CN113993290A - Method for manufacturing metal-based printed board - Google Patents
Method for manufacturing metal-based printed board Download PDFInfo
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- CN113993290A CN113993290A CN202111228905.0A CN202111228905A CN113993290A CN 113993290 A CN113993290 A CN 113993290A CN 202111228905 A CN202111228905 A CN 202111228905A CN 113993290 A CN113993290 A CN 113993290A
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- printed board
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- 239000002184 metal Substances 0.000 title claims abstract description 152
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 152
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 113
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 108
- 229910052802 copper Inorganic materials 0.000 claims abstract description 77
- 239000010949 copper Substances 0.000 claims abstract description 77
- 238000009713 electroplating Methods 0.000 claims abstract description 46
- 238000003801 milling Methods 0.000 claims abstract description 33
- 238000007747 plating Methods 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000007790 scraping Methods 0.000 claims abstract description 17
- 230000008021 deposition Effects 0.000 claims abstract description 12
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 238000005553 drilling Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 8
- 238000003698 laser cutting Methods 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 3
- 238000006087 Brown hydroboration reaction Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the field of printed circuit board manufacturing, and provides a method for manufacturing a metal-based printed board. In the step of milling groove hollowing, milling groove hollowing is carried out on a non-working plate area outside the border of the working plate area to expose the surface-mounted side wall of the working plate area; in the step of copper deposition and electroplating, electroplating on the mounting side wall to form an electroplated copper layer; plating a first tin layer on the electroplated copper layer in a tin plating resist step; in the step of scraping the tin stripping groove, scraping the tin stripping groove on the first tin layer to expose the corresponding copper electroplating layer area of the tin stripping groove, wherein the tin stripping groove is arranged between the positive electrode area and the negative electrode area; in the step of etching and stripping tin, the copper electroplating layer area corresponding to the tin stripping tank is etched first, and then the first tin layer is removed. The manufacturing method of the metal-based printed board can manufacture the metal-based printed board which has high heat dissipation, is suitable for horizontal mounting and vertical mounting of components, occupies small space and is beneficial to miniaturization.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a manufacturing method of a metal-based printed board.
Background
Metal-based printed boards are widely used in electronic devices such as mobile phones because of their excellent heat dissipation properties. However, as the functions of electronic devices increase, more and more components need to be integrated on the metal-based printed board. In order to compress the occupied space of the metal-based printed board, except that the components are pasted in a flat mode, vertical pasting of partial components is innovatively considered in related industries. Therefore, how to manufacture a metal-based printed board suitable for vertical mounting of components becomes a technical problem to be solved urgently in the industry.
Disclosure of Invention
The embodiment of the invention aims to provide a method for manufacturing a metal-based printed board, which is suitable for vertical mounting of components.
In order to achieve the purpose, the invention adopts the technical scheme that: a method of manufacturing a metal-based printed board, comprising the steps of:
the method comprises the following steps of pressing a blank plate, preparing copper foils, insulating medium layers and metal bases which are sequentially stacked from top to bottom, and pressing the copper foils, the insulating medium layers and the metal bases to form a pressed blank plate, wherein the pressed blank plate is provided with at least one working plate area and non-working plate areas which are located outside the working plate areas, and each working plate area is provided with a connecting edge, and a negative electrode area and a positive electrode area which are arranged along the connecting edge;
milling grooves and hollowing, namely milling grooves and hollowing the non-working plate area outside the border of the working plate area to expose the surface-mounted side wall of the working plate area;
copper deposition and electroplating, wherein an electroplated copper layer is formed on the mounting side wall in an electroplating mode;
a tin plating resist, a first tin layer being plated on the electroplated copper layer;
scraping the tin stripping groove from the first tin layer to expose the corresponding copper electroplating layer area of the tin stripping groove, wherein the tin stripping groove is arranged between the positive electrode area and the negative electrode area and is communicated in the vertical direction;
and etching and removing tin, namely etching the area of the electroplated copper layer corresponding to the tin removing tank, and then removing the first tin layer.
