CN114075652B - Preparation method of conductive film, current collection and transmission material and energy storage device - Google Patents
Preparation method of conductive film, current collection and transmission material and energy storage device Download PDFInfo
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- CN114075652B CN114075652B CN202010830135.6A CN202010830135A CN114075652B CN 114075652 B CN114075652 B CN 114075652B CN 202010830135 A CN202010830135 A CN 202010830135A CN 114075652 B CN114075652 B CN 114075652B
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- 239000000463 material Substances 0.000 title claims abstract description 31
- 238000004146 energy storage Methods 0.000 title claims description 9
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 230000005540 biological transmission Effects 0.000 title description 4
- 238000007747 plating Methods 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 238000000576 coating method Methods 0.000 claims abstract description 55
- 239000011248 coating agent Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000010030 laminating Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 8
- 238000001125 extrusion Methods 0.000 claims abstract description 7
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 238000005507 spraying Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229920002799 BoPET Polymers 0.000 claims description 8
- 238000007738 vacuum evaporation Methods 0.000 claims description 8
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 239000005022 packaging material Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 1
- 239000002001 electrolyte material Substances 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 239000007888 film coating Substances 0.000 claims 1
- 238000009501 film coating Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 31
- 238000001704 evaporation Methods 0.000 abstract description 15
- 230000008020 evaporation Effects 0.000 abstract description 15
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 238000005265 energy consumption Methods 0.000 description 5
- 239000004594 Masterbatch (MB) Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005478 sputtering type Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model discloses a preparation method of a conductive film, and relates to the technical field of metal film manufacturing; the method comprises the following steps: coating the surface of the film substrate by adopting vacuum coating equipment, and forming a first metal coating with the thickness of 50-200nm on one outer surface of the film substrate; forming a second metal coating of 600-900nm on the outer surface of the first metal coating by a water plating device; unreeling the two films coated with the second metal coating by using a laminating machine device, and extruding and forming a sandwich layer with the thickness of 2-4 mu m between the two second metal coatings by using an extrusion type discharging system of the laminating machine device to form a film with a sandwich structure; performing physical stripping on the film compounded in the step S3, removing a film substrate on the outer surface of the film with the sandwich structure, and finally forming a finished film with the thickness of 4-6 mu m; the beneficial effects of the utility model are as follows: the problem that the base material is easy to generate bubbles and holes in the evaporation plating is avoided, and the breakdown risk in the process of the hydropower plating is reduced.
Description
Technical Field
The utility model relates to the technical field of conductive metal film manufacturing, in particular to a preparation method of a conductive film, a current collection and transmission material and an energy storage device.
Background
The vacuum coating is mainly a coating which needs to be performed under a higher vacuum degree, and particularly comprises various types including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition and the like. The method is mainly divided into evaporation and sputtering, and the evaporation coating is generally formed by heating a target material to evaporate surface components in the form of atomic groups or ions, depositing the surface components on the surface of a substrate and forming a film through a film forming process. For sputtering type coating films, the method can be simply understood as that electrons or high-energy laser are used for bombarding a target material, surface components are sputtered in an atomic group or ion form and finally deposited on the surface of a substrate, and the film is finally formed through a film forming process.
The process route of combining evaporation coating with water plating coating has the following outstanding technical problems when producing flexible conductive film coiled materials:
1. stringing problem: the base film adopted by the flexible conductive film coiled material product is a stretching process, local deformation is easy to occur in the process, and when the evaporation coating process is performed, the deformation of the base film is deteriorated due to the high temperature of the evaporation coating process, and a series of deformations in the film running direction are generated, which is called as bubble strings. Two problems can occur in the process of processing and using the flexible conductive film coiled material product in the back industry chain: (1) in the film feeding process, because the film surface is provided with the foam, folds are easily generated in the foam-forming area, and the product quality is affected. (2) In the post-processing process of the user, the uniformity of the tape feeding and various surface treatments of the post-process cannot be ensured due to the bubble stringing area on the film surface, so that the consistency of the product is affected. In view of this problem, the current process route cannot meet the requirements of product consistency and rate of preference, and from practical estimation, the bubbles will generate about 30% rate of preference loss for the product.
2. Hole problem: when the base film of the flexible conductive film coiled material product is subjected to an evaporation coating process, high-temperature metal particles caused by uneven evaporation in the film feeding process are easy to break down the base film to form holes, and the size of the holes can reach millimeter level at maximum due to high temperature and tiny fluctuation of the evaporation coating process. And the qualification rate of the flexible conductive film product is generally required to be no more than 100um. The defect can cause a material leakage phenomenon in the surface treatment process in the processing and use of a rear industrial chain, so that a certain probability can cause a great safety risk to a terminal product.
