CN114122251A - Sintering device and sintering method for piezoelectric ceramic piece - Google Patents
Sintering device and sintering method for piezoelectric ceramic piece Download PDFInfo
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- CN114122251A CN114122251A CN202111284671.1A CN202111284671A CN114122251A CN 114122251 A CN114122251 A CN 114122251A CN 202111284671 A CN202111284671 A CN 202111284671A CN 114122251 A CN114122251 A CN 114122251A
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- piezoelectric ceramic
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
Abstract
The embodiment of the application provides a sintering device and a sintering method for a piezoelectric ceramic piece. The sintering device of the piezoelectric ceramic piece comprises a laminated structure; the laminated structure includes: m piezoelectric ceramic piece blank films, wherein m is more than or equal to 1; and the partition plates and the piezoelectric ceramic piece blank films are alternately laminated in the vertical direction, the top layer of the laminated structure is the first layer from top to bottom in the n partition plates, the bottom layer of the laminated structure is the nth layer from top to bottom in the n partition plates, and n is more than or equal to 2 and is more than n m. The embodiment of the application is used for solving the technical problem that the sintered piezoelectric ceramic piece is easy to bond and not easy to take down in the prior art, and can effectively reduce the possibility that the piezoelectric ceramic membrane is deformed and torn in the sintering process.
Description
Technical Field
The application relates to the technical field of piezoelectric ceramics, in particular to a sintering device and a sintering method of a piezoelectric ceramic piece.
Background
The piezoelectric ceramic piece is an electronic element widely applied, a plurality of piezoelectric ceramic piece green bodies are generally stacked together for sintering in the conventional sintering mode of the piezoelectric ceramic piece, and zirconium powder is generally coated on the adjacent piezoelectric ceramic piece green bodies to avoid the adhesion of the piezoelectric ceramic piece green bodies.
Along with the progress of science and technology, electronic components are more and more miniaturized, and for ultrathin piezoelectric ceramic pieces (15-20um), the piezoelectric ceramic pieces sintered by adopting the sintering method are easy to bond and difficult to take down.
Disclosure of Invention
The application aims at the defects of the prior art and provides a sintering device and a sintering method for piezoelectric ceramic pieces, and the technical problem that the sintered piezoelectric ceramic pieces are easy to bond and not easy to take down in the prior art is solved.
In a first aspect, an embodiment of the present application provides an apparatus for sintering a piezoelectric ceramic sheet, including a laminated structure;
the laminated structure includes:
m piezoelectric ceramic piece blank films, wherein m is more than or equal to 1; and the number of the first and second groups,
the piezoelectric ceramic chip blank film stacking structure comprises n partition plates, the partition plates and the piezoelectric ceramic chip blank film are stacked alternately in the vertical direction, the top layer of the stacking structure is the first layer from top to bottom of the n partition plates, the bottom layer of the stacking structure is the nth layer from top to bottom of the n partition plates, n is larger than or equal to 2, and n is larger than m.
In some embodiments, further comprising:
a compression structure located over a top layer of the laminated structure.
In some embodiments, the spacer is a sintered piezoceramic wafer.
In some embodiments, the thickness of the separator is 100-.
In some embodiments, the compression structure is a sintered ceramic sheet.
In some embodiments, the cross-sectional area of the diaphragm is greater than or equal to the cross-sectional area of the piezoelectric ceramic sheet blank film, so that the piezoelectric ceramic sheet blank film is completely covered by the adjacent diaphragm.
In some embodiments, the weight of the compression structure is greater than the weight of the diaphragm.
In some embodiments, the cross-sectional area of the pressurization structure is greater than or equal to the cross-sectional area of the separator.