In one embodiment, after the copper plating step and before the tin plating resist step, the metal-based printed board manufacturing method further includes the steps of:
preparing a circuit, namely laminating a film positive film on the upper base surface of the copper foil, and then carrying out exposure and development treatment to expose the positive electrode area of the copper foil to form an outer circuit and enable a dry film to cover the area outside the outer circuit, wherein the outer circuit is provided with a bonding pad which extends to the bordering edge and is conducted with the electroplated copper layer;
wherein, in the tin plating resist step, a first tin layer is plated on the electroplated copper layer, and a second tin layer is plated on the outer layer circuit;
in the step of etching and removing tin, the dry film is removed firstly, then the copper foil area corresponding to the tin removing groove and the copper foil area outside the outer layer circuit are etched together, and finally the first tin layer and the second tin layer are removed.
In one embodiment, after the milling groove hollowing step and before the copper plating step, the method for manufacturing a metal-based printed board further includes the steps of:
laser drilling, namely drilling a communication hole which is communicated with the metal base in the positive electrode area of the copper foil;
in the step of copper deposition and electroplating, an electroplated copper layer is formed on the mounting side wall in an electroplating mode, and the communicating hole is filled in an electroplating mode.
In one embodiment, the aperture of the communicating hole is 0.1-0.15 mm.
In one embodiment, before the press-fitting of the board, the method of manufacturing a metal-based printed board further includes the steps of:
preparing a metal matrix, preparing the metal matrix, forming a plurality of metal blocks arranged along the extending direction of the bordering edges on each working plate area of the metal matrix through laser cutting, and filling resin between the adjacent metal blocks.
In one embodiment, in the step of filling the resin between the adjacent metal blocks, a protective film is attached to the lower base surface of the metal base, the resin is filled between the adjacent metal blocks and cured, and finally the protective film is torn off.
In one embodiment, resin is filled between adjacent metal blocks by a vacuum screen printer and cured by a vacuum press.
In one embodiment, the width of the space between adjacent metal blocks is 0.2-0.4 mm.
In one embodiment, in the tin groove scraping and stripping step, the tin stripping groove is scraped on the first tin layer through a drill, wherein the diameter of the drill is smaller than that of a milling cutter used in the groove milling and emptying step.
In one embodiment, the diameter of the drill is 0.1mm smaller than the diameter of the milling cutter used in the milling groove hollowing step.
The invention has the following beneficial effects:
according to the manufacturing method of the metal-based printed board provided by the embodiment of the invention, after the step of pressing and manufacturing the board, the subsequent mounting side wall suitable for vertical mounting of the component in each working board area is exposed through the step of milling the groove and routing; then, through a copper deposition electroplating step, electroplating on the mounting side wall to form an electroplated copper layer, so that the components mounted on the electroplated copper layer in the following process can be electrically conducted with the outer layer circuit on the copper foil; and then, etching an open circuit in a region between the positive electrode region and the negative electrode region corresponding to the electroplated copper layer in a targeted manner through the steps of tin plating corrosion resistance, tin scraping and stripping and tin etching and stripping, so that the positive electrode region and the negative electrode region are electrically disconnected and insulated, and different electrical networks are insulated. Therefore, the metal-based printed board manufacturing method provided by the embodiment of the invention can manufacture the metal-based printed board which has high heat dissipation, is suitable for horizontal mounting and vertical mounting of components, occupies a small space and is beneficial to miniaturization.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flowchart of a method of manufacturing a metal-based printed board according to an embodiment of the present invention;
FIG. 2 is a top view of a metal base in a metal base preparation step provided by an embodiment of the present invention;
FIG. 3 is a top view of a pressed material plate after an etching step for stripping tin according to an embodiment of the present invention;
fig. 4 is a front view of a mounting sidewall of a metal-based printed board provided in an embodiment of the present invention;
fig. 5 is a cross-sectional view of a metal-based printed board provided by an embodiment of the present invention;
fig. 6 is a top view of a metal-based printed board provided by an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
100-pressing a blank plate, 101-a working plate area, 1011-a border, 1012-a negative electrode area, 1013-a positive electrode area, 102-a non-working plate area, 1021-a milling groove position and 1022-a drilling position; 110-copper foil, 111-outer layer line, 1111-pad, 1112-header, 1113-extension, 112-via; 120-insulating dielectric layer; 130-metal base, 131-metal block, 1311-positive block, 1312-negative block, 132-resin; 140-electroplating copper layer, 141-electroplating copper layer area corresponding to the tin stripping tank.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:
referring to fig. 1, an embodiment of the present invention provides a metal-based printed board for manufacturing a metal-based printed board suitable for vertical mounting of components. The metal-based printed board comprises the steps of pressing and board manufacturing, milling groove hollowing, copper deposition and electroplating, tin plating and corrosion resistance, tin scraping and stripping, etching and tin stripping and the like.
