CN114071958B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN114071958B CN114071958B CN202111305919.8A CN202111305919A CN114071958B CN 114071958 B CN114071958 B CN 114071958B CN 202111305919 A CN202111305919 A CN 202111305919A CN 114071958 B CN114071958 B CN 114071958B
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- Prior art keywords
- chamber
- cooling
- side plate
- cavity
- transition
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 88
- 230000007704 transition Effects 0.000 claims abstract description 42
- 238000005452 bending Methods 0.000 claims abstract description 32
- 239000007788 liquid Substances 0.000 claims description 61
- 239000002826 coolant Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 2
- 238000007664 blowing Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat dissipation device, which comprises a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are oppositely arranged on two sides of the bottom plate; the bottom plate is provided with a first cooling cavity, the first side plate is provided with a second cooling cavity communicated with the first cooling cavity, and the second side plate is provided with a third cooling cavity communicated with the first cooling cavity; a first connecting part is arranged at a bending part between the bottom plate and the first side plate, and the first connecting part comprises a first transition cavity communicated with the first cooling cavity and the second cooling cavity; a second connecting part is arranged at a bent part between the bottom plate and the second side plate, and the second connecting part comprises a second transition cavity communicated with the first cooling cavity and the third cooling cavity; the first connecting portion and the second connecting portion are both recessed from the inside of the heat dissipation device to the outside of the heat dissipation device. According to the invention, the connecting parts are arranged at the bending positions of the bottom plate and the two side plates, so that the cooling cavity of the bottom plate and the cooling cavity of the side plates can be communicated with each other and the problems of wrinkling, cracking or collapsing can be avoided. And the fitting degree of the heat dissipation device and the heating device during assembly is higher.
Description
Technical Field
The invention relates to a heat dissipation device, in particular to a liquid cooling plate.
Background
Along with the continuous increase of new forms of energy field heat dissipation demand, the continuous promotion of heat dissipation requirement, the liquid cooling heat dissipation becomes the mainstream in new forms of energy heat dissipation field, and conventional liquid cooling board is flat structure usually, and the liquid cooling flow path can only be in dull and stereotyped internal flow channel, leads to the temperature distribution homogeneity of the device that generates heat relatively poor, along with the continuous promotion of the device temperature homogeneity requirement that generates heat, the formula of bending liquid cooling board produces thereupon.
The bending type liquid cooling plate is formed by punch forming or bending. During punch forming or bending forming, the liquid cooling pipelines at the intersection of the two surfaces are easy to wrinkle and deform or even crack; when the angle of bending is great, the department of bending of the formula of bending liquid cooling board when practical application is difficult to laminating heating devices such as electric core, makes liquid cooling board performance decline, and when the angle of bending is less, flat the collapsing easily appears in department of bending liquid cooling flow path, and the fluid is difficult to pass through, and this problem does not obtain good solution at present.
Therefore, there is a need to provide a liquid-cooled panel with an excellent bending process to overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide a heat dissipation device with excellent bending process.
According to an aspect of the present invention, there is provided a heat dissipating device including:
the first side plate and the second side plate are oppositely arranged on two sides of the bottom plate;
the bottom plate is provided with a first cooling cavity, the first side plate is provided with a second cooling cavity communicated with the first cooling cavity, and the second side plate is provided with a third cooling cavity communicated with the first cooling cavity;
a first connecting part is arranged at a bent part between the bottom plate and the first side plate, and the first connecting part comprises a first transition cavity communicated with the first cooling cavity and the second cooling cavity;
a second connecting part is arranged at a bent part between the bottom plate and the second side plate, and the second connecting part comprises a second transition cavity communicated with the first cooling cavity and the third cooling cavity;
the first connecting portion and the second connecting portion are both recessed from the inside of the heat dissipation device to the outside of the heat dissipation device.
Preferably, the first connecting portion includes a first curved portion located inside the heat sink and a second curved portion located outside the heat sink, the first curved portion and the second curved portion forming the first transition cavity therebetween, the first curved portion forming a groove portion inside the heat sink, the second curved portion forming a protrusion portion outside the heat sink corresponding to the groove portion of the first curved portion.
Preferably, the first cooling chamber comprises a liquid inlet chamber and a liquid outlet chamber which are communicated with each other, the second cooling chamber is communicated with the liquid inlet chamber, and the third cooling chamber is communicated with the liquid outlet chamber.
Preferably, the bending part between the bottom plate and the first side plate is further provided with a third connecting part, the third connecting part comprises a third transition cavity communicated with the liquid inlet cavity and the second cooling cavity, the bending part between the bottom plate and the second side plate is further provided with a fourth connecting part, and the fourth connecting part comprises a fourth transition cavity communicated with the liquid outlet cavity and the third cooling cavity.
