CN114160450A - Semiconductor wafer detection system and detection method thereof - Google Patents
Semiconductor wafer detection system and detection method thereof Download PDFInfo
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- CN114160450A CN114160450A CN202111513315.2A CN202111513315A CN114160450A CN 114160450 A CN114160450 A CN 114160450A CN 202111513315 A CN202111513315 A CN 202111513315A CN 114160450 A CN114160450 A CN 114160450A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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Abstract
The invention discloses a semiconductor wafer detection system and a detection method thereof, wherein the system comprises a detection table and a first shell, a recovery box is movably arranged at the lower end of the detection table, a computer main body is fixedly arranged at the right side end of the first shell, a wafer arrangement mechanism is arranged at the upper end of the first shell, a protection mechanism is arranged at the front end of the computer main body, a first electric slide rail is horizontally and fixedly arranged at the bottom end inside the first shell, a wafer bearing mechanism is movably arranged on the first electric slide rail, and a second electric slide rail is fixedly arranged at the inside of the first shell. After the detection is finished, if special defects needing manual inspection appear, the hand position penetrates through the rubber gloves, then the electromagnet is closed, then the bearing disc is moved until the defect position moves to a position right below the microscope probe at the lower end of the microscope, and then the electromagnet is started to fix the bearing disc, so that the manual reinspection of the defect position is facilitated.
Description
Technical Field
The invention relates to the field of semiconductor detection, in particular to a semiconductor wafer detection system and a detection method thereof.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 8 inches and 12 inches.
The main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and the reliability of the processed wafer is increased during wafer processing, and the particle number has new data characteristics along with the improvement of cleanness.
The existing wafer is required to be detected after being processed, the existing detection system is used for amplifying and detecting the wafer through a microscope system, then a detection result is displayed on a computer display screen, the microscope system is required to adjust the height of the microscope system in order to ensure the detection definition when detecting wafers with different thicknesses, but the existing adjustment system is large in adjustment interval and difficult to finely adjust to ensure the definition, and the wafer is required to be sent into the detection system during detection, because the external environment is poor and the dust content is high, the detection system is directly communicated with the external environment when the wafer is sent, so that the interior of the detection system is easy to pollute and difficult to ensure the cleanliness, meanwhile, manual determination is required after part of production defects are detected during detection, the specific cause of the defects is convenient to determine, and the detection path of the existing system is system controlled, when some defects need to be detected manually, the detection system cannot be operated, and the detection system needs to be replaced, which causes inconvenience, so that a device is urgently needed to solve the problems.
Disclosure of Invention
The present invention is directed to a semiconductor wafer inspection system and a method thereof, which are used to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor wafer detection system comprises a detection platform and a first shell, wherein a recovery box is movably arranged at the lower end of the detection platform and is convenient for recovering unqualified products, a computer main body is fixedly arranged at the right side end of the first shell, a wafer arranging mechanism is arranged at the upper end of the first shell, a protection mechanism is arranged at the front end of the computer main body, a first electric slide rail is horizontally and fixedly arranged at the bottom end inside the first shell, a wafer bearing mechanism is movably arranged on the first electric slide rail, a second electric slide rail is fixedly arranged inside the first shell and movably penetrates through the wafer bearing mechanism, rubber gloves are fixedly arranged at the front end of the first shell and movably extend into the first shell, a first electric push rod is fixedly arranged at the left side end inside the first shell, the utility model discloses a microscope, including first electric putter, first casing, second electric putter, microscope lower extreme position fixed mounting, first electric putter upper end position horizontal fixed mounting is provided with the horizontal plate, the inside top position fixed mounting of first casing is provided with second electric putter, second electric putter lower extreme position fixed mounting is provided with the microscope, microscope lower extreme position fixed mounting is provided with the coiled pipe, coiled pipe lower extreme fixed mounting is provided with the microprobe, microscope lower extreme position is provided with fine-tuning, microscope lower extreme position fixed mounting is provided with a plurality of infrared generator.
Preferably, the wafer bearing mechanism comprises a negative pressure hole, an infrared receiver, a bearing disc, a cavity, a telescopic rod, a moving disc, a corrugated hose, an electromagnet and a first negative pressure pump, wherein the first electric slide rail is movably arranged at the bottom of the moving disc, the second electric slide rail is movably arranged at the center of the moving disc, the bearing disc is movably clamped and arranged at the inner position of the moving disc, the cavity is arranged inside the bearing disc, the first negative pressure pump is fixedly arranged at the center of the bottom of the moving disc, the corrugated hose is fixedly arranged at the upper end of the first negative pressure pump, the upper end of the corrugated hose is fixed at the center of the lower end of the bearing disc and communicated with the cavity, the bearing disc is made of magnetic metal, the electromagnet is fixedly arranged inside the moving disc, and the bearing disc is uniformly provided with a plurality of negative pressure holes, the upper end position of the bearing disc is fixedly provided with a plurality of infrared receivers in an embedded manner, the infrared receivers are electrically connected with a computer main body, the number of the infrared receivers is the same as that of the infrared generators and corresponds to that of the infrared receivers one by one, a plurality of telescopic rods are uniformly and movably arranged on the outer side of the bearing disc, the other side of each telescopic rod is movably arranged on the inner side wall of the movable disc, the telescopic rods are self-recovery telescopic rods, the hand position penetrates through rubber gloves during detection, then the wafer is arranged at the upper end position of the bearing disc, then the electromagnet is started to adsorb and fix the bearing disc, and the first negative pressure pump is started, forms negative pressure inside a negative pressure hole through a cavity, so that the wafer is adsorbed and fixed without clamping and fixing to prevent the wafer from being clamped and damaged, and meanwhile, the infrared generated by the infrared generators after the wafer is arranged is received by the infrared receivers, the wafer is in suitable position this moment, the infrared receiver of skew position can't receive the infrared ray this moment if the wafer skew, thereby make data can't transmit to inside the computer main part, the wafer is in the skew state this moment, adjust the wafer position until suitable position, thereby make things convenient for subsequent detection work, prevent that the wafer part position that the skew caused can't be effectively detected, cause the hourglass to examine, and after detecting the completion, if the special defect that needs artifical inspection appears, the user passes rubber gloves with the hand position, then close the electro-magnet, later remove and bear the dish until the defect position removes to microscope lower extreme microprobe under the position, later start the fixed dish that bears of electro-magnet, conveniently carry out artifical reinspection to the defect position.
