CN113976882A - Preparation method of composite material - Google Patents
Preparation method of composite material Download PDFInfo
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- CN113976882A CN113976882A CN202111274515.7A CN202111274515A CN113976882A CN 113976882 A CN113976882 A CN 113976882A CN 202111274515 A CN202111274515 A CN 202111274515A CN 113976882 A CN113976882 A CN 113976882A
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- diamond
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- substrate layer
- composite
- composite material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
- B22F3/1007—Atmosphere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Abstract
The invention discloses a preparation method of a composite material, which comprises the steps of coating diamond particles with powder made of a base material layer to obtain diamond composite particles; arranging the diamond composite particles on the surface of the substrate layer in order; pressing the diamond composite particles into the surface of the substrate layer by adopting a pressing die to obtain a semi-finished product I; sintering the semi-finished product I to obtain a semi-finished product II; and grinding the semi-finished product II to expose the diamond particles, and combining the diamond particles and the substrate layer to form a flat surface to obtain the finished composite material. The invention makes the diamond particles in the composite material arranged in order, improves the uniformity of heat conduction, exposes the diamond particles on the surface of the composite material, can effectively contact with a heating device, improves the heat conduction performance, and has convenient processing, high efficiency and low cost.
Description
Technical Field
The invention relates to the technical field of preparation of heat conduction materials, in particular to a preparation method of a composite material.
Background
The diamond is the substance with the highest thermal conductivity in nature, the thermal conductivity at normal temperature is 2200-2600W/(m.K), and the thermal expansion coefficient is about 0.86 multiplied by 10-6And is an insulator at room temperature. Copper metal has high thermal conductivity, low cost, and easy processing, and is the most commonly used packaging material, with a thermal conductivity of 400W/(m.K), and a thermal expansion coefficient of 17 × 10－6And the material meets the use performance requirements of low thermal expansion coefficient and high thermal conductivity of the electronic packaging substrate material. Therefore, the diamond/copper composite material taking diamond as the reinforcing phase and copper as the matrix material has better heat conduction potential. The existing diamond/copper composite material has two modes of solid phase forming and liquid phase forming, and is prepared by controlling conditions such as temperature, time, pressure and the like, and common preparation methods comprise a high-temperature high-pressure method, a discharge plasma sintering method, a powder metallurgy method, a liquid phase infiltration method and the like, the process is complex, the implementation difficulty is high, the equipment is complex, the investment cost is high, and the distribution condition of diamond in the obtained diamond/copper composite material is random and uncontrollable, namely, the diamond serving as a reinforcing phase is unevenly distributed in a base material, the internal interfaces of the composite material are many and complex, the efficient transfer of heat is hindered, the local thermal conductivity of the composite material is poor, and the improvement of the thermal conductivity of the composite material is limited.
Disclosure of Invention
The invention aims to solve the technical problems and the technical task of improving the prior art, provides a preparation method of a composite material, and solves the problems that in the prior art, the diamond of the composite material is unevenly distributed in a base material, so that the local heat conduction of the composite material is poor, and the overall heat conduction performance is influenced.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a method for preparing a composite material comprises the following steps:
coating diamond particles with powder made of a base material layer to obtain diamond composite particles;
arranging the diamond composite particles on the surface of the substrate layer in order;
pressing the diamond composite particles into the surface of the substrate layer by adopting a pressing die to obtain a semi-finished product I;
sintering the semi-finished product I to obtain a semi-finished product II;
and grinding the semi-finished product II to expose the diamond particles, and combining the diamond particles and the substrate layer to form a flat surface to obtain the finished composite material.
The preparation method of the composite material can ensure that the diamond particles in the composite material are distributed orderly and uniformly, effectively improve the heat conduction uniformity of the composite material, avoid uneven heat conduction caused by the fact that the diamond particles are concentrated in the local part of the base material layer, conveniently and flexibly control the volume fraction of the diamond particles in the composite material, further flexibly adjust the heat conductivity of the composite material according to needs, directly embed the diamond particles into the base material layer in a pressing mode, conveniently and efficiently realize the uniform distribution of the diamond particles on the base material layer, then fuse the powder of the base material layer material for wrapping the diamond particles and the base material layer into a whole through sintering, fully combine the diamond particles with the base material layer, effectively remove the adhesive used when the powder wraps the diamond particles through sintering, and finally obtain the composite material only containing the material components of the diamond particles and the base material layer, the interface combination state of the diamond particles and the substrate layer is optimized, the heat transfer efficiency is improved, compared with the existing processing method, the processing is convenient, the efficiency is high, the cost is low, the composite material forms a smooth and flat surface through a grinding processing mode, the composite material can be fully contacted with a heating device, the contact area is increased, the heat conduction effect is improved, the diamond particles are exposed on the surface of the composite material, the diamond particles can be effectively contacted with the heating device, the contact area of the diamond particles and the heating device is effectively increased, and the heat conduction performance is fundamentally improved.