In a second aspect, an embodiment of the present application provides a method for sintering a piezoelectric ceramic sheet, which is suitable for the apparatus for sintering a piezoelectric ceramic sheet according to the above embodiment, and the method includes:
alternately stacking m piezoelectric ceramic piece blank films to be sintered and n partition plates in the vertical direction to form a laminated structure, wherein the top layer of the laminated structure is the first layer from top to bottom of the n partition plates, the bottom layer of the laminated structure is the nth layer from top to bottom of the n partition plates, n is more than or equal to 2, m is more than or equal to 1, and n is more than m;
and sintering the formed laminated structure to sinter the piezoelectric ceramic piece blank film into a piezoelectric ceramic piece.
In some embodiments, the sintering the formed laminated structure comprises:
placing a compression structure over a top layer of the laminated structure;
and sintering the pressurizing structure and the laminated structure to sinter the piezoelectric ceramic piece blank film into the piezoelectric ceramic piece.
Compared with the prior art, the sintering device of the piezoelectric ceramic piece provided by the embodiment of the application comprises a laminated structure; the laminated structure includes: m piezoelectric ceramic piece blank films, wherein m is more than or equal to 1; the piezoelectric ceramic piece blank film is stacked on the bottom layer of the stacked structure, the number of the spacers is n, and the spacers are stacked alternately with the piezoelectric ceramic piece blank film along the vertical direction, the top layer of the stacked structure is the first layer from top to bottom of the n spacers, the bottom layer of the stacked structure is the nth layer from top to bottom of the n spacers, n is larger than or equal to 2 and is larger than n and larger than m. And the sintering deformation is prevented, the possibility that the piezoelectric ceramic piece is torn due to slight difference of the shrinkage rates of the ultrathin piezoelectric ceramic membrane in the sintering process can be reduced, the sintered piezoelectric ceramic piece is favorably and completely taken down, the breakage rate of a product is greatly reduced, and the piezoelectric ceramic piece obtained by sintering has good piezoelectric performance, good appearance and convenient operation. Meanwhile, the method is suitable for preparing ultrathin piezoelectric ceramic plates and can be used for manufacturing high-power MEMS devices.
The embodiment enables the weight of the pressurizing structure to be uniformly distributed to each layer of the piezoelectric ceramic sheet blank film by arranging the pressurizing structure on the top layer of the laminated structure, thereby effectively preventing the situation that the piezoelectric ceramic sheet is deformed along with the deformation of the partition plate in the sintering process, and effectively reducing the possibility that the piezoelectric ceramic sheet blank film is torn in the sintering process.
According to the sintering method of the piezoelectric ceramic piece, m piezoelectric ceramic piece blank films to be sintered and n partition plates are alternately stacked in the vertical direction to form a laminated structure, wherein the top layer of the laminated structure is the first layer from top to bottom of the n partition plates, the bottom layer of the laminated structure is the nth layer from top to bottom of the n partition plates, n is more than or equal to 2, m is more than or equal to 1, and n is more than m; the formed laminated structure is sintered to sinter the blank film of the piezoelectric ceramic piece into the piezoelectric ceramic piece, so that the method can prevent the piezoelectric ceramic piece obtained by sintering from being adhered when being laminated and is used for solving the technical problem that the sintered piezoelectric ceramic piece is easy to adhere and not easy to take down in the prior art. And the sintering deformation is prevented, the possibility that the piezoelectric ceramic piece is torn due to slight difference of the shrinkage rates of the ultrathin piezoelectric ceramic membrane in the sintering process can be reduced, the sintered piezoelectric ceramic piece is favorably and completely taken down, the breakage rate of a product is greatly reduced, and the piezoelectric ceramic piece obtained by sintering has good piezoelectric performance, good appearance and convenient operation. Meanwhile, the sintering method of the embodiment is suitable for preparing the ultrathin piezoelectric ceramic wafer, can be used for manufacturing high-power MEMS devices, and has the characteristic of wide application range.