Preferably, the wafer arrangement mechanism comprises a dust removal mechanism, a sealing mechanism, a window, a movable plate, a second shell, a timing switch and an arrangement frame, the second shell is fixedly arranged at the upper end of the first shell, the sealing mechanism is arranged on two sides of the second shell, the dust removal mechanism is arranged at the upper end of the sealing mechanism, the window is arranged at the front end of the second shell, the movable plate is movably arranged at the front end of the second shell, the movable plate is convenient to seal the window, the timing switch is fixedly arranged on the left side of the first shell and electrically connected with the first electric push rod, and the arrangement frame is movably arranged at the inner position of the second shell.
Preferably, the closing mechanism comprises a closing plate, a first chute, a spring, a fixed pulley, a motor, a winding wheel, a fourth shell and a steel wire rope, the fourth shell is fixedly installed at the two side end positions of the second shell, the first chute is horizontally arranged in the fourth shell, the closing plate is movably clamped and arranged at the inner position of the first chute, the closing plate movably extends into the second shell and closes the bottom end position of the second shell, the spring is fixedly connected and arranged between the closing plate and the inner side wall of the first chute, the fixed pulley is fixedly installed in the fourth shell, the motor is fixedly installed in the fourth shell, the winding wheel is fixedly installed at the front end position of the motor, the steel wire rope is fixedly installed at one side of the closing plate, the steel wire rope passes through the bottom end position of the fixed pulley and then is wound and fixed at the outer side of the winding wheel, the motor is electrically connected with the timing switch.
Preferably, the dust removing mechanism comprises a first connecting pipe, a second negative pressure pump, a third shell, a dust screen and a limiting block, the third shell is fixedly arranged at the upper end of the fourth shell, the limiting block is fixedly arranged in the third shell, the door plate is fixedly arranged at the front end of the third shell, the dust screen is movably arranged at the upper end of the limiting block, the second negative pressure pump is fixedly arranged in the fourth shell, the upper end of the second negative pressure pump is communicated with the inside of the third shell, the second connecting pipe is fixedly arranged at the lower end of the second negative pressure pump, the left side of the second connecting pipe is divided into a plurality of extension pipes which extend into the second shell, the first connecting pipe is fixedly arranged at the central position of the upper end of the third shell, and the first connecting pipe fixedly penetrates into the left side of the second shell, when the device is used, a wafer to be detected is arranged on the arrangement frame, then the wafer is sent into the second shell through the window and is arranged at the upper end position of the sealing plate, then the window is sealed through the movable plate, then the second negative pressure pump is started, negative pressure is formed inside the third shell through the second negative pressure pump, air inside the second shell is sucked into the third shell through the first connecting pipe and is filtered by the dustproof net, then the air inside the second shell is purified through the second connecting pipe and is prevented from entering the first shell, the timing switch starting motor drives the winding wheel to rotate after a certain time, the steel wire rope is wound outside the winding wheel, the sealing plate is pulled to move the extrusion spring along the first sliding groove until the arrangement frame drops on the upper end of the horizontal plate, then the timing switch starts the first electric push rod to move the horizontal plate to the inside of the first shell, then the motor antiport, the spring can drive the closing plate and reset again and seal the position between second casing and the first casing, so prevent that outside dust from getting into inside the first casing, guarantee the inside clean of first casing.
Preferably, the fine adjustment mechanism comprises a screw rod, a fixing ring, a lantern ring, a driving wheel, a driving belt, an operation block and a sealing cover, the screw rod is movably arranged at two sides of the lower end of the microscope, the lantern ring is sleeved at the end position of the outer side of the screw rod, the fixing ring is fixedly arranged between the lantern rings, the fixing ring is fixedly arranged at the outer side of the microprobe, the sealing cover is sleeved at the lower end of the microprobe, the driving wheel is fixedly arranged at the lower end of the screw rod, the driving belt is arranged between the driving wheels in a surrounding manner, the operation block is fixedly arranged at the lower end of the driving wheel, anti-skid grains are arranged at the outer side of the operation block in a surrounding manner, when in use, the screw rod is rotated by the operation block, the screw rod rotates, the lantern ring moves up and down along the screw rod in a linkage manner by the driving wheel and the driving belt, when the screw rod rotates, therefore, the upper position and the lower position of the microprobe can be adjusted, so that fine adjustment work is conveniently carried out, and the definition of a microscopic picture is ensured.
Preferably, protection machanism includes permanent magnet, second spout, cell body, movable rod and protection cloth, the second spout has been seted up to computer main part front end both sides position, the inside activity joint of second spout is provided with the movable rod, the cell body has been seted up to the movable rod front end position, the fixed permanent magnet that is provided with is inlayed to computer main part internal position, the movable rod is the magnetic metal material, fixed position is connected between movable rod bottom and the computer main part and is provided with the protection cloth, and when idle, the user upwards removes the movable rod along the second spout for the movable rod adsorbs to be fixed in permanent magnet bottom position, so can make the protection cloth shelter from in computer main part front end position to conveniently protect the computer main part, effectively prevent that the computer main part from being polluted, improve computer main part's life.
Preferably, the first electric slide rail and the second electric slide rail are both electrically connected with the computer main body, and the computer main body controls the first electric slide rail and the second electric slide rail to operate, so that the movement of the wafer bearing mechanism is controlled.