Preferably, the first connection portion, the second connection portion, the third connection portion, and the fourth connection portion have the same structure.
Preferably, the bottom plate comprises an extension part, and one side of the extension part is provided with a liquid inlet communicated with the liquid inlet cavity and a liquid outlet communicated with the liquid outlet cavity.
Preferably, the first transition cavity is located between the third transition cavity and the liquid inlet, the cooling medium in the liquid inlet cavity enters the second cooling cavity through the first transition cavity, the cooling medium in the second cooling cavity returns to the liquid inlet cavity through the third transition cavity, the second transition cavity is located between the liquid outlet and the fourth transition cavity, the cooling medium in the liquid outlet cavity enters the third cooling cavity through the fourth transition cavity, and the cooling medium in the third cooling cavity returns to the liquid outlet cavity through the second transition cavity.
Preferably, the first cooling cavity is internally provided with a strip-shaped first flow channel and a strip-shaped first spoiler at intervals.
Preferably, a second flow channel arranged along the length direction of the first side plate and a third flow channel arranged along the height direction of the first side plate are arranged in the second cooling cavity, and a second turbulent flow portion is arranged between the second flow channel and the third flow channel.
Preferably, a choke is arranged in the second cooling cavity, the choke is arranged above the third connecting part, and the first side plate and the second side plate are identical in structure.
Compared with the prior art, the heat dissipation device provided by the invention has the following beneficial effects:
the bending part of the bottom plate and the two side plates is provided with the connecting part, so that the cooling cavity of the bottom plate and the cooling cavity of the side plates can be mutually communicated without the problems of wrinkles, cracking or shriveling. And the fitting degree of the heat dissipation device and the heating device during assembly is higher.
Drawings
The invention is described in further detail below with reference to the following figures and embodiments:
FIG. 1 is a first perspective view of the heat dissipation device of the present invention;
FIG. 2 is a second perspective view of the heat dissipation device of the present invention;
FIG. 3 is a third perspective view of the heat dissipation device of the present invention;
FIG. 4 is a plan view of the heat dissipation device of the present invention;
fig. 5 is a sectional view of the heat dissipating device of the present invention.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "a" means not only "only one of this but also a case of" more than one ".
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
In this context, it is to be understood that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
In addition, in the description of the present application, the terms "first," "second," and the like are used only for distinguishing the description, and are not intended to indicate or imply relative importance.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
Referring to fig. 1, 2 and 3, the present invention discloses a heat dissipation apparatus 100, which includes a bottom plate 1, and a first side plate 2 and a second side plate 3 oppositely disposed on two sides of the bottom plate 1. The bottom plate 1 and the two side plates form a cuboid containing cavity for placing a heating device. The accommodating cavity inner side is arranged to be a plane for attaching a heat generating device, and the accommodating cavity outer side comprises a first cooling cavity 11 protruding downwards from the bottom plate 1, a second cooling cavity 21 protruding outwards from the first side plate 2 and a third cooling cavity 31 protruding outwards from the second side plate 3.
Be equipped with first connecting portion 12 between bottom plate 1 and the first curb plate 2, be equipped with first transition chamber 121 in the first connecting portion 12, be equipped with second connecting portion 13 between bottom plate 1 and the second curb plate 3, be equipped with second transition chamber 131 in the second connecting portion 13. The first cooling chamber 11 includes an inlet chamber 111 and an outlet chamber 112 communicating with each other. The bottom plate 1 further includes an extending portion 113 extending along the bottom surface, and an upper surface of the extending portion 113 is provided with a liquid inlet 1111 communicating with the liquid inlet cavity 111 and a liquid outlet 1121 communicating with the liquid outlet cavity 112.
The liquid inlet chamber 111 communicates with the second cooling chamber 21 through the first transition chamber 121. The liquid outlet chamber 112 communicates with the third cooling chamber 31 through the second transition chamber 131. Still be equipped with third connecting portion 14 between bottom plate 1 and the first curb plate 2, still be equipped with fourth connecting portion 15 between bottom plate 1 and the second curb plate 3, be equipped with the third transition chamber (not marking) in the third connecting portion 14, be equipped with the fourth transition chamber (not marking) in the fourth connecting portion 15.
Referring to fig. 4, the first connection portion 12, the second connection portion 13, the third connection portion 14, and the fourth connection portion 15 have the same structure. In the embodiment disclosed by the invention, the number of the connecting parts is 4, and in other embodiments, the number of the connecting parts can be adjusted. In the embodiment, the two connecting parts are arranged between the two adjacent cavities, so that the cooling medium can flow in one direction in the two cavities, and convection is avoided.