In addition, the process route of combining the evaporation coating with the water coating has the defect of longer process, so that the production energy consumption and the material cost of the film are high, and the healthy development of enterprises is hindered.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides a preparation method of a conductive film, a current collection and transmission material and an energy storage device.
The utility model solves the technical problems by adopting the technical scheme that the preparation method of the conductive film is improved in that the method comprises the following steps:
s1, coating the surface of a film substrate by adopting vacuum coating equipment, and forming a first metal coating with the thickness of 50-200nm on one outer surface of the film substrate;
s2, forming a 600-900nm second metal coating on the outer surface of the first metal coating through a water plating device;
s3, unreeling two rolls of films plated with the second metal coating by using a laminating machine device, and extruding and forming a sandwich layer with the thickness of 2-4 mu m between the two layers of second metal coating by using an extrusion type unreeling system of the laminating machine device to form a film with a sandwich structure;
s4, physically stripping the film compounded in the step S3, removing the film substrate on the outer surface of the film with the sandwich structure, and finally forming a finished film of the conductive film.
Further, in the step S1, the vacuum coating apparatus includes, but is not limited to, a vacuum evaporation coating apparatus or a magnetron sputtering coating apparatus.
Further, in the step S1, the film substrate includes but is not limited to PP film, PE film or PET film.
Further, the thickness of the film base material is 8-20 mu m; the thickness of the conductive film is 4-6 mu m.
Further, in the step S1, the first metal plating layer is a copper plating layer.
Further, in the step S2, the water plating device is an alkaline water plating device or an acidic water plating device.
Further, in the step S2, the second metal plating layer is a copper plating layer.
Further, in the step S3, the PE or PI material is adopted by the film coater device for melting and spraying, and the spraying amount is 3-5g/m 2 。
Further, in the step S4, the sheet resistance of the single side of the finished film is controlled to be within 20mΩ.
Further, in the step S4, a peeling machine is used to physically peel the film in the step S3.
Further, before step S1, step S0 is further included: and (3) coating a layer of release agent with the thickness of 0.3-1um on each side of the film substrate so as to facilitate the effective stripping of the film substrate and the functional film with the sandwich structure in the subsequent S4 step.
The utility model also provides a current collecting and transmitting material, which is characterized in that: including the finished film as described above.
In addition, the utility model also provides an energy storage device, which comprises a cathode pole piece, an anode pole piece, a separation film, electrolyte and a packaging material, and the improvement is that: the cathode sheet uses the current collecting and transporting material as described above.
The beneficial effects of the utility model are as follows: the method has the advantages that the limitation on the thickness of the substrate of the outer film is relaxed, meanwhile, the phenomenon that the substrate is easy to generate bubbles and holes in the evaporation plating process in the prior art route is avoided, the link of magnetron sputtering is omitted, the process is shortened, the breakdown risk of the hydropower plating process is reduced, the original forming film is replaced by PE raw material master batch, the production energy consumption and the material cost are reduced, and the product quality can be improved to a great extent.
Drawings
Fig. 1 is a schematic flow chart of a method for preparing a conductive film according to the present utility model.
Fig. 2 is a schematic structural diagram of a conductive film formed by a second metal coating according to the present utility model.
Fig. 3 is a schematic diagram of a sandwich structure formed by the method for preparing a conductive film according to the present utility model.
Detailed Description
The utility model will be further described with reference to the drawings and examples.
The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model. In addition, all the coupling/connection relationships referred to in the patent are not direct connection of the single-finger members, but rather, it means that a better coupling structure can be formed by adding or subtracting coupling aids depending on the specific implementation. The technical features in the utility model can be interactively combined on the premise of no contradiction and conflict.