A detection method of a semiconductor wafer detection system specifically comprises the following steps:
the first step is as follows: when the device is used, a wafer to be detected is arranged on the arrangement frame, then the wafer is sent into the second shell through the window and is arranged at the upper end position of the sealing plate, then the window is sealed through the movable plate, then the second negative pressure pump is started, negative pressure is formed inside the third shell through the second negative pressure pump, air inside the second shell is sucked into the third shell through the first connecting pipe and is filtered by the dustproof net, then the air inside the second shell is purified through the second connecting pipe and is prevented from entering the first shell, the timing switch starting motor drives the winding wheel to rotate after a certain time, the steel wire rope is wound outside the winding wheel, the sealing plate is pulled to move the extrusion spring along the first sliding groove until the arrangement frame drops on the upper end of the horizontal plate, then the timing switch starts the first electric push rod to move the horizontal plate to the inside of the first shell, then the motor rotates reversely, the spring can drive the closing plate to reset again to close the position between the second shell and the first shell, so that external dust is prevented from entering the first shell, and the cleanness of the interior of the first shell is ensured;
the second step is that: during detection, a hand position penetrates through a rubber glove, then a wafer is arranged at the upper end position of a bearing plate, then an electromagnet is started to adsorb and fix the bearing plate, a first negative pressure pump is started, negative pressure is formed inside a negative pressure hole through a cavity of the first negative pressure pump, so that the wafer is adsorbed and fixed, the wafer is not required to be clamped and fixed, the wafer is prevented from being damaged by clamping, infrared rays generated by an infrared ray generator after the wafer is arranged are received by an infrared ray receiver, the wafer is at a proper position, if the wafer deviates from the infrared ray receiver at the deviated position, the infrared ray can not receive the infrared rays, so that data can not be transmitted into a computer main body, the wafer is at the deviated state, the position of the wafer is adjusted to the proper position, subsequent detection work is facilitated, partial position of the wafer caused by deviation can not be effectively detected, detection omission is caused, and after detection is finished, if a special defect needing manual inspection appears, a user penetrates the hand position through the rubber gloves, then the electromagnet is closed, then the bearing disc is moved until the defect position moves to a position right below a microscope probe at the lower end of the microscope, and then the electromagnet is started to fix the bearing disc, so that the manual reinspection of the defect position is facilitated;
the third step: when the micro probe is used, the screw rod is rotated through the operation block, so that the screw rod rotates, the driving wheel is matched with the screw rods on the two sides of the driving belt to be linked, the lantern ring moves up and down along the screw rod when the screw rod rotates, and thus the up-and-down position of the micro probe can be adjusted, the fine adjustment work is convenient, and the definition of a microscopic picture is ensured;
the fourth step: when idle, the user upwards removes the movable rod along the second spout for the movable rod adsorbs to be fixed in permanent magnet bottom position, so can make protective cloth shelter from in computer main part front position, thereby conveniently protect the computer main part, effectively prevents that the computer main part from being polluted, improves the life of computer main part.
Compared with the prior art, the invention has the beneficial effects that:
1. the wafer to be detected is arranged on the arranging frame, then is sent into the second shell through the window and is arranged at the upper end position of the sealing plate, then the window is sealed through the movable plate, then the second negative pressure pump is started, negative pressure is formed in the third shell through the second negative pressure pump, the air in the second shell is sucked into the third shell through the first connecting pipe and is filtered by the dustproof net, then the air in the second shell is purified through the second connecting pipe and is prevented from entering the first shell, the timing switch starting motor drives the winding wheel to rotate after a certain time, the steel wire rope is wound outside the winding wheel, the sealing plate is pulled to move the extrusion spring along the first sliding groove until the arranging frame falls on the upper end of the horizontal plate, then the timing switch starts the first electric push rod to move the horizontal plate into the first shell, then the motor rotates reversely, the spring can drive the closing plate to reset again to close the position between the second shell and the first shell, so that external dust is prevented from entering the first shell, and the cleanness of the interior of the first shell is ensured;
2. according to the invention, the hand position penetrates through a rubber glove, then a wafer is arranged at the upper end position of a bearing disc, then an electromagnet is started to adsorb and fix the bearing disc, and a first negative pressure pump is started, so that negative pressure is formed inside a negative pressure hole through a cavity, the wafer is adsorbed and fixed, the wafer is prevented from being clamped and damaged without clamping and fixing, meanwhile, infrared rays generated by an infrared ray generator after the wafer is arranged are received by an infrared ray receiver, the wafer is at a proper position at the moment, if the wafer deviates from the infrared ray receiver at the deviation position at the moment, the infrared ray can not be received, so that data can not be transmitted to the inside of a computer main body, the wafer is at the deviation state at the moment, and the position of the wafer is adjusted to the proper position, so that subsequent detection work is facilitated, and the partial position of the wafer caused by deviation can not be effectively detected, and the detection leakage can be prevented;
3. after the detection is finished, if special defects needing manual inspection appear, a user penetrates the hand position through the rubber gloves, then the electromagnet is closed, then the bearing disc is moved until the defect position moves to a position right below a microscopic probe at the lower end of the microscope, and then the electromagnet is started to fix the bearing disc, so that the manual reinspection of the defect position is facilitated;
4. when the micro probe is used, the screw rod is rotated through the operation block, the screw rod is rotated, the driving wheel is matched with the screw rods on the two sides of the driving belt to be linked, and the lantern ring moves up and down along the screw rod when the screw rod rotates, so that the up-and-down position of the micro probe can be adjusted, the micro probe can be conveniently finely adjusted, and the definition of a microscopic picture can be ensured; when idle, the user upwards removes the movable rod along the second spout for the movable rod adsorbs to be fixed in permanent magnet bottom position, so can make protective cloth shelter from in computer main part front position, thereby conveniently protect the computer main part, effectively prevents that the computer main part from being polluted, improves the life of computer main part.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a semiconductor wafer inspection system according to the present invention;
FIG. 2 is a top view of a susceptor in a semiconductor wafer inspection system according to the present invention;
FIG. 3 is a schematic view of a wafer loading mechanism in a semiconductor wafer inspection system according to the present invention;
FIG. 4 is a schematic diagram of a wafer positioning mechanism in a semiconductor wafer inspection system according to the present invention;
FIG. 5 is an enlarged view of A1 shown in FIG. 1 of the semiconductor wafer inspection system according to the present invention;
FIG. 6 is a schematic diagram of a protection mechanism in a semiconductor wafer inspection system according to the present invention.
