CN114008753A - 用于安装和冷却电路元件的方法和装置 - Google Patents
用于安装和冷却电路元件的方法和装置 Download PDFInfo
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- CN114008753A CN114008753A CN202080046135.5A CN202080046135A CN114008753A CN 114008753 A CN114008753 A CN 114008753A CN 202080046135 A CN202080046135 A CN 202080046135A CN 114008753 A CN114008753 A CN 114008753A
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- circuit board
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Abstract
公开了一种用于安装和冷却具有多个触点的电路元件的方法。所述方法包括将电路元件安装在导热且电绝缘的材料的刚性基板上,其中电路板布置在电路元件和基板之间。具有柔性基底并承载终止于接触焊盘的导电迹线的电路板被固定到刚性基板,其中电路板上的至少一些接触焊盘被设置在电路板的面向刚性基板的一侧上,至少一些接触焊盘被接合到基板。为了在电路元件的触点和接合到基板的接触焊盘之间建立电连接和热连接,在电路板的柔性基底中形成盲孔,每个孔终止于接合到基板的接触焊盘中的相应一个。接触焊盘的被孔暴露的一侧被电镀以形成导电过孔,该导电过孔填充孔并焊接到电路元件的触点。
Description
技术领域
本发明涉及一种用于安装和冷却电路元件的方法和装置。
背景技术
某些电路元件需要几个电连接,并且在工作期间产生相当多的热量。为了防止过热和/或允许有效操作,这些部件需要以与散热器良好热接触的方式安装,以避免它们被损坏或变得功能异常。因此,它们需要在实现与部件的触点的电连接的同时提供良好的排热的安装件。虽然下面将具体参照垂直腔面发射激光器VCSEL芯片来描述本发明,但是这些仅仅是消耗相对高功率并产生大量热的电路元件的一个示例。在许多其它可以从本发明获益的电路中有微处理器芯片,尤其是用于计算机和越来越多的设备中。
本申请人已经提出了一种印刷方法,该方法需要将供体表面上的聚合物颗粒加热到它们变得发粘的程度。当供体表面随后被压在基板上时,颗粒转移到基板上以形成所需的印刷图像。通过VCSEL芯片阵列发射的激光束加热待发粘的聚合物颗粒。颗粒可以包含着色剂(例如颜料或印模),在这种情况下,印刷图像至少部分地被着色,或者它们可以没有这样的试剂,在这种情况下,印刷图像可以在印刷基板上提供不同的效果(例如光泽、压花等)或者用作随后印刷步骤的接受层。
需要相当大的功率来产生软化聚合物颗粒所需的能量。为了避免芯片过热,迄今为止,它们被直接安装在薄的刚性陶瓷电路板上,与冷却的歧管直接热接触。陶瓷电路板是良好的热导体,但也是良好的电绝缘体。这允许电迹线(有时也称为迹线或引线)直接以电解方式形成在陶瓷电路板上,其中VCSEL芯片可以焊接到接触焊盘上。
在偏离VCSEL芯片的分离位置,陶瓷电路板形成有另外的接触焊盘,以允许焊接具有用于将VCSEL芯片连接到控制和驱动电路的迹线的柔性电路板。因此,来自控制和驱动电路的电流在到达相关VCSEL元件之前需要流经柔性电路板上的迹线、柔性和陶瓷电路板之间的第一焊接连接、陶瓷电路板上的相应迹线以及陶瓷电路板和VCSEL芯片之间的第二焊接连接。
这种安装和冷却VCSEL芯片的方法具有影响可靠性的某些缺点。首先,在通向VCSEL芯片的每个触点的电流路径中存在两个焊接连接的事实增加了不良电连接的可能性。焊接连接中的缺陷(其可能随时间而增加或传播)甚至可能在芯片的操作期间导致故障。其次,陶瓷板本身相对易碎,并且已知会破裂。使其更坚固(例如,更厚)降低了其热效率,而板的破裂会导致在板上形成的迹线中的开路,这可能另外降低芯片电路的完整性。
