CN114141793A - Display panel, preparation method thereof and display device - Google Patents

Display panel, preparation method thereof and display device Download PDF

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Publication number
CN114141793A
CN114141793A CN202111445725.8A CN202111445725A CN114141793A CN 114141793 A CN114141793 A CN 114141793A CN 202111445725 A CN202111445725 A CN 202111445725A CN 114141793 A CN114141793 A CN 114141793A
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China
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layer
metal layer
display panel
cavity
composite
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CN202111445725.8A
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Chinese (zh)
Inventor
黄丹
谢锋
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Hubei Changjiang New Display Industry Innovation Center Co Ltd
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Hubei Changjiang New Display Industry Innovation Center Co Ltd
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Priority to CN202111445725.8A priority Critical patent/CN114141793A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The embodiment of the application provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises a substrate, a protruding structure and a first organic layer; the substrate comprises a non-display area and a display area; a protrusion structure disposed in a non-display region of the substrate, the protrusion structure including a first composite layer and a second composite layer stacked, and the protrusion structure including a cavity; the first composite layer is positioned on one side of the second composite layer close to the substrate, and the cavity penetrates through the second composite layer and at least part of the first composite layer along the thickness direction of the display panel; the first organic layer extends from the display area to the non-display area, the first organic layer is positioned on one side, away from the substrate, of the second composite layer, and the first organic layer is disconnected at the cavity. In the present application, the first organic layer is broken at the cavity, blocking the path of external water oxygen into the display region. Meanwhile, the two composite layers in the protruding structure can also comprise metal, so that the stability of the cavity is improved, and the reliability of the disconnection of the first organic layer at the cavity is ensured.

Description

Display panel, preparation method thereof and display device
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
[ background of the invention ]
The Organic Light-Emitting Diode (OLED) display panel has the advantages of simple manufacturing process, low power consumption, Light weight, fast response speed, wide viewing angle, high resolution, wide temperature characteristic and the like, and has wide market application prospect.
At present, the display area of the OLED display panel is getting larger, and in order to enrich the functions of the display device, some light sensing elements are usually disposed in the display area, and a non-display area is disposed around the light sensing elements. This causes water and oxygen in the external environment to easily enter the display area through the area where the photosensitive element is located and the non-display area around the photosensitive element, and erodes the components in the display area, thereby affecting the yield of the display panel.
[ application contents ]
In view of the above, embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device to solve the above problems.
In a first aspect, an embodiment of the present application provides a display panel, including a substrate, a protruding structure, and a first organic layer; the substrate comprises a non-display area and a display area; a protrusion structure disposed in a non-display region of the substrate, the protrusion structure including a first composite layer and a second composite layer stacked, and the protrusion structure including a cavity; the first composite layer is positioned on one side of the second composite layer close to the substrate, and the cavity penetrates through the second composite layer and at least part of the first composite layer along the thickness direction of the display panel; the first organic layer extends from the display area to the non-display area, the first organic layer is positioned on one side, away from the substrate, of the second composite layer, and the first organic layer is disconnected at the cavity.
In one implementation of the first aspect, the substrate further comprises an open area, the open area extending through the substrate, the non-display area comprising a first non-display area, the first non-display area being located between the open area and the display area and at least partially surrounding the open area, the display area at least partially surrounding the first non-display area; the first organic layer extends from the display region to the first non-display region, and the protrusion structure is disposed in the first non-display region of the substrate.
In one implementation of the first aspect, the second composite layer includes a first metal layer and a second metal layer, the first metal layer is located on a side of the second metal layer close to the substrate; and the first metal layer is of a different material than the second metal layer.
In one implementation manner of the first aspect, the second composite layer further includes a third metal layer, the third metal layer is located on a side of the second metal layer away from the first metal layer, and the third metal layer is the same as the first metal layer in material.
In one implementation form of the first aspect, the material of the first metal layer comprises Ti and the material of the second metal layer comprises Al.
In one implementation of the first aspect, the first composite layer includes a fourth metal layer, the fourth metal layer is located on a side of the cavity close to the substrate, the fourth metal layer is connected to the first metal layer, and the fourth metal layer is made of the same material as the first metal layer.
In one implementation of the first aspect, the first composite layer further includes a fifth metal layer, and the fifth metal layer is attached to a surface of the first metal layer facing the substrate, and is made of the same material as the first metal layer.
In one implementation manner of the first aspect, the display panel further includes a transistor array layer, the transistor array layer includes a transistor, and the first composite layer is fabricated on the same layer as a source or a drain of the transistor.
In an implementation manner of the first aspect, the display panel further includes a transition metal layer, the transition metal layer is located on a side of the source or the drain of the transistor away from the substrate, and the second composite layer and the transition metal layer are prepared on the same layer.
In one implementation of the first aspect, the thickness of the first organic layer is less than the depth of the cavity in a thickness direction of the display panel.
In one implementation manner of the first aspect, the cavity comprises first side surfaces connected with each other, the first side surfaces are connected with the bottom surface of the cavity, an included angle between each first side surface and the bottom surface of the cavity is theta, and theta is larger than 0 degree and smaller than or equal to 90 degrees.