Further, the powder material of the base material layer and the diamond particles are mixed and spheroidized, the adhesive is added in an atomizing spraying mode, and the powder material of the base material layer is coated on the diamond particles through the adhesive to obtain the diamond composite particles. The powder of substrate layer material is gone up in the surface attachment cladding of diamond granule of ability convenience and efficient, the adhesive adds the homogeneity good, the powder can be even cladding diamond granule's whole periphery, thereby make the powder thickness on diamond granule surface even unanimous, that is to say, diamond granule is in the central point of diamond composite grain puts, and then when guaranteeing to impress diamond composite grain in the surface of substrate layer, diamond granule is in the center of the pit of the production of impressing, avoid diamond granule position skew, improve the accuracy nature that diamond granule arranged in order, ensure that diamond granule among the composite reaches orderly evenly distributed, guarantee heat conduction homogeneity.
Further, the diamond composite particles are orderly arranged on the surface of the base material layer through the distributing device, a plurality of cloth holes matched with the particle size of the diamond composite particles are formed in the distributing device, the cloth holes are orderly arranged along the surface of the base material layer, and each cloth hole only contains one diamond composite particle. The distribution situation of distributing hole is required diamond particle distribution situation on the substrate layer promptly on the distributing device, utilizes the distributing device can be reliable and accurate arrange the surface of substrate layer in order as required with diamond particle, distributing device simple structure, implementation cost are low, convenient to use, efficient.
Furthermore, the distributing hole is a slotted hole, the distributing device is provided with an air hole communicated to the distributing hole, and the caliber of the air hole is smaller than the grain diameter of the diamond composite grains and is used for being connected with a negative pressure device. Adsorb diamond composite particle in the cloth hole through the mode of negative pressure adsorption, the distributing device removes to the upper surface of substrate layer, then negative pressure equipment closes, and diamond composite particle can fall automatically and arrange in order on the surface of substrate layer as required, convenient to use, efficient, is convenient for realize the automation.
Further, arrange diamond composite grain on the sticky tape in order through the distributing device earlier, then with the mode of diamond composite grain face towards substrate layer surface with the sticky tape attached to the substrate layer on, the embossing mold utensil carries out the pre-compaction in order to imbed diamond composite grain in advance on the surface of substrate layer, then removes the sticky tape, utilizes the embossing mold utensil to impress diamond composite grain in the surface of substrate layer in order to obtain semi-manufactured goods one. Utilize the viscidity of sticky tape to come the compound grain of pre-fixation diamond, thereby keep the state that the compound grain of diamond arranged in order, the compound grain of diamond is through the pre-compaction and imbed in advance on the substrate layer, because the existence of sticky tape, thereby can ensure that the compound grain of diamond is arranged in order on the surface of substrate layer, can avoid the situation that the compound grain of diamond rolls the off tracking appearing in the pressing process, can maintain the state of arranging in order when guaranteeing that final diamond granule impresses the surface of substrate layer completely, and then ensure that the finally composite who obtains has the diamond granule of orderly equipartition, guarantee heat conduction homogeneity.
Further, adopt the embossing mold utensil when impressing the surface of substrate layer with the compound grain of diamond, heat the substrate layer, adopt the mode of hot pressing, enable the substrate layer and soften, be favorable to the compound grain of diamond more smooth and easy imbed on the surface of substrate layer.
Further, the embossing mold utensil includes pedestal and pressure head, arranges one deck diamond composite grain in order on the pedestal, on this deck diamond composite grain with the substrate layer is kept flat, arranges one deck diamond composite grain in order again on the upper surface of substrate layer, then the pressure head pushes down in order to impress diamond composite grain in the surface of substrate layer, obtain semi-manufactured goods one, can make the combined material that the two sides all have diamond granule, adopt the mode of two sides suppression simultaneously, can effectively improve machining efficiency, guarantee diamond granule at the both sides surface uniform distribution of substrate layer simultaneously, guarantee heat conduction homogeneity.
