CN114014972A - Ketone hydrazine crosslinking system for organic carrier in photovoltaic silver paste - Google Patents

Ketone hydrazine crosslinking system for organic carrier in photovoltaic silver paste Download PDF

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CN114014972A
CN114014972A CN202111345594.6A CN202111345594A CN114014972A CN 114014972 A CN114014972 A CN 114014972A CN 202111345594 A CN202111345594 A CN 202111345594A CN 114014972 A CN114014972 A CN 114014972A
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silver paste
reagent
hydrazine
acrylic resin
acid dihydrazide
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CN114014972B (en
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任晓明
薛小兴
武会达
石岩
陈浩
胡西领
马海波
廖飞
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Shanghai Yinjiang Technology Co ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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    • Y02E10/50Photovoltaic [PV] energy

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Abstract

The invention provides a ketone hydrazine crosslinking system for an organic carrier in photovoltaic silver paste, which consists of acrylic resin, a hydrazine reagent and an amine reagent, wherein the ketone hydrazine crosslinking system comprises the following components in parts by weight: the total molar ratio of the acrylic resin to the acrylic resin, the hydrazine reagent and the amine reagent is (0.05-0.2): 1, the molar ratio of the amine reagent to the hydrazine reagent is (0.5-2): 1, and diacetone acrylamide (DAAM) is used as a monomer in the synthesis of the acrylic resin. The organic carrier for the photovoltaic silver paste comprises acrylic resin, a hydrazine reagent and an amine reagent, and when the organic carrier is used in the photovoltaic silver paste, the printed grid line can not collapse when being heated and dried, so that the narrow line width and the good height-width ratio are kept.

