CN113963857A - Manufacturing method of conductive film layer, conductive film layer structure and touch sensor - Google Patents
Manufacturing method of conductive film layer, conductive film layer structure and touch sensor Download PDFInfo
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- CN113963857A CN113963857A CN202111387184.8A CN202111387184A CN113963857A CN 113963857 A CN113963857 A CN 113963857A CN 202111387184 A CN202111387184 A CN 202111387184A CN 113963857 A CN113963857 A CN 113963857A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention provides a manufacturing method of a conductive film layer, a conductive film layer structure, a touch sensor and a touch screen, wherein the manufacturing method of the conductive film layer comprises the following steps: providing a conductive material film to be etched, wherein the conductive material film is obtained by processing a conductive material layer on the surface of a first area of a carrier layer, the first area of the carrier layer corresponds to a sensing area of the conductive film layer, and a second area of the carrier layer corresponds to a lead area of the conductive film layer; etching the conductive material layer to form a patterned conductive layer; forming a medium layer with a groove body on the surface of the second area of the carrier layer; and filling metal slurry into the groove body to form an electrode lead. According to the manufacturing method of the conductive film layer, the patterns of the conductive electrodes and the compensation electrodes with fine line spacing and the electrode leads arranged in the groove body are formed on the conductive film layer, so that the problem of color difference visibility of the touch screen in some scenes is solved, and the production yield and the use reliability of the electrode leads are improved.
Description
Technical Field
The invention relates to the technical field of touch devices, in particular to a manufacturing method of a conductive film layer, a conductive film layer structure, a touch sensor and a touch screen.
Background
With the rapid development of the touch screen technology, the application field of the touch screen is wider and wider, and in order to meet various use requirements in different use scenes, the development of the touch screen technology shows the trends of specialization, multifunction, three-dimensional, large screen and the like.
The touch screen has advantages such as convenient directly perceived, the image is clear, sturdy and durable and save space, however, the touch screen can appear screen colour difference under some use scenes, for example, special light, perhaps AR glass, under some special circumstances, touch screen surface colour difference can be more obvious, leads to user's use to experience from this to receive the influence. On the other hand, due to factors such as a production process or use abrasion, a breakpoint or a virtual connection of the conductive circuit occurs, so that normal use of the touch screen is affected.
Disclosure of Invention
In view of this, embodiments of the present invention provide a method for manufacturing a conductive film, a conductive film structure, a touch sensor and a touch panel, so as to achieve ultra-fine manufacturing of a conductive circuit and improve production yield and use reliability of an electrode lead.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a conductive film layer, including: providing a conductive material film to be etched, wherein the conductive material film is obtained by processing a conductive material layer on the surface of a first area of a carrier layer, the first area of the carrier layer corresponds to a sensing area of the conductive film layer, and a second area of the carrier layer corresponds to a lead area of the conductive film layer; etching the conductive material layer to form a patterned conductive layer, wherein the patterned conductive layer comprises a conductive electrode and a compensation electrode, and the conductive electrode and the compensation electrode are insulated; forming a medium layer with a groove body on the surface of the second area of the carrier layer; and filling metal slurry into the groove body to form an electrode lead.
In certain embodiments of the first aspect of the present invention, the layer of conductive material completely covers the first region and partially covers the second region, and the conductive electrode and the electrode lead have overlapping portions in the second region.
In certain embodiments of the first aspect of the present invention, etching the layer of conductive material to form a patterned conductive layer comprises: printing an etchant on the conductive material layer by using a gravure roller mold to etch and form a patterned conductive layer on the conductive material layer, or preparing a photoresist layer on the surface of the conductive material layer away from the carrier layer, wherein the photoresist layer is provided with a first hollow pattern; laminating a screen plate jig with a second hollow pattern on the surface of the photoresist layer far away from the conductive material layer, wherein the second hollow pattern at least partially overlaps the first hollow pattern in the orthographic projection area of the conductive material layer; and etching the conductive material layer based on the screen jig and the photoresist layer to form a patterned conductive layer.