Further, the diamond composite particles are in surface dislocation arrangement of the two sides of the first semi-finished product avoids collision and contact of upper and lower two-layer diamond particles in the pressing process, avoids the diamond particles from being pressed to break, ensures the integrity of the diamond particles, and can reduce the thickness of the base material layer on the basis that the surfaces of the two sides of the base material layer are provided with the diamond particles, so that the volume fraction of the diamond particles is effectively improved, and the thermal conductivity of the composite material is improved.
Furthermore, the semi-finished product I is sintered in a vacuum environment or in a gas protection environment, so that the diamond particles and the substrate layer are prevented from being oxidized in the sintering process, the sintering quality is guaranteed, and the composite material is guaranteed to have good heat-conducting property.
Further, the semi-finished product I is placed in a sintering mold for limiting the shape and size of the semi-finished product I to be sintered, the phenomenon that the semi-finished product II is seriously deformed due to softening and deformation of the base material layer in the sintering process is avoided, the shape and size of the base material layer in the sintering process are stable, and the structure and size of the finally obtained composite material meet requirements.
A composite material is prepared by the preparation method of the composite material. The composite material has the diamond particles which are orderly arranged on the surface of the composite material, and the diamond particles are exposed on the surface of the composite material, so that the heat conduction uniformity is effectively improved, the phenomenon that the diamond particles are concentrated on the part in the base material layer to cause uneven heat conduction is avoided, the diamond particles can be effectively contacted with a heating device, the contact area between the diamond particles and the heating device is effectively increased, and the heat conduction performance is improved.
Compared with the prior art, the invention has the advantages that:
according to the preparation method of the composite material, the diamond particles in the composite material are orderly arranged, the heat conduction uniformity of the composite material is improved, the volume fraction of the diamond particles in the composite material can be flexibly and conveniently controlled according to requirements, the diamond particles are exposed on the surface of the composite material, the diamond particles can be effectively contacted with a heating device, the contact area of the diamond particles and the heating device is increased, the heat conduction performance is improved, the heat conductivity of the composite material can reach 600-1000W/(m.K), the processing is convenient, the efficiency is high, the cost is low, the implementation is convenient, and no complex equipment is needed.
Drawings
FIG. 1 is a schematic structural diagram of a diamond composite particle obtained by wrapping diamond particles with powder made of a base material layer according to the present invention;
FIG. 2 is a schematic structural view of a pressing die and a material distributor according to the present invention;
FIG. 3 is a schematic view of a pressing die and another material distributor according to the present invention;
FIG. 4 is a schematic view of the distributor removed after the diamond composite particles are arranged on the surface of the substrate layer;
FIG. 5 is a schematic view of the press head pressing down to press the diamond composite particles into the substrate layer;
FIG. 6 is a schematic view of an induction heating coil arranged on a pressing mold for hot pressing;
FIG. 7 is a schematic view of a powder layer automatically filling the gap between the pits and the diamond particles;
FIG. 8 is a schematic view of a semi-finished product placed in a sintering mold for sintering;
FIG. 9 is a schematic structural view of a composite material;
FIG. 10 is another schematic structural view of a composite material;
FIG. 11 is a schematic view of two sides of a substrate layer simultaneously pressed with diamond composite particles according to example II;
fig. 12 is a schematic structural view of a composite material with diamond particles arranged on both sides.
FIG. 13 is a schematic view of diamond composite particles being arranged on a tape using a distributor;
fig. 14 is a schematic view of an adhesive tape attached to a substrate layer to pre-embed diamond composite particles into the substrate layer.
In the figure:
the device comprises a composite layer 1, a substrate layer 2, diamond particles 3, a powder layer 31, diamond composite particles 32, a distributor 4, a distribution hole 41, an air hole 42, an adhesive tape 43, a base 5, a pressure head 6, an induction heating coil 7 and a sintering mold 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to the preparation method of the composite material disclosed by the embodiment of the invention, the diamonds are orderly and uniformly distributed on the base material, so that the heat conduction uniformity of the composite material is improved, the interface bonding state of the composite material is effectively improved, the interface thermal resistance is reduced, the overall heat conductivity of the composite material is effectively improved, the implementation is convenient, and the cost is low.