Referring to fig. 2, 3 and 5, in the step of pressing the green sheet, a copper foil 110, an insulating medium layer 120 and a metal base 130 are prepared and laminated in sequence from top to bottom, and the pressed green sheet 100 is formed by pressing, wherein the pressed green sheet 100 has at least one working sheet area 101 and a non-working sheet area 102 outside the working sheet areas 101, and each working sheet area 101 has a border edge 1011 and a negative electrode area 1012 and a positive electrode area 1013 arranged along the border edge 1011.
It should be noted that the surface of the pressing blank plate 100 may be divided into one or more working plate areas 101 arranged in a matrix array and a non-working plate area 102 outside each working plate area 101, each working plate area 101 is further divided into a negative electrode area 1012 and a positive electrode area 1013, wherein the lines, the pads 1111, the components and the like are all disposed in the positive electrode area 1013 of the working plate area 101.
The number of the working plate areas 101 arranged on the pressed blank plate 100 is planned according to the number of shipment units/finished products preset on the pressed blank plate 100, that is, on the finally manufactured pressed blank plate 100, the plate can be cut along each working plate area 101, and the metal-based printed boards with the preset number of shipment units are obtained.
The working plate areas 101 of the copper foil 110, the insulating medium layer 120 and the metal base 130, which are sequentially stacked from top to bottom, are in a corresponding relationship from top to bottom, specifically, the positive electrode areas 1013 of the copper foil 110, the insulating medium layer 120 and the metal base 130 are in a corresponding relationship from top to bottom, and the negative electrode areas 1012 of the copper foil 110, the insulating medium layer 120 and the metal base 130 are also in a corresponding relationship from top to bottom.
It should be further noted that at least one prepreg may be stacked on the prepared metal base 130, and then the copper foil 110 may be stacked and pressed to form the pressed blank plate 100, wherein each prepreg forms the insulating dielectric layer 120 after being pressed.
The prepared metal base 130 can be subjected to brown oxidation treatment before laminating prepregs so as to remove impurities such as grease on the surface of the metal base 130 and ensure the cleanliness of the metal base 130; the surface of the metal base 130 is roughened, so that the bonding force between the metal base 130 and the prepreg during subsequent lamination is improved, and the risks of layering and board explosion of the laminated blank plate 100 can be reduced.
In the groove milling hollowing step, the groove milling hollowing is carried out on the non-work board area 102 outside the border 1011 of the work board area 101 so as to expose the mounting side wall of the work board area 101.
It should be noted that, the non-work board area 102 outside the work board area may be milled out along the border 1011 of the work board area 101 (e.g. the milled slot 1021 shown in fig. 3) by a milling cutter, so as to expose the sidewall corresponding to the border 1011 of the work board area 101 as a mounting sidewall suitable for vertical mounting of a component, and facilitate the construction of a required power connection relationship between the corresponding positive electrode area 1013 and the negative electrode area 1012.
Based on the step, the mounting side wall can be exposed, so that the conduction between the mounting side wall and the copper foil 110 in the subsequent step can be realized, and the burr problem of the mounting side wall can be solved, namely, the processing precision of the mounting side wall can be ensured and improved.
