CN114122160A - Battery piece edge blocking method - Google Patents
Battery piece edge blocking method Download PDFInfo
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- CN114122160A CN114122160A CN202111336396.3A CN202111336396A CN114122160A CN 114122160 A CN114122160 A CN 114122160A CN 202111336396 A CN202111336396 A CN 202111336396A CN 114122160 A CN114122160 A CN 114122160A
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- battery piece
- insulating barrier
- layer
- electroplating
- grid line
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 230000000903 blocking effect Effects 0.000 title claims description 20
- 230000004888 barrier function Effects 0.000 claims abstract description 69
- 238000009713 electroplating Methods 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 18
- 238000009413 insulation Methods 0.000 claims abstract description 15
- 238000004544 sputter deposition Methods 0.000 claims abstract description 8
- 230000001360 synchronised effect Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- 238000001723 curing Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 229910003322 NiCu Inorganic materials 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 238000011084 recovery Methods 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 2
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Energy (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- Sustainable Development (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Electrodes Of Semiconductors (AREA)
- Photovoltaic Devices (AREA)
Abstract
An insulation barrier layer is formed on each edge and side face of a battery piece which is formed with an electroplating grid line pattern and is to be electroplated, so that the problems of electric leakage and poor short circuit of the battery piece caused by copper electrodes grown in an electroplating process of a metal seed layer wound and plated on the side face during sputtering of the battery piece can be effectively solved. The method comprises the steps of coating insulating barrier layers on the edges and the side faces of a battery piece to be electroplated with an electroplating grid line pattern by utilizing synchronous vertical rollers on two sides of a conveyor belt, and repeating the operation by horizontally rotating the battery piece for 90 degrees after the battery piece is rapidly solidified to finish the insulating barrier layers on the edges and the side faces of the battery piece. Meanwhile, the method has the advantages of simple structure, high productivity, no damage to the transparent conductive layers on the front and back sides of the cell, avoidance of cell efficiency loss and contribution to the promotion of the industrial development of the copper electrode solar cell.
Description
Technical Field
The invention relates to the technical field of solar cell manufacturing, in particular to an edge blocking method of a cell.
Background
Compared with a silver paste screen printing process, the copper electrode polarization process adopted in the crystalline silicon cell process has the advantages of low cost, electrode grid line thinning, light shading area reduction, cell efficiency improvement and the like, and meets the future development requirements of the photovoltaic industry.
When the copper electrode battery is produced in a large scale by a process, the metal seed layer is inevitably coated on the side surface of the silicon chip by double-sided sputtering, and the side surface of each side of the silicon chip is difficult to be covered by the grid line pattern material due to process limitation, so that the copper electrode grows on the side surface of the silicon chip in the electroplating process, and the defects of electric leakage, short circuit and the like of the battery are caused.
In the existing copper electrode solar cell process, before the electroplating grid line pattern is formed, the metal seed layers at the edges of the front side and the back side of the silicon wafer are removed by adopting an etching method, and the method can simultaneously etch the transparent conductive layer of the cell, so that the efficiency loss of the cell is caused.
Disclosure of Invention
Aiming at the problems, the patent provides a battery piece edge blocking method which is simple in structure and high in productivity, does not damage transparent conductive layers on the front and back surfaces of a battery, avoids the efficiency loss of the battery piece, and can effectively prevent poor electric leakage and short circuit caused by electroplating growth of copper electrodes on the side surfaces of the battery piece.
An insulating barrier layer is formed on each edge and side face of a battery piece which is formed with an electroplating grid line pattern and is to be electroplated, so that the problems of electric leakage and poor short circuit of the battery piece caused by copper electrodes grown in an electroplating process of a metal seed layer wound and plated on the side face during sputtering are solved.
Preferably, the battery piece edge blocking method adopts the following technical scheme:
placing the battery piece with the electroplated grid line pattern layer on a conveyor belt, pumping the insulating barrier material from a supply and recovery device by a pneumatic pump, injecting the insulating barrier material into a vertical hollow roller wheel, and allowing the insulating barrier material to seep out of the surface of the roller wheel, the coating roller wheel is rotated to transfer an insulating barrier material to the coating roller wheel, the thickness of the insulating barrier material on the surface of the coating roller wheel is uniform through roller wheel extrusion, the coating roller wheel is contacted with a battery piece, the insulating barrier material is uniformly coated on the front side, the back side edge and the side surface of the battery piece to form an insulating barrier layer, the rotating speed of each roller wheel is synchronous with the conveying speed of the battery piece, the insulating barrier layer is solidified by a solidifying device to form a battery piece with insulating barrier layers at the edges of two sides and on the side surface, the battery piece is horizontally transposed by 90 degrees, the coating of the roller wheel and the solidifying operation of the roller wheel are repeated, and the battery piece with the insulating barrier layers at the edges of four sides and on the side surface is formed.