US2006/0109632(Berlin等人)公开了电路子组件,其包括由电绝缘但导热的材料形成的刚性基板、安装在基板上的电路板、电路元件和安装在电路板中的孔,电路板具有基底和终止于相应接触焊盘的多个迹线,电路元件安装在电路板的与刚性基板相对的一侧上并且电连接到电路板的接触焊盘,孔由导电和导热的过孔填充以将热量从电路元件传导到刚性基板并且将电路板上的迹线连接到电路元件。在US2006/0109632中,电路板具有由陶瓷层的层压构造形成的基底,并且通过用随后烧制的银膏填充形成在基底中的孔来形成导热过孔。在700℃或更高的高温下进行的烧制不仅对于在过孔中形成导电路径是关键的,而且对于形成多层陶瓷载体也是关键的。
在某些应用中,希望电路板是柔性的,而US2006/0109632的电路板必须是刚性的,因为其由陶瓷制成。相同的生产方法不能用于柔性电路板,其中基底由不能承受烧结陶瓷层和银膏以形成过孔所需的高温的材料制成。此外,柔性板的基底可以具有仅几十微米的厚度,并且优选地甚至更小,这将使得即使基底的材料可以耐受温度,也很难形成烧结的过孔。
目的
因此,本发明尤其寻求提供一种在刚性基板上安装和冷却具有多个触点的电路元件的方法,该刚性基板由使用薄的柔性电路板的导热的电绝缘材料制成。
发明内容
根据本发明的第一方面,提供了一种安装和冷却具有多个触点的电路元件的方法,该方法包括:
(i)提供导热且电绝缘的材料的刚性基板,
(ii)提供电路板,其具有电绝缘的柔性基底和在柔性基底上用于连接到电路元件的触点的多个导电迹线,每个迹线终止于相应的接触焊盘,所述相应的接触焊盘定位成与电路元件的相应触点对准,
(iii)将所述电路板固定到所述刚性基板,其中所述电路板上的所述接触焊盘中的至少一些设置在所述电路板的面向所述刚性基板的一侧上,
(iv)将所述电路板的面向所述刚性基板的一侧上的所述接触焊盘中的至少一些接合到所述刚性基板,以在接合的接触焊盘与所述刚性基板之间建立热接触,
(v)在所述电路板的所述柔性基底中形成盲孔,每个孔终止于所述柔性基底上的所述接触焊盘中的相应一个接触焊盘,所述相应一个接触焊盘位于所述电路板的面向所述刚性基板的一侧上,
(vi)电镀所述接触焊盘的被所述孔暴露的一侧,以生长至少一种金属材料来填充所述电路板的所述柔性基底中的所述孔,从而形成在所述柔性基底的相对侧之间延伸的导电和导热过孔,
(vii)将电路元件放置在电路板上,使得具有柔性基底的电路板位于电路元件和刚性基板之间,以及
(viii)将所述电路元件的所述触点焊接到所述过孔,以在所述电路元件的所述触点与所述电路板上的所述迹线之间建立电连接,并且在所述电路元件的所述触点中的至少一些触点与所述刚性基板之间建立热连接。
电路板的焊盘可以直接连接到刚性基板,或者通过扩散接合或低温烧结连接到形成在刚性基板上的金属焊盘。
术语“扩散接合”是指在金属和另一种材料(其本身可以是金属,但不必须是金属)之间建立连接的方法,其中对金属施加热和压力,使得接触表面通过扩散或迁移而彼此接合,而金属不会达到其熔点。
术语“低温烧结”在本文中用于指在金属和另一种材料(例如,用于刚性基板的陶瓷材料)之间建立连接的方法,其中对两种材料施加热和压力,使得它们彼此接合,而金属不会达到其熔点。通常,低温烧结在300℃或更低的温度下进行。
扩散接合和烧结与软钎焊和硬钎焊的不同之处在于,它们不使用任何液体填料,并且取决于材料和接合条件,可能不一定需要使用接合剂。在根据本教导的制造子组件的方法中避免使用液体填充物是期望的,因为当接触焊盘彼此靠近定位时,其防止意外短路。
方便地,形成过孔的电镀可以是化学镀镍浸金(ENIG)电镀。
根据本发明的第二方面,提供了一种电路子组件,包括:
a)由电绝缘但导热的材料形成的刚性基板,
b)安装在所述基板上的电路板,所述电路板具有基底和终止于相应的接触焊盘中的多个迹线,
c)电路元件,其安装在所述电路板的与所述刚性基板相对的一侧上,并且电连接到所述电路板的所述接触焊盘,以及
d)形成在所述电路板中的孔,所述孔填充有导电和导热过孔以将热量从所述电路元件传导到所述刚性基板并且将所述电路板上的迹线连接到所述电路元件,
其特征在于
e)所述电路板的所述基底是柔性的,
f)电路板的接触焊盘的至少一些被布置在电路板的面向刚性基板的一侧上并且被接合到刚性基板,
g)电路板的柔性基底中的至少一些孔终止于但不穿过接合到刚性基板的相应接触焊盘,以及
h)填充电路板的柔性基底中的孔的每个孔形成为相应接触焊盘的背对刚性基板的一侧的镀层,其焊接到电路元件的相应触点。
在一些实施例中,电路板的柔性基底的厚度可以在1μm至125μm、2μm至75μm、2μm至50μm、2μm至25μm、2μm至10μm或2μm至5μm的范围内。