In certain embodiments of the first aspect of the present invention, forming a dielectric layer having a trough on a surface of the second region of the carrier layer comprises: coating a photosensitive resin layer on the surface of the second region of the carrier layer; carrying out exposure and development process flow treatment on the photosensitive resin layer to form a photosensitive resin layer with a groove body; or, printing on the surface of the second area of the carrier layer by using a printing process to form a colloid layer with a groove body.
In certain embodiments of the first aspect of the present invention, filling a metal paste into the inside of a tank body to form an electrode lead includes: accurately aligning the hollow patterns of the screen jig with the groove body and covering the screen on the surface of the dielectric layer far away from the carrier layer so that the orthographic projection area formed by the hollow patterns of the screen jig on the plane of the dielectric layer is at least partially superposed with the orthographic projection area formed by the groove body on the plane of the dielectric layer; and filling the metal slurry into the groove body through the hollow pattern of the screen jig to form an electrode lead.
In a second aspect, embodiments of the present invention provide a conductive film layer structure, including: the conductive electrode is arranged in the sensing area of the conductive film layer and comprises at least one sensing electrode strip; the compensation electrode comprises one or more compensation blocks and is arranged in a compensation area around at least one induction electrode strip, and the compensation electrode is insulated from the conductive electrode; the electrode lead is positioned in the lead area of the conductive film layer and is electrically connected with the conductive electrode; the insulating medium is positioned in a lead area of the conductive film layer, the insulating medium is provided with a groove body, and the electrode lead is arranged inside the groove body; and the carrier is used for carrying the conductive electrode, the compensation electrode, the electrode lead and the insulating medium, and the structure of the conductive film layer has the advantages of improving the surface chromatic aberration of the touch screen and improving the electric connection reliability.
In certain embodiments of the second aspect of the present invention, at least one end of the conductive electrode extends through an edge of the sensing region to the lead region to form an extension of the conductive electrode, and the extension of the conductive electrode overlaps with one end of an adjacent electrode lead.
In certain embodiments of the second aspect of the present invention, the electrode lead includes at least two portions, one end of the first portion of the electrode lead is electrically connected to the conductive electrode, and one end of the second portion of the electrode lead is electrically connected to the other end of the first portion of the electrode lead, wherein the first portion of the electrode lead has a width greater than that of the first portion of the electrode lead.
In certain embodiments of the second aspect of the present invention, the electrode leads are structured as a single metal strip, and/or as metal grid strips, wherein the metal grid strips comprise one or more combinations of rectangles, diamonds, regular polygons, or arbitrary polygons.
In certain embodiments of the second aspect of the present invention, the conductive electrode comprises: a plurality of electrode blocks; and the connecting part is used for connecting any two adjacent electrode blocks in the plurality of electrode blocks and is provided with a hollow structure.
In a third aspect, embodiments of the present invention provide a touch sensor, which includes the above-described conductive film layer structure.
In a fourth aspect, an embodiment of the present invention provides a touch screen, which includes the touch sensor described above.
According to the manufacturing method of the conductive film layer, the conductive film layer structure, the touch sensor and the touch screen, the patterns of the conductive electrode and the compensation electrode with fine line spacing are formed on the conductive film layer, and the visual effect of a display area and the color difference visibility problem of the touch screen are improved. Meanwhile, according to the manufacturing method of the conductive film layer, the conductive film layer structure, the touch sensor and the touch screen, the electrode lead is arranged in the groove body, so that the production yield and the electric connection reliability of the electrode lead are improved, and the service cycle is prolonged.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a conductive film according to an exemplary embodiment of the present invention.
Fig. 2A is a schematic diagram illustrating a touch area and a lead area of a conductive film structure according to an exemplary embodiment of the invention.
Fig. 2B is a schematic diagram illustrating a structure of a conductive film according to an exemplary embodiment of the invention.
Fig. 3A is a schematic diagram illustrating an electrode pattern structure of a touch area according to an exemplary embodiment of the invention.