The embodiment of the invention sinters the pressurizing structure and the laminated structure by placing the pressurizing structure above the top layer of the laminated structure, so that the weight of the pressurizing structure can be uniformly distributed to each layer of the piezoelectric ceramic sheet blank film, thereby effectively preventing the situation that the partition board deforms in the sintering process to cause the deformation of the piezoelectric ceramic sheet, and effectively reducing the possibility that the piezoelectric ceramic sheet blank film is torn in the sintering process.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a sintering apparatus for a piezoelectric ceramic plate according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a sintering apparatus for a piezoelectric ceramic plate according to an embodiment of the present disclosure;
fig. 3 is a schematic flow chart of a sintering method of a piezoelectric ceramic plate according to an embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
Referring to fig. 1, a schematic structural diagram of a sintering apparatus for a piezoelectric ceramic sheet according to an embodiment of the present application is shown, where the sintering apparatus for a piezoelectric ceramic sheet includes a laminated structure 1;
the laminated structure 1 includes:
m piezoelectric ceramic piece blank films 11, wherein m is more than or equal to 1; and the number of the first and second groups,
the piezoelectric ceramic chip green film structure comprises n partition boards 12, wherein the partition boards 12 are alternately laminated with the piezoelectric ceramic chip green films 11 in the vertical direction, the top layer of the laminated structure 1 is the first layer from top to bottom in the n partition boards 12, the bottom layer of the laminated structure 1 is the nth layer from top to bottom in the n partition boards 12, n is larger than or equal to 2, and n is larger than m.
It should be noted that the piezoelectric ceramic sheet blank film 11 is sintered to obtain a piezoelectric ceramic sheet, for example, an ultrathin piezoelectric ceramic sheet blank film is sintered to obtain an ultrathin piezoelectric ceramic sheet. Referring to fig. 1, in the laminated structure 1, the green piezoelectric ceramic films 11 and the partition plates 12 are vertically laminated, and the partition plates 12 and the green piezoelectric ceramic films 11 are alternately laminated, that is, a plurality of green piezoelectric ceramic films 11 are arranged at intervals, and the green piezoelectric ceramic films 11 are located between the adjacent partition plates 12. The top layer (i.e., the uppermost layer) of the laminated structure 1 is the uppermost layer of the plurality of partition plates 12, and the bottom layer (i.e., the lowermost layer) of the laminated structure 1 is the lowermost layer of the plurality of partition plates 12, so that each laminated piezoelectric ceramic sheet blank film 11 is disposed between the partition plates 12, and the adhesion of the sintered piezoelectric ceramic sheets in the prior art when the sintered piezoelectric ceramic sheets are stacked and the adhesion of the sintered piezoelectric ceramic sheets with the partition plates can be effectively prevented.
According to the sintering device of the piezoelectric ceramic piece, the sintering device of the piezoelectric ceramic piece comprises a laminated structure; the laminated structure includes: m piezoelectric ceramic piece blank films, wherein m is more than or equal to 1; the piezoelectric ceramic piece blank film is stacked on the bottom layer of the stacked structure, the number of the spacers is n, and the spacers are stacked alternately with the piezoelectric ceramic piece blank film along the vertical direction, the top layer of the stacked structure is the first layer from top to bottom of the n spacers, the bottom layer of the stacked structure is the nth layer from top to bottom of the n spacers, n is larger than or equal to 2 and is larger than n and larger than m. And the possibility that the piezoelectric ceramic piece is torn due to slight difference of all-directional shrinkage rates of the ultrathin piezoelectric ceramic membrane in the sintering process can be reduced, so that the sintered piezoelectric ceramic piece is favorably and completely taken down, the breakage rate of a product is greatly reduced, and the piezoelectric ceramic piece obtained by sintering has good piezoelectric performance, good appearance and convenient operation. Meanwhile, the method is suitable for preparing ultrathin piezoelectric ceramic plates and can be used for manufacturing high-power MEMS devices.
In some embodiments, the sintering apparatus of the piezoceramic sheet further comprises:
a pressing structure 2, said pressing structure 2 being located on top of the top layer of the laminated structure 1.