In the figure: 1. a detection table; 2. a first housing; 3. rubber gloves; 4. a second electric push rod; 5. a microscope; 6. a serpentine tube; 7. a microscopic probe; 8. a recycling bin; 9. a computer main body; 10. a wafer placement mechanism; 11. a first electric push rod; 12. a first negative pressure pump; 13. a first electric slide rail; 14. a wafer carrying mechanism; 15. a second electric slide rail; 16. a carrier tray; 17. a horizontal plate; 18. an infrared generator; 19. an infrared receiver; 20. a movable tray; 21. a telescopic rod; 22. a negative pressure hole; 23. a corrugated hose; 24. a cavity; 25. an electromagnet; 26. a permanent magnet; 27. a second chute; 28. a movable rod; 29. a trough body; 30. protective cloth; 31. a screw; 32. a collar; 33. a fixing ring; 34. a driving wheel; 35. a transmission belt; 36. an operation block; 37. a sealing cover; 38. a window; 39. a movable plate; 40. a placement frame; 41. a second housing; 42. a fourth housing; 43. a winding wheel; 44. a motor; 45. a fixed pulley; 46. a wire rope; 47. a first chute; 48. a spring; 49. a closing plate; 50. a third housing; 51. a second negative pressure pump; 52. a second connecting pipe; 53. a limiting block; 54. a dust screen; 55. a first connecting pipe; 56. a timing switch; 57. a fine adjustment mechanism; 58. a dust removal mechanism; 59. a sealing mechanism; 60. a guard mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a semiconductor wafer detection system comprises a detection platform 1 and a first shell 2, wherein a recovery box 8 is movably arranged at the lower end of the detection platform 1, unqualified products can be conveniently recovered by the recovery box 8, a computer main body 9 is fixedly arranged at the right side end of the first shell 2, a wafer arranging mechanism 10 is arranged at the upper end of the first shell 2, a protection mechanism 60 is arranged at the front end of the computer main body 9, a first electric slide rail 13 is horizontally and fixedly arranged at the bottom end inside the first shell 2, a wafer bearing mechanism 14 is movably arranged on the first electric slide rail 13, a second electric slide rail 15 is fixedly arranged at the inner position inside the first shell 2, the second electric slide rail 15 movably penetrates through the wafer bearing mechanism 14, and the first electric slide rail 13 and the second electric slide rail 15 are both electrically connected with the computer main body 9, the operation of a first electric slide rail 13 and a second electric slide rail 15 is controlled through a computer main body 9, so as to control the movement of a wafer bearing mechanism 14, a rubber glove 3 is fixedly arranged at the front end of a first shell 2, the rubber glove 3 movably extends into the first shell 2, a first electric push rod 11 is fixedly arranged at the left end position in the first shell 2, a horizontal plate 17 is horizontally and fixedly arranged at the upper end position of the first electric push rod 11, a second electric push rod 4 is fixedly arranged at the top end position in the first shell 2, a microscope 5 is fixedly arranged at the lower end position of the second electric push rod 4, a coiled pipe 6 is fixedly arranged at the lower end position of the microscope 5, a microscopic probe 7 is fixedly arranged at the lower end of the coiled pipe 6, and a fine adjustment mechanism 57 is arranged at the lower end position of the microscope 5, the lower end of the microscope 5 is fixedly provided with a plurality of infrared generators 18.
The wafer bearing mechanism 14 comprises a negative pressure hole 22, an infrared receiver 19, a bearing disc 16, a cavity 24, an expansion link 21, a moving disc 20, a corrugated hose 23, an electromagnet 25 and a first negative pressure pump 12, wherein the first electric slide rail 13 is movably arranged at the bottom end of the moving disc 20, the second electric slide rail 15 is movably arranged at the center of the moving disc 20, the bearing disc 16 is movably clamped at the inner position of the moving disc 20, the cavity 24 is formed in the bearing disc 16, the first negative pressure pump 12 is fixedly arranged at the bottom end center of the moving disc 20, the corrugated hose 23 is fixedly arranged at the upper end of the first negative pressure pump 12, the upper end of the corrugated hose 23 is fixed at the lower end center of the bearing disc 16 and communicated with the cavity 24, the bearing disc 16 is made of magnetic metal, the electromagnet 25 is fixedly arranged at the inner position of the moving disc 20, the bearing plate 16 is uniformly provided with a plurality of negative pressure holes 22, the upper end position of the bearing plate 16 is fixedly provided with a plurality of infrared receivers 19 in an embedded manner, the infrared receivers 19 are electrically connected with the computer main body 9, the infrared receivers 19 and the infrared generators 18 are in the same quantity and are in one-to-one correspondence, the outer side of the bearing plate 16 is uniformly and movably provided with a plurality of telescopic rods 21, the other sides of the telescopic rods 21 are movably arranged on the inner side wall of the movable plate 20, the telescopic rods 21 are self-recovery telescopic rods, the hand position penetrates through the rubber gloves 3 during detection, then the wafer is arranged at the upper end position of the bearing plate 16, then the electromagnet 25 is started to adsorb and fix the bearing plate 16, the first negative pressure pump 12 is started, the first negative pressure pump 12 enables the inside of the negative pressure holes 22 to form negative pressure through the cavity 24, and the wafer is adsorbed and fixed, the wafer is prevented from being clamped and damaged without clamping and fixing, meanwhile, after the wafer is arranged, infrared rays generated by an infrared ray generator 18 are received by an infrared ray receiver 19, the wafer is in a proper position, if the wafer deviates from the infrared ray receiver 19 at the deviation position, the infrared rays cannot be received, so that data cannot be transmitted to the inside of a computer main body 9, the wafer is in a deviation state at the moment, the position of the wafer is adjusted to the proper position, so that subsequent detection work is facilitated, the situation that partial position of the wafer caused by deviation cannot be effectively detected and detection omission is caused is avoided, and after the detection is finished, if special defects needing manual inspection appear, a user passes through a rubber glove 3 at the hand position, then closes an electromagnet 25, then moves a bearing disc 16 until the defect position moves to a position under a microscope probe 7 at the lower end of a microscope 5, and then starts the electromagnet 25 to fix the bearing disc 16, the defect position can be conveniently rechecked manually.