Example 1
Referring to fig. 1, the present utility model discloses a method for preparing a conductive film, by which a desired conductive film is formed, comprising the steps of:
s0, coating a layer of release agent with the thickness of 0.3-1um on each side of the PET film 10 with the thickness of 12 mu m;
s1, plating a film on the surface of a PET film 10 by adopting vacuum evaporation plating, and forming a 50nm first metal plating layer 20 on one outer surface of the PET film 10, wherein the first metal plating layer 20 is a copper plating layer;
s2, forming a 900nm second metal coating 30 on the outer surface of the first metal coating 20 through a water plating device, wherein the second metal coating 30 is a copper plating layer, and in the embodiment, the water plating device is an alkaline water plating device; as shown in fig. 2, in the formation of the first metal plating layer 20, only a single surface of the PET film 10 is vacuum evaporation plated, and the first metal plating layer 20 has an effect of improving adhesion force when the second metal plating layer 30 is formed, so that the second metal plating layer 30 can be rapidly formed on the outer surface of the first metal plating layer 20;
s3, unreeling the two rolls of films plated with the second metal coating 30 by using a laminating machine device, and extruding and discharging the films between the two layers of second metal coating 30 by using an extrusion type discharging system of the laminating machine device to form a sandwich layer 40 with the thickness of 3 mu m, so as to form the film with a sandwich structure, as shown in FIG. 3, namely after moldingSchematic cross-sectional structure of the film with the sandwich structure; in the embodiment, PE material is adopted by the film spraying machine device for melting and spraying, and the spraying amount is 4g/m 2 ；
S4, physically stripping the film compounded in the step S3, removing the film substrate, namely the PET film 10, on the outer surface of the film with the sandwich structure, and finally forming a finished film with the thickness of 5 mu m, wherein the single-sided sheet resistance of the finished film is controlled within 20mΩ.
By the preparation method, a metal film with the thickness of 5 mu m can be obtained, the thickness of the PET film 10 used for preparation is 12 mu m, and the limitation on the thickness of an external film substrate is relaxed; meanwhile, the phenomenon that the base material is easy to generate bubbles and holes in the evaporation plating process in the original technical route is avoided, the link of magnetron sputtering is omitted, the process procedure is shortened, the breakdown risk of the hydropower plating process is reduced, the original forming film is replaced by PE raw material master batch, the production energy consumption and the material cost are reduced, and the product rate can be improved to a great extent. In addition, the preparation method greatly reduces the specification requirements on true plating equipment and water electroplating equipment and reduces the investment of fixed assets, thereby greatly reducing the total cost of the product as a whole. The peeled outer layer film substrate can be recycled after being treated.
In this example, the present utility model also discloses a current collecting and transmitting material comprising a conductive film having a thickness of 5 μm obtained by the above-mentioned process.
In addition, the utility model also discloses an energy storage device, in particular a lithium ion battery, which comprises a cathode pole piece, an anode pole piece, an isolating film, electrolyte and a packaging material.
Example 2
Referring to fig. 1, the present utility model discloses a method for preparing a conductive film, by which a desired conductive film is formed, comprising the steps of:
s1, coating a film on the surface of a PP film 10 with the thickness of 20 mu m by using a magnetron sputtering coating device, and forming a first metal coating 20 with the thickness of 200nm on one outer surface of the PP film 10, wherein the first metal coating 20 is a copper plating layer;
s2, forming a 600nm second metal coating 30 on the outer surface of the first metal coating 20 through a water plating device, wherein the second metal coating 30 is a copper plating layer, and the water plating device is an acid water plating device in the embodiment; as shown in fig. 2, in the process of forming the first metal plating layer 20, only a single surface of the PP film 10 is vacuum evaporation plated, and the first metal plating layer 20 has an effect of improving adhesion force when the second metal plating layer 30 is formed, so that the second metal plating layer 30 can be rapidly formed on the outer surface of the first metal plating layer 20;
s3, unreeling the two rolls of films plated with the second metal coating 30 by using a laminating machine device, and extruding and forming a sandwich layer 40 with the thickness of 2 mu m between the two layers of second metal coating 30 by using an extrusion type unreeling system of the laminating machine device to form a film with a sandwich structure, wherein the cross-sectional structure schematic diagram of the film with the sandwich structure is shown in FIG. 3; in the embodiment, PE material is adopted by the film spraying machine device for melting and spraying, and the spraying amount is 3g/m 2 ；
S4, physically stripping the film compounded in the step S3, removing the film substrate, namely the PP film 10, on the outer surface of the film with the sandwich structure, and finally forming a finished film with the thickness of 4 mu m, wherein the single-sided sheet resistance of the finished film is controlled within 20mΩ.
The process of the utility model releases the limit on the thickness of the substrate of the external film; meanwhile, the phenomenon that the base material is easy to generate bubbles and holes in the evaporation plating process in the original technical route is avoided, the process procedure is shortened, the breakdown risk of the hydropower plating process is reduced, and the PE raw material master batch is used for replacing the original formed film, so that the production energy consumption and the material cost are reduced, and the product quality can be improved to a great extent. In addition, the preparation method greatly reduces the specification requirements on true plating equipment and water electroplating equipment and reduces the investment of fixed assets, thereby greatly reducing the total cost of the product as a whole. The peeled outer layer film substrate can be recycled after being treated.