Referring also to fig. 4, in the step of copper deposition and electroplating, an electroplated copper layer 140 is formed on the mounting sidewall by electroplating. Based on the step, the electroplated copper layer 140 which is conducted with the copper foil 110 can be formed on the mounting side wall, so that the subsequent components mounted on the electroplated copper layer 140 can be electrically conducted with the outer layer circuit 111 on the copper foil 110, and the service performance and functions of the components mounted on the electroplated copper layer 140 can be further guaranteed.
However, the electroplated copper layer 140 formed in this step also allows conduction between the positive electrode region 1013 and the negative electrode region 1012, and particularly, between the positive electrode region 1013 and the negative electrode region 1012 of the metal base 130, and to solve this phenomenon, the present embodiment is followed by steps of tin plating resist, tin scraping and tin etching.
In the tin plating resist step, a first tin layer (not shown in the drawing) is plated on the electroplated copper layer 140; in the step of scraping and stripping the tin bath, scraping a tin bath (not shown) on the first tin layer to expose the copper electroplating layer region 141 corresponding to the tin bath, wherein the tin bath is disposed between the positive electrode region 1013 and the negative electrode region 1012 and is vertically penetrated; in the step of etching and stripping tin, the copper electroplating layer region 141 corresponding to the tin stripping tank is etched first, and then the first tin layer is removed.
Based on the above steps, a first tin layer with corrosion resistance and full coverage is plated on the copper electroplating layer 140, and then a tin stripping tank is formed by scraping off a part of the first tin layer, so as to remove the corrosion resistance protection of the copper electroplating layer region 141 corresponding to the tin stripping tank, and then the copper electroplating layer region 141 corresponding to the tin stripping tank is etched away in a targeted manner during etching, so as to etch an open circuit in the region of the copper electroplating layer 140 corresponding to the boundary between the positive electrode region 1013 and the negative electrode region 1012, and further the positive electrode region 1013 and the negative electrode region 1012 can be disconnected, so as to insulate the positive electrode region 1013 and the negative electrode region 1012 and insulate different electrical networks. Thus, each functional component can be vertically attached to the corresponding electroplated copper layer 140 area corresponding to the positive electrode area 1013 and the negative electrode area 1012 and corresponding to the electrical network, thereby ensuring the performance, function and effectiveness.
In summary, after the step of pressing and manufacturing the board, the subsequent mounting side wall suitable for vertical mounting of the component in each working board area 101 is exposed through the step of milling the groove and routing; then, through a copper deposition electroplating step, an electroplated copper layer 140 is formed on the mounting side wall in an electroplating mode, so that the subsequent components mounted on the electroplated copper layer 140 can be electrically conducted with the outer layer circuit 111 on the copper foil 110; then, through the steps of tin plating and corrosion resistance, tin scraping and tin stripping, an open circuit is etched in the region of the electroplated copper layer 140 corresponding to the region between the positive electrode region 1013 and the negative electrode region 1012, so that the positive electrode region 1013 and the negative electrode region 1012 are electrically disconnected and insulated, and different electrical networks are insulated. Therefore, the metal-based printed board provided by the embodiment of the invention can be used for manufacturing the metal-based printed board which has high heat dissipation, is suitable for horizontal mounting and vertical mounting of components, occupies a small space and is beneficial to miniaturization.
And after the step of pressing and manufacturing the board and before the step of milling the groove and routing, the metal-based printed board further comprises a step of drilling a positioning hole. In the step of drilling the positioning hole, a positioning hole required by a post-process is drilled through a target drilling machine.
Referring to fig. 3 and 6, in the present embodiment, after the copper deposition electroplating step and before the tin plating resist step, the metal-based printed board further includes a wire preparation step.
In the circuit preparation step, a positive film is laminated on the upper base surface of the copper foil 110, and then exposure and development processes are performed to expose the positive electrode region 1013 of the copper foil 110 to form an outer layer circuit 111, and to cover the dry film on the region other than the outer layer circuit 111, wherein the outer layer circuit 111 has a pad 1111 extending to the border edge 1011 and electrically connected to the copper plating layer 140.