The wafer arranging mechanism 10 comprises a dust removing mechanism 58, a sealing mechanism 59, a window 38, a movable plate 39, a second shell 41, a timing switch 56 and an arranging frame 40, the second shell 41 is fixedly arranged at the upper end of the first shell 2, the sealing mechanisms 59 are arranged on two sides of the second shell 41, the dust removing mechanism 58 is arranged at the upper end of the sealing mechanism 59, the window 38 is arranged at the front end of the second shell 41, the movable plate 39 is movably arranged at the front end of the second shell 41, the window 38 is conveniently sealed by the movable plate 39, the timing switch 56 is fixedly arranged on the left side of the first shell 2, the timing switch 56 is electrically connected with the first electric push rod 11, and the arranging frame 40 is movably arranged at the inner position of the second shell 41.
The sealing mechanism 59 comprises a sealing plate 49, a first sliding groove 47, a spring 48, a fixed pulley 45, a motor 44, a winding wheel 43, a fourth shell 42 and a steel wire rope 46, the fourth shell 42 is fixedly installed at the two side end positions of the second shell 41, the first sliding groove 47 is horizontally formed in the fourth shell 42, the sealing plate 49 is movably clamped and connected at the inner position of the first sliding groove 47, the sealing plate 49 movably extends into the second shell 41 and seals the bottom end position of the second shell 41, the spring 48 is fixedly connected between the sealing plate 49 and the inner side wall of the first sliding groove 47, the fixed pulley 45 is fixedly installed in the fourth shell 42, the motor 44 is fixedly installed in the fourth shell 42, the winding wheel 43 is fixedly installed at the front end position of the motor 44, the steel wire rope 46 is fixedly installed at one side of the sealing plate 49, the wire rope 46 passes through the bottom end position of the fixed pulley 45 and then is wound and fixed on the outer side of the winding wheel 43, and the motor 44 is electrically connected with the timing switch 56.
The dust removing mechanism 58 comprises a first connecting pipe 55, a second connecting pipe 52, a second negative pressure pump 51, a third shell 50, a dust screen 54 and a limiting block 53, the third shell 50 is fixedly arranged at the upper end of the fourth shell 42, the limiting block 53 is fixedly arranged inside the third shell 50, a door plate is fixedly arranged at the front end of the third shell 50, the dust screen 54 is movably arranged at the upper end of the limiting block 53, the second negative pressure pump 51 is fixedly arranged inside the fourth shell 42, the upper end of the second negative pressure pump 51 is communicated with the inside of the third shell 50, the second connecting pipe 52 is fixedly arranged at the lower end of the second negative pressure pump 51, the left side of the second connecting pipe 52 is divided into a plurality of extending pipes to extend into the inside of the second shell 41, and the first connecting pipe 55 is fixedly arranged at the upper end center of the third shell 50, the first connecting pipe 55 fixedly penetrates into the left side of the second shell 41, when in use, a wafer to be detected is arranged on the arrangement frame 40, then the wafer is sent into the second shell 41 through the window 38 and is arranged at the upper end position of the closing plate 49, then the window 38 is closed through the movable plate 39, then the second negative pressure pump 51 is started, the second negative pressure pump 51 enables negative pressure to be formed inside the third shell 50, the first connecting pipe 55 enables air inside the second shell 41 to be sucked into the third shell 50 and filtered by the dustproof net 54, then the air is injected into the second shell 41 through the second connecting pipe 52, the air inside the second shell 41 is purified, dust is prevented from entering the inside of the first shell 2, the timing switch 56 starts the motor 44 to drive the winding wheel 43 to rotate after a certain time, the wire rope 46 is wound outside the winding wheel 43, and the closing plate 49 is pulled to move the extrusion spring 48 along the first chute 47, until the placement frame 40 drops on the upper end of the horizontal plate 17, the timing switch 56 starts the first electric push rod 11 to move the horizontal plate 17 to the inside of the first shell 2, then the motor 44 rotates reversely, the spring 48 can drive the closing plate 49 to reset to close the position between the second shell 41 and the first shell 2, so that external dust is prevented from entering the inside of the first shell 2, and the cleanness of the inside of the first shell 2 is ensured.
The fine adjustment mechanism 57 comprises a screw 31, a fixed ring 33, a lantern ring 32, a transmission wheel 34, a transmission belt 35, an operation block 36 and a sealing cover 37, the screw 31 is movably arranged at the two sides of the lower end of the microscope 5, the lantern ring 32 is sleeved at the outer side end of the screw 31, the fixed ring 33 is fixedly arranged between the lantern rings 32, the fixed ring 33 is fixedly arranged at the outer side of the microscope probe 7, the sealing cover 37 is sleeved at the lower end of the microscope probe 7, the transmission wheel 34 is fixedly arranged at the lower end of the screw 31, the transmission belt 35 is arranged between the transmission wheels 34 in a surrounding manner, the operation block 36 is fixedly arranged at the lower end of the transmission wheel 34, anti-skid grains are arranged at the outer side of the operation block 36 in a surrounding manner, when in use, the screw 31 is rotated through the operation block 36, the screw 31 is rotated, and the transmission wheel 34 is matched with the screw 31 at the two sides of the transmission belt 35 in linkage, when the screw rod 31 rotates, the lantern ring 32 moves up and down along the screw rod 31, so that the up-and-down position of the microprobe 7 can be adjusted, fine adjustment work is conveniently carried out, and the definition of a microscopic picture is ensured.
The protection mechanism 60 comprises a permanent magnet 26, a second chute 27, a groove body 29, a movable rod 28 and protection cloth 30, the second chute 27 is arranged at two sides of the front end of the computer main body 9, the movable rod 28 is movably clamped in the second chute 27, the groove body 29 is arranged at the front end of the movable rod 28, the permanent magnet 26 is fixedly embedded in the computer main body 9, the movable rod 28 is made of magnetic metal, the protection cloth 30 is fixedly connected between the bottom end of the movable rod 28 and the computer main body 9, when the protection mechanism is idle, a user moves the movable rod 28 upwards along the second chute 27 to enable the movable rod 28 to be adsorbed and fixed at the bottom end of the permanent magnet 26, so that the protection cloth 30 is shielded at the front end of the computer main body 9, the computer main body 9 is conveniently protected, and the computer main body 9 is effectively prevented from being polluted, the service life of the computer main body 9 is improved.