In one implementation of the first aspect, the first organic layer is disposed over the entire display area.
In one implementation form of the first aspect, the first organic layer includes at least one of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer.
In one implementation of the first aspect, the projection structure further includes a protective layer covering at least a portion of a surface of the second composite layer facing the cavity.
In a second aspect, an embodiment of the present application provides a display device, including the display panel provided in the first aspect.
In a third aspect, an embodiment of the present application provides a method for manufacturing a display panel, including:
providing a substrate, wherein the substrate comprises a non-display area and a display area;
depositing a first film layer in a non-display area of a substrate, and etching the first film layer to form an initial structure;
depositing a second film layer on the initial structure, the second film layer covering the initial structure;
etching the second film layer to form a second composite layer, wherein the second composite layer comprises a first opening;
etching the initial structure to form a first composite layer, wherein the first composite layer comprises a second opening;
wherein, the first opening is communicated with the second opening to form a cavity.
In one implementation of the third aspect, the second composite layer includes a first metal layer and a second metal layer, the first metal layer being located between the second metal layer and the initial structure; and the first metal layer is of a different material than the second metal layer.
In one implementation of the third aspect, the initial structure comprises an intermediate layer and a fifth metal layer, the fifth metal layer being located on a side of the intermediate layer remote from the substrate; the fifth metal layer is made of the same material as the first metal layer and is made of a different material from the intermediate layer;
etching the initial structure to form a first metal composite layer, comprising:
dry etching the fifth metal layer to form a first sub-opening in the fifth metal layer;
and wet etching the intermediate layer to form a second opening including the first sub-opening.
In one implementation manner of the third aspect, before etching the initial structure to form the first composite layer, the method further includes: and preparing a protective layer, wherein the protective layer at least covers part of the surface of the second composite layer facing the cavity.
In this application, first organic layer is in cavity department disconnection, has blocked the route that external water oxygen got into the display area through first organic layer to avoided the erosion of water oxygen to components and parts in the display area, and then improved display panel's finished product yield. Meanwhile, the protruding structure comprises two layers of composite layers, and the two layers of composite layers can also comprise metal, so that the stability of the protruding structure is improved, the stability and controllability of the shape of the cavity are ensured, and the reliability of the disconnection of the first organic layer at the cavity is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 3 is a schematic view of a display panel according to an embodiment of the present disclosure;
fig. 4 is a schematic view of another display panel provided in an embodiment of the present application;
FIG. 5 is a schematic view of a bump structure provided in an embodiment of the present application;
FIG. 6 is a schematic view of another bump structure provided in the embodiments of the present application;
FIG. 7 is a schematic view of another bump structure provided in embodiments of the present application;
fig. 8 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 9 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
FIG. 10 is a schematic view of another bump structure provided in an embodiment of the present application;
fig. 11 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 12 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 13 is an enlarged view of a structure formed in step S4 of FIG. 11;
FIG. 14 is an enlarged view of a structure formed in step S4 of FIG. 12;
fig. 15 is a schematic flowchart of another display panel manufacturing method according to an embodiment of the present disclosure;
fig. 16 is a flowchart illustrating a method for manufacturing a display panel according to another embodiment of the present disclosure;
fig. 17 is a schematic partial manufacturing flow diagram of a display panel according to an embodiment of the present disclosure;
fig. 18 is a schematic view of a display device according to an embodiment of the present application.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
In the description herein, it is to be understood that the terms "substantially", "approximately", "about", "substantially", and the like, as used in the claims and the examples herein, are intended to be generally accepted as not being precise, within the scope of reasonable process operation or tolerance.
It should be understood that although the terms first, second, etc. may be used in the embodiments of the present application to describe composite layers, metal layers, etc., these composite layers, metal layers, etc. should not be limited to these terms. These terms are only used to distinguish composite layers, metal layers, and the like from one another. For example, a first composite layer may also be referred to as a second composite layer, and similarly, a second composite layer may also be referred to as a first composite layer, without departing from the scope of embodiments herein.
The applicant provides a solution to the problems of the prior art through intensive research.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure.
The embodiment of the present application provides a display panel 001, as shown in fig. 1, the display panel 001 includes a substrate 10, a protrusion structure 20, and a first organic layer 30, and the substrate 10 includes a display area AA and a non-display area BB. The bump structure 20 is disposed in the non-display area BB of the substrate 10, and the bump structure 20 includes a first composite layer 21 and a second composite layer 22 stacked, where the first composite layer 21 is located on a side of the second composite layer 22 close to the substrate 10. That is, the second composite layer 22 covers the outer surface of the first composite layer 21 in the thickness direction of the display panel 001.
The first composite layer 21 and the second composite layer 22 in the present application are each a specific structure in the display panel 001. It should be noted that the final structure of the first composite layer 21 in the display panel 001 may be only one layer, and the first composite layer 21 is named as the first composite layer in the preparation process of the display panel 001, and the intermediate state thereof includes different material layers stacked. In addition, the final structure of the first composite layer 21 in the display panel 001 may also include different material film layers, or as shown in fig. 1, the final structure of the first composite layer 21 in the display panel 001 may also include partial residues 210 of other film layers, and the final structure of the second composite layer 22 in the display panel 001 may also include different material film layers.