In the present embodiment, since the spacer 12 itself in the present application is thin (i.e., has a small thickness), deformation may occur during sintering, resulting in deformation of the piezoelectric ceramic sheet. Therefore, the present embodiment can effectively prevent the deformation of the partition 12 during the sintering process, prevent the deformation of the partition 12 and the consequent deformation of the piezoelectric ceramic sheet, and effectively reduce the possibility of the occurrence of the tearing of the piezoelectric ceramic sheet blank film during the sintering process, by providing the pressurizing structure 2 above the lamination structure 1, so that the weight of the pressurizing structure 2 can be uniformly distributed to each piezoelectric ceramic sheet blank film 11.
For example, referring to fig. 2, a specific structural diagram of a sintering apparatus for a piezoelectric ceramic plate according to an embodiment of the present application is provided, where two piezoelectric ceramic plate green films 11 are provided, and three spacers 12 are provided, that is, m is 2, and n is 3. Specifically, the piezoelectric ceramic green film 11 includes a first piezoelectric ceramic green film 111 and a second piezoelectric ceramic green film 112, and the partition plate 12 includes a first partition plate 121, a second partition plate 122 and a third partition plate 123, so that the laminated structure 1 is composed of the first partition plate 121, the first piezoelectric ceramic green film 111, the second partition plate 122, the second piezoelectric ceramic green film 112 and the third partition plate 123 from top to bottom, that is, the top layer of the laminated structure 1 is the first partition plate 121, the bottom layer thereof is the third partition plate 123, and the two piezoelectric ceramic green films 11 are disposed in the middle of the laminated structure 1. Further, as shown in fig. 2, the pressurizing structure 2 is disposed on the top layer of the laminated structure 1, i.e., above the first diaphragm 121, to prevent the diaphragm and the piezoelectric ceramic sheet green film from being deformed during sintering.
In some embodiments, the spacer 12 is a sintered piezoceramic wafer. Preferably, the partition plate 12 is a sintered ultrathin piezoelectric ceramic plate, and is suitable for preparing ultrathin piezoelectric ceramic plates.
In a preferred embodiment, the thickness of the partition 12 is 100-200 um. Secondly, the size of the partition plate is 40mm by 40mm, but the size of the partition plate is selected according to the size of the piezoelectric ceramic plate to be sintered, and is not required to be too large, and the size of the partition plate is not limited in the application.
In some embodiments, referring to fig. 1, the cross-sectional area of the partition 12 is greater than or equal to the cross-sectional area of the piezoceramic blank film, so that the piezoceramic blank film 11 is completely covered by the adjacent partition 12. In the embodiment, the outer edge of the partition board 12 is larger than the outer edge of the piezoelectric ceramic blank film 11, so that each piezoelectric ceramic blank film 11 is completely arranged between adjacent partition boards 12, the sintering reaction of each piezoelectric ceramic blank film 11 is more uniform and thorough, the possibility of deformation and adhesion of the piezoelectric ceramic in the sintering process can be effectively reduced, and the quality effect of the product is ensured.
In some embodiments, the pressurized structure 2 is a compact with certain importance. Preferably, the pressure structure 2 is a sintered ceramic plate.
On the basis of the above embodiment, in one embodiment, the weight of the pressing structure 2 is greater than the weight of the partition 12. It should be noted that, since the weight of the separator itself is small in the present application, in order to solve the problem that deformation is likely to occur during the sintering process, the pressurizing structure 2 is added above the laminated structure 1, so that the pressurizing structure 2 in the present application needs to have a certain weight in order to apply weight to the plurality of separators 12 and the plurality of piezoelectric ceramic green films 11 in the laminated structure 1 to prevent deformation.