A detection method of a semiconductor wafer detection system specifically comprises the following steps:
the first step is as follows: when in use, a wafer to be detected is placed on the placing frame 40, then is sent into the second shell 41 through the window 38 and is placed at the upper end position of the closing plate 49, then the window 38 is closed through the movable plate 39, then the second negative pressure pump 51 is started, the second negative pressure pump 51 enables the interior of the third shell 50 to form negative pressure, the first connecting pipe 55 enables the air in the interior of the second shell 41 to be sucked into the interior of the third shell 50 and filtered by the dustproof net 54, then the air is injected into the second shell 41 through the second connecting pipe 52, so that the air in the interior of the second shell 41 is purified and dust is prevented from entering the interior of the first shell 2, the timing switch 56 starts the motor 44 to drive the winding wheel 43 to rotate after a certain time, the wire rope 46 is wound outside the winding wheel 43, the closing plate 49 is pulled to move the extrusion spring 48 along the first chute 47 until the placing frame 40 falls on the upper end of the horizontal plate 17, then the timing switch 56 starts the first electric push rod 11 to move the horizontal plate 17 to the inside of the first housing 2, then the motor 44 rotates in reverse direction, the spring 48 can drive the closing plate 49 to reset to close the position between the second housing 41 and the first housing 2, so as to prevent external dust from entering the inside of the first housing 2 and ensure the cleanness of the inside of the first housing 2;
the second step is that: during detection, the hand position penetrates through the rubber glove 3, then the wafer is arranged at the upper end position of the bearing disc 16, then the electromagnet 25 is started to adsorb and fix the bearing disc 16, the first negative pressure pump 12 is started, negative pressure is formed inside the negative pressure hole 22 through the cavity 24 by the first negative pressure pump 12, so that the wafer is adsorbed and fixed without clamping and fixing to prevent the wafer from being damaged by clamping, meanwhile, infrared rays generated by the infrared ray generator 18 after the wafer is arranged are received by the infrared ray receiver 19, the wafer is at a proper position, if the wafer deviates, the infrared ray receiver 19 at the deviated position cannot receive the infrared rays, data cannot be transmitted to the inside of the computer main body 9, the wafer is at the deviated state, the position of the wafer is adjusted to the proper position, so that subsequent detection work is facilitated, and partial position of the wafer caused by deviation cannot be effectively detected, the detection is missed, and after the detection is finished, if special defects needing manual detection appear, a user penetrates the rubber gloves 3 at the hand position, then the electromagnet 25 is closed, then the bearing disc 16 is moved until the defect position moves to a position right below the microscopic probe 7 at the lower end of the microscope 5, then the electromagnet 25 is started to fix the bearing disc 16, and the manual reinspection of the defect position is facilitated;
the third step: when the microscope is used, the screw rod 31 is rotated through the operation block 36, the screw rod 31 is rotated, the driving wheel 34 is matched with the driving belt 35 to link the screw rods 31 at two sides, and the lantern ring 32 moves up and down along the screw rod 31 when the screw rod 31 rotates, so that the up-and-down position of the microscope probe 7 can be adjusted, fine adjustment work is facilitated, and the definition of a microscope picture is ensured;
the fourth step: when not using, the user moves movable rod 28 along second spout 27 upwards for movable rod 28 adsorbs to be fixed in permanent magnet 26 bottom position, so can make protection cloth 30 shelter from in computer main body 9 front position, thereby conveniently protect computer main body 9, effectively prevent that computer main body 9 from being contaminated, improves computer main body 9's life.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A semiconductor wafer inspection system comprising an inspection station (1) and a first housing (2), characterized in that: the detection table is characterized in that a recovery box (8) is movably arranged at the lower end of the detection table (1), a computer main body (9) is fixedly arranged at the right side of the first shell (2), a wafer arranging mechanism (10) is arranged at the upper end of the first shell (2), a protection mechanism (60) is arranged at the front end of the computer main body (9), a first electric slide rail (13) is horizontally and fixedly arranged at the bottom end inside the first shell (2), a wafer bearing mechanism (14) is movably arranged on the first electric slide rail (13), a second electric slide rail (15) is fixedly arranged at the inner position inside the first shell (2), the second electric slide rail (15) movably penetrates through the wafer bearing mechanism (14), a rubber glove (3) is fixedly arranged at the front end of the first shell (2), and the rubber glove (3) movably extends into the first shell (2), the utility model discloses a microscope, including first casing (2), first casing (2) inside left end position fixed mounting is provided with first electric putter (11), first electric putter (11) upper end position horizontal fixed mounting is provided with horizontal plate (17), the inside top position fixed mounting of first casing (2) is provided with second electric putter (4), second electric putter (4) lower extreme position fixed mounting is provided with microscope (5), microscope (5) lower extreme position fixed mounting is provided with coiled pipe (6), coiled pipe (6) lower extreme fixed mounting is provided with microprobe (7), microscope (5) lower extreme position is provided with fine-tuning (57), microscope (5) lower extreme position fixed mounting is provided with a plurality of infrared generator (18).