Further, the first composite layer 21 and the second composite layer 22 may both be metal composite layers. Further, the first composite layer 21 and the second composite layer 22 may include metal composite layers of the same material.
The protrusion structure 20 further includes a cavity 23, and the cavity 23 penetrates through the second composite layer 22 and at least a portion of the first composite layer 21 in a thickness direction of the display panel 001. That is, the cavity 23 includes an opening away from the substrate 10. It is understood that the cavity 23 may be formed by etching the materials in the second composite layer 22 and the first composite layer 21. As can be seen from fig. 1, the second composite layer 22 is located at the periphery of the first composite layer 21 and surrounds the first composite layer 21, and the side of the cavity 23 at least includes the second composite layer 22, so that the cavity 23 is formed by etching the first composite layer 21 wrapped by the second composite layer 22 to form the cavity 23.
The first organic layer 30 extends from the display area AA to the non-display area BB, the first organic layer 30 is located on a side of the second composite layer 22 away from the substrate 10, i.e., in the non-display area BB, the first organic layer 30 is located on a side of the protruding structure 20 away from the substrate 10. Wherein the first organic layer 30 is disconnected at the cavity 23, that is, the portions of the first organic layer 30 located at both sides of the cavity 23 are discontinuous structures. That is, the portion of the first organic layer 30 located in the non-display area BB is discontinuous.
The light emitting device in the organic light emitting display panel may be an organic light-emitting diode (OLED), and the OLED is a current type organic light emitting device, and emits light by injecting and combining carriers, and the light emitting intensity is proportional to the injected current. Under the action of an electric field, holes generated by an anode and electrons generated by a cathode move, are respectively injected into a hole transport layer and an electron transport layer, and migrate to a light emitting layer. When the two meet at the light emitting layer, energy excitons are generated, thereby exciting the light emitting molecules to finally generate visible light.
In the process of manufacturing an OLED display panel, functional layers such as hole transport layers and electron transport layers located on both sides of a light emitting layer are generally evaporated on the whole surface by using a common mask, which results in that the functional layers extend from a display region to a non-display region. And these functional layers are the organic layer that organic material formed usually, and the effect of organic layer separation water oxygen is relatively poor, and when the water oxygen among the external environment invaded, water oxygen can be along inside organic layer entering display panel, erodees the regional components and parts of display to influence display panel's normal demonstration.
The first organic layer 30 in the present application may include at least one of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer.
Alternatively, the first organic layer 30 is disposed entirely in the display area AA.
In the embodiment of the present application, the first organic layer 30 is disconnected at the cavity 23, and a path through which external water and oxygen enter the display area AA through the first organic layer 30 is blocked, so that corrosion of the water and oxygen to components in the display area AA is avoided, and the yield of the finished products of the display panel 001 is improved.
Meanwhile, the projection structure 20 includes two composite layers, the second composite layer 22 is located at the periphery of the first composite layer 21 and surrounds the first composite layer 21, and the side of the cavity 23 is at least partially surrounded by the second composite layer 22. The second composite layer 22 located at the side of the cavity 23 improves the stability of the protruding structure 20, thereby being beneficial to ensure the stable shape of the cavity 23 and improving the reliability of the disconnection of the first organic layer 30 at the cavity 23.
Fig. 2 is a schematic structural diagram of another display panel provided in the embodiment of the present application.
As shown in fig. 2, in one embodiment of the present application, the second composite layer 22 includes a base portion 220 that extends parallel to the substrate 10 and in a direction away from the cavity 23.
The embodiment of the present application increases the contact area between the second composite layer 22 and the film layer therebelow, for example, increases the contact area between the second composite layer 22 and the substrate 10, and further improves the stability of the protrusion structure 20, thereby being beneficial to ensuring the stable shape of the cavity 23.
Fig. 3 is a schematic view of a display panel provided in an embodiment of the present application, and fig. 4 is a schematic view of another display panel provided in the embodiment of the present application.
In one embodiment of the present application, please refer to fig. 1 and 3 or fig. 1 and 4, the substrate 10 further includes an opening region CC, and the opening region CC penetrates through the substrate 10. The non-display area BB includes a first non-display area YB located between the opening area CC and the display area AA, and the first non-display area YB at least partially surrounds the opening area CC and the display area AA at least partially surrounds the first non-display area YB.
Alternatively, as shown in FIG. 3, the first non-display area YB entirely surrounds the opening area CC, and the display area AA entirely surrounds the first non-display area YB.
Alternatively, as shown in FIG. 4, the first non-display area YB partially surrounds the opening area CC, and the display area AA partially surrounds the first non-display area YB.
Wherein the first organic layer 30 extends from the display area AA to the first non-display area YB, and the protrusion structures 20 are disposed in the first non-display area YB of the substrate 10.