Fig. 3B is a schematic diagram illustrating an electrode pattern structure of a touch area according to another exemplary embodiment of the invention.
Fig. 3C is a schematic diagram illustrating an electrode pattern structure of a touch area according to another exemplary embodiment of the invention.
Fig. 4 is a schematic diagram illustrating a structure of a conductive film according to another exemplary embodiment of the present invention.
Fig. 4A is a schematic view of a portion a of a conductive film structure according to an exemplary embodiment of the invention.
Fig. 5 is a schematic diagram illustrating a structure of a patterned conductive film layer formed by using a gravure roller mold according to an exemplary embodiment of the present invention.
Fig. 6 is a schematic flow chart illustrating a process of forming a patterned conductive layer according to an exemplary embodiment of the invention.
Fig. 7 is a schematic diagram illustrating a structure of forming a patterned conductive film layer according to an exemplary embodiment of the invention.
Fig. 8 is a schematic flow chart illustrating a method for manufacturing a conductive film according to another exemplary embodiment of the present invention.
Fig. 9 is a schematic diagram illustrating an electrode lead structure according to an exemplary embodiment of the present invention.
Fig. 10 is a schematic view illustrating an electrode lead structure according to another exemplary embodiment of the present invention.
Fig. 11 is a schematic view illustrating an electrode lead structure according to another exemplary embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The conductive layer of the touch screen is mainly formed on an insulating substrate by ITO (indium tin oxide) through processes of vacuum coating and graphical etching, a touch sensing area and a lead area adjacent to the touch sensing area are defined on the conductive layer, and in the lead area, silver paste can be directly printed on the conductive material layer by utilizing a printing process through an electrode lead, and the electrode lead is formed after solidification. However, the line prepared by the printing process has too coarse fineness, the line width of the electrode lead is difficult to be made fine, for example, the line width pitch fineness is 80 to 120 micrometers, the narrow frame design of the display screen is seriously affected, and the production yield is reduced along with the thinning of the electrode lead. In a touch sensing area, an ITO layer forms a conducting layer with a certain pattern and a concave-convex effect after photoetching, optical differences in the aspects of light transmittance, reflectivity and the like exist in a hollow-out area and an ITO area (non-hollow-out area), so that chromatic aberration exists on the surface of a capacitive touch screen under some conditions, and under special lamplight or antireflection glass with different wavelengths or different angles, the chromatic aberration on the surface of the capacitive touch screen is more obvious, and the use experience of a user is influenced.
In order to solve the above problems, embodiments of the present invention provide a method for manufacturing a conductive film layer, a conductive film layer structure, a touch sensor and a touch screen, which improve the visual effect of a display area and the color difference visibility of the touch screen, improve the production yield and the electrical connection reliability of an electrode lead, and prolong the service life.
In the embodiment of the present invention, a conductive film layer of a touch panel is taken as an example, and detailed description is given with reference to fig. 1 to 8.
It should be noted that in the various drawings of the present application, some dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration, and thus, are used only to illustrate the basic structure of the subject matter of the present application.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a conductive film according to an exemplary embodiment of the present invention. Fig. 2A is a schematic diagram illustrating a touch area and a lead area of a conductive film structure according to an exemplary embodiment of the invention. Fig. 2B is a schematic diagram illustrating a structure of a conductive film according to an exemplary embodiment of the invention. Fig. 3A is a schematic diagram illustrating an electrode pattern structure of a touch area according to an exemplary embodiment of the invention.
As shown in fig. 1, the method for manufacturing the conductive film layer includes the following steps.
S110: and providing a conductive material film to be etched, wherein the conductive material film is obtained by processing a conductive material layer on the surface of a first area of a carrier layer, the first area of the carrier layer corresponds to the sensing area of the conductive film layer, and a second area of the carrier layer corresponds to the lead area of the conductive film layer.