2. The semiconductor wafer inspection system of claim 1, wherein: the wafer bearing mechanism (14) comprises a negative pressure hole (22), an infrared receiver (19), a bearing disc (16), a cavity (24), a telescopic rod (21), a moving disc (20), a corrugated hose (23), an electromagnet (25) and a first negative pressure pump (12), wherein the first electric slide rail (13) is movably arranged at the bottom end of the moving disc (20), the second electric slide rail (15) is movably arranged at the central position of the moving disc (20), the bearing disc (16) is movably clamped and connected at the inner position of the moving disc (20), the cavity (24) is arranged inside the bearing disc (16), the first negative pressure pump (12) is fixedly arranged at the bottom end central position of the moving disc (20), the corrugated hose (23) is fixedly arranged at the upper end of the first negative pressure pump (12), and the upper end of the corrugated hose (23) is fixed at the central position of the lower end of the bearing disc (16), and communicate with cavity (24), bear dish (16) and be the magnetic metal material, it is provided with electro-magnet (25) to remove the inside fixed position installation of dish (20), bear and evenly seted up a plurality of negative pressure hole (22) on dish (16), bear dish (16) upper end position and inlay fixed a plurality of infrared receiver (19) that is provided with, infrared receiver (19) and computer main body (9) electric connection, infrared receiver (19) are the same with infrared generator (18) quantity to the one-to-one, bear the even movable mounting in dish (16) outside and be provided with a plurality of telescopic link (21), telescopic link (21) opposite side movable mounting sets up on removing dish (20) inside wall to telescopic link (21) are the self-resuming telescopic link.
3. The semiconductor wafer inspection system of claim 2, wherein: the wafer arranging mechanism (10) comprises a dust removing mechanism (58), a sealing mechanism (59), a window (38), a movable plate (39), a second shell (41), a timing switch (56) and an arranging frame (40), a second shell (41) is fixedly arranged at the upper end of the first shell (2), two sides of the second shell (41) are provided with a sealing mechanism (59), the upper end of the sealing mechanism (59) is provided with a dust removing mechanism (58), a window (38) is arranged at the front end of the second shell (41), a movable plate (39) is movably arranged at the front end of the second shell (41), a timing switch (56) is fixedly arranged on the left side of the first shell (2), the timing switch (56) is electrically connected with the first electric push rod (11), and the placement frame (40) is movably arranged in the second shell (41).
4. The system of claim 3, wherein: the sealing mechanism (59) comprises a sealing plate (49), a first sliding groove (47), a spring (48), a fixed pulley (45), a motor (44), a winding wheel (43), a fourth shell (42) and a steel wire rope (46), the fourth shell (42) is fixedly installed at two side end positions of the second shell (41), the first sliding groove (47) is horizontally formed in the fourth shell (42), the sealing plate (49) is movably clamped and connected at the inner position of the first sliding groove (47), the sealing plate (49) movably extends into the second shell (41) and seals the bottom end position of the second shell (41), the spring (48) is fixedly connected between the sealing plate (49) and the inner side wall of the first sliding groove (47), the fixed pulley (45) is fixedly installed in the fourth shell (42), the motor (44) is fixedly installed in the fourth shell (42), motor (44) front end position fixed mounting is provided with winding wheel (43), closing plate (49) one side fixed mounting is provided with wire rope (46), wire rope (46) pass fixed pulley (45) bottom position, and the later winding is fixed in the winding wheel (43) outside, motor (44) and time switch (56) electric connection.
5. The system of claim 4, wherein: the dust removal mechanism (58) comprises a first connecting pipe (55), a second connecting pipe (52), a second negative pressure pump (51), a third shell (50), a dustproof net (54) and a limiting block (53), the upper end of the fourth shell (42) is fixedly provided with the third shell (50), the inside of the third shell (50) is fixedly provided with the limiting block (53), the front end of the third shell (50) is fixedly provided with a door plate, the upper end of the limiting block (53) is movably provided with the dustproof net (54), the inside of the fourth shell (42) is fixedly provided with the second negative pressure pump (51), the upper end of the second negative pressure pump (51) is communicated with the inside of the third shell (50), the lower end of the second negative pressure pump (51) is fixedly provided with the second connecting pipe (52), the left side of the second connecting pipe (52) is divided into a plurality of extending pipes which extend to the inside of the second shell (41), and a first connecting pipe (55) is fixedly arranged at the center of the upper end of the third shell (50), and the first connecting pipe (55) fixedly penetrates into the left side of the second shell (41).
6. The system of claim 5, wherein: the fine adjustment mechanism (57) comprises a screw rod (31), a fixed ring (33), a lantern ring (32), a transmission wheel (34), a transmission belt (35), an operation block (36) and a sealing cover (37), screw rods (31) are movably arranged at the two sides of the lower end of the microscope (5), a lantern ring (32) is sleeved at the outer side end position of the screw rod (31), a fixing ring (33) is fixedly arranged between the lantern rings (32), the fixing ring (33) is fixedly arranged on the outer side of the microscopic probe (7), the lower end of the microscopic probe (7) is sleeved with a sealing cover (37), a driving wheel (34) is fixedly arranged at the lower end of the screw rod (31), a transmission belt (35) is arranged between the transmission wheels (34) in a surrounding mode, an operation block (36) is fixedly arranged at the lower end of each transmission wheel (34), and anti-skid grains are arranged on the outer side of each operation block (36) in a surrounding mode.
7. The system of claim 6, wherein: protection machanism (60) include permanent magnet (26), second spout (27), cell body (29), movable rod (28) and protection cloth (30), second spout (27) have been seted up to computer main part (9) front end both sides position, the inside activity joint of second spout (27) is provided with movable rod (28), cell body (29) have been seted up to movable rod (28) front end position, computer main part (9) inside position is inlayed fixedly and is provided with permanent magnet (26), movable rod (28) are the magnetic metal material, position fixed connection is provided with protection cloth (30) between movable rod (28) bottom and computer main part (9).
8. The system of claim 7, wherein: the first electric slide rail (13) and the second electric slide rail (15) are electrically connected with the computer main body (9).