In this example, the present utility model also discloses a current collecting and transmitting material comprising a 4 μm thick conductive film produced by the above process. In addition, the utility model also discloses an energy storage device which comprises a cathode pole piece, an anode pole piece, a separation film, electrolyte and a packaging material.
Example 3
Referring to fig. 1, the present utility model discloses a method for preparing a conductive film, by which a desired conductive film is formed, comprising the steps of:
s1, plating a film on the surface of a PE film 10 with the thickness of 8 mu m by adopting vacuum evaporation plating, and forming a first metal plating layer 20 with the thickness of 100nm on one outer surface of the PE film 10, wherein the first metal plating layer 20 is a copper plating layer;
s2, forming a second metal plating layer 30 with the thickness of 800nm on the outer surface of the first metal plating layer 20 by a water plating device, wherein the second metal plating layer 30 is a copper plating layer; as shown in fig. 2, in the formation of the first metal plating layer 20, only a single surface of the PE film 10 is vacuum evaporation plated, and the first metal plating layer 20 has an effect of improving adhesion force when the second metal plating layer 30 is formed, so that the second metal plating layer 30 can be rapidly formed on the outer surface of the first metal plating layer 20;
s3, unreeling the two rolls of films plated with the second metal coating 30 by using a laminating machine device, and extruding and forming a sandwich layer 40 with the thickness of 4 mu m between the two layers of second metal coating 30 by using an extrusion type unreeling system of the laminating machine device to form a film with a sandwich structure, wherein the cross-sectional structure schematic diagram of the film with the sandwich structure is shown in FIG. 3; in the embodiment, PE material is adopted by the film spraying machine device for melting and spraying, and the spraying amount is 5g/m 2 ；
S4, physically stripping the film compounded in the step S3, removing the film substrate on the outer surface of the film with the sandwich structure, namely the PE film 10, and finally forming a finished film with the thickness of 6 mu m, wherein the single-sided sheet resistance of the finished film is controlled within 20mΩ.
In this example, the present utility model also discloses a current collecting and transmitting material comprising a conductive film with a thickness of 6 μm prepared by the above process.
In addition, the utility model also discloses an energy storage device which comprises a cathode pole piece, an anode pole piece, a separation film, electrolyte and a packaging material.
By the preparation method, a metal film with the thickness of 6 mu m can be obtained, the thickness of the PE film 10 used for preparation is 8 mu m, and the limitation on the thickness of an external film substrate is relaxed; meanwhile, the phenomenon that the base material is easy to generate bubbles and holes in the evaporation plating process in the original technical route is avoided, the link of magnetron sputtering is omitted, the process procedure is shortened, the breakdown risk of the hydropower plating process is reduced, the original forming film is replaced by PE raw material master batch, the production energy consumption and the material cost are reduced, and the product rate can be improved to a great extent. In addition, the preparation method greatly reduces the specification requirements on true plating equipment and water electroplating equipment and reduces the investment of fixed assets, thereby greatly reducing the total cost of the product as a whole. The peeled outer layer film substrate can be recycled after being treated.
In the above-described embodiment 3, the formation of the first metal plating layer 20 was achieved by using a vacuum evaporation plating apparatus, and the formation of the second metal plating layer 30 was achieved by using a water plating device, which is an alkaline water plating device, the second metal plating layer 30 being used to achieve thickening of the metal layer. Since the structures of the vacuum coating apparatus and the alkaline water plating device are common in the prior art, the structures of the vacuum coating apparatus and the alkaline water plating device are not described in detail in all embodiments of the present utility model. In addition, in step S3 of the above embodiment, a laminating machine device is used, which is mainly used for implementing extrusion molding of the two second metal coatings 30, and its structure is also common in the prior art, for example, the utility model name is a device capable of processing a multilayer laminated composite nonwoven fabric, and implementing PE laminated composite, so that the detailed description of the structure is not needed in this embodiment either.
In addition, in any of the above embodiments, the removal of the film substrate on the outer surface of the film with the sandwich structure can be achieved by using a stripper when physically stripping the composite film; also, since the stripper belongs to a well-established device in the prior art, it will not be explained in detail in this embodiment.