It can be understood that the opening area CC can be used to set a photosensitive element (such as a camera, fingerprint recognition, etc.), and there is no shielding device in the opening area CC for the light collection process of the photosensitive element, so as to provide the accuracy of the signal collected by the light sensing device. Due to the open area CC, water oxygen in the external environment easily invades into the first organic layer 30 through the open area CC and enters the display area AA through the first organic layer 30.
In this embodiment, the protruding structure 20 is disposed in the first non-display area YB at least partially surrounding the opening area CC, and then the portion of the first organic layer 30 extending to the first non-display area YB is disconnected in the cavity 23 of the protruding structure 20, so as to block water and oxygen in the external environment from entering the display area AA through the first organic layer 30, thereby preventing corrosion of components in the display area AA by water and oxygen, and further improving the yield of the display panel 001.
It should be noted that the raised structure 20 may surround the opening area CC, i.e. the cavity 23 may surround the opening area CC. Thereby ensuring that water oxygen in the external environment is blocked from entering the display area AA from all directions of the open area CC.
In addition, the protrusion structures 20 may be disposed along the extending direction of the first non-display area YB, i.e., the cavities 23 are disposed along the extending direction of the first non-display area YB. For example, when the first non-display area YB partially surrounds the opening area CC, the cavity 23 is disposed in the first non-display area YB, and a portion of the opening area CC surrounded by the first non-display area YB is also surrounded by the cavity 23.
Fig. 5 is a schematic view of a bump structure provided in an embodiment of the present application.
In one embodiment of the present application, as shown in fig. 5, the second composite layer 22 includes a first metal layer 221 and a second metal layer 222, the first metal layer 221 is located on a side of the second metal layer 222 close to the substrate 10 or the first metal layer 221 is located on a side of the second metal layer 222 close to the cavity 23, and the first metal layer 221 and the second metal layer 222 are made of different materials.
It should be noted that, when the first metal layer 221 and the second metal layer 222 are etched by the same method, the etching rates of the first metal layer 221 and the second metal layer 222 may be different.
In the embodiment of the present application, the second composite layer 22 includes two metal layers having different etching rates, and the etching degree of the second composite layer 22 is easily controlled during the formation of the cavity 23 in the protruding structure 20. Moreover, since the second composite layer 22 covers the outer surface of the first composite layer 21, during the etching process of the first composite layer 21, the etching rate of the first metal layer 221 in the second composite layer 22 may be slower than the etching rate of the material layer etched away to form the cavity in the first composite layer 21, so that the portion of the second composite layer 22 surrounding the side surface of the cavity 23 may be well protected, and the collapse of the protrusion structure 20 due to the formation of the opening on the side surface of the cavity 23 may be avoided. The embodiment of the present application is advantageous for improving the stability of the protruding structure 20, thereby improving the reliability of the cavity 23.
Fig. 6 is a schematic view of another bump structure provided in the embodiment of the present application.
As shown in fig. 6, in one embodiment of the present application, the second composite layer 22 further includes a third metal layer 223, the third metal layer 223 being located on a side of the second metal layer 222 away from the first metal layer 221, that is, the second metal layer 222 is located between the first metal layer 221 and the third metal layer 223.
Wherein the third metal layer 223 is the same as the first metal layer 221 in material. Further, the first metal layer 221 and the third metal layer 223 may be etched at the same rate, and the first metal layer 221 may be etched at a slower rate relative to the second metal layer 222.
In the embodiment of the present application, at least a partial region of the second metal layer 222 is protected by at least two metal layers with slower etching speed, which is beneficial to further reduce the etching degree of the second composite layer 22. The side surface of the cavity 23 is prevented from being opened during the process of forming the cavity 23, so that the convex structure 20 is prevented from collapsing, and the stability and reliability of the cavity 23 are further improved.
Alternatively, the material of the first metal layer 221 includes Ti, and the material of the second metal layer 222 includes Al. It is understood that the material of the third metal layer 223 also includes Ti.
Fig. 7 is a schematic view of another bump structure provided in the embodiment of the present application.
As shown in fig. 7, in one embodiment of the present application, the first composite layer 21 includes a fourth metal layer 211, and the fourth metal layer 211 is located on one side of the cavity 23 close to the substrate 10, i.e., the fourth metal layer 211 is located on the bottom side of the cavity 23. The fourth metal layer 211 is connected to the first metal layer 221, and the fourth metal layer 211 is the same material as the first metal layer 221.
It is understood that the first metal layer 221 includes a portion surrounding the side of the cavity. The fourth metal layer 211 is integrally connected to the first metal layer 221. The side and bottom surfaces of the cavity 23 are at least partially surrounded by the whole formed by the connection of the fourth metal layer 211 and the first metal layer 221, which further improves the stability of the cavity 23 and facilitates the controllability of the size of the cavity 23.
In one embodiment of the present application, please continue to refer to fig. 7, the first composite layer 21 further includes a fifth metal layer 212, and the fifth metal layer 212 is attached to a surface of the first metal layer 221 facing the substrate 10, that is, the fifth metal layer 212 is in direct contact with the first metal layer 221, and the fifth metal layer 212 is located below the first metal layer 221. The fifth metal layer 212 is the same material as the first metal layer 221.