Example one
As shown in fig. 1 to 8, a method for preparing a composite material includes the steps of:
s1, wrapping diamond particles 3 with powder made of a base material layer 2 to obtain diamond composite particles 32, specifically, putting the diamond particles 3 into a diamond wrapping device, driving the diamond particles 3 to roll by the diamond wrapping device, spraying an adhesive into the diamond wrapping device in an atomizing manner, coating the adhesive on the surfaces of the diamond particles 3, adding the powder made of the base material layer 2 into the diamond wrapping device, wrapping the powder on the surfaces of the diamond particles 3 by the adhesive, mixing and rolling the powder and the diamond particles 3 in the diamond wrapping device for spheroidization, wrapping the whole circumferential periphery of the diamond particles 3 with the powder to finally obtain the diamond composite particles, wherein the diamond composite particles 32 comprise the diamond particles 3 and the powder layer 31 wrapped on the outer surfaces of the diamond particles 3, and the powder layer 31 mainly comprises the powder made of the base material layer 2 and the adhesive, by adopting the mode, the periphery of the diamond particles 3 can be uniformly wrapped by the powder, namely, the thickness of the powder in the whole circumferential direction of the diamond particles is uniform, and the diamond particles are positioned at the central position of the diamond composite particles, so that when the diamond composite particles are accurately arranged in place, the diamond particles are also just positioned at the accurate position, and the distribution uniformity of the diamond particles in the composite material can be improved.
S2, arranging the diamond composite particles 32 on the surface of the substrate layer 2 in order through a distributor 4, wherein the distributor 4 is provided with a plurality of distribution holes 41 matched with the particle size of the diamond composite particles 32, the distribution holes 41 are arranged in order along the surface of the substrate layer 2, and each distribution hole 41 contains one diamond composite particle 32;
the distributing device 4 has two structures, as shown in fig. 3, one structure is that the distributing hole 41 is a through hole penetrating through the upper surface and the lower surface of the distributing device 4, the distributing device 4 is identical to the screen and the substrate layer 2 is flatly placed, then the distributing device 4 is placed on the upper surface of the substrate layer 2, then the diamond composite particles 32 are laid on the distributing device 4, the diamond composite particles 32 fall on the upper surface of the substrate layer 2 through the distributing hole, so that the diamond composite particles 32 are uniformly distributed on the upper surface of the substrate layer 2, and then the redundant diamond composite particles 32 on the distributing device 4 and the distributing device 4 are removed; as shown in FIG. 2, in another structure, the distribution hole 41 is a slotted hole, the distributor 4 is provided with an air hole 42 communicated with the distribution hole 41, the aperture of the air hole 42 is smaller than the particle diameter of the diamond composite particle 32, the air hole 42 is connected with a negative pressure device, the diamond composite particle 32 is absorbed in the distribution hole 41 by negative pressure, then the distributing device 4 is placed on the upper surface of the substrate layer 2, the negative pressure device is stopped, the diamond composite particles 32 automatically fall on the upper surface of the substrate layer 2, the same diamond composite particles 32 are uniformly distributed on the upper surface of the substrate layer 2, the distribution efficiency and the precision of the diamond composite particles 32 by the distributing device 4 are high, the diamond composite particles 32 can be ensured to be orderly and uniformly distributed on the surface of the substrate layer 2 according to the requirements, thereby ensuring that the finally obtained composite material has uniformly distributed diamond particles 3 and ensuring the heat conduction uniformity of the composite material.