While the preferred embodiment of the present utility model has been described in detail, the present utility model is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model, and these equivalent modifications or substitutions are included in the scope of the present utility model as defined in the appended claims.
Claims (9)
1. A method for preparing a conductive film, comprising the steps of:
s1, coating the surface of a film substrate by adopting vacuum coating equipment, and forming a first metal coating with the thickness of 8-20 mu m on one outer surface of the film substrate, wherein the first metal coating is a copper plating layer;
s2, forming a second metal coating with the thickness of 600-900nm on the outer surface of the first metal coating by a water plating device, wherein the second metal coating is a copper plating layer;
s3, unreeling two rolls of films plated with the second metal coating by using a laminating machine device, and extruding and forming a sandwich layer with the thickness of 2-4 mu m between the two second metal coatings by using an extrusion type discharging system of the laminating machine device to form a film with a sandwich structure;
s4, physically stripping the film compounded in the step S3, removing the film substrate on the outermost surface of the sandwich structure, and finally forming a finished film of the conductive film, wherein the thickness of the finished film of the conductive film is 4-6 mu m, and the single-sided sheet resistance of the finished film is controlled within 20mΩ.
2. The method for producing a conductive film according to claim 1, wherein: in step S1, the vacuum coating apparatus includes a vacuum evaporation coating apparatus or a magnetron sputtering coating apparatus.
3. The method for producing a conductive film according to claim 1, wherein: in step S1, the film substrate includes a PP film, a PE film, or a PET film.
4. The method for producing a conductive film according to claim 1, wherein: in step S2, the water plating device is an alkaline water plating device or an acidic water plating device.
5. The method for producing a conductive film according to claim 1, wherein: in the step S3, the film coating machine device adopts PE or PI materials to carry out melting spraying, and the spraying amount is 3-5g/m 2 。
6. The method for producing a conductive film according to claim 1, wherein: in step S4, the film in step S3 is physically peeled by a peeling machine.
7. The method for producing a conductive film according to claim 1, wherein: the method also comprises a step S0, wherein a layer of release agent with the thickness of 0.3-1um is respectively coated on the two sides of the film substrate, so that the film substrate and the functional film with the sandwich structure can be effectively peeled in the subsequent step S4.
8. A current collecting and transporting material, characterized in that: a conductive film comprising any one of claims 1-7.
9. The utility model provides an energy storage device, includes negative pole piece, positive pole piece, barrier film, electrolyte and packaging material, its characterized in that: the cathode sheet using the current collecting and transporting material according to claim 8.
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| CN202010830135.6A CN114075652B (en) | 2020-08-22 | 2020-08-22 | Preparation method of conductive film, current collection and transmission material and energy storage device |
| PCT/CN2020/123843 WO2022041443A1 (en) | 2020-08-22 | 2020-10-27 | Preparation method for conductive thin film, electric current collection and transmission material, and energy storage device |
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| CN1822262A (en) * | 2006-03-24 | 2006-08-23 | 潘旭祥 | Anti-oxidation and anti-high voltage multilayer metallized capacitor film |
| CN106981665A (en) * | 2017-04-14 | 2017-07-25 | 深圳鑫智美科技有限公司 | A kind of negative current collector, its preparation method and its application |
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| AU2002368229A1 (en) * | 2002-08-29 | 2004-03-29 | Toyo Kohan Co., Ltd. | Composite current collector |
| WO2012127561A1 (en) * | 2011-03-18 | 2012-09-27 | 株式会社日立製作所 | Non-aqueous electrolyte battery |
| CN106654285B (en) * | 2016-11-18 | 2021-03-05 | 浙江大学 | Flexible current collector for lithium battery and preparation method thereof |
| CN106929850A (en) * | 2017-05-17 | 2017-07-07 | 福建新嵛高新柔性材料有限公司 | A kind of preparation method and its production equipment of low profile flexible circuitry plate material |
| CN109873164B (en) * | 2017-12-05 | 2021-08-20 | 宁德时代新能源科技股份有限公司 | Current collector, pole piece thereof and electrochemical device |
| CN108842136A (en) * | 2018-06-21 | 2018-11-20 | 张家港康得新光电材料有限公司 | Flexible copper-clad plate and its manufacturing process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1822262A (en) * | 2006-03-24 | 2006-08-23 | 潘旭祥 | Anti-oxidation and anti-high voltage multilayer metallized capacitor film |
| CN106981665A (en) * | 2017-04-14 | 2017-07-25 | 深圳鑫智美科技有限公司 | A kind of negative current collector, its preparation method and its application |
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