Referring to fig. 4, in the tin plating resist step, a first tin layer is plated on the electroplated copper layer 140, and a second tin layer (not shown) is plated on the outer layer circuit 111; in the step of etching and stripping tin, the dry film is removed, the copper electroplating layer region 141 corresponding to the tin stripping tank and the copper foil 110 region outside the outer layer circuit 111 are etched, and finally the first tin layer and the second tin layer are removed.
Here, the shaded area of the film print corresponds to the outer layer line 111, and the transparent area of the film print corresponds to an area other than the outer layer line 111. After the exposure process, the dry film in the transparent region is exposed to light to be chemically cured on the upper base surface of the copper foil 110, and the dry film in the shadow region is not cured. Subsequently, the dry film that is not hardened is removed by a developing process, so that the outer layer circuit 111 is exposed.
Therefore, when the tin plating and corrosion resisting step is performed, the first tin layer can be plated on the electroplated copper layer 140, and simultaneously the second tin layer can be plated on the exposed outer layer circuit 111, so that the outer layer circuit 111 can be effectively protected through the second tin layer in the subsequent process, and the outer layer circuit 111 is prevented from being etched.
Therefore, when the etching and tin stripping step is performed, the hardened dry film remaining in the region outside the outer layer circuit 111 can be removed, then the copper electroplating layer region 141 corresponding to the tin stripping groove not covered by the first tin layer and the copper foil 110 region (including the negative electrode region 1012 of the copper foil 110) outside the outer layer circuit 111 not covered by the second tin layer are etched together, and finally the first tin layer and the second tin layer are removed, so that the precise outer layer circuit 111 can be conveniently manufactured, and the copper electroplating layer 140 portion conducted with the outer layer circuit 111 is reserved to be suitable for vertical component mounting.
The outer layer circuit 111 is electrically connected to the electroplated copper layer 140 via the pad 1111. Based on this, the electrical conduction between the electroplated copper layer 140 and the outer layer circuit 111 can be conveniently and reliably maintained, and the relevance between the vertically mounted component and the horizontally mounted component mounted on the outer layer circuit 111 can be established based on the bonding pad 1111 conducted to the electroplated copper layer 140, so that the performance and the function of the subsequent vertically mounted component mounted on the electroplated copper layer 140 can be ensured.
The pad 1111 connected to the electroplated copper layer 140 is tangent to the border 1011, i.e. tangent to the electroplated copper layer 140. Based on this, the flatness of the boundary of the pad 1111 and the copper electroplating layer 140 can be secured and improved, so that the risk of the occurrence of burrs at the boundary of the pad 1111 and the copper electroplating layer 140 can be further reduced.
Referring to fig. 4, 5 and 6, the negative electrode region 1012 of the copper foil 110 is etched in the etching and tin stripping step without covering the second tin layer, and therefore, after the etching and tin stripping step, a laser ablation step may be provided, in which the negative electrode region 1012 of the insulating dielectric layer 120 is removed by laser ablation to expose the negative electrode region 1012 of the metal base 130. In this way, the negative electrode region 1012 of the bare metal substrate 130 can be directly used as the negative electrode of the metal-based printed board.
Of course, after the laser ablation step, the metal-based printed board may further include steps of AOI (Automated Optical Inspection), solder mask, character, flying probe test, gold deposition, V-CUT (cutting and cutting the edge except the mounting side wall), routing, product cleaning, FQC (Final Quality Control), packaging, shipping, and the like. This embodiment will not be described in detail herein.
Referring to fig. 3, 4 and 5, in the present embodiment, after the milling step and before the copper plating step, the metal-based printed board further includes a laser drilling step.
In the laser drilling step, the via hole 112 leading to (the positive electrode region 1013 of) the metal base 130 is drilled in the positive electrode region 1013 (specifically, on the outer layer wiring 111) of the copper foil 110; in the step of copper deposition and electroplating, an electroplated copper layer 140 is formed on the mounting side wall by electroplating, and the through hole 112 is filled by electroplating.