Preferably, the insulation barrier layer is at least one of electroplating-resistant ink, photoresist, UV (ultraviolet) ink and the like, and the thickness of the insulation barrier layer is 3-50 um; the edge insulation barrier layer covers the edge of the battery piece inwards by a distance of 0-900 um;
preferably, the insulation barrier layer is cured by one of ultraviolet curing and baking thermal curing, the ultraviolet wavelength of the ultraviolet curing is 190-400 nm, and the ultraviolet energy is 100-2000mj/cm2The baking and thermosetting temperature is 50-150 ℃, and the baking time is 1-30 min;
the invention also provides a preparation method of the copper electrode battery piece based on the battery piece edge blocking method, which adopts the following technical scheme:
plating a transparent conductive layer and a metal seed layer on both sides of the cell;
forming electroplating grid line pattern layers on the metal seed layers on the two sides of the battery piece;
forming insulating barrier layers on the edges and the side faces of all the edges of the battery piece by adopting the battery piece edge barrier method;
carrying out electroplating growth on a copper electrode on the battery piece with the insulating barrier layer;
and simultaneously removing the electroplated grid line pattern layer and the insulating barrier layer by a wet method, and then removing the metal seed layer.
Preferably, the silicon wafer adopted by the cell has the size specifications of M2, G1, M6, M10 and the like, and the thickness of the silicon wafer is 90-180 um;
preferably, the metal seed layer is at least one of Cu, Ni, Ti and NiCu, and the thickness is 50-300 nm; the metal seed layer is deposited by PVD sputtering;
preferably, the electroplating grid line pattern layer is at least one of a printing ink pattern, a photoresist or a dry film exposure pattern, and the thickness is 5-100 um; the distance between the electroplating grid line pattern layer and the side edge of the battery piece is 0-800 um;
preferably, at least one of NaOH and KOH solution or corresponding stripping solution is used for removing the electroplated grid line pattern layer and the insulating barrier layer, the mass concentration of the stripping solution is 1% -10%, the temperature is 20-60 ℃, and the time is 5-300 s;
preferably, at least one of combined solutions such as an ammonia water system and a hydrogen peroxide system is used for removing the metal seed layer.
Has the advantages that:
the invention provides a battery piece edge blocking method, which comprises the steps of coating insulating blocking layers on the edges and the side faces of a battery piece to be electroplated with an electroplating grid line pattern by utilizing synchronous vertical rollers on two sides of a conveyor belt, and repeating the operation by horizontally rotating the battery piece for 90 degrees after the battery piece is rapidly solidified to finish the insulating blocking layers on the edges and the side faces of the battery piece. The problems of poor electric leakage, short circuit and the like of the battery piece caused by copper electrodes grown on the edges of all sides of the battery piece and the metal seed layers on the side surfaces in the electroplating process are avoided. Meanwhile, the method has the advantages of simple structure, high productivity, no damage to the transparent conductive layers on the front and back sides of the cell, avoidance of cell efficiency loss and contribution to the promotion of the industrial development of the copper electrode solar cell.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a process for completing barrier layers at two edges and a side surface of a battery plate according to the edge barrier method of the present invention;
fig. 2 is a schematic view illustrating a process of completing barrier layers at four edges and at side surfaces by the method for blocking the edges of a battery plate according to the present invention;
fig. 3 is a process flow chart of the preparation method of the copper electrode battery plate based on the battery plate edge blocking method provided by the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 and 2, the invention provides a battery piece edge blocking method, which is to form insulating blocking layers on each edge and side surface of a battery piece to be electroplated, on which an electroplating grid line pattern is formed, so as to solve the problems of poor battery piece leakage and short circuit caused by copper electrodes grown in an electroplating process by a metal seed layer wound and plated on the side surface during sputtering. The specific technical scheme is as follows:
placing a battery piece 7 with a plating grid line pattern layer on a conveyor belt 6, pumping an insulating barrier material from a supply recovery device 11 by a pneumatic pump 10, injecting the insulating barrier material into a vertical hollow roller 12, enabling the insulating barrier material to seep out of the surface of the roller 12, transmitting the insulating barrier material to a coating roller 8 by the rotation of the roller 12, extruding the coating roller 8 by a roller 9 to enable the thickness of the insulating barrier material on the surface of the coating roller 8 to be uniform, enabling the coating roller 8 to be in contact with the battery piece 7, uniformly coating the insulating barrier material on the front, back and side areas of the battery piece 7 to form an insulating barrier layer 3, enabling the rotation speed of each roller 8, 9 and 12 to be synchronous with the transmission speed of the battery piece 7, enabling the insulating barrier layer 3 to be solidified by a solidification device 13 to form a battery piece 14 with the insulating barrier layer 3 on the two edges and the side surfaces, horizontally transposing the battery piece 14 to be 90 degrees, repeating the coating of the roller 8 and the solidification operation by the solidification device 13, a battery piece 15 having the insulating barrier layer 3 at the four edges and the side surfaces is formed.