As shown in fig. 2A and 2B, the conductive material film includes a conductive material layer 2020 and a carrier layer 2010, the carrier layer 2010 includes a first region i and a second region ii, the first region i of the carrier layer 2010 corresponds to the touch sensing region i of the conductive film, and the second region ii of the carrier layer 2010 corresponds to the lead region ii of the conductive film. A layer 2020 of conductive material is laminated to the upper surface of the first region i of the carrier layer 2010, the carrier layer 2010 being for carrying the layer 2020 of conductive material. In some embodiments, the carrier layer 2010 material may be selected from an insulating polymer that is resistant to the etchant, for example, the carrier material may be at least one of polycarbonate, polyethylene terephthalate, polymethyl methacrylate, and glass. The layer of conductive material 2020 can be formed on the upper surface of the first region i of the carrier layer 2010 by sputtering, plating, evaporation, coating, or the like. In some embodiments, the layer of conductive material 2020 may have a thickness on the order of microns, for example, 2 microns, and in the thinner case, may be less than 1 micron.
S120: and etching the conductive material layer to form a patterned conductive layer, wherein the patterned conductive layer comprises a conductive electrode and a compensation electrode, and the conductive electrode and the compensation electrode are insulated.
As shown in fig. 3A, the conductive material layer is etched to form a patterned conductive layer, where the patterned conductive layer includes a conductive electrode and a compensation electrode, where the conductive electrode includes at least one sensing electrode strip 301, and the sensing electrode strip 301 may be in the form of a rectangular parallelepiped, or may be formed by stringing a plurality of diamonds, which is not limited in particular.
S130: and forming a medium layer with a groove body on the surface of the second area of the carrier layer.
As shown in fig. 2A and 2B, a dielectric layer 2030 is laminated on the upper surface of the second region ii of the carrier layer 2010, and the carrier layer 2010 is used for carrying the dielectric layer 2030. The dielectric layer 2030 is selected from a material having no conductive function, such as a gel or a resin. The dielectric layer 2030 is provided with a groove 2040, and the groove 2040 is a groove formed on the dielectric layer and having a certain depth, and in some embodiments of the present invention, the depth of the groove 2040 may be the same as the thickness of the dielectric layer. The number of the grooves 2040 may be one or more, and the shape of the grooves 2040 may be set according to a target pattern, which is not limited herein.
S140: and filling metal slurry into the groove body to form an electrode lead.
The metal paste refers to any material that can realize a conductive function, for example, gold, silver, copper, or a metal alloy, etc. And filling the prepared metal slurry into the groove body of the dielectric layer, and forming an electrode lead after the metal slurry is solidified.
According to the manufacturing method of the conductive film layer provided by the embodiment of the invention, the patterns of the conductive electrode and the compensation electrode are formed on the conductive film layer, so that the visual effect of a display area and the color difference visibility problem of a touch screen are improved, the line width spacing of the electrode lead manufactured by the manufacturing method can be refined, the design of the touch screen with a narrower frame is facilitated, meanwhile, the electrode lead is arranged in the groove body, the dielectric layer can play a certain role in protecting the electrode lead, the production yield and the electric connection reliability of the electrode lead are improved, and the service cycle is prolonged.
In some embodiments of the invention, the layer of conductive material completely covers the first region and partially covers the second region, and the conductive electrode and the electrode lead have overlapping portions in the second region.
Fig. 4 is a schematic diagram illustrating a structure of a conductive film according to another exemplary embodiment of the present invention. Fig. 4A is a schematic view of a portion a of a conductive film structure according to an exemplary embodiment of the invention.
Specifically, in conjunction with the embodiment shown in fig. 1-3, conductive material layer 2020 disposed on first region i of carrier layer 2010 extends to second region ii of carrier layer 2010, where an extension of the electrode is formed at lead region ii of the conductive film layer. As shown in fig. 4, the conductive material 2020 is etched (corresponding to S120) to form a patterned conductive layer, and a pattern including a conductive electrode is formed in the second region ii of the carrier layer 2010. A dielectric layer 2030 having a groove 2040 is formed on the surface of the second region ii of the carrier layer 2010 (corresponding to S130), and a part of the region of the dielectric layer 2030 having a groove 2040 overlaps the upper surface of the conductive electrode provided as the extension of the electrode in the second region ii.