By adopting the above scheme, the through hole 112 extending to (the positive electrode region 1013 of) the metal base 130 in the up-down direction is drilled in the positive electrode region 1013 (the outer layer circuit 111) of the copper foil 110, and then the through hole 112 is filled by electroplating while the electroplated copper layer 140 is formed by electroplating, so that conduction and heat conduction between the copper foil 110 (the outer layer circuit 111) and (the positive electrode region 1013 of) the metal base 130 are realized, and further, the heat dissipation performance of the manufactured metal base printed board can be ensured and improved.
In the present embodiment, the via hole 112 is provided on the pad 1111 that is electrically connected to the copper electroplating layer 140. With this arrangement, conduction and heat conduction between the outer layer circuit 111 and (the positive electrode region 1013 of) the metal base can be specifically achieved, and especially conduction and heat conduction between the outer layer circuit 111, the copper electroplating layer 140 and (the positive electrode region 1013 of) the metal base 130 can be achieved through the bonding pad 1111, so that heat dissipation performance of the manufactured metal-based printed board can be further improved.
In the present embodiment, the pad 1111, which is in communication with the copper plating layer 140, has a head 1112 far away from the copper plating layer 140, and an extension 1113 connected between the head 1112 and the copper plating layer 140, wherein the width of the head 1112 in the extending direction of the border 1011 is larger than the width of the extension 1113 in the extending direction of the border 1011, and the communication hole 112 is specifically formed on the head 1112. With this arrangement, the head 1112 of the bonding pad 1111 can have a sufficient space for providing one or more communication holes 112 while securing and improving the conduction and heat conduction effects among the outer layer wiring 111, the copper electroplating layer 140, and (the positive electrode region 1013 of) the metal base 130.
Wherein, prior to the laser drilling step, the entire board may be browned to roughen the upper base surface of the copper foil 110 for absorbing energy during the laser drilling step.
Referring to fig. 3, 5 and 6, in the present embodiment, the communication hole 112 is a circular hole, and the aperture of the communication hole 112 is 0.1 to 0.15 mm.
By adopting the scheme, the electroplating effect of the communication hole 112 can be ensured and improved, and further the conduction effect and the heat conduction effect between the copper foil 110 (the outer layer circuit 111) and the positive electrode region 1013 of the metal base 130 can be ensured and improved, so that the heat dissipation performance of the manufactured metal base printed board can be further improved, and the manufacturing yield of the metal base printed board can be further improved.
Referring to fig. 2 and 5, in the present embodiment, before pressing the board, the metal-based printed board further includes a metal-based preparation step.
In the metal matrix preparation step, the metal matrix 130 is prepared, and a plurality of metal blocks 131 arranged in the extending direction of the bordering edges 1011 are formed on each work board region 101 of the metal matrix 130 by laser cutting, and then the resin 132 is filled between the adjacent metal blocks 131.
It should be noted that the prepared metal base 130 is provided with a plurality of metal blocks 131 in each working plate area 101, wherein the metal block 131 corresponding to the negative electrode area 1012 is a negative electrode block 1312, the metal blocks 131 corresponding to the remaining positive electrode areas 1013 are positive electrode blocks 1311, and the positive electrode blocks 1311 and the negative electrode blocks 1312 are arranged alternately in the extending direction of the bordering edge 1011. For example, as shown in fig. 2 and 5, in each work board region 101, the metal base 130 has three metal blocks 131, the middle metal block 131 is a negative electrode block 1312, and the metal blocks 131 on both sides are positive electrode blocks 1311. Based on this, it is possible to facilitate multi-network design based on each metal block 131.
The resin 132 filled between the adjacent metal blocks 131 can connect the adjacent metal blocks 131 together, insulate the adjacent metal blocks 131, and conduct heat between the adjacent metal blocks 131.
It should be further noted that, in the present embodiment, the metal base 130 between the adjacent metal blocks 131 is removed by laser cutting, and compared with the prior art that the metal base 130 between the adjacent metal blocks 131 is milled by using a milling machine, the present embodiment is more beneficial to miniaturizing and miniaturizing the space between the adjacent metal blocks 131, so that the occupied space of the multi-network can be easily enlarged, and the wiring space can be easily enlarged.