S3, pressing the diamond composite particles 32 into the surface of the substrate layer 2 by adopting a pressing die to obtain a semi-finished product I, wherein the pressing die comprises a base 5 and a pressing head 6, the substrate layer 2 is flatly placed on the base 5, the pressing head 6 presses the base 5 downwards to press the diamond composite particles 32 into the surface of the substrate layer 2, the substrate layer 2 is made of pure copper or copper-based composite material, the hardness of the pure copper or copper-based composite material is lower than that of the diamond particles 3, the pressing head 6 is made of a material with the hardness higher than that of the diamond particles 3, so that the service life of the pressing head 6 is ensured, the pressing quality is ensured, the pressing head 6 of the pressing die is provided with a plane parallel to the upper surface of the substrate layer 2, the pressing head 6 of the pressing die is pressed downwards to be flush with the surface of the substrate layer 2, and the diamond particles 3 are fully pressed into the surface of the substrate layer 2;
as shown in fig. 4 and 5, the pressing mode of directly pressing the diamond particles 3 into the surface of the substrate layer 2 by using a pressing die is a cold pressing mode, that is, the diamond particles 3 are pressed into the surface of the substrate layer 2 by using pressure only through the pressing die, as shown in fig. 6, the hot pressing mode can also be used, that is, the substrate layer 2 is heated in the pressing process, the heating temperature is 400-1000 ℃, specifically, an induction heating coil 7 can be arranged on the base 5 to heat the substrate layer 2, so that the material of the substrate layer 2 can be softened, the diamond particles 3 can be smoothly pressed into the surface of the substrate layer 2, and the diamond particles 3 can be better combined with the substrate layer 2, the interface combination state of the composite material is improved, and the heat conductivity is improved;
the hardness of the diamond particles 3 is greater than that of the substrate layer 2, when the diamond particles 3 are pressed into the substrate layer 2, the substrate layer 2 can generate pits, and the diamond particles 3 are generally tetrahedron, hexahedron, octahedron, dodecahedron and the like, so that the caliber of the diamond particles 3 is large at the middle part and small at the two ends, the pits generated when the diamond particles 3 are pressed into the substrate layer 2 are matched with the middle part of the diamond particles 3, but are greater than the top part of the diamond particles 3, that is, after the diamond particles 3 are pressed into the surface of the substrate layer 2, gaps can be formed between the generated pits and the top parts of the diamond particles 3, as shown in figure 7, as the periphery of the diamond particles 3 is wrapped with the powder layer 31, when the diamond composite particles 32 are pressed into the substrate layer 2, the powder layer 31 can be extruded towards the peripheral direction of the diamond particles 3 due to extrusion, so that the powder layer 31 can automatically fill the gaps between the pits and the diamond particles 3, that is, the powder layer 31 constitutes a filler for filling the gap between the pit and the diamond particle 3;
s4, sintering the semi-finished product I to enable the filler to be sintered into a compact structure so as to really fill the gap between the pit and the top of the diamond particle 3, wherein the filler becomes a compact component after sintering and is fused with the substrate layer 2 into a whole, and finally the semi-finished product II is obtained;
specifically, sintering is performed in a vacuum environment or a gas-shielded environment, the gas-shielded environment is an inert environment such as nitrogen or a reducing gas environment such as hydrogen, or a mixed gas environment of nitrogen and hydrogen, the vacuum environment and the gas-shielded environment can effectively prevent the diamond particles and the substrate layer from being oxidized in the sintering process, the filler and the substrate layer 2 are fully combined into a whole through sintering, the interface condition of the composite material is optimized, the composite material can form a continuous and flat surface conveniently, the contact area between the composite material and a heating device is increased, the heat transfer efficiency is improved, the overall heat-conducting performance of the composite material is improved, as shown in fig. 8, a semi-finished product I is placed in a sintering mold 8 for sintering, a plurality of sintering molds 8 can be simultaneously accommodated in a sintering furnace, and a single or a plurality of semi-finished products I can be placed in each sintering mold 8, the sintering mold 8 is matched with the size of the first semi-finished product, so that the size structure of the first semi-finished product is limited in the sintering process, the situation that the second semi-finished product is seriously deformed due to the fact that the base material layer 2 is softened and deformed in the sintering process is avoided, the structure and the size of the finally obtained composite material meet requirements is guaranteed, the sintering mold 8 is integrally a box body matched with the surface shape and the size of the base material layer 2 and can limit the edge of the first semi-finished product, the shape and the size of the obtained second semi-finished product meet requirements are kept, the temperature during sintering is 400-1300 ℃, the sintering time is 2-10 min, the material filled into the gap can be effectively integrated with the base material layer 2, the interface combination condition is optimized, and as the powder layer 31 used for filling the gap between the pit and the diamond particles 3 comprises powder and an adhesive made of the base material layer 2, and the adhesive is an excessive component for the composite material of the finished product, the heat conducting performance is affected and needs to be removed, so that the sintering process of the semi-finished product I is divided into two stages, the temperature of the first stage is 400-600 ℃, the adhesive is mainly removed, and the temperature of the second stage is 600-1300, so that the powder of the base material layer 2 in the powder layer 31 for filling the gap becomes compact and is fully combined with the base material layer 2 into a whole, and the interface combination condition is optimized.