As shown in fig. 4 and 4A, the metal paste is filled into the groove 2040 to form the electrode lead 303 (corresponding to S130), and there is an overlapping portion iii between one end of the electrode lead 303 and the conductive electrode in the second area ii to form an overlapping joint between at least one end of the conductive electrode and one end of the electrode lead 303, so as to avoid the problem of open circuit or virtual connection caused by insufficient filling of the conductive paste at the end portion, improve the reliability of electrical connection of the line, and prolong the service life.
In some embodiments of the present invention, etching the layer of conductive material to form a patterned conductive layer comprises: printing an etchant on the conductive material layer by using a gravure roller mold to etch and form a patterned conductive layer on the conductive material layer, or preparing a photoresist layer on the surface of the conductive material layer away from the carrier layer, wherein the photoresist layer is provided with a first hollow pattern; laminating a screen plate jig with a second hollow pattern on the surface of the photoresist layer far away from the conductive material layer, wherein the second hollow pattern at least partially overlaps the first hollow pattern in the orthographic projection area of the conductive material layer; and etching the conductive material layer based on the screen jig and the photoresist layer to form a patterned conductive layer.
Fig. 5 is a schematic diagram illustrating a structure of a patterned conductive film layer formed by using a gravure roller mold according to an exemplary embodiment of the present invention.
As shown in fig. 5, the gravure roll mold 50 is provided with at least one groove 51, an etchant 52 is filled in the at least one groove 51 of the gravure roll mold, the etchant 52 filled in the gravure roll mold 50 is transferred to the conductive material layer 2020 by a gravure printing method, and the conductive material layer 2020 is etched by the etchant 52, thereby forming a patterned conductive layer. It should be noted that the grooves 51 of the gravure roll mold 50 may be patterned according to a predetermined pattern, and the conductive material at the locations of the conductive material layer 2020 where the etchant 52 is printed may be removed, thereby forming a patterned conductive layer.
Fig. 6 is a schematic flow chart illustrating a process of forming a patterned conductive layer according to an exemplary embodiment of the invention. Fig. 7 is a schematic diagram illustrating a structure of forming a patterned conductive film layer according to an exemplary embodiment of the invention.
Alternatively, as shown in fig. 6-7, the patterned conductive layer may be formed using the following process.
S610: and preparing a light resistance layer on the surface of the conductive material layer far away from the carrier layer, wherein the light resistance layer is provided with a first hollow pattern.
The photoresist layer comprises a photoresist material, which is also called photoresist, photosensitive material or photoresist, etc. Coating a photoresist material on the surface of the conductive material layer 2020 far away from the preparation carrier to form a photoresist material layer, covering a mask on the surface of the photoresist material layer far away from the conductive material layer, illuminating the surface of the mask far away from the photoresist material layer, removing the mask, and developing to remove the uncured photoresist material in the photoresist material layer to obtain a photoresist layer 2050 comprising a first hollow pattern.
S620: and laminating a screen plate jig with a second hollow pattern on the surface of the photoresist layer far away from the conductive material layer, wherein the second hollow pattern at least partially coincides with the orthographic projection area of the first hollow pattern on the plane of the conductive material layer in the orthographic projection area of the conductive material layer.
The screen jig 2060 is stacked on the surface of the photoresist layer 2050, and based on the positioning mark, the screen jig 2060 and the photoresist layer 2050 are precisely positioned, so that the second hollow pattern of the screen jig 2060 at least partially overlaps the first hollow pattern at the orthographic projection area of the conductive material layer 2020, and it can be understood that the at least partial overlapping includes two parts, namely, partial overlapping and full overlapping.
S630: and etching the conductive material layer based on the screen jig and the photoresist layer to form a patterned conductive layer.