The cooling medium enters the liquid inlet cavity 111 from the liquid inlet 1111, a part of the cooling medium enters the second cooling cavity 21 through the first transition cavity 121 and returns to the liquid inlet cavity 111 from the third transition cavity (not labeled), and the other part of the cooling medium directly flows from one side of the liquid inlet cavity 111 where the liquid inlet 1112 is located to the opposite side, and enters the liquid outlet cavity 112 through the fifth transition cavity 114 after being merged.
After the cooling medium enters liquid outlet cavity 112, a portion of the cooling medium enters third cooling cavity 31 through a fourth transition cavity (not labeled) and returns to liquid outlet cavity 112 from second transition cavity 131, and another portion of the cooling medium directly flows to liquid outlet 1121 from a side of liquid outlet cavity 112 away from liquid outlet 1121, and the cooling medium flows out from liquid outlet 1121 after being merged. The cooling medium completes a circulation route inside the heat sink 100.
Referring to fig. 5, taking the first connection portion 12 as an example, the first connection portion 12 includes a first curved portion 122 located inside the heat dissipation device 100 and a second curved portion 123 located outside the heat dissipation device 100, and a first transition cavity 121 is formed between the first curved portion 122 and the second curved portion 123. The first curved portion 122 forms a groove portion 1221 at a junction of the bottom plate 1 and the first side plate 2, and the second curved portion 123 forms a protrusion 1231 corresponding to the groove portion 1211 at an outer side of the heat sink. If the grooves or protrusions are not visible on the outside of the product by painting or grinding, the inner wall of the transition chamber may have a similar structure to that of the present invention, and thus the present invention is considered to fall within the protection scope of the present invention.
The heat dissipation device 100 of the invention is formed by bending and secondary blowing of a flat liquid cooling plate, wherein the flat liquid cooling plate is formed by two substrates in a flat blowing mode, and the blowing mode comprises direct blowing molding and pre-blowing molding. And the liquid cooling pipeline is directly blown to a specified height by direct blow molding. And the pre-inflation is to inflate the outline of the pipeline first and then carry out the punching bulge treatment and the bending treatment on the pre-bending part. And (3) punching bulges at the pre-bending part of the flat plate type liquid cooling plate to enable the liquid cooling pipeline at the pre-bending part to protrude, and then avoiding the liquid cooling flow path region at the pre-bending part to perform bending treatment, so that the liquid cooling pipeline communicated with the two adjacent side plates is arranged between the two adjacent side plates.
And carrying out secondary blow-up forming on the bent liquid cooling plate, wherein the blow-up mode used for the secondary blow-up forming comprises water pressure and air pressure, and blowing up the liquid cooling pipelines at other positions to a specified height while blowing up the liquid cooling pipelines at the bent positions to form the bent liquid cooling plate.
The connecting portion at two adjacent panel department of bending has good manufacturability, and the problem that fold, fracture and shriveling collapsed can not take place for the transition chamber. Simultaneously, the laminating degree is higher when placing the device that generates heat, has improved the radiating efficiency.
The first cooling chamber 1 is provided with strip-shaped first flow channels 115 and strip-shaped first turbulators 115 at intervals. The first side plate 2 and the second side plate 3 are identical in structure and are inverted in the front-back direction. A second flow channel 211 arranged along the length direction of the first side plate 2 and a third flow channel 212 arranged along the height direction of the first side plate 2 are arranged in the second cooling cavity 21, and a second spoiler 213 is arranged between the second flow channel 211 and the third flow channel 212. The second cooling chamber 21 is further provided with a choke 214, and the choke 214 is provided above the third connecting portion 14.
The flow velocity and the flow direction of the cooling medium can be changed by arranging the flow disturbing part. The throttling opening can locally improve the flow velocity of the cooling medium and improve the cooling efficiency of the heat dissipation device.
In the heat dissipating device 100 of the present invention, the flow path of the cooling medium depends on the positions of the liquid inlet and the liquid outlet, and in other embodiments, the positions of the liquid inlet and the liquid outlet are different, and the flow path may be adjusted accordingly, which still falls within the scope of the present invention. The heat sink preferably belongs to a battery pack.