In the embodiment of the present application, the fifth metal layer 212 is disposed to support the first metal layer 221, that is, the fifth metal layer 212 in the first composite layer 21 can support the second composite layer 22, so as to better ensure the shape and appearance of the protruding structure 20. Moreover, since the material of the fifth metal layer 212 is the same as that of the first metal layer 221, the fifth metal layer 212 can protect the first metal layer 221 during the etching of the first composite layer 21, so as to protect the second composite layer 22 from being further etched, which is beneficial to protecting the form of the second composite layer 22.
Please refer to fig. 7, in the embodiment of the present application, the fifth metal layer 212 may cover a partial area Q1 of the cavity 23 along the thickness direction of the display panel 001. Therefore, when the first organic layer 30 is prepared using a process such as evaporation, the first organic layer 30 is not formed in the region Q1 where the cavity 23 is covered by the fifth organic layer 212, and the reliability of the first organic layer 30 being broken at the cavity 23 is improved, thereby reducing the possibility that water oxygen in the external environment enters the display area AA.
Fig. 8 is a schematic structural diagram of another display panel according to an embodiment of the present disclosure.
As shown in fig. 8, in an embodiment of the present application, the display panel 001 further includes a transistor array layer 40, the transistor array layer 40 includes a transistor 41, and the first composite layer 21 is fabricated on the same layer as the source 411/drain 412 of the transistor 41.
Wherein the transistor array layer 40 is located between the first organic layer 30 and the substrate 10, and the source 411 and the drain 412 of the transistor 41 are fabricated in the same layer. In the embodiment of the present application, the first composite layer 21 and the source 411/drain 412 of the transistor 41 are fabricated on the same layer, which is beneficial to simplifying the fabrication process and saving the fabrication cost.
Further, the material comprised by the first composite layer 21 may be at least partially the same as the material of the source 411/drain 412 of the transistor 41. It should be noted that, in the process of forming the cavity 23, the first composite layer 21 is formed by etching, and the material of the structure before etching corresponding to the first composite layer 21 may be completely the same as the material of the source 411/the drain 412 of the transistor 41, but the material of the first composite layer 21 formed by etching may be the same as only a part of the material of the source 411/the drain 412.
In addition, when the source 411 and the drain 412 of the transistor 41 are a Ti/Al/Ti composite layer, the first composite layer 21 may be Ti/Al/Ti, or the first composite layer 21 may be Ti/Ti.
Fig. 9 is a schematic structural diagram of another display panel according to an embodiment of the present application.
In an embodiment of the present application, as shown in fig. 9, the display panel 001 further includes a transition metal layer 50, the transition metal layer 50 is located on a side of the source or the drain of the transistor 41 away from the substrate 10, and the second composite layer 22 is fabricated on the same layer as the transition metal layer 50.
It is to be understood that a light emitting device is included in the display panel 001, and a pixel circuit formed of the transistor 41 in the transistor array layer 40 is used to supply a light emitting signal to the light emitting device. The light emitting signal is generally transmitted from the source 411 or the drain 412 of the transistor 41 to an electrode of the light emitting device, and the source 411 or the drain 412 of the transistor 41 and the electrode of the light emitting device are electrically connected through a via hole. However, since the depth of the via hole is deep, the source 411 or the drain 412 of the transistor 41 and the electrode of the light emitting device are easily broken when electrically connected through the via hole. Therefore, in order to improve the reliability of the electrical connection between the source 411 or the drain 412 of the transistor 41 and the electrode of the light emitting device, a transition metal layer 50 is disposed between the source 411 or the drain 412 of the transistor 41 and the electrode of the light emitting device, and the source 411 or the drain 412 of the transistor 41 and the electrode of the light emitting device are electrically connected through the transition metal layer 50. Of course, the transition metal layer 50 is located between the first organic layer 30 and the transistor array layer 40.
In the embodiment of the present application, the second composite layer 22 and the transition metal layer 50 are formed by using the same patterning process, so that when the transition metal layer 50 is prepared, the preparation of the second composite layer 22 is completed simultaneously, the preparation process is further simplified, and the manufacturing cost is saved.
It should be noted that the second composite layer 22 may include the same material as the transition metal layer 50.
Referring to fig. 1, in an embodiment of the present application, a thickness D1 of the first organic layer 30 is smaller than a depth D2 of the cavity 23 along a thickness direction of the display panel 001. The reliability of the disconnection of the first organic layer 30 at the cavity 23 is ensured.
Specifically, as shown in fig. 1, the first organic layer 30 includes a first portion 31 and a second portion 32, the first portion 31 covering at least a portion of a surface of the second composite layer 22 away from the substrate 10, and the second portion 32 being located within the cavity 23. It will be appreciated that the first portion 31 and the second portion 32 are formed by the same manufacturing process. Due to the arrangement of the cavity 23, the first organic layer 30 may be broken at the cavity 23 to form a first portion 31 located outside the cavity 23 and a second portion 32 located inside the cavity.