Description

Ketone hydrazine crosslinking system for organic carrier in photovoltaic silver paste
Technical Field
The invention relates to a ketone hydrazine crosslinking system for an organic carrier in photovoltaic silver paste.
Background
The photovoltaic industry is currently developing vigorously and silicon solar cells occupy more than 80% of the current market. The electrode grid lines for receiving the light surface of the silicon solar cell are formed by screen printing, drying and sintering conductive paste, so that the electrode grid lines are as narrow as possible and have a good height-width ratio, and the reduction of photovoltaic conversion efficiency caused by shielding of incident light can be reduced. The conductive silver paste for the silicon solar cell generally comprises an organic carrier, glass powder and conductive metal powder, the organic carrier part of the conductive paste generally comprises resin and an auxiliary agent, and the organic components generally soften or decompose gradually along with the heating temperature, so that the width of a grid line is widened and the cell efficiency is reduced. The ketone hydrazine crosslinking system is generally applied to water-based coatings, and has no disclosed application in the field of oily photovoltaic silver paste.
Disclosure of Invention
The invention aims to provide a ketone hydrazine crosslinking system for an organic carrier in photovoltaic silver paste, wherein the organic carrier is conductive silver paste for a solar cell, and can prevent linear collapse of the paste in a heating process, so that the line width of a printed grid line is narrow.
The invention provides a ketone hydrazine crosslinking system for an organic carrier in photovoltaic silver paste, which comprises acrylic resin, a hydrazine reagent and an amine reagent, wherein the ketone hydrazine crosslinking system comprises the following components in parts by weight: the total molar ratio of the acrylic resin to the acrylic resin, the hydrazine reagent and the amine reagent is (0.05-0.2): 1, the molar ratio of the amine reagent to the hydrazine reagent is (0.5-2): 1, and diacetone acrylamide (DAAM) is used as a monomer in the synthesis of the acrylic resin.
In the invention, the hydrazine reagent is one or a combination of more of adipic acid dihydrazide, oxalic acid dihydrazide, maleic acid dihydrazide, succinic acid dihydrazide, glutaric acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, tartaric acid dihydrazide, lauric acid dihydrazide, terephthalic acid dihydrazide, isophthalic acid dihydrazide and carbonic acid hydrazine.
In the invention, the amine reagent is an aliphatic tertiary amine reagent, and is one or a combination of triethanolamine and triethylamine.
In the present invention, the molar ratio of the hydrazine reagent to DAAM used for synthesizing the acrylic resin is (0.25-1): 1.
The ketone hydrazine crosslinking system for the organic carrier in the photovoltaic silver paste comprises acrylic resin containing ketone carbonyl, a hydrazine reagent and an amine reagent, wherein the ketone carbonyl of the acrylic resin is introduced by using a monomer diacetone acrylamide during synthesis, and at normal temperature or low temperature, the conductive silver paste can be prepared by adding glass powder and conductive metal powder into the organic carrier; when the grid line is heated, along with the volatilization of the amine reagent, the ketone carbonyl group and the hydrazine reagent in the acrylic resin are subjected to a crosslinking reaction, so that the printed grid line does not collapse in the drying and sintering stage, and the narrower line width and the better height-to-width ratio are kept.
The invention has the beneficial effects that:
the ketone hydrazine crosslinking system for the organic carrier in the photovoltaic silver paste comprises acrylic resin, a hydrazine reagent and an amine reagent, and when the ketone hydrazine crosslinking system is used in the photovoltaic silver paste, the printed grid line can not collapse when being heated and dried, so that the narrow line width and the good height-width ratio are kept.
Detailed Description
The invention is further illustrated by the following examples.
Example 1:
synthesis of acrylic resin
236.31 g of deionized water, 0.22 g of sodium lauryl sulfate and 7.12 g of a 0.7% aqueous potassium dihydrogen phosphate solution (neutralized to a pH of about 7 with potassium hydroxide) were added sequentially to a 500ml three-necked flask under a nitrogen blanket to obtain a mixture, which was then heated to 85 deg.foC was stirred for half an hour, and in a separate beaker, 55.18 g of n-butyl methacrylate monomer, 12.95 g of methyl methacrylate, 8.77 g of diacetone acrylamide and 0.26 g of ethylene glycol dimethacrylate as a crosslinking agent were added in this order to obtain a monomer mixture. At 85oC, 28.58 g of the monomer mixture in the beaker was charged into the three-necked flask, and after stirring for 15 minutes, 1.11 g of a 2.5% aqueous ammonium persulfate solution was added thereto, followed by 85 goAnd C, under the protection of nitrogen, dropwise adding the residual monomer mixture in the beaker into the three-neck flask at a constant speed, and finishing dropwise adding for 1 hour. After which the mixture continues at 85oStirring is continued for 2 hours under C, then 1.11 g of 2.5 percent aqueous ammonium persulfate solution is added, and the temperature is kept at 85 DEGoC, stirring for 2 hours, cooling, filtering the reacted mixed solution by a filter screen, pouring the filtered mixed solution into an aluminum pot, standing at 30 ℃ for 10 hours, and mechanically crushing to obtain white powder acrylic resin R1.
The above is for the synthesis of acrylic resin R1, wherein the molar ratio of n-Butyl Methacrylate (BMA) to Methyl Methacrylate (MMA) is 3:1, wherein the molar ratio of active monomer diacetone acrylamide (DAAM) to the total amount of monomers BMA and MMA is 0.1:1, denoted as content 10%, and the molar ratio of crosslinking agent Ethylene Glycol Dimethacrylate (EGDMA) to the total amount of monomers BMA and MMA is 0.0025:1, denoted as content 0.25%. The synthesis of the acrylic resin R2 and the acrylic resin R3 both adopt the same synthesis method as that of the example 1, but the content is adjusted, based on the acrylic resin R1, wherein the content of the acrylic resin R2 and the acrylic resin R3 using active monomers is adjusted to be 5 percent and 20 percent; the synthesis of each acrylic resin is shown in table 1.
The composition ratio of the monomer and the cross-linking agent in the synthesis of the acrylic resin R1-R3
Figure DEST_PATH_IMAGE001
Example 2:
preparation of conductive silver paste P1-P20 containing acrylic resin
Mixing the acrylic resin R1-R3 with other organic components according to the content in Table 2, and heating to 90 goC is cooled to 25 ℃ after being stirred for 2 hoursoC, adding glass powder and silver powder according to the content in the table 1, stirring the mixture into paste, adding an amine reagent and a hydrazine reagent (the specific content and the reagent name are shown in the table 3), finally adding a diethylene glycol monobutyl ether acetate and a diethylene glycol monobutyl ether mixed solution, adjusting the proportion of the two, repeatedly grinding and dispersing the mixture by using a three-roll machine until the Fineness (FOG) is less than 10 mu m and the viscosity is 83-88 Pa S (Brookfield VISCOMETER, available from BROOKFLE VISCOMETER, model HBDV 2T) at the rotating speed of 50rpm respectively obtain P1-P20 slurries.