Wherein, the insulation barrier layer 3 is electroplating-resistant ink, and the thickness of the insulation barrier layer is 3-50 um; the insulation barrier layer 3 covers the edge of the battery piece inwards by a distance of 0-900 um; the insulation barrier layer 3 is cured by one of ultraviolet light curing and baking thermal curing, the ultraviolet light wavelength of the ultraviolet light curing is 190-400 nm, and the ultraviolet light energy is 100-2The baking and thermosetting temperature is 50-150 ℃, and the baking time is 1-30 min;
the battery piece 15 with the insulating barrier layers 3 at the four edges and the side surfaces avoids the problems of electric leakage and poor short circuit of the battery piece caused by copper electrodes growing in the electroplating process of a metal seed layer sputtered and wound on the side surfaces due to the existence of the insulating barrier layers 3 at the four edges and the side surfaces. Compared with the method for removing the metal seed layers at the edges of the front side and the back side of the cell by corrosion in the copper electrode solar cell process in the prior art, the method has the advantages of not damaging the transparent conducting layer and avoiding the loss of the efficiency of the cell.
As shown in fig. 3, the invention also provides a preparation method of a copper electrode battery plate based on the battery plate edge blocking method, and the preparation method adopts the following technical scheme:
s01, plating a transparent conductive layer and a metal seed layer on both sides of the cell;
s02, forming electroplating grid line pattern layers on the metal seed layers on the two sides of the battery piece;
s03, forming insulation barrier layers on the edges and the side faces of the battery piece by adopting the battery piece edge barrier method;
s04, carrying out electroplating growth on the battery piece with the insulating barrier layer to form a copper electrode;
and S05, removing the electroplated grid line pattern layer and the insulation barrier layer simultaneously by a wet method, and then removing the metal seed layer.
The silicon wafer adopted by the cell slice has the size specifications of M2, G1, M6, M10 and the like, and the thickness of the silicon wafer is 90-180 um; the metal seed layer is at least one of Cu, Ni, Ti and NiCu, and the thickness is 50-300 nm; the metal seed layer is deposited by PVD sputtering; the electroplating grid line pattern layer is at least one of a printing ink pattern, a photoresist or a dry film exposure pattern, and the thickness is 5-100 um; the distance between the electroplating grid line pattern layer and the side edge of the battery piece is 0-800 um; at least one of NaOH and KOH solution or corresponding stripping solution is used for removing the electroplated grid line pattern layer and the insulating barrier layer, the mass concentration of the stripping solution is 1-10%, the temperature is 20-60 ℃, and the time is 5-300 s; and the metal seed layer is removed by using at least one of combined solutions such as an ammonia water system, a hydrogen peroxide system and the like.
In conclusion, the invention coats the insulating barrier layers on the edges and the side surfaces of the battery piece which is formed with the electroplating grid line pattern and is to be electroplated by utilizing the synchronous vertical rollers on the two sides of the conveyor belt, and repeats the operation by horizontally rotating the battery piece for 90 degrees after the battery piece is rapidly solidified, thereby completing the insulating barrier layers on the edges and the side surfaces of the battery piece. The problems of poor electric leakage, short circuit and the like of the battery piece caused by copper electrodes grown on the edges of all sides of the battery piece and the metal seed layers on the side surfaces in the electroplating process are avoided. Meanwhile, the method has the advantages of simple structure, high productivity, no damage to the transparent conductive layers on the front and back sides of the cell, avoidance of cell efficiency loss and contribution to the promotion of the industrial development of the copper electrode solar cell.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A battery piece edge blocking method is characterized in that: and forming insulating barrier layers at the edges and the side faces of the battery piece on which the electroplating grid line pattern is formed and to be electroplated, so as to solve the problems of electric leakage and poor short circuit of the battery piece caused by copper electrodes grown in the electroplating process of the metal seed layer wound and plated on the side faces during sputtering.
2. The battery sheet edge blocking method of claim 1, further characterized by: the battery piece edge blocking method adopts the following technical scheme:
placing the battery piece with the electroplated grid line pattern layer on a conveyor belt, pumping the insulating barrier material from a supply and recovery device by a pneumatic pump, injecting the insulating barrier material into a vertical hollow roller wheel, and allowing the insulating barrier material to seep out of the surface of the roller wheel, the coating roller wheel is rotated to transfer an insulating barrier material to the coating roller wheel, the thickness of the insulating barrier material on the surface of the coating roller wheel is uniform through roller wheel extrusion, the coating roller wheel is contacted with a battery piece, the insulating barrier material is uniformly coated on the front side, the back side edge and the side surface of the battery piece to form an insulating barrier layer, the rotating speed of each roller wheel is synchronous with the conveying speed of the battery piece, the insulating barrier layer is solidified by a solidifying device to form a battery piece with insulating barrier layers at the edges of two sides and on the side surface, the battery piece is horizontally transposed by 90 degrees, the coating of the roller wheel and the solidifying operation of the roller wheel are repeated, and the battery piece with the insulating barrier layers at the edges of four sides and on the side surface is formed.