S5, the surface of the semi-finished product II obtained after sintering is rough and uneven and is difficult to fully and effectively contact with a heating device, so that the heat conduction performance is poor, and the diamond particles 3 are also covered by the filling material, so that the diamond particles 3 cannot directly contact with the heating device, and the heat conduction performance is influenced;
therefore, the semi-finished product II is ground and polished, the diamond particles 3 are exposed, the diamond particles 3 and the substrate layer 2 are combined to form a flat surface, the smooth flatness of the surface of the composite material is improved, the composite material can be in full and good contact with a heating device, the contact area is increased, the diamond particles 3 are also fully exposed, the contact area of the diamond particles 3 and the heating device is large, the heat conducting performance is effectively improved, and the finished composite material is finally obtained.
The composite material prepared by the method mainly comprises a composite layer 1 as shown in fig. 9, wherein the composite layer 1 comprises a substrate layer 2 and diamond particles 3, the substrate layer 2 is a sheet-shaped metal material layer prepared in advance, the compactness is high, the mechanical property is good, and the excellent thermal conductivity can be guaranteed, concretely, the substrate layer 2 is a copper layer or a copper-based composite material layer, the copper layer is made of pure copper, the copper-based composite material layer is made of copper as an essential component and doped with elements such as silver, aluminum and neodymium, the diamond particles 3 are embedded on the surface of the substrate layer 2, the diamond particles 3 and the surface of the substrate layer 2 are combined to form a flat surface, that is, the diamond particles 3 are exposed on the surface of the substrate layer 2, the diamond particles 3 and the surface of the substrate layer 2 form a flat surface with high smoothness and good flatness, and the diamond particles 3 are distributed orderly along the surface of the substrate layer 2, preferably, the diamond particles 3 are uniformly distributed along the surface of the base material layer 2, so that the volume fraction of the diamond particles can be effectively improved, the heat conduction uniformity is improved, and the overall heat conductivity of the composite material is improved.
In this embodiment, the thickness of substrate layer 2 is less than or equal to 10mm, the particle size of diamond granule 3 is less than or equal to 5mm, and preferably, the thickness of substrate layer 2 is 0.1 ~ 1mm, the particle size of diamond granule 3 is 0.05 ~ 0.5mm, according to actual application demand, the substrate layer of different thickness and the diamond granule of different particle sizes are selected in a flexible way to control diamond granule 3 along the interval of 2 surface distributions of substrate layer, thereby the bulk thermal conductivity of composite is adjusted to the volume fraction of controlling diamond granule in a flexible way, satisfies various different demands.
Finally, the obtained single-layer finished composite material can be laminated for a plurality of layers and then sintered, so that the substrate layers 2 of the adjacent composite layers 1 are fused into a whole, the composite material with large size and thickness can be prepared, diamond particles are uniformly distributed in the composite material with large size and thickness, no binder and other components exist in the composite material, and the excellent heat-conducting property is effectively guaranteed.
Example two
In the first embodiment, a method for preparing a composite material having diamond particles 3 on one surface is provided, and when a composite material having diamond particles 3 on both surfaces thereof is to be prepared, the method may be to press diamond composite particles 32 on one surface of a substrate layer 2, turn the substrate layer 2 over, and press the diamond composite particles 32 on the other surface of the substrate layer 2, and in this embodiment, a method of simultaneously processing both surfaces is adopted, as shown in fig. 11, the difference from the first embodiment is that, in step S3, a layer of diamond composite particles 32 is orderly arranged on a base 5 through a distributor 4, the substrate layer 2 is laid flat on the layer of diamond composite particles 32 after the distributor is removed, a layer of diamond composite particles 32 is orderly arranged on the upper surface of the substrate layer 2 through the distributor 4, and then a press head 6 is pressed down to press the diamond composite particles 32 into the upper and lower surfaces of the substrate layer 2 simultaneously, obtain both sides surface and all have diamond particle 3's semi-manufactured goods one, diamond composite particle 32 arranges, make two-layer diamond composite particle 32 dislocation arrangement about the messenger, that is to say, diamond composite particle 32 of 2 lower surfaces of substrate layer and the direction on substrate layer 2 upper surface's a diamond composite particle 32 line out of plumb in substrate layer 2 surface, avoid two-layer diamond particle 3 to bump contact about the suppression in-process, avoid diamond particle 3 to be pressed and break, guarantee diamond particle 3's integrity, thereby the diamond particle 3 on the surface of the both sides of the semi-manufactured goods one that obtains is dislocation arrangement, can realize that substrate layer both sides surface all has the thickness of diamond particle on the basis of reducing the substrate layer, the volume fraction of effectual improvement diamond particle, improve combined material's thermal conductivity.