由于上述电路子组件包括彼此连接的至少一个柔性部分和至少一个刚性部分,所以子组件也可称为“刚性-柔性子组件”、“刚性-柔性组件”或“刚性-柔性电路”等变型。
尽管US2006/0109632公开了电路子组件的制造,所述电路子组件包括具有多个触点的电路元件、在基底上具有多个迹线的电路板以及刚性基板,电路元件的触点电连接到所述基底上,所述刚性基板由电绝缘但导热材料形成,并设置在柔性电路板的与电路元件相对的一侧上,但是相信以前从未尝试过使用具有这种构造的柔性基底的电路板。这是因为电路板的基底的柔性产生了若干挑战性的障碍,特别是当考虑具有小于100微米(μm)的厚度的相对薄的柔性基底时。
当使用具有柔性基底的电路板时遇到的严重障碍之一是,基底由不能承受金属烧结所需的高温的塑料材料制成。
本发明与US2006/0109632的不同之处尤其在于形成过孔的方法。尽管'632申请中的孔是通孔,但是本发明的电路板的基底中的孔是盲孔,该盲孔在一端处通过接合或待接合到刚性基板的接触焊盘封闭。因为在本发明的情况下,过孔仅需要具有仅几微米的高度,所以它们可以通过电镀金属表面覆盖和封闭基底中的孔的端部来形成。这避免了通过烧结形成通孔的需要,并且还避免了在通孔和电路板上的迹线之间进行焊接连接的需要。结果,在电路径中,即在过孔和电路元件的相应触点之间,仅需要单个焊料接头。
参考以下接合附图、非限制性实施例和所附权利要求的详细描述,本公开的这些和另外的益处和特征将被更好地理解,并且部分地对于本领域技术人员将是显而易见的。
附图说明
现在将参考附图通过示例的方式进一步描述本发明,其中相同的附图标记或字符表示相应或相同的部件。该描述与附图一起使得本领域的普通技术人员明白如何可以实践本发明的一些实施例。附图是为了说明性讨论的目的,并且不试图比基本理解本发明所必需的更详细地示出实施例的结构细节。为了清楚和方便呈现,图中描绘的一些对象不一定按比例示出。
在附图中:
图1是通过包括VCSEL芯片、柔性电路板、刚性基板和散热器的子组件的截面图;
图2是图1所示的子组件的分解图;以及
图3示意性地示出了根据本发明的实施例的用于制造图1和图2的子组件的方法中涉及的步骤。
具体实施方式
图1示出了电路子组件100的截面图,该子组件具有管芯10形式的电路元件,该电路元件安装在通过散热器18冷却的刚性基板16上,在管芯10和刚性基板16之间设置有柔性电路板12。这些元件之间的互连在下面参考图2进行描述,图2是子组件的分解图。在所有附图中,为了帮助理解,管芯10和散热器18未加阴影,较暗的灰色阴影用于电绝缘材料,而较亮的灰色用于电导体。附图是通过示例性电路子组件的横截面,放大了子组件的说明性部分,清楚的是,通常存在附加迹线,这些迹线从所示视图中隐藏,其中迹线可以被终接它的接触焊盘隐藏。未示出驱动器和控制器。
无论是柔性的还是刚性的电路板,在此也可以称为印刷电路板,而不管在柔性或刚性支撑上形成导电电路的图案的实际模式。如印刷电路板领域的技术人员容易理解的,电路可以通过叠加法(例如,选择性沉积期望的导体图案)或减法方法(例如,从均匀的导电层蚀刻掉期望图案周围的区域)形成,并且不需要必须以术语的常规意义“印刷”。这些方法不需要在此详述。
现在参考图2,如图所示,管芯10在其下侧具有多个触点101,并且在其上侧具有单个触点102。虽然在图中由管芯上侧上的单个触点102表示,但是公共触点的数量可以多于一个,同时优选地少于管芯下侧上的多个触点101的数量。公共触点的数量优选地是该多个触点的数量的一半或更少、三分之一或更少、四分之一或更少。
可由管芯制造商应用的触点可具有铟(In)、金(Au)、银(Ag)、锡(Sn)或其合金的凸块的形式,或者可以是SAC焊料凸块、包括各种量的锡(例如≥95%)、银(例如≤5%)和铜(例如≤1%)的SAC合金,焊料凸块旨在实现管芯的表面安装。管芯10例如可以是VCSEL芯片。这种芯片包括多个激光器元件(例如16、32、64、128、256等),每个激光器元件可以通过在相应的一个触点101和一个或多个公共触点102上施加电压来供电。例如,在管芯10是具有六十四个单独激光元件的VCSEL芯片的情况下,管芯可以包括六十四个触点101和八个公共触点102。如上所述,VCSEL芯片仅是可以从本发明获益的管芯组件的一个示例,并且如果管芯替代地是CPU,则这样的单元可以包含通常紧密封装的数百个直至数千个单独的触点。