On the basis of the above embodiment, in an embodiment, the cross-sectional area of the pressurizing structure is greater than or equal to the cross-sectional area of the partition plate, that is, the outer edge of the pressurizing structure 2 is greater than the outer edge of the partition plate 12, so that the weight of the pressurizing structure 2 can be uniformly distributed to the partition plate 12 and the piezoelectric ceramic green film 11 in the laminated structure 1, the partition plate and the piezoelectric ceramic green film are further prevented from being deformed during sintering, and the tearing of the piezoelectric ceramic sheet can be effectively reduced.
Referring to fig. 3, a schematic flow chart of a sintering method of a piezoelectric ceramic plate according to an embodiment of the present application is shown, where the sintering method of a piezoelectric ceramic plate is suitable for a sintering apparatus of a piezoelectric ceramic plate according to the above embodiment, and the method includes steps S301 to S302.
S301, alternately stacking m piezoelectric ceramic piece blank films to be sintered and n partition plates in the vertical direction to form a laminated structure, wherein the top layer of the laminated structure is the first layer from top to bottom of the n partition plates, the bottom layer of the laminated structure is the nth layer from top to bottom of the n partition plates, n is more than or equal to 2, m is more than or equal to 1, and n is more than m.
S302, sintering the formed laminated structure to sinter the piezoelectric ceramic piece blank film into a piezoelectric ceramic piece.
According to the sintering method of the piezoelectric ceramic piece, m piezoelectric ceramic piece blank films to be sintered and n partition plates are alternately stacked in the vertical direction to form a laminated structure, wherein the top layer of the laminated structure is the first layer from top to bottom of the n partition plates, the bottom layer of the laminated structure is the nth layer from top to bottom of the n partition plates, n is more than or equal to 2, m is more than or equal to 1, and n is more than m; the formed laminated structure is sintered to sinter the blank film of the piezoelectric ceramic piece into the piezoelectric ceramic piece, so that the method can prevent the piezoelectric ceramic piece obtained by sintering from being adhered when being laminated and is used for solving the technical problem that the sintered piezoelectric ceramic piece is easy to adhere and not easy to take down in the prior art. And the sintering deformation is prevented, the possibility that the piezoelectric ceramic piece is torn due to slight difference of the shrinkage rates of the ultrathin piezoelectric ceramic membrane in the sintering process can be reduced, the sintered piezoelectric ceramic piece is favorably and completely taken down, the breakage rate of a product is greatly reduced, and the piezoelectric ceramic piece obtained by sintering has good piezoelectric performance, good appearance and convenient operation. Meanwhile, the sintering method of the embodiment is suitable for preparing the ultrathin piezoelectric ceramic wafer, can be used for manufacturing high-power MEMS devices, and has the characteristic of wide application range.
In some embodiments, the sintering the formed laminated structure comprises:
placing a compression structure over a top layer of the laminated structure;
and sintering the pressurizing structure and the laminated structure to sinter the piezoelectric ceramic piece blank film into the piezoelectric ceramic piece.
In the embodiment, the pressurizing structure is placed above the top layer of the laminated structure, and the pressurizing structure and the laminated structure are sintered, so that the weight of the pressurizing structure can be uniformly distributed to each layer of the piezoelectric ceramic sheet blank film, the situation that the partition board deforms in the sintering process to cause the deformation of the piezoelectric ceramic sheet can be effectively prevented, and the possibility that the piezoelectric ceramic sheet blank film is torn in the sintering process can be effectively reduced.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. The sintering device for the piezoelectric ceramic plates is characterized by comprising a laminated structure;
the laminated structure includes:
m piezoelectric ceramic piece blank films, wherein m is more than or equal to 1; and the number of the first and second groups,
the piezoelectric ceramic chip blank film stacking structure comprises n partition plates, the partition plates and the piezoelectric ceramic chip blank film are stacked alternately in the vertical direction, the top layer of the stacking structure is the first layer from top to bottom of the n partition plates, the bottom layer of the stacking structure is the nth layer from top to bottom of the n partition plates, n is larger than or equal to 2, and n is larger than m.