TABLE 2 fixed content of paste components in silver paste P1-P6 formulation
Figure 311352DEST_PATH_IMAGE002
TABLE 3 silver paste formulations P1-P6 with varying component names and amounts
Figure DEST_PATH_IMAGE003
Example 3:
observation of viscosity change of conductive silver paste
The viscosities of the conductive silver pastes P1-P5 at 50rpm were measured using a brookfield VISCOMETER (available from brookfield mill, model HBDV 2T) using spindle 14 after 0.5 hours and 48 hours, respectively, after the sample preparation, and the specific viscosity values are given in table 4. After the conductive silver paste samples P1-P5 are configured for 0.5 hour, the viscosities are basically close to each other and are all about 84mPa S, after the conductive silver paste samples P1-P5 are configured for 48 hours, the viscosity changes of the conductive silver paste P2 and the conductive silver paste P3 are not large, the viscosity increase of the conductive silver paste P1 is large, and therefore the conductive silver paste P1 is unstable, and probably due to the fact that a ketone carbonyl unit introduced into acrylic resin through DAAM and adipic acid dihydrazide are subjected to a cross-linking reaction; the viscosity of the conductive silver paste P2-P5 is not changed greatly, which indicates that amine substances are adopted and the molar ratio of the used amount to the hydrazine substances is (0.5-2): 1, the cross-linking chemical reaction change in the silver paste can be avoided.
TABLE 4 viscosity Change Observation of conductive silver paste P1-P3
Figure 193901DEST_PATH_IMAGE004
Example 4:
tracking of line type changes during printing, baking and sintering of conductive silver paste P2, conductive silver paste P3 and comparative conductive silver paste P20
After the conductive silver paste was dispensed, conductive silver paste P2, conductive silver paste P3 and comparative conductive silver paste P20 were each printed by screen printing onto 158.75 μm by 158.75 μm P-type single crystal silicon wafers with backside silver and aluminum pastes using screen parameters of 520 mesh, 17 μm wire diameter, 8 μm film thickness and 22 μm opening, which was labeled as the printing process. The printed silicon wafer is immediately subjected to line type parameter observation through a 3D microscope (purchased from Keynes, model VHX-970F), the line height and the line width of the printed fine grid silver line on the solar cell wafer are mainly measured, and the height-width ratio is calculated. 3 battery pieces are taken from each battery piece printed by the paste, linear parameters of fixed positions on the battery pieces are measured, and then an average value is taken; heating the silicon wafer subjected to line measurement at the temperature of 280-350 ℃ for about 10 seconds by a multi-temperature-zone tunnel furnace, marking the process as a drying process, taking out the silicon wafer, and observing line parameters by a 3D microscope according to the same method; after the test is finished, the silicon wafer is subjected to 830 ℃ heating treatment for about 20 seconds through a multi-temperature-zone tunnel furnace at 750-. The line type parameters of the grid lines in the printing, drying and sintering processes are shown in table 5.
TABLE 5 tracking of line type changes in drying and sintering processes after printing of conductive silver paste
Figure DEST_PATH_IMAGE005
As can be seen from table 5, the line width of the line pattern printed with the conductive silver paste P20 of comparative example was expanded, the line height was reduced, and the line pattern collapse was confirmed during the period from printing to drying. Compared with the conductive silver paste P20 of the comparative example, the line widths of the conductive silver paste P2 and the conductive silver paste P3 from printing to drying to sintering are narrowed, and the aspect ratio is not changed greatly, which indicates that the ketohydrazine crosslinking system applied in the conductive silver paste P2 and the conductive silver paste P3 can effectively inhibit the linear collapse in the heating process.
Example 5
Screen printing and line inspection of conductive silver paste
All slurries of examples and comparative examples were printed by screen printing 1 hour after slurry placement onto P-type single crystal silicon wafers of 158.75 μm by 158.75 μm size with backside silver and aluminum pastes using screen parameters of 520 mesh, 17 μm wire diameter, 8 μm film thickness and 22 μm openings, respectively. And (3) heating the printed silicon wafer by using a multi-temperature-zone tunnel furnace to obtain a stable solar cell, wherein the temperature of the initial heating section of the tunnel furnace is 280 ℃, and the temperature of the final heating section is 900 ℃.
The line height, line width and aspect ratio of the fine grid silver line printed on the solar cell sheet were mainly measured by observing the line parameters after sintering with a 3D microscope (from keyence, model VHX-970F). And 3 battery pieces printed by each paste are respectively taken, the linear parameters of the fixed positions on the battery pieces are measured, and then the average value is taken. Specific linetype parameters are shown in Table 6.
TABLE 6 grid line profile parameters of solar cells made from conductive silver pastes P3-P11 and comparative example P20
Figure 281942DEST_PATH_IMAGE006
In table 6, from the printing results of the conductive silver paste P3 and the conductive silver paste P4, it can be seen that the amine reagent is used in an increased amount, which results in an increased line width; from the printing results of the conductive silver paste P6 and the conductive silver paste P7, it was found that when the molar ratio of the hydrazine-based agent to the DAAM deviates from 0.5:1, the effect of suppressing the linear collapse is reduced; from the printing results of the conductive silver paste P8-P11, it can be known that when the content of DAAM and hydrazine is correspondingly reduced or increased, the effect of inhibiting linear collapse is correspondingly reduced or enhanced; from the printing results of the conductive silver paste P12-P19, compared with the conductive silver paste P20 of the comparative example, the application of different hydrazines can play the roles of narrowing the line width and improving the aspect ratio due to the fact that the linear collapse in the heating process can be inhibited; further, the longer the linking structure between dihydrazides is, the weaker the effect of suppressing linear collapse is.
The embodiments of the present invention have been described in detail, but the embodiments are merely examples, and the present invention is not limited to the embodiments described above. Any equivalent modifications and substitutions to those skilled in the art are also within the scope of the present invention. Accordingly, equivalent changes and modifications made without departing from the spirit and scope of the present invention should be covered by the present invention.