回到VCSEL的例子,当从VCSEL芯片的单个激光器元件发射激光束时,在激活的激光器元件附近产生大量的热。为此,希望除了提供电流到激光器元件的路径之外,通向管芯的相应触点101的电导体还应当提供热路径以允许热量从管芯10耗散。鉴于这种管芯可能需要的大量连接,并非所有的电导体都必须具有充当用于散热的热路径的双重作用。在一些实施例中,仅子组件的各个部分之间的一些连接足以(例如,经由刚性板与散热器的接触)排出过多的热量。
应当理解,VCSEL芯片仅是一种具有多个触点的管芯,这些触点通过电导体连接到其它电路,并且由于产生的热量,在工作期间需要冷却,并且本发明提供的改进同样适用于这些其它管芯。此外,尽管本发明对于由管芯、管芯上的元件产生的热量和/或由此所需的电流可能相当大的应用(例如,将温度升高到环境操作温度以上20℃或更多)是有利的,但是它可以替代地或附加地用于刚性-柔性组件,在该刚性-柔性组件中,触点的数量被提高(例如,>50触点/mm2)和/或在该刚性-柔性组件中,相邻触点之间的间距相对较小(例如,≤200μm,或≤100μm,或≤75μm,间距通常不小于50μm)。在相应的相邻孔之间可形成类似的相对小的间距(小的,例如≤200μm,或≤100μm,或≤75μm,且可选地≥50μm)。
通向各个触点101的电导体由具有柔性基底122的柔性电路板12的导电迹线121形成。每条迹线终止于焊盘123,该焊盘与管芯10的相应触点101对准,并通过填充柔性电路板12的基底122中的孔125的金属124与其连接。可以通过CNC机器、UV激光器或CO2激光器、通过化学蚀刻电路板基底的材料、通过反应离子蚀刻(化学活性物质和高能离子轰击之间的协同过程,缩写为IRE)或使用任何合适的装置或方法在柔性电路板中钻孔,以形成直径(或任何其它代表性尺寸)在40μm至200μm、或40μm至100μm、或40μm至75μm范围内的孔。钻孔方法必须具有足够的选择性,以形成仅穿过柔性基底厚度的孔,而不损坏下面的接触焊盘(例如123)或任何预先存在于柔性基底上与预期孔的位置重叠的迹线。如果需要,在一些实施例中,在电路板已经固定到刚性基板之后,孔可以形成在电路板的柔性基底中。
柔性电路板12在其相对侧上还具有公共或接地导体126,其通过通常由金(Au)、铝(Al)或铜(Cu)制成的相应带或线14连接到管芯10上的一个或多个公共触点102。焊料掩模的绝缘层127和128覆盖导电迹线121和公共导体126,以避免导电材料的不期望的化学变化(例如,金属的氧化)和短路(即,迹线之间的无意的电连接,其允许电流沿着非预期的路径行进)。
为了冷却管芯10,提供了导热但电绝缘的材料的薄刚性基板16,其可以安装成与散热器18良好热接触,该散热器可以例如被流体冷却。接触焊盘161可选地形成在刚性基板16上,其可以在组装状态下(例如,通过扩散熔合)接合到柔性电路板12上的焊盘123。或者,接触焊盘123可直接低温烧结或扩散接合至刚性基板16。(例如,150℃至300℃之间或200℃至300℃之间的)直接低温烧结可通过使用用于形成接触焊盘123的银及通过使刚性基板的相对粗糙(例如,具有在1μm至10μm、1μm至5μm或1μm至2μm范围内的平均表面粗糙度rz)的表面来促进。在每个触点101处产生的热量可以经由由金属124、接触焊盘123(和161,当存在时)和刚性基板16形成的导热路径流到散热器18。如前所述,并非所有的互连都必须用作热路径。
虽然为了简化说明,金属填充孔125被示出为可能由相同材料制成的单个块体,但是金属124可以包括两层或更多层不同的金属或其合金。为了说明,在一个实施例中,孔可以由第一镍层填充,镍层面对焊盘123,并且由第二金层填充,金层面对管芯10上的触点101。在另一个实施例中,孔可以由三层金属填充,诸如第一镍层,镍层面对焊盘,第二中间铂或钯层,以及第三金层,金层面对触点。可以使用金属的化学镀和/或电化学镀来完成用导电材料填充孔。另外或替代地,可以在连续步骤中进行以形成各种金属和/或合金(例如金、镍、钯、铂和更多)的层。通过将柔性印刷电路板12夹在管芯10和散热器18上的刚性基板16之间,所示的子组件提供到管芯的每个触点101的电路径,该电路径可以另外提供到散热器18的热路径。
现在将参照图3描述构造图1和2的子组件的方法以及子组件的部件的进一步细节,其中示意性地表示了九个阶段,并分别由罗马数字I至IX表示。