3. The cell edge blocking method of claim 1 or 2, further characterized by: the insulation barrier layer is at least one of electroplating-resistant ink, photoresist, UV (ultraviolet) ink and the like, and the thickness of the insulation barrier layer is 3-50 um; the edge insulation barrier layer covers the distance of 0-900um inwards from the edge of the battery piece.
4. The cell edge blocking method of claim 1 or 2, further characterized by: the insulation barrier layer is cured by one of ultraviolet light curing and baking thermal curing, the ultraviolet light wavelength of the ultraviolet light curing is 190-400 nm, and the ultraviolet light energy is 100-2The baking and thermosetting temperature is 50-150 ℃, and the baking time is 1-30 min.
5. A preparation method of a copper electrode battery piece based on the battery piece edge blocking method of claim 1 or 2 is characterized in that: the preparation method adopts the following technical scheme:
plating a transparent conductive layer and a metal seed layer on both sides of the cell;
forming electroplating grid line pattern layers on the metal seed layers on the two sides of the battery piece;
forming insulating barrier layers on the edges and the side faces of all the edges of the battery piece by adopting the battery piece edge barrier method;
carrying out electroplating growth on a copper electrode on the battery piece with the insulating barrier layer;
and simultaneously removing the electroplated grid line pattern layer and the insulating barrier layer by a wet method, and then removing the metal seed layer.
6. The method for producing a copper electrode cell according to claim 6, further characterized by: the silicon slice adopted by the cell slice has the size specifications of M2, G1, M6, M10 and the like, and the thickness is 90-180 um.
7. The method for producing a copper electrode cell according to claim 6, further characterized by: the metal seed layer is at least one of Cu, Ni, Ti and NiCu, and the thickness is 50-300 nm; the metal seed layer is deposited by PVD sputtering.
8. The method for producing a copper electrode cell according to claim 6, further characterized by: the electroplating grid line pattern layer is at least one of a printing ink pattern, a photoresist or a dry film exposure pattern, and the thickness is 5-100 um; the distance between the electroplating grid line pattern layer and the side edge of the battery piece is 0-800 um.
9. The method for producing a copper electrode cell according to claim 6, further characterized by: and removing the electroplated grid line pattern layer and the insulating barrier layer by using at least one of NaOH and KOH solutions or corresponding stripping solutions, wherein the mass concentration of the stripping solutions is 1-10%, the temperature is 20-60 ℃, and the time is 5-300 s.
10. The method for producing a copper electrode cell according to claim 6, further characterized by: and the metal seed layer is removed by using at least one of combined solutions such as an ammonia water system, a hydrogen peroxide system and the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111336396.3A CN114122160A (en) | 2021-11-12 | 2021-11-12 | Battery piece edge blocking method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111336396.3A CN114122160A (en) | 2021-11-12 | 2021-11-12 | Battery piece edge blocking method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115799355A (en) * | 2022-11-10 | 2023-03-14 | 通威太阳能（成都）有限公司 | Preparation method of solar cell |
| CN115863485A (en) * | 2022-12-22 | 2023-03-28 | 通威太阳能（成都）有限公司 | Preparation method of solar cell |
| WO2023125394A1 (en) * | 2021-12-31 | 2023-07-06 | 苏州太阳井新能源有限公司 | Edge coating apparatus and coating method for photovoltaic cell sheets |
| WO2024131467A1 (en) * | 2022-12-22 | 2024-06-27 | 通威太阳能（成都）有限公司 | Solar cell with copper grid line, and preparation method therefor |
-
2021
- 2021-11-12 CN CN202111336396.3A patent/CN114122160A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023125394A1 (en) * | 2021-12-31 | 2023-07-06 | 苏州太阳井新能源有限公司 | Edge coating apparatus and coating method for photovoltaic cell sheets |
| CN115799355A (en) * | 2022-11-10 | 2023-03-14 | 通威太阳能（成都）有限公司 | Preparation method of solar cell |
| CN115799355B (en) * | 2022-11-10 | 2024-07-23 | 通威太阳能（成都）有限公司 | Preparation method of solar cell |
| CN115863485A (en) * | 2022-12-22 | 2023-03-28 | 通威太阳能（成都）有限公司 | Preparation method of solar cell |
| WO2024131467A1 (en) * | 2022-12-22 | 2024-06-27 | 通威太阳能（成都）有限公司 | Solar cell with copper grid line, and preparation method therefor |
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