Since the thickness D1 of the first organic layer 30 is less than the depth D2 of the cavity 23, the thickness D1 of each of the first and second portions 31 and 32 is less than the depth D2 of the cavity 23. That is, there is a distance between the surface of the first portion 31 close to the substrate 10 and the surface of the second portion 32 far from the substrate 10 in the thickness direction of the display panel 001. A complete disconnection between the first portion 31 and the second portion 32 is ensured, thus ensuring a complete blocking of the path of water oxygen ingress in the external environment.
In one embodiment of the present application, with continued reference to FIG. 7, the cavity 23 includes a first side 231 connected to each other, the first side 231 is connected to a bottom 232 of the cavity, and an included angle between the first side 231 and the bottom 232 of the cavity 23 is θ, wherein θ is greater than 0 ° < θ ≦ 90 °.
Wherein, the closer to the substrate 10 in the cavity 23, the larger the distance between the side surfaces of the two opposite sides thereof, i.e. the closer to the substrate 10, the larger the width of the cavity 23, ensuring the reliability of the disconnection of the first organic layer 30 at the position of the cavity 23.
In the embodiment of the present application, due to the arrangement of the included angle θ, an area of the bottom surface 232 of the cavity 23 covered by the first side surface 231 in the thickness direction of the display panel 001 may be increased. Therefore, when the first organic layer 30 is prepared by using a process such as evaporation, the first organic layer 30 is not formed in the region of the cavity 23 covered by the first side surface 231 due to the shielding of the first side surface 231, the reliability of the disconnection of the first organic layer 30 at the cavity 23 is further improved, and the possibility that water and oxygen in the external environment enter the display area AA can be further reduced.
Fig. 10 is a schematic view of another bump structure provided in an embodiment of the present application.
In one embodiment of the present application, as shown in fig. 10, the bump structure 20 further includes a protective layer 24, and the protective layer 24 covers at least a portion of the surface 22a of the second composite layer 22 facing the cavity 23.
Specifically, the portion of the cavity 23 penetrating the second composite layer 22 may be the first opening 22M, and the protective layer 24 covers at least a surface of the second composite layer 22 facing the first opening 22M.
Optionally, the protective layer 24 covers the surface of the second composite layer 22 facing the first opening 22M and the surface of the second composite layer 22 facing away from the substrate 10, which is advantageous for facilitating the preparation of the protective layer 24.
In the embodiment of the present application, during the etching process of the first composite layer 21, the protection layer 24 is disposed to protect the surface 22a of the second composite layer 22 facing the cavity 23 from being further etched, which is beneficial to realize the controllable form of the second composite layer 22.
Fig. 11 is a flowchart illustrating a manufacturing method of a display panel according to an embodiment of the present application, and fig. 12 is a flowchart illustrating a manufacturing method of another display panel according to an embodiment of the present application.
The embodiment of the present application provides a manufacturing method of a display panel 001, and the manufacturing method can be used for preparing the display panel 001 provided in the embodiment. As shown in fig. 11 and 12, the manufacturing method includes:
step S1: a substrate 10 is provided, the substrate 10 comprising a non-display area BB and a display area AA.
Step S2: depositing a first film layer 21A on the non-display area BB of the substrate 10, and etching the first film layer 21A to form an initial structure 21B. The included angle between the side surface and the bottom surface of the initial structure 21B is theta, and theta is more than 0 degree and less than or equal to 90 degrees.
The first film layer 21A is a composite film layer. Further, the first film layer 21A may be deposited on the same layer as the source 411 and the drain 412 of the transistor 41, and the first film layer 21A may have the same material structure as the source 411 or the drain 412. For example, the source 411 and the drain 412 may be made of a Ti/Al/Ti alloy, and the first film layer 21A may also be a Ti/Al/Ti structure.
Step S3: depositing a second film layer 22A on the initial structure 21B, the second film layer 22A covering the initial structure 21B;
the second film layer 22A covers the other surfaces of the initial structure 21B than the surface close to the substrate 10, i.e. the second film layer 22A covers the side wall surfaces and the top surface of the initial structure 21B.
The second film layer 22A is a composite film layer. Further, the second film layer 22A may be combined with a transition metal layer
50 are deposited in the same layer, and accordingly, the second film layer 22A may be formed of the same material as the transition metal layer 50. For example, the transition metal layer 50 may be made of a Ti/Al/Ti alloy, and the second film layer 22A may also be a Ti/Al/Ti structure.
Step S4: etching the second film layer 22A to form a second composite layer 22, the second composite layer 22 including a first opening 22M; it is understood that the first opening 22M extends through the second composite layer 22.
Optionally, dry etching is used for etching the second film layer 22A, which is beneficial to controlling the form of the first opening 22M.
Step S5: the initial structure 21B is etched to form the first composite layer 21, and the first composite layer 21 includes the second opening 21M. The second opening 21M may penetrate the first composite layer 21, or the second opening 21M may penetrate a portion of the first composite layer 21.
The first opening 22M and the second opening 21M communicate with each other to form a cavity 23.
It is to be understood that the substrate 10 may further include an opening area (not shown) extending through the substrate 10, the non-display area BB may further include a first non-display area YB between the opening area and the display area AA, and the first non-display area YB at least partially surrounds the opening area, and the display area AA at least partially surrounds the first non-display area YB.