Claims (4)

1. A ketone hydrazine crosslinking system for an organic carrier in photovoltaic silver paste is characterized in that: the ketone hydrazine crosslinking system comprises acrylic resin, a hydrazine reagent and an amine reagent, wherein: the total molar ratio of the acrylic resin to the acrylic resin, the hydrazine reagent and the amine reagent is (0.05-0.2): 1, the molar ratio of the amine reagent to the hydrazine reagent is (0.5-2): 1, and diacetone acrylamide (DAAM) is used as a monomer in the synthesis of the acrylic resin.
2. The ketone hydrazine crosslinking system for the organic carrier in the photovoltaic silver paste as claimed in claim 1, wherein: the hydrazine reagent is one or more of adipic acid dihydrazide, oxalic acid dihydrazide, maleic acid dihydrazide, succinic acid dihydrazide, glutaric acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, tartaric acid dihydrazide, lauric acid dihydrazide, terephthalic acid dihydrazide, isophthalic acid dihydrazide or carbohydrazide.
3. The ketone hydrazine crosslinking system for the organic carrier in the photovoltaic silver paste as claimed in claim 1, wherein: the amine reagent is an aliphatic tertiary amine reagent and is one or a combination of triethanolamine and triethylamine.
4. The ketone hydrazine crosslinking system for the organic carrier in the photovoltaic silver paste as claimed in claim 1, wherein: the molar ratio of the hydrazine reagent to DAAM used in the synthesis of the acrylic resin is (0.25-1): 1.
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Citations (12)

