intelligence TFT instrument screen intensity wake-up circuits and its control method |
| CN110350903A (en) * | 2019-08-13 | 2019-10-18 | 厦门亚锝电子科技有限公司 | A kind of novel touch key-press BLE remote control switch panel |
| CN111404494A (en) * | 2020-06-04 | 2020-07-10 | 微龛(广州)半导体有限公司 | Transimpedance amplifier chip and optical receiving module |
-
2020
- 2020-09-10 CN CN202010945034.3A patent/CN114168507B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7872346B1 (en) * | 2007-12-03 | 2011-01-18 | Xilinx, Inc. | Power plane and land pad feature to prevent human metal electrostatic discharge damage |
| CN207117649U (en) * | 2017-09-16 | 2018-03-16 | 锦州辽晶电子科技有限公司 | CAN isolated transceiver |
| CN108556632A (en) * | 2018-06-10 | 2018-09-21 | 重庆三三电器股份有限公司 | A kind of intelligence TFT instrument screen intensity wake-up circuits and its control method |
| CN110350903A (en) * | 2019-08-13 | 2019-10-18 | 厦门亚锝电子科技有限公司 | A kind of novel touch key-press BLE remote control switch panel |
| CN111404494A (en) * | 2020-06-04 | 2020-07-10 | 微龛(广州)半导体有限公司 | Transimpedance amplifier chip and optical receiving module |
Non-Patent Citations (1)
| Title |
|---|
| 宫磊: "高速CAN收发器的设计与研究", 《中国优秀硕士学位论文全文数据库信息科技辑》, pages 136 - 75 * |
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| CN114168507B (en) | 2023-12-05 |
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