子组件的制造可以从空白柔性板120(例如,具有一个或多个(例如,两个)铜层的覆铜层压板)和刚性导热但电绝缘的基板16开始,这些是商业上可获得的物品。在一些实施例中,参照图1和图2描述的柔性印刷电路板12可以根据以下步骤中的一些来制备。因此,以下在工艺和空白且逐步修改的柔性板120的上下文中描述的材料和参数可相应地应用于包括构成电路的任何期望图案中的迹线的成品电路板12。
在阶段I中,柔性板120仅包括柔性基底122和层压到基底122上的公共导体126。由于基底122可以是薄的,所以可以将更坚固的载体129固定到公共导体126的相对侧。
电路板120的柔性基底122可由热塑性或热固性塑料材料形成,例如聚酰亚胺(PI)、聚醚醚酮(PEEK)、聚酯(包括聚对苯二甲酸乙二醇酯(PET))、聚萘二甲酸乙二醇酯(PEN)、聚醚酰亚胺(PEI)、任何合适的含氟聚合物(FEP)或任何合适的共聚物。柔性基底的厚度通常在1μm至125μm、或2μm至75μm、或2μm至50μm、或2μm至25μm、或2μm至10μm、或2μm至5μm的范围内,但更厚的柔性基底厚度是可能的,只要所得柔性板12能够充分弯曲以适合其用途。
导体126以及迹线121通常由铜或铜合金形成,但可由任何合适的导电材料(例如,金属,诸如银、金、铝或镍,或导电聚合物,诸如聚吡咯等)制成。导体层126的厚度通常在1μm至100μm、或1μm至50μm、或5μm至20μm的范围内。
导体层126通常在存在适于聚合物和待附接的导电材料的中间粘合层的情况下与柔性基底122层压。一些层压物120可能不需要粘合剂来实现结构完整性。
如果载体129本身是柔性的,其材料通常是聚对苯二甲酸乙二醇酯(PET),但这并不重要,因为载体随后要被分离和丢弃。或者,载体可以是固体支持物,例如玻璃背衬或硅晶片,在这种情况下,在分离层压物后可以将其回收。
刚性导热基板16可由氮化铝(AlN)制成,其在环境温度和压力下测量的热导率在约100至约250瓦每米开尔文(W/m·K)的范围内,或在约100至约230W/m·K的范围内,或在约140至约250W/m·K的范围内,或在约140至约230W/m·K的范围内,或在约170至约250W/m·K的范围内,或在约170至约230W/m·K的范围内。刚性基板的厚度可以为约250μm或更小、200μm或更小、150μm或更小、100μm或更小、甚至约50μm或更小。适用于本发明的刚性基板的厚度通常为5μm或更大、10μm或更大、或25μm或更大。这种相对较薄的厚度是值得注意的,如常规的刚性-柔性,其中陶瓷刚性基板通常包括电路的一部分,并且如果由类似材料制成,则目前根据本教导的子组件的柔性区段(一个或多个)所约束的连接点通常具有300μm或更大、或甚至350μm或更大的厚度。
足够坚固并能够承受电路子组件及其部件的工作温度的任何其它材料都可以用作刚性基板。例如,诸如氮化硼(BN)、磷化硼(BP)、ShapalTM Hi-M Soft(德山公司开发的可机加工的氮化铝和氮化硼混合型)、氧化铍(BeO)和氧化铝(Al2O3)之类的许多陶瓷材料将是合适的。或者,刚性基底可由金刚石或类金刚石碳(DLC)制成。有利地,刚性基板应具有与其在子组件的操作条件所关注的温度范围(例如,从-20℃到+300℃)中可接触的表面(例如,散热器18)匹配的热膨胀系数。
在阶段II中,导电迹线121和接触焊盘123形成在柔性电路板120的基底122上,并且对应的接触焊盘161形成在刚性基板16上。这些导电迹线和接触焊盘可以使用在电路板的制造中采用的常规技术形成,因此不需要在此进行任何详细描述。例如,可以通过电镀施加所需的导电图案,并且通过电镀在图案上形成一定厚度的铜或铜合金,以获得所需水平的导电性。适当地,迹线可以具有5μm至100μm之间、5μm至50μm之间、或5μm至25μm之间的宽度。通常,相邻迹线之间的最小距离(间距)在5μm与500μm之间、在5μm与250μm之间、在5μm与125μm之间或在5μm与62.5μm之间。相邻线之间的最小距离也可以称为电路的临界尺寸(CD)空间。已经阐明,印刷电路还可以包括这样的区域,在该区域中,相邻的线彼此分开大于500μm,并且根据电路板设计,该区域可以例如相距几毫米,或者甚至几厘米。虽然迹线可以具有各种形状和横截面轮廓,但是具有梯形或矩形横截面的迹线是优选的。在柔性板表面上其基底的水平处的迹线宽度和其最大高度(通常,但不是必须在迹线宽度的中心)之间的迹线轮廓的纵横比在1:5到2:1的范围内,或在1:4到2:1之间,或在1:3到2:1之间。