Referring to fig. 2 and 5, in the present embodiment, in the step of filling the resin 132 between the adjacent metal blocks 131, a protective film (not shown) is firstly attached to the lower base surface of the metal base 130, then the resin 132 is filled between the adjacent metal blocks 131 and the resin 132 is cured, and finally the protective film is torn off.
It should be noted that, the gap between the adjacent metal blocks 131 is completely through in the vertical direction, and therefore, in the present embodiment, the protective film is attached to the lower base surface of the metal base 130, so as to effectively limit the resin 132 from overflowing downwards during the period from the filling of the resin 132 between the adjacent metal blocks 131 to the curing, thereby being beneficial to ensuring and improving the filling effect of the resin 132 filled between the adjacent metal blocks 131, further being beneficial to ensuring and improving the connection, insulation and heat conduction effects exerted by the resin 132 between the adjacent metal blocks 131, and further being beneficial to further improving the manufacturing yield of the metal-based printed board.
In this case, after the step of "forming the metal block 131 by laser cutting in each work board region 101 of the metal base 130" and before the step of "attaching the protective film to the lower base surface of the metal base 130", the whole metal base 130 may be subjected to brown oxidation. Based on the structure, impurities such as grease on the surface of the metal base 130 can be removed, and the cleanliness of the metal base 130 is guaranteed; the surface of the metal base 130 can be roughened, and the bonding force between the subsequent protective film and the metal base 130 can be improved.
After the "finally peeling the protective film", the excess resin 132 on the surface of the metal substrate 130 can be polished.
Referring to fig. 2 and 5, in the present embodiment, a resin 132 is filled between adjacent metal blocks 131 through a vacuum screen printer, and the resin 132 is cured through a vacuum press.
By adopting the above scheme, the filling effect of the resin 132 filled between the adjacent metal blocks 131 can be improved, and the void phenomenon caused by nonuniform gummosis due to gaps between the prepreg gummosis and the adjacent metal blocks 131 in the step of pressing and manufacturing the board can be avoided. Therefore, by adopting the scheme, the manufacturing yield of the metal-based printed board can be further improved, and the product reliability of the manufactured metal-based printed board can be ensured and improved.
Referring to fig. 2 and 5, in the present embodiment, the width of the space between adjacent metal blocks 131 is 0.2 to 0.4 mm.
By adopting the above scheme, the interval width between the adjacent metal blocks 131 can be ensured to be micro-interval, so that the occupied space of a plurality of networks can be favorably expanded, and the wiring space can be favorably expanded.
Referring to fig. 3, in the present embodiment, in the step of scraping and removing the tin groove, the tin groove is scraped on the first tin layer by the drill, wherein the diameter of the drill is smaller than the diameter of the milling cutter used in the step of milling the groove.
Here, it should be noted that scraping the tin stripping groove on the first tin layer can be realized by passing the drill bit into the milling groove from top to bottom along the drill bit 1022 as shown in the figure, and based on this, the processing convenience, the processing precision and the processing precision of the tin stripping groove can be improved.
The diameter of the drilling tool is controlled to be smaller than that of a milling cutter used in the milling groove hollowing step, so that the risk that the drilling tool accidentally drills and damages the adjacent working plate area 101 during scraping and retreating of the tin groove can be effectively reduced, and the manufacturing yield of the metal-based printed board can be further improved.
Referring to fig. 3, in the present embodiment, the diameter of the drill is 0.1mm smaller than the diameter of the milling cutter used in the slot milling and hollowing step.