An etchant is coated on the surface of the screen jig 2060 away from the photoresist layer, and the etchant sequentially flows through the second hollow pattern and the first hollow pattern to etch the conductive material layer 2020, thereby forming a patterned conductive layer.
In the method for manufacturing the conductive film layer described in fig. 1 and 6, the screen jig is used to etch the conductive material layer to form a patterned conductive layer, so that a finer electrode pattern with a line pitch is realized.
In some embodiments of the present invention, forming a medium layer having a groove on a surface of the second region of the carrier layer includes: coating a photosensitive resin layer on the surface of the second region of the carrier layer; carrying out exposure and development process flow treatment on the photosensitive resin layer to form a photosensitive resin layer with a groove body; or, printing on the surface of the second area of the carrier layer by using a printing process to form a colloid layer with a groove body.
Specifically, the photosensitive resin layer is applied to the surface of the second region ii of the support layer, and preferably, the photosensitive resin material is applied continuously and uniformly. The photosensitive resin layer is subjected to a process flow of exposure and development to form a photosensitive resin layer having a groove, and the specific steps may refer to step S610, which will not be described in detail herein.
Alternatively, the dielectric layer in the embodiment may also be printed directly on the surface of the second region ii of the carrier layer by using a printing process to form a colloid layer with a groove.
In the scheme, the dielectric layer formed in the second area of the carrier layer has a protection effect on the electrode lead, so that the production yield and the use reliability of the electrode lead are improved.
In some embodiments of the present invention, filling a metal paste into the inside of a tank body to form an electrode lead includes: accurately aligning the hollow patterns of the screen jig with the groove body and covering the screen on the surface of the dielectric layer far away from the carrier layer so that the orthographic projection area formed by the hollow patterns of the screen jig on the plane of the dielectric layer is at least partially superposed with the orthographic projection area formed by the groove body on the plane of the dielectric layer; and filling the metal slurry into the groove body through the hollow pattern of the screen jig to form an electrode lead.
Specifically, the hollowed-out patterns of the screen plate jig can be manufactured according to the patterns of the preset electrode lead, the screen plate jig and the carrier layer are provided with positioning marks, the hollowed-out patterns of the screen plate jig and the groove body of the carrier layer are accurately aligned, so that metal slurry is filled into the groove body through the hollowed-out patterns of the screen plate jig to form the electrode lead, the manufacturing of the electrode lead with fine line spacing is realized, and the production yield of the electrode lead is improved.
Fig. 8 is a schematic flow chart illustrating a method for manufacturing a conductive film according to another exemplary embodiment of the present invention.
As shown in fig. 8, the manufacturing method includes the following steps.
S810: providing a conductive material film to be etched, wherein the conductive material film comprises a carrier layer, and a conductive material layer which is formed on a first area of the carrier layer and extends to a second area in a sputtering mode.
S820: and coating a light resistance material on the surface of the conductive material layer far away from the carrier layer, and carrying out exposure and development process steps on the light resistance material layer to obtain the light resistance layer with the hollow pattern.
S830: and stacking the screen plate jig on the surface of the photoresist layer far away from the conductive material layer, and performing accurate alignment based on the alignment mark.
S840: and etching the conductive material layer by passing the etchant through the screen jig and the hollow pattern of the photoresist layer in sequence to form an electrode pattern, wherein part of the electrode pattern extends to the lead region of the conductive film layer.
In some embodiments of the present invention, the steps S820-S840 can be replaced by the embodiment shown in FIG. 5.
S850: a photosensitive resin layer is coated on the surface of the second region of the carrier layer, and the photosensitive resin layer has an overlapping portion with the electrode pattern formed in the lead region of the conductive film layer.
S860: and setting a mask plate, exposing the photosensitive resin layer, carrying out development treatment, and removing the mask plate to form the photosensitive resin layer with the groove body.
S870: and (3) stacking the screen plate jig with the hollow pattern on the surface of the photosensitive resin layer far away from the carrier, and carrying out accurate alignment based on the alignment mark.