选择用于形成焊盘123和161的金属,使得它们可以彼此扩散接合,以形成物理上坚固的连接,并在焊盘123和161之间提供良好的导热性和导电性。从顶视图看,接触焊盘通常是圆形或椭圆形的,其至少一个直径通常大于焊盘终止的迹线的宽度。优选地,印刷电路上的接触焊盘的直径对应于管芯上的触点的直径的80%到120%。印刷电路上的接触焊盘的高度通常类似于迹线的高度,但是考虑到互连性,可以高达焊盘所终止的迹线的高度的10%、20%或40%。
在阶段III中,在施加压力以实现期望的接合(例如,通过扩散接合或低温烧结)而不涉及任何材料转变为液相的同时,加热柔性电路板120(包括其上的任何迹线121和焊盘123)和基板16。虽然温度和压力可以取决于柔性电路板120、基板16和形成在其上的接触焊盘123(和161,当存在时)中的每一个的特定构造(例如,材料和尺寸),但是施加的温度和压力各自和组合地足够高以实现接合并且足够低以防止组件或其部分的功能损害和/或减少组件或其部分的物理损坏。合适的温度可以在100℃至300℃、150℃至300℃或200℃至300℃的范围内。通常,用于本发明方法的温度相对低于常规用于制备完全基于耐热材料的制品的温度。可以理解,由塑料材料(也称为聚合物)制成的薄柔性基底的存在排除了适于通常较厚的由陶瓷制成的支撑件的温度的使用,并且特别排除了适于烧结导电材料和/或用于接合层压支撑件的刚性层的高温(例如,高于700℃)的使用。
合适的压力可以在0.5兆帕(MPa)至100MPa、0.5MPa至60MPa或1MPa至10MPa的范围内。通过伴随的或顺序的这些因素中的每一个的上升,可以获得期望的扩散接合温度,例如在达到期望的温度之后,压力可以升高到所需的水平。在合适的上述温度和压力下,这种接合可以在几分钟内(例如,在5分钟或更短、4分钟或更短、3分钟或更短、或2分钟或更短)或在允许范围内的升高的温度和几秒内(例如,在60秒或更短、40秒或更短、或30秒或更短)的压力下获得。通常,接合持续时间为至少10秒。
在阶段IV中,将阻焊层127施加到导电迹线121,并且在阶段V中,在载体129被剥离之后,将类似的阻焊层128施加到公共导体126的一些部分。施加阻焊层127和128以覆盖任何金属或互连不需要的其它导电材料,确保由此覆盖的任何部分保持物理完整,并且电仅流过预期路径,而没有短路。
在阶段VI,没有被阻焊层128选择性保护的公共导体126的一个或多个部分被蚀刻以暴露柔性电路板的基底122的覆盖接触焊盘123(和161,当存在时)的区域,这是稍后要在其上安装管芯10的区域。
在阶段VII中,在柔性电路板的基底122中形成与焊盘123(和161,当存在时)对准的孔125。在阶段VIII中,例如可以通过钻孔、通过暴露于激光或者通过物理/化学蚀刻形成孔125,用金属124填充以形成过孔。例如,可以通过使用化学镀镍浸金(ENIG)电镀或电解银沉积来实现填充以形成导电和导热过孔(垂直互连通路)。无论沉积的组成和方法如何,金属124都可以被称为凸块下金属化(UBM)。优选地,填充孔的金属(可选地在多于一层中,例如在两层或三层中,等等)将与柔性基底的表面齐平。在柔性基底的水平面上方突出的UBM将不必要地增加热路径,而相对于柔性基底表面凹陷的UBM可能在焊接工艺中引起设计引起的空隙,从而增加热阻,这两种现象与水平的UBM 124相比都降低了冷却功效。
在阶段IX中,通过将管芯10的触点101焊接到填充孔125的UBM 124并通过将(例如,由金制成)的导线14接合到触点102和公共导体126来完成子组件的制造。这种焊接和引线接合以将元件焊接和接合到表面安装电路板的传统方式进行。
虽然为了清楚起见,柔性板120在图3中被示为包括单层导体126,但是这不必被解释为限制性的,并且柔性板可以包括多于一个这样的层。在这种情况下,不同的导电层或其中的导体可以通过任何适当数量的常规过孔彼此连接。
尽管将接触焊盘123接合到刚性基板16的步骤在图3中被示为制造过程中的第一步,但是可替代地,该接合可以在已经在电路板的基底122中形成孔125并用金属124填充之后进行。