As shown in fig. 12, diamond particles 3 are respectively arranged on both side surfaces of the finally obtained composite material, the diamond particles 3 are respectively and uniformly distributed on both side surfaces of the composite material, and the diamond particles 3 on both side surfaces of the composite material are arranged in a staggered manner, so that the composite material has good heat conduction uniformity, high volume fraction of the diamond particles, and high overall heat conductivity of the composite material.
EXAMPLE III
Because in step S2, the diamond particles 3 are wrapped by the powder material of the substrate layer 2 to form the diamond composite particles 32, specifically, the diamond composite particles 32 are obtained by mixing and spheroidizing the powder material of the substrate layer 2 and the diamond particles 3, and the diamond composite particles 32 are spherical, when the diamond composite particles 32 are directly arranged on the surface of the substrate layer 2, the diamond composite particles 32 are easy to roll, so as to deviate from the original precise arrangement position, and further easily cause the orderly arrangement state to be damaged, therefore, another way can be adopted to ensure that the diamond composite particles 32 can be stably and orderly arranged on the surface of the substrate layer 2, specifically, as shown in fig. 13 and 14, the diamond composite particles 32 are orderly arranged on the adhesive tape 43 by the distributor 4, and due to the viscosity of the adhesive tape 43, the diamond particles 3 can be adhered and fixed on the adhesive tape 43, and the orderly arrangement distribution condition can be effectively maintained, then the adhesive tape 43 is attached to the surface of the substrate layer 2 in a manner that the diamond composite particles 32 face the surface of the substrate layer 2, due to the existence of the adhesive tape 43, the state of orderly arrangement of the diamond composite particles 32 can be kept stable and unchanged, the diamond composite particles 32 cannot roll and shift, so that the diamond composite particles 32 can be accurately pressed into the surface of the substrate layer 2 in the follow-up process, and the diamond particles 3 in the finally obtained composite material can be ensured to be orderly and uniformly distributed, after the adhesive tape 43 adhered with the diamond composite particles 32 is attached to the substrate layer 2, the subsequent step S3 can be directly performed, that is, the diamond composite particles 32 are pressed into the surface of the substrate layer 2 by adopting a pressing mold, but due to the large pressure in the pressing process, the adhesive tape 43 can be broken and remain on the diamond composite particles 32 and the substrate layer 2, the follow-up cleaning is required, and the cleaning difficulty is large, therefore, a more preferable mode is that a smaller pressure is firstly adopted for prepressing, specifically, a pressing mold adopts a pressure of 1-5 MPa for prepressing, a small part of the diamond composite particles 32 can be pre-embedded into the surface of the substrate layer 2, then the adhesive tape 43 is removed, organic matters such as residual glue on the diamond composite particles 32 and the substrate layer 2 can be cleaned by using an organic solvent, and then the diamond composite particles 32 are fully pressed into the surface of the substrate layer 2 by the pressing mold according to a normal pressing pressure (6-160 MPa) to obtain a semi-finished product i.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (11)
1. A method for preparing a composite material is characterized by comprising the following steps:
coating the diamond particles (3) with powder made of a base material layer (2) to obtain diamond composite particles (32), wherein the diamond composite particles (32) comprise the diamond particles (3) and a powder layer (31) coated on the surfaces of the diamond particles (3);
the diamond composite particles (32) are orderly arranged on the surface of the base material layer (2);
pressing the diamond composite particles (32) into the surface of the substrate layer (2) by adopting a pressing die to obtain a semi-finished product I;
sintering the semi-finished product I to obtain a semi-finished product II;
and grinding the semi-finished product II to expose the diamond particles (3), and combining the diamond particles (3) and the substrate layer (2) to form a flat surface to obtain the finished composite material.
2. The method for preparing the composite material according to claim 1, wherein the powder material of the base material layer (2) is mixed with the diamond particles (3) for spheroidization, the adhesive is added by means of atomization spraying, and the powder material of the base material layer (2) is coated on the diamond particles (3) by the adhesive to obtain the diamond composite particles (32).
3. The preparation method of the composite material as claimed in claim 1, wherein the diamond composite particles are orderly arranged on the surface of the substrate layer (2) through a distributor (4), a plurality of distribution holes (41) matched with the particle size of the diamond composite particles are formed in the distributor (4), the distribution holes (41) are orderly arranged along the surface of the substrate layer (2), and each distribution hole (41) only accommodates one diamond composite particle (32).