It will be apparent to those skilled in the art that various modifications and variations can be made to the above-described exemplary embodiments of the present invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (9)
1. A heat dissipating device, comprising:
the bottom plate, the first side plate and the second side plate are oppositely arranged on two sides of the bottom plate;
the bottom plate is provided with a first cooling cavity, the first side plate is provided with a second cooling cavity communicated with the first cooling cavity, and the second side plate is provided with a third cooling cavity communicated with the first cooling cavity;
a first connecting part is arranged at a bending part between the bottom plate and the first side plate, and the first connecting part comprises a first transition cavity communicated with the first cooling cavity and the second cooling cavity;
a second connecting part is arranged at a bent part between the bottom plate and the second side plate, and the second connecting part comprises a second transition cavity communicated with the first cooling cavity and the third cooling cavity;
the first connecting part and the second connecting part are both arranged to be sunken from the inside of the heat dissipation device to the outside of the heat dissipation device;
the first connecting portion comprises a first bending portion located on the inner side of the heat dissipation device and a second bending portion located on the outer side of the heat dissipation device, the first transition cavity is formed between the first bending portion and the second bending portion, the first bending portion forms a groove portion on the inner side of the heat dissipation device, and the second bending portion forms a protruding portion on the outer side of the heat dissipation device corresponding to the groove portion of the first bending portion.
2. The heat dissipating device of claim 1, wherein the first cooling chamber comprises an inlet chamber and an outlet chamber that are in communication with each other, the second cooling chamber is in communication with the inlet chamber, and the third cooling chamber is in communication with the outlet chamber.
3. The heat dissipating device of claim 2, wherein a third connecting portion is further disposed at the bend between the bottom plate and the first side plate, the third connecting portion includes a third transition chamber communicating the liquid inlet chamber with the second cooling chamber, and a fourth connecting portion is further disposed at the bend between the bottom plate and the second side plate, the fourth connecting portion includes a fourth transition chamber communicating the liquid outlet chamber with the third cooling chamber.
4. The heat dissipating device of claim 3, wherein the first connecting portion, the second connecting portion, the third connecting portion, and the fourth connecting portion are identical in structure.
5. The heat dissipating device of claim 4, wherein said bottom plate comprises an extension, and one side of said extension is provided with an inlet communicating with said inlet chamber and an outlet communicating with said outlet chamber.
6. The heat dissipation device of claim 5, wherein the first transition chamber is located between the third transition chamber and the inlet port, the cooling medium in the inlet chamber enters the second cooling chamber through the first transition chamber, the cooling medium in the second cooling chamber returns to the inlet chamber through the third transition chamber, the second transition chamber is located between the outlet port and the fourth transition chamber, the cooling medium in the outlet chamber enters the third cooling chamber through the fourth transition chamber, and the cooling medium in the third cooling chamber returns to the outlet chamber through the second transition chamber.
7. The heat dissipating device of claim 6, wherein the first cooling chamber has a first flow channel with a bar shape and a first spoiler with a bar shape at intervals.
8. The heat dissipating device of claim 6, wherein a second flow channel is disposed in the second cooling cavity along a length direction of the first side plate, and a third flow channel is disposed in a height direction of the first side plate, and a second spoiler is disposed between the second flow channel and the third flow channel.
9. The heat dissipating device of claim 8, wherein a restriction is disposed in the second cooling chamber, the restriction is disposed above the third connecting portion, and the first side plate and the second side plate are identical in structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111305919.8A CN114071958B (en) | 2021-11-05 | 2021-11-05 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111305919.8A CN114071958B (en) | 2021-11-05 | 2021-11-05 | Heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114071958A CN114071958A (en) | 2022-02-18 |
| CN114071958B true CN114071958B (en) | 2022-11-15 |
Family
ID=80274162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111305919.8A Active CN114071958B (en) | 2021-11-05 | 2021-11-05 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114071958B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114823249B (en) * | 2022-04-24 | 2023-11-21 | 宁德时代新能源科技股份有限公司 | Cooling device, high-voltage box, battery and power consumption device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552476B (en) * | 2016-03-07 | 2018-11-09 | 宁德时代新能源科技股份有限公司 | Battery pack thermal management system |
| CN111312940A (en) * | 2018-12-12 | 2020-06-19 | 湖南中车时代电动汽车股份有限公司 | Device based on battery package thermal design |
| CN209877476U (en) * | 2019-02-27 | 2019-12-31 | 常州恒创热管理有限公司 | Bending type liquid cooling plate |
| CN209926945U (en) * | 2019-02-27 | 2020-01-10 | 常州恒创热管理有限公司 | Bent plate type heat pipe |
| CN112770612B (en) * | 2021-01-25 | 2022-09-16 | 深圳市飞荣达科技股份有限公司 | Edge-folded heat dissipation plate and machining method thereof |
-
2021
- 2021-11-05 CN CN202111305919.8A patent/CN114071958B/en active Active
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| Publication number | Publication date |
|---|---|
| CN114071958A (en) | 2022-02-18 |
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Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd. Country or region after: China Address before: 213100 room 580, No. 18, Xinya Road, Wujin national high tech Industrial Development Zone, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd. Country or region before: China |