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CN102103895A (en) * 2010-11-23 2011-06-22 湖南威能新材料科技有限公司 Silver paste used for positive electrodes of solar batteries and grid lines, preparation method thereof and solar battery containing same
US20120015472A1 (en) * 2009-03-30 2012-01-19 Sanyo Electric Co., Ltd. Method of producing solar cell module
JP2013001750A (en) * 2011-06-14 2013-01-07 Nippon Steel & Sumikin Chemical Co Ltd Cross-linked polyimide resin, method of producing the same, adhesive resin composition, cured product thereof, coverlay film, and circuit board
CN102993534A (en) * 2012-11-10 2013-03-27 江苏瑞德新能源科技有限公司 Organic carrier capable of increasing height-width ratio of grid line
JP2013060637A (en) * 2011-09-14 2013-04-04 Dic Corp Complex of organic compound and nano copper particle, complex of organic compound and nano copper oxide (i) particle, and method for manufacturing them
US20160126384A1 (en) * 2013-07-09 2016-05-05 Agfa-Gevaert A backsheet for photovoltaic modules
CN106674418A (en) * 2016-12-12 2017-05-17 华南理工大学 Ketone-hydrazine crosslinking aqueous acrylic resin with film-forming-assisting function and preparation method and application thereof
WO2019006764A1 (en) * 2017-07-07 2019-01-10 上迈(香港)有限公司 Laminated structure of photovoltaic module, preparation method therefor, and photovoltaic module
JP2019102273A (en) * 2017-12-01 2019-06-24 株式会社カネカ Conductive paste composition
US20200095370A1 (en) * 2017-05-26 2020-03-26 Kaneka Corporation Conductive paste composition, device comprising electrode formed from same, and method for producing conductive paste composition
CN113035408A (en) * 2020-03-17 2021-06-25 深圳市百柔新材料技术有限公司 Solar cell grid line paste and preparation method thereof, and solar cell

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100186823A1 (en) * 2008-12-31 2010-07-29 Eternal Chemical Co., Ltd. Solvent-free conductive paste composition and solar cell element employing the same
US20120015472A1 (en) * 2009-03-30 2012-01-19 Sanyo Electric Co., Ltd. Method of producing solar cell module
CN102103895A (en) * 2010-11-23 2011-06-22 湖南威能新材料科技有限公司 Silver paste used for positive electrodes of solar batteries and grid lines, preparation method thereof and solar battery containing same
JP2013001750A (en) * 2011-06-14 2013-01-07 Nippon Steel & Sumikin Chemical Co Ltd Cross-linked polyimide resin, method of producing the same, adhesive resin composition, cured product thereof, coverlay film, and circuit board
JP2013060637A (en) * 2011-09-14 2013-04-04 Dic Corp Complex of organic compound and nano copper particle, complex of organic compound and nano copper oxide (i) particle, and method for manufacturing them
CN102993534A (en) * 2012-11-10 2013-03-27 江苏瑞德新能源科技有限公司 Organic carrier capable of increasing height-width ratio of grid line
US20160126384A1 (en) * 2013-07-09 2016-05-05 Agfa-Gevaert A backsheet for photovoltaic modules
CN106674418A (en) * 2016-12-12 2017-05-17 华南理工大学 Ketone-hydrazine crosslinking aqueous acrylic resin with film-forming-assisting function and preparation method and application thereof
US20200095370A1 (en) * 2017-05-26 2020-03-26 Kaneka Corporation Conductive paste composition, device comprising electrode formed from same, and method for producing conductive paste composition
WO2019006764A1 (en) * 2017-07-07 2019-01-10 上迈(香港)有限公司 Laminated structure of photovoltaic module, preparation method therefor, and photovoltaic module
JP2019102273A (en) * 2017-12-01 2019-06-24 株式会社カネカ Conductive paste composition
CN113035408A (en) * 2020-03-17 2021-06-25 深圳市百柔新材料技术有限公司 Solar cell grid line paste and preparation method thereof, and solar cell

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