4. The preparation method of the composite material as claimed in claim 3, wherein the distribution hole (41) is a slotted hole, the distributor (4) is provided with an air hole (42) communicated with the distribution hole (41), and the caliber of the air hole (42) is smaller than the grain diameter of the diamond composite grains (32) and is used for connecting a negative pressure device.
5. The preparation method of the composite material as claimed in claim 3, characterized in that the diamond composite particles (32) are orderly arranged on the adhesive tape (43) through the distributor (4), then the adhesive tape (43) is attached to the substrate layer (2) in a manner that the diamond composite particles (32) face the surface of the substrate layer (2), a pressing mold is pre-pressed to pre-embed the diamond composite particles (32) on the surface of the substrate layer (2), then the adhesive tape (43) is removed, and then the diamond composite particles (32) are pressed into the surface of the substrate layer (2) by the pressing mold to obtain the semi-finished product I.
6. The method for preparing the composite material according to claim 1, wherein the substrate layer (2) is heated at a temperature of 400 to 1000 ℃ while the diamond composite particles are pressed into the surface of the substrate layer (2) by using a pressing die.
7. The preparation method of the composite material as claimed in claim 1, wherein the pressing die comprises a base body (5) and a pressing head (6), a layer of diamond composite particles (32) is orderly arranged on the base body (5), the substrate layer (2) is flatly placed on the layer of diamond composite particles, a layer of diamond composite particles (32) is orderly arranged on the upper surface of the substrate layer (2), and then the pressing head (6) is pressed downwards to press the diamond composite particles into the surface of the substrate layer (2) to obtain a first semi-finished product.
8. The method for preparing a composite material according to claim 7, wherein the diamond composite grains are arranged in a staggered manner on both side surfaces of the first semi-finished product.
9. Method for the production of a composite material according to any one of claims 1 to 8, characterised in that the semifinished product is sintered in a vacuum environment or in a gas-protected environment.
10. The method for preparing a composite material according to claim 9, wherein the first semi-finished product is placed in a sintering mold for limiting the shape and size of the first semi-finished product for sintering.
11. A composite material produced by the method for producing a composite material according to any one of claims 1 to 10.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| CN115319099A (en) * | 2022-07-20 | 2022-11-11 | 中山市海明润超硬材料有限公司 | Diamond composite material and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050051891A1 (en) * | 2001-11-09 | 2005-03-10 | Katsuhito Yoshida | Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
| CN101885060A (en) * | 2010-06-22 | 2010-11-17 | 上海中希合金有限公司 | High-performance copper-diamond electrical contact material and preparation process thereof |
| CN102672188A (en) * | 2012-06-05 | 2012-09-19 | 安泰科技股份有限公司 | Method for positioning and distributing diamonds in tool bit and distributing device |
| CN104858435A (en) * | 2015-05-12 | 2015-08-26 | 东南大学 | Method for preparing sandwich structure diamond-Al composite material |
| CN112059192A (en) * | 2020-09-08 | 2020-12-11 | 泉州众志金刚石工具有限公司 | Production method for orderly arranging diamond sintered bodies |
-
2021
- 2021-10-29 CN CN202111274515.7A patent/CN113976882B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050051891A1 (en) * | 2001-11-09 | 2005-03-10 | Katsuhito Yoshida | Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
| CN101885060A (en) * | 2010-06-22 | 2010-11-17 | 上海中希合金有限公司 | High-performance copper-diamond electrical contact material and preparation process thereof |
| CN102672188A (en) * | 2012-06-05 | 2012-09-19 | 安泰科技股份有限公司 | Method for positioning and distributing diamonds in tool bit and distributing device |
| CN104858435A (en) * | 2015-05-12 | 2015-08-26 | 东南大学 | Method for preparing sandwich structure diamond-Al composite material |
| CN112059192A (en) * | 2020-09-08 | 2020-12-11 | 泉州众志金刚石工具有限公司 | Production method for orderly arranging diamond sintered bodies |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115026730A (en) * | 2022-07-11 | 2022-09-09 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| CN115026730B (en) * | 2022-07-11 | 2024-03-01 | 河北锟洲科技有限公司 | Roller diamond arrangement implantation method based on 3D printing |
| CN115319099A (en) * | 2022-07-20 | 2022-11-11 | 中山市海明润超硬材料有限公司 | Diamond composite material and preparation method thereof |
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| CN113976882B (en) | 2023-08-01 |
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