9. The inspection method of claim 8, wherein: the method specifically comprises the following steps:
the first step is as follows: when the device is used, a wafer to be detected is placed on the placing frame (40), then the wafer is conveyed into the second shell (41) through the window (38), and is placed at the upper end position of the closing plate (49), then the window (38) is closed through the movable plate (39), then the second negative pressure pump (51) is started, the second negative pressure pump (51) enables the inside of the third shell (50) to form negative pressure, so that the first connecting pipe (55) sucks air in the inside of the second shell (41) into the third shell (50), the air is filtered by the dust screen (54), then the air is injected into the second shell (41) through the second connecting pipe (52), the air in the second shell (41) is purified, dust is prevented from entering the inside of the first shell (2), the timing switch (56) starts the motor (44) to drive the winding wheel (43) to rotate after a certain time, and the steel wire rope (46) is wound outside the winding wheel (43), the closing plate (49) is pulled to move along the first sliding groove (47) to extrude the spring (48) until the placing frame (40) drops to the upper end of the horizontal plate (17), then the timing switch (56) starts the first electric push rod (11) to move the horizontal plate (17) to the inside of the first shell (2), then the motor (44) rotates reversely, the spring (48) can drive the closing plate (49) to reset again to close the position between the second shell (41) and the first shell (2), so that external dust is prevented from entering the inside of the first shell (2), and the cleanness of the inside of the first shell (2) is guaranteed;
the second step is that: when in detection, the hand position penetrates through the rubber gloves (3), then the wafer is arranged at the upper end position of the bearing disc (16), then the electromagnet (25) is started to adsorb and fix the bearing disc (16), and the first negative pressure pump (12) is started, the first negative pressure pump (12) enables the negative pressure inside the negative pressure hole (22) to form negative pressure through the cavity (24), so that the wafer is adsorbed and fixed, the clamping and fixing are not needed, the wafer is prevented from being damaged by clamping, meanwhile, the infrared ray generated by the infrared ray generator (18) after the wafer is arranged is received by the infrared ray receiver (19), the wafer is in a proper position, if the wafer deviates, the infrared ray receiver (19) at the deviation position cannot receive the infrared ray, so that data cannot be transmitted to the inside of the computer main body (9), the wafer is in a deviation state at the moment, the wafer position is adjusted to the proper position, and subsequent detection work is facilitated, the wafer position caused by the deviation can not be effectively detected to cause missed detection, and after the detection is finished, if special defects needing manual detection appear, a user penetrates the rubber gloves (3) with the hand position, then the electromagnet (25) is closed, then the bearing disc (16) is moved until the defect position is moved to a position under a microscope probe (7) at the lower end of the microscope (5), then the electromagnet (25) is started to fix the bearing disc (16), and manual reinspection is conveniently carried out on the defect position;
the third step: when the microscope is used, the screw rod (31) is rotated through the operation block (36), the screw rod (31) is rotated, the screw rods (31) on two sides are linked through the transmission wheel (34) and the transmission belt (35), the lantern ring (32) moves up and down along the screw rod (31) when the screw rod (31) rotates, so that the up-and-down position of the microscope probe (7) can be adjusted, fine adjustment work is facilitated, and the definition of a microscope picture is guaranteed;
the fourth step: when not using, the user upwards removes movable rod (28) along second spout (27) for movable rod (28) adsorb to be fixed in permanent magnet (26) bottom position, so can make protection cloth (30) shelter from in computer main body (9) front position, thereby conveniently protect computer main body (9), effectively prevent that computer main body (9) from being polluted, improve the life of computer main body (9).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111513315.2A CN114160450A (en) | 2021-12-12 | 2021-12-12 | Semiconductor wafer detection system and detection method thereof |
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| CN202111513315.2A CN114160450A (en) | 2021-12-12 | 2021-12-12 | Semiconductor wafer detection system and detection method thereof |
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| CN202111513315.2A Withdrawn CN114160450A (en) | 2021-12-12 | 2021-12-12 | Semiconductor wafer detection system and detection method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377978A (en) * | 2022-03-23 | 2022-04-22 | 深圳超盈智能科技有限公司 | Defect detection device of semiconductor chip |
| CN115015596A (en) * | 2022-06-09 | 2022-09-06 | 法特迪精密科技（苏州）有限公司 | Semiconductor attitude adjusting structure, adjusting method and probe station |
| CN116500047A (en) * | 2023-06-28 | 2023-07-28 | 苏州鸿安机械股份有限公司 | Wafer defect detection equipment |
| CN117085971A (en) * | 2023-10-18 | 2023-11-21 | 淄博澳丰电子有限公司 | Detection device for tube seat |
| CN117259331A (en) * | 2023-11-23 | 2023-12-22 | 青岛立昂晶电半导体科技有限公司 | Dosing device for automatic cleaning of indium phosphide wafers comprising a flow control |
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2021
- 2021-12-12 CN CN202111513315.2A patent/CN114160450A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114377978A (en) * | 2022-03-23 | 2022-04-22 | 深圳超盈智能科技有限公司 | Defect detection device of semiconductor chip |
| CN114377978B (en) * | 2022-03-23 | 2022-06-14 | 深圳超盈智能科技有限公司 | Defect detection device of semiconductor chip |
| CN115015596A (en) * | 2022-06-09 | 2022-09-06 | 法特迪精密科技（苏州）有限公司 | Semiconductor attitude adjusting structure, adjusting method and probe station |
| CN115015596B (en) * | 2022-06-09 | 2023-03-17 | 法特迪精密科技（苏州）有限公司 | Semiconductor attitude adjusting structure, adjusting method and probe station |
| CN116500047A (en) * | 2023-06-28 | 2023-07-28 | 苏州鸿安机械股份有限公司 | Wafer defect detection equipment |
| CN116500047B (en) * | 2023-06-28 | 2023-09-08 | 苏州鸿安机械股份有限公司 | Wafer defect detection equipment |
| CN117085971A (en) * | 2023-10-18 | 2023-11-21 | 淄博澳丰电子有限公司 | Detection device for tube seat |
| CN117085971B (en) * | 2023-10-18 | 2023-12-15 | 淄博澳丰电子有限公司 | Detection device for tube seat |
| CN117259331A (en) * | 2023-11-23 | 2023-12-22 | 青岛立昂晶电半导体科技有限公司 | Dosing device for automatic cleaning of indium phosphide wafers comprising a flow control |
| CN117259331B (en) * | 2023-11-23 | 2024-02-20 | 青岛立昂晶电半导体科技有限公司 | Dosing device for automatic cleaning of indium phosphide wafers comprising a flow control |
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Application publication date: 20220311 |