2. The device for sintering piezoelectric ceramic sheets according to claim 1, further comprising:
a compression structure located over a top layer of the laminated structure.
3. The device for sintering piezoelectric ceramic sheets according to claim 1, wherein the partition is a sintered piezoelectric ceramic sheet.
4. The device for sintering piezoelectric ceramic plates according to claim 1, wherein the thickness of the spacer is 100-200 um.
5. The device for sintering piezoelectric ceramic sheets according to claim 2, wherein the pressurizing structure is a sintered ceramic sheet.
6. The device for sintering the piezoelectric ceramic sheet according to claim 1, wherein the cross-sectional area of the partition plate is greater than or equal to the cross-sectional area of the piezoelectric ceramic sheet blank film so that the piezoelectric ceramic sheet blank film is completely covered with the adjacent partition plate.
7. The device for sintering piezoelectric ceramic sheets according to claim 2, wherein the weight of the pressurizing structure is greater than the weight of the spacer.
8. The device for sintering piezoelectric ceramic sheets according to claim 5, wherein the cross-sectional area of the pressurizing structure is greater than or equal to the cross-sectional area of the partition.
9. A method for sintering a piezoceramic wafer, which is applied to the device for sintering a piezoceramic wafer according to any one of claims 1 to 8, the method comprising:
alternately stacking m piezoelectric ceramic piece blank films to be sintered and n partition plates in the vertical direction to form a laminated structure, wherein the top layer of the laminated structure is the first layer from top to bottom of the n partition plates, the bottom layer of the laminated structure is the nth layer from top to bottom of the n partition plates, n is more than or equal to 2, m is more than or equal to 1, and n is more than m;
and sintering the formed laminated structure to sinter the piezoelectric ceramic piece blank film into a piezoelectric ceramic piece.
10. The method of sintering the piezoceramic sheet according to claim 9, wherein the sintering the formed laminated structure comprises:
placing a compression structure over a top layer of the laminated structure;
and sintering the pressurizing structure and the laminated structure to sinter the piezoelectric ceramic piece blank film into the piezoelectric ceramic piece.
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| CN202111284671.1A CN114122251A (en) | 2021-11-01 | 2021-11-01 | Sintering device and sintering method for piezoelectric ceramic piece |
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| CN202111284671.1A CN114122251A (en) | 2021-11-01 | 2021-11-01 | Sintering device and sintering method for piezoelectric ceramic piece |
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Citations (4)
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| US6001761A (en) * | 1994-09-27 | 1999-12-14 | Nippon Shokubai Co., Ltd. | Ceramics sheet and production method for same |
| US7108827B1 (en) * | 1998-04-10 | 2006-09-19 | Nippon Shokubai Co., Ltd. | Ceramic sheet and method of producing ceramic sheet |
| JP2007302515A (en) * | 2006-05-11 | 2007-11-22 | Nippon Shokubai Co Ltd | Manufacturing process of ceramic sheet and porous firing implement used in the process |
| CN114790115A (en) * | 2021-01-25 | 2022-07-26 | 南京以太通信技术有限公司 | Sintering method of ceramic block |
-
2021
- 2021-11-01 CN CN202111284671.1A patent/CN114122251A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001761A (en) * | 1994-09-27 | 1999-12-14 | Nippon Shokubai Co., Ltd. | Ceramics sheet and production method for same |
| US7108827B1 (en) * | 1998-04-10 | 2006-09-19 | Nippon Shokubai Co., Ltd. | Ceramic sheet and method of producing ceramic sheet |
| JP2007302515A (en) * | 2006-05-11 | 2007-11-22 | Nippon Shokubai Co Ltd | Manufacturing process of ceramic sheet and porous firing implement used in the process |
| CN114790115A (en) * | 2021-01-25 | 2022-07-26 | 南京以太通信技术有限公司 | Sintering method of ceramic block |
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