从上文将注意到,刚性基板16不承载任何从其控制和驱动电路(图中未示出)向管芯10传导电流的迹线。结果,如果刚性基板包括或产生裂纹,则其不会干扰管芯的操作。为了说明,尽管承载迹线的刚性基板可具有至少约250μm的总厚度,但在本发明中,无迹线刚性基板可具有至多200μm、至多150μm、至多100μm或至多50μm的厚度;刚性基板的厚度为至少5μm、至少10μm或至少25μm。这又改善了通过刚性基板到散热器的热流,促进了可能由管芯产生的热的耗散。
应当理解,可以对参考图3描述的实施例进行各种修改,而仍然在所附权利要求书中阐述的本发明的范围内。例如,在所述实施例中已经假设,柔性电路板12上要连接到管芯10的触点101的所有接触焊盘123形成在柔性基底122的背离管芯10并朝向刚性基板16的一侧上,并且提供到触点101的电路径的所有连接也用于提供到刚性基板的热路径。这些都不是必需的。例如,人们可能希望在柔性基底122的一侧上形成一些焊盘123,而在相对侧上形成其它焊盘。在这种结构中,面向管芯10的接触焊盘可以直接焊接到触点101,使得它们不会提供到散热器18的热路径,并且只有柔性板的背离管芯10的一侧上的焊盘123将提供到散热器的热路径。此外,可以在管芯10和刚性基板16之间提供热连接,该热连接穿过柔性印刷电路板的基底中的孔,但是不提供管芯的触点和柔性电路板的迹线之间的电连接。
尽管为了说明起见,已经根据某些实施例和一般相关联的方法描述了本公开,但是基于本申请的公开,这些实施例和方法的变更和置换对于本领域技术人员将是显而易见的。本公开内容应被理解为不受本文所述的具体实施方案的限制。本发明旨在涵盖所有这些替代、修改和变化,并且仅受本公开的精神和范围以及在其等效含义和范围内的任何改变的约束。
应当理解,为了清楚起见在不同的实施例的上下文中描述的本公开的某些特征也可以在单个实施例中组合提供。相反地,为了简洁起见在单个实施例的上下文中描述的本公开的各种特征也可以单独地或以任何合适的子组合或如在本公开的任何其它描述的实施例中合适地提供。在各种实施例的上下文中描述的某些特征不被认为是那些实施例的必要特征,除非在没有那些元件的情况下实施例是不可操作的。
除非另有说明,否则在用于选择的选项列表的最后两个成员之间使用表达“和/或”指示对所列出选项中的一者或一者以上的选择是适当的且可作出。
词语“示例性”在这里用于表示“用作示例、实例或说明”。任何被描述为“示例性”的实施例不必被解释为比其它实施例优选或有利和/或排除来自其它实施例的特征的接合。
在本公开中,除非另有说明,修饰本技术的实施例的一个或多个特征的条件或关系特性的形容词诸如“基本上”、“近似”和“大约”应理解为是指该条件或特性被限定在对于其所意图的应用的实施例的操作可接受的公差内,或在从正在执行的测量和/或从正在使用的测量仪器预期的变化内。当术语“约”和“大约”在数值之前时,其意在表示+/-15%或+/-10%或甚至仅+/-5%,并且在一些情况下是精确值。此外,除非另有说明,否则即使没有这样的形容词,本公开中使用的术语(例如,数字)也应当被解释为具有可能偏离相关术语的精确含义的公差,但是将使得本发明或其相关部分能够如所描述的那样操作和起作用,并且如本领域技术人员所理解的那样。
在本公开的说明书和权利要求书中,动词“包括”、“包含”和“具有”及其变化形式中的每一个都用于表示动词的一个或多个宾语不一定是动词的一个或多个主语的特征、构件、步骤、部件、元件或部分的完整列表。
如本文所用,单数形式“一”、“一个”和“所述”包括复数指代,并且表示“至少一个”或“一个或多个”,除非上下文另外明确指出。A和B中的至少一个旨在表示A或B,并且在一些实施例中可以表示A和B。
位置或运动术语,例如“上”、“下”、“右”、“左”、“底”、“下”、“降低”、“低”、“顶”、“上方”、“升高”、“高”、“垂直”、“水平”、“向后”、“向前”、“上游”和“下游”及其语法变型,可在本文中仅用于示例性目的,以示出某些部件的相对定位、放置或移位,以指示本说明中的第一和第二部件或两者。这些术语不一定表示例如“底部”部件在“顶部”部件之下,因为这些方向、部件或两者可以翻转、旋转、在空间中移动、放置在对角取向或位置、水平或垂直放置、或类似地修改。
除非另有说明,当在本公开中指出关于本技术的实施例的特征的范围的外边界时,应当理解,在实施例中,特征的可能值可以包括所述外边界以及在所述外边界之间的值。
这里所引用的某些商标可以是第三方的普通法律或注册商标。这些标记的使用是作为示例,而不应被解释为描述性的或将本公开的范围限制为仅与这些标记相关联的材料。
Claims (14)