By adopting the scheme, the risk that the drill accidentally drills and damages the adjacent working plate area 101 during the tin groove scraping process can be basically avoided, so that the manufacturing yield of the metal-based printed board can be further improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A method for manufacturing a metal-based printed board, comprising the steps of:
the method comprises the following steps of pressing a blank plate, preparing copper foils, insulating medium layers and metal bases which are sequentially stacked from top to bottom, and pressing the copper foils, the insulating medium layers and the metal bases to form a pressed blank plate, wherein the pressed blank plate is provided with at least one working plate area and non-working plate areas which are located outside the working plate areas, and each working plate area is provided with a connecting edge, and a negative electrode area and a positive electrode area which are arranged along the connecting edge;
milling grooves and hollowing, namely milling grooves and hollowing the non-working plate area outside the border of the working plate area to expose the surface-mounted side wall of the working plate area;
copper deposition and electroplating, wherein an electroplated copper layer is formed on the mounting side wall in an electroplating mode;
a tin plating resist, a first tin layer being plated on the electroplated copper layer;
scraping the tin stripping groove from the first tin layer to expose the corresponding copper electroplating layer area of the tin stripping groove, wherein the tin stripping groove is arranged between the positive electrode area and the negative electrode area and is communicated in the vertical direction;
and etching and removing tin, namely etching the area of the electroplated copper layer corresponding to the tin removing tank, and then removing the first tin layer.
2. The method of manufacturing a metal-based printed board according to claim 1, wherein after the copper plating step and before the tin plating resist step, the method of manufacturing a metal-based printed board further comprises the steps of:
preparing a circuit, namely laminating a film positive film on the upper base surface of the copper foil, and then carrying out exposure and development treatment to expose the positive electrode area of the copper foil to form an outer circuit and enable a dry film to cover the area outside the outer circuit, wherein the outer circuit is provided with a bonding pad which extends to the bordering edge and is conducted with the electroplated copper layer;
wherein, in the tin plating resist step, a first tin layer is plated on the electroplated copper layer, and a second tin layer is plated on the outer layer circuit;
in the step of etching and removing tin, the dry film is removed firstly, then the copper foil area corresponding to the tin removing groove and the copper foil area outside the outer layer circuit are etched together, and finally the first tin layer and the second tin layer are removed.
3. The method of manufacturing a metal-based printed board according to claim 1, wherein after the milling groove hollowing step and before the copper plating step, the method of manufacturing a metal-based printed board further comprises the steps of:
laser drilling, namely drilling a communication hole which is communicated with the metal base in the positive electrode area of the copper foil;
in the step of copper deposition and electroplating, an electroplated copper layer is formed on the mounting side wall in an electroplating mode, and the communicating hole is filled in an electroplating mode.
4. The method of manufacturing a metal-based printed board according to claim 3, wherein the aperture of the communicating hole is 0.1 to 0.15 mm.
5. The method of manufacturing a metal-based printed board according to claim 1, wherein the method of manufacturing a metal-based printed board further comprises, before the press-fitting of the board, the steps of:
preparing a metal matrix, preparing the metal matrix, forming a plurality of metal blocks arranged along the extending direction of the bordering edges on each working plate area of the metal matrix through laser cutting, and filling resin between the adjacent metal blocks.
6. The method of manufacturing a metal-based printed board according to claim 5, wherein in the step of filling resin between adjacent metal blocks, a protective film is attached to a lower base surface of the metal matrix, the resin is filled between the adjacent metal blocks and cured, and finally the protective film is peeled off.
7. The method of manufacturing a metal-based printed board according to claim 6, wherein resin is filled between adjacent metal blocks by a vacuum screen printer and cured by a vacuum press.
8. The method of manufacturing a metal-based printed board according to claim 5, wherein a space width between adjacent metal blocks is 0.2 to 0.4 mm.
9. The method of manufacturing a metal-based printed board according to any one of claims 1 to 8, wherein in the tin groove scraping and stripping step, the tin stripping groove is scraped on the first tin layer by a drill having a diameter smaller than a diameter of a milling cutter used in the milling groove hollowing step.
10. The method of manufacturing a metal-based printed board according to claim 9, wherein a diameter of the drill is 0.1mm smaller than a diameter of a milling cutter used in the milling groove hollowing step.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996503A (en) * | 2019-12-31 | 2020-04-10 | 四会富仕电子科技股份有限公司 | Manufacturing method of high-heat-dissipation metal substrate |
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996503A (en) * | 2019-12-31 | 2020-04-10 | 四会富仕电子科技股份有限公司 | Manufacturing method of high-heat-dissipation metal substrate |
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
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