Among them, steps S2 to S5 in fig. 11 and 12 may be prepared in the first non-display area YB.
Fig. 13 is an enlarged view of a structure formed at step S4 in fig. 11, and fig. 14 is an enlarged view of a structure formed at step S4 in fig. 12.
In one embodiment of the present application, as shown in fig. 13 and 14, the second composite layer 22 includes a first metal layer 221 and a second metal layer 222, the first metal layer 221 is located between the second metal layer 222 and the initial structure 21B, and the first metal layer 221 is different from the second metal layer 222 in material. It is understood that the rates at which the first metal layer 221 and the second metal layer 222 are etched may be different.
Further, the etching rate of the first metal layer 221 may be smaller than that of the second metal layer 222, and in the step S5 of fig. 11 and 12, it may be ensured that the second opening 21M maintains a stable form during the etching of the initial structure 21B. It is avoided that during the formation of the cavity 23, an opening is formed in the side of the cavity 23, which results in a collapse of the protruding structure 20.
Note that, as shown in fig. 13 and 14, the second composite layer 22 may further include a third metal layer 223, and the third metal layer 223 is located on the side of the second metal layer 222 away from the first metal layer 221. That is, the second metal layer 222 is located in the middle of the first metal layer 221 and the third metal layer 223.
Alternatively, the material of the third metal layer 223 is the same as that of the first metal layer 221.
Fig. 15 is a flowchart illustrating another manufacturing method of a display panel according to an embodiment of the present disclosure, and fig. 16 is a flowchart illustrating another manufacturing method of a display panel according to an embodiment of the present disclosure.
In one embodiment of the present application, with continued reference to fig. 13, the initial structure 21B includes an intermediate layer 213 and a fifth metal layer 212, the fifth metal layer 212 is located on a side of the intermediate layer 213 away from the substrate 10, the fifth metal layer 212 may be the same material as the first metal layer 221, and the fifth metal layer 212 is different from the intermediate layer 213.
Alternatively, as shown in fig. 14, the initial structure 21B may further include a fourth metal layer 211, where the fourth metal layer 211 is located on a side of the intermediate layer 213 close to the substrate 10; the fourth metal layer 211 is connected to the first metal layer 221, and the fourth metal layer 211 is made of the same material as the first metal layer 221.
Wherein, as shown in fig. 15, in step S5 shown in fig. 11, or as shown in fig. 16, in step S5 shown in fig. 12, etching the initial structure 21B to form the first composite layer 21 includes:
step S51: dry etching the fifth metal layer 212, forming a first sub-opening 211M in the fifth metal layer 212;
step S52: the intermediate layer 213 is wet etched to form the second opening 21M including the first sub-opening 211M.
The second opening 21M formed after wet etching may have a larger volume, and the closer the second opening 21M is to the substrate 10, the greater the distance between the side surfaces on the two opposite sides is, that is, the closer to the substrate 10, the greater the width of the second opening 21M is, so that the reliability of the disconnection of the first organic layer 30 at the position of the cavity 23 is effectively ensured.
The intermediate layer 213 may be etched in its entirety and the cavity 23 includes the entire area where the intermediate layer 213 is located. It should be noted that, in the actual manufacturing process, due to the limitation of the process conditions, only a portion of the intermediate layer 213 may be etched away, and the remaining portion of the intermediate layer 213 may be included in the cavity 23.
In the preparation method provided in this embodiment, the fifth metal layer 212 is dry-etched, so that further etching of the second composite layer 22 is avoided, and the form of the first opening 22M in the second composite layer 22 is effectively protected. The wet etching of the intermediate layer 213 can make the volume of the second opening 21M larger, and meanwhile, since the second composite layer 22 covers the sidewall of the initial structure 21B, in the process of wet etching the intermediate layer 213, the etching rate of the first metal layer 221 in the second composite layer 22 can be lower than that of the intermediate layer 213, so that the form of the second opening 21M can be ensured to be stable and controllable.
Fig. 17 is a schematic view of a partial manufacturing process of a display panel according to an embodiment of the present disclosure.
Before step S5 in fig. 11, that is, before the etching of the initial structure 21B to form the first composite layer 21, as shown in fig. 17, the method for manufacturing the display panel 001 further includes:
step S4A: a protective layer 24 is prepared, the protective layer 24 covering at least a part of the surface of the second composite layer 22 facing the cavity 23.
Further, the protective layer 24 covers at least the side surfaces of the first opening 22M.
In the process of etching the initial structure 21B to form the first composite layer 21, the protective layer 24 is disposed to protect the first opening 22M from further etching, which is beneficial to realize controllable configuration of the first opening 22M.
It is understood that step S4A may also be provided before step S5 in fig. 12.
Fig. 18 is a schematic view of a display device according to an embodiment of the present application.
The embodiment of the present application provides a display device 100, as shown in fig. 18, including a display panel 001 according to any one of the embodiments described above. The display device 100 provided in the embodiment of the present application may be a mobile phone, or may be a display device such as a computer or a television.