1.一种安装和冷却具有多个触点的电路元件的方法,所述方法包括:
(i)提供导热且电绝缘的材料的刚性基板,
(ii)提供电路板,所述电路板具有电绝缘的柔性基底和在所述柔性基底上用于连接到所述电路元件的触点的多个导电迹线,每个迹线终止于相应的接触焊盘,所述相应的接触焊盘定位成与所述电路元件的相应触点对准,
(iii)将所述电路板固定到所述刚性基板,其中所述电路板上的所述接触焊盘中的至少一些设置在所述电路板的面向所述刚性基板的一侧上,
(iv)将所述电路板的面向所述刚性基板的一侧上的所述接触焊盘中的至少一些接合到所述刚性基板,以在接合的接触焊盘与所述刚性基板之间建立热接触,
(v)在所述电路板的所述柔性基底中形成盲孔,每个孔终止于所述柔性基底上的所述接触焊盘中的相应一个接触焊盘,所述相应一个接触焊盘位于所述电路板的面向所述刚性基板的一侧上,
(vi)电镀所述接触焊盘的被所述孔暴露的一侧,以生长至少一种金属材料来填充所述电路板的所述柔性基底中的所述孔,从而形成在所述柔性基底的相对侧之间延伸的导电和导热过孔,
(vii)将所述电路元件放置在所述电路板上,使得具有所述柔性基底的所述电路板位于所述电路元件和所述刚性基板之间,以及
(viii)将所述电路元件的所述触点焊接到所述过孔,以在所述电路元件的所述触点与所述电路板上的所述迹线之间建立电连接,并且在所述电路元件的所述触点中的至少一些触点与所述刚性基板之间建立热连接。
2.根据权利要求1所述的方法,其中,所述电路板的所述接触焊盘通过扩散接合或低温烧结直接连接至所述刚性基板。
3.根据权利要求1或2所述的方法,其中,通过在所述刚性基板上形成与所述电路板上的所述接触焊盘对准的金属接触焊盘,并且将所述电路板和所述刚性基板上的对准的接触焊盘彼此接合,来将所述电路板的面向所述刚性基板的一侧上的所述接触焊盘接合到所述刚性基板。
4.根据权利要求3所述的方法,其中,所述电路板的所述接触焊盘通过扩散接合连接到所述刚性基板上的所述接触焊盘。
5.根据权利要求1至4中任一项所述的方法,其中,形成所述过孔的电镀为化学镀镍浸金(ENIG)电镀。
6.一种电路子组件,包括:
a)由电绝缘但导热的材料形成的刚性基板,
b)安装在所述基板上的电路板,所述电路板具有基底和终止于相应的接触焊盘中的多个迹线,
c)电路元件,其安装在所述电路板的与所述刚性基板相对的一侧上,并且电连接到所述电路板的所述接触焊盘,以及
d)形成在所述电路板中的孔,所述孔填充有导电和导热过孔以将热量从所述电路元件传导到所述刚性基板并且将所述电路板上的迹线连接到所述电路元件,
其特征在于
e)所述电路板的所述基底是柔性的,
f)所述电路板的所述接触焊盘的至少一些被布置在所述电路板的面向所述刚性基板的一侧上并且被接合到所述刚性基板,
g)所述电路板的所述柔性基底中的至少一些孔终止于但不穿过接合到所述刚性基板的相应接触焊盘,以及
h)填充所述电路板的所述柔性基底中的孔的每个过孔形成为相应接触焊盘的背对所述刚性基板的一侧的镀层,其焊接到所述电路元件的相应触点。
7.根据权利要求6所述的电路子组件,其中,所述电路板的所述柔性基底具有在1μm到125μm、2μm到75μm、2μm到50μm、2μm到25μm、2μm到10μm或2μm到5μm的范围内的厚度。
8.根据权利要求6或7所述的电路子组件,其中,所述刚性基板还包括与所述电路元件的相应触点基本上对准的接触焊盘。
9.根据权利要求6至8中任一项所述的电路子组件,其中,所述电路板的所述迹线与所述电路元件的触点之间的所有金属连接还被连接到接合到所述刚性基板的焊盘。
10.根据权利要求6至9中任一项所述的电路子组件,其中,所述过孔由两层或更多层形成,包括一个镍层和另一个金层。
11.根据权利要求6至10中任一项所述的电路子组件,其中,所述电路板的所述柔性基底由一种或多种塑料材料制成。
12.根据权利要求6至11中任一项所述的电路子组件,其中,所述刚性基板具有250μm或更小、200μm或更小、150μm或更小、100μm或更小、或50μm或更小的厚度。
13.根据权利要求6至12中任一项所述的电路子组件,其中,所述刚性基板具有5μm或更大、10μm或更大、或25μm或更大的厚度。
14.根据权利要求6至13中任一项所述的电路子组件,其中,所述刚性基板没有导电迹线。
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