In the display device 100, the first organic layer 30 is disconnected at the cavity 23, and a path through which external water and oxygen enter the display area AA through the first organic layer 30 is blocked, so that corrosion of the water and oxygen to components in the display area AA is avoided, and the yield of finished products of the display panel 001 is improved. Meanwhile, the protruding structure 20 comprises two layers of composite layers, and the two layers of composite layers can also comprise metal, so that the stability of the protruding structure 20 is improved, the stability and controllability of the shape of the cavity 23 are ensured, and the reliability of the disconnection of the first organic layer 30 at the cavity 23 is improved.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims (19)

1. A display panel, comprising:
a substrate including a non-display region and a display region;
a protruding structure disposed at the non-display region of the substrate; the protruding structure comprises a first composite layer and a second composite layer which are stacked, and the protruding structure comprises a cavity; the first composite layer is positioned on one side of the second composite layer close to the substrate, and the cavity penetrates through the second composite layer and at least part of the first composite layer along the thickness direction of the display panel;
a first organic layer extending from the display region to the non-display region; the first organic layer is positioned on one side of the second composite layer far away from the substrate, and the first organic layer is disconnected at the cavity.
2. The display panel according to claim 1, wherein the substrate further comprises an opening area, the opening area penetrates through the substrate, the non-display area comprises a first non-display area, the first non-display area is located between the opening area and the display area, and the first non-display area at least partially surrounds the opening area, and the display area at least partially surrounds the first non-display area;
the first organic layer extends from the display area to the first non-display area, and the protruding structure is disposed in the first non-display area of the substrate.
3. The display panel according to claim 1, wherein the second composite layer comprises a first metal layer and a second metal layer, the first metal layer being located on a side of the second metal layer adjacent to the substrate; and the first metal layer and the second metal layer are made of different materials.
4. The display panel according to claim 3, wherein the second composite layer further comprises a third metal layer on a side of the second metal layer away from the first metal layer, and the third metal layer is made of the same material as the first metal layer.
5. The display panel according to claim 3 or 4, wherein the material of the first metal layer comprises Ti and the material of the second metal layer comprises Al.
6. The display panel according to claim 3, wherein the first composite layer comprises a fourth metal layer, the fourth metal layer is located on one side of the cavity close to the substrate, the fourth metal layer is connected to the first metal layer, and the fourth metal layer is made of the same material as the first metal layer.
7. The display panel of claim 6, wherein the first composite layer further comprises a fifth metal layer, wherein the fifth metal layer is attached to the surface of the first metal layer facing the substrate, and wherein the fifth metal layer is made of the same material as the first metal layer.
8. The display panel of claim 1, further comprising a transistor array layer comprising transistors, wherein the first composite layer is fabricated on the same layer as the source or drain of the transistors.
9. The display panel according to claim 8, further comprising a transition metal layer on a side of the source or drain of the transistor away from the substrate, wherein the second composite layer and the transition metal layer are formed in the same layer.
10. The display panel according to claim 1, wherein a thickness of the first organic layer is smaller than a depth of the cavity in a thickness direction of the display panel.
11. The display panel according to claim 1, wherein the cavity comprises first side surfaces connected with each other, the first side surfaces are connected with the bottom surface of the cavity, and an included angle between the first side surfaces and the bottom surface of the cavity is θ, and θ is greater than 0 ° and less than or equal to 90 °.
12. The display panel according to claim 1, wherein the first organic layer is provided over the entire display region.
13. The display panel according to claim 12, wherein the first organic layer comprises at least one of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer.
14. The display panel according to claim 1, wherein the protrusion structure further comprises a protective layer covering at least a portion of a surface of the second composite layer facing the cavity.
15. A display device characterized in that it comprises a display panel according to any one of claims 1 to 14.
16. A manufacturing method of a display panel is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a non-display area and a display area;
depositing a first film layer in the non-display area of the substrate, and etching the first film layer to form an initial structure;
depositing a second film layer on the initial structure, the second film layer covering the initial structure;
etching the second film layer to form a second composite layer, wherein the second composite layer comprises a first opening;
etching the initial structure to form a first composite layer, wherein the first composite layer comprises a second opening;
wherein the first opening is communicated with the second opening to form a cavity.
17. The method according to claim 16, wherein the second composite layer comprises a first metal layer and a second metal layer, and the first metal layer is located between the second metal layer and the initial structure; and the first metal layer and the second metal layer are made of different materials.
18. The method of manufacturing a display panel according to claim 17, wherein the initial structure includes an intermediate layer and a fifth metal layer, the fifth metal layer being located on a side of the intermediate layer away from the substrate; the fifth metal layer is made of the same material as the first metal layer and is made of a different material from the intermediate layer;
the etching the initial structure to form the first composite layer includes:
dry etching the fifth metal layer, forming a first sub-opening in the fifth metal layer;
wet etching the intermediate layer to form the second opening including the first sub-opening.
19. The method for manufacturing a display panel according to claim 16, further comprising, before etching the initial structure to form the first composite layer:
preparing a protective layer, wherein the protective layer at least covers part of the surface of the second composite layer facing the cavity.
CN202111445725.8A 2021-11-30 2021-11-30 Display panel, preparation method thereof and display device Pending CN114141793A (en)

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