S880: and providing metal slurry, and filling the metal slurry into the groove body of the photosensitive resin layer through the hollow pattern of the screen jig so as to form an electrode lead.
In some embodiments of the present invention, in the steps S850 to S860, a printing process may be also used to directly print the colloid layer with the groove on the surface of the second region of the carrier layer, so as to simplify the process flow and reduce the manufacturing cost.
An embodiment of the present invention provides a conductive film structure, as shown in fig. 2A, 2B, and 3A, the conductive film defines an induction area i and a lead area ii, the conductive film structure includes a conductive electrode disposed in the induction area i of the conductive film, the conductive electrode includes at least one induction electrode strip 301; the compensation electrode comprises one or more compensation blocks 302 arranged in a compensation area around at least one induction electrode strip 301, and the compensation electrode is insulated from the conductive electrode; the electrode lead 303 is positioned in the lead area II of the conductive film layer, and the electrode lead 303 is electrically connected with the conductive electrode; the insulating medium 2030 is located in the lead region II of the conductive film layer, the insulating medium is provided with a groove 2040, and the electrode lead 303 is arranged inside the groove 2040; and a carrier 2010 for carrying the conductive electrodes, compensation electrodes, electrode leads and insulating medium.
The electrode lead is arranged in the groove body of the insulating medium, so that on one hand, the insulating medium plays a certain role in protecting the electrode lead in the using process, the probability of abrasion or break points of the electrode lead is reduced, the reliability of electric connection is improved, and the service cycle is prolonged; on the other hand, by forming the groove body with the ultra-fine width, the fine manufacturing of the line spacing of the electrode leads and the design of a narrower frame of the touch screen can be realized. Meanwhile, the compensation area is provided with one or more compensation blocks, so that the difference of optical properties such as light transmittance, reflectivity, refractive index and the like between the area where the conductive electrode is located and other non-conductive electrode areas (compensation areas) is reduced, the chromatic aberration of the structure of the conductive film layer is reduced, the problem of chromatic aberration visibility of the touch screen in some scenes is solved, and the use experience of a user is improved.
In some embodiments of the present invention, in conjunction with the embodiment shown in fig. 2, the conductive material 2020 is formed on the carrier layer 2010 by vacuum coating or sputtering, and at least one end of the conductive material 2020 extends through the edge of the sensing region i to the lead region ii to form an extension of the conductive electrode, which overlaps with an end of an adjacent electrode lead. As shown in fig. 4 and 4A, one end of the sensing electrode strip 301 extends to the lead region ii through the edge of the sensing region i, wherein the sensing electrode strip 301 may be in the form of a rectangular parallelepiped, or may be formed by stringing a plurality of diamonds, or may be in the form of any polygon, which is not limited herein. One end of the induction electrode strip 301 and one end of the electrode lead 303 form overlapping in the overlapping area III, so that the condition of open circuit or virtual connection caused by insufficient filling of metal paste at the end part of the electrode lead and other factors is avoided, and the reliability of electric connection is improved.
Fig. 9 is a schematic diagram illustrating an electrode lead structure according to an exemplary embodiment of the present invention.
In some embodiments of the present invention, the electrode lead includes at least two portions, one end of the first portion of the electrode lead is electrically connected to the conductive electrode, and one end of the second portion of the electrode lead is electrically connected to the other end of the first portion of the electrode lead, wherein the first portion of the electrode lead has a width greater than that of the first portion of the electrode lead.
As shown in fig. 9, the electrode lead 303 includes a first portion 3031 and a second portion 3032, one end of the first portion 3031 is electrically connected to the sensing electrode strip 301, and the other end of the first portion 3031 is electrically connected to the second portion, wherein the width of the first portion 3031 of the electrode lead is greater than that of the second portion 3032, which effectively improves the reliability of the electrical connection between the conductive electrode and the electrode lead. The width of the second part 3032 of the electrode lead is smaller than that of the first part 3032, so that the design of the narrow frame of the touch screen is facilitated.
Fig. 10 is a schematic view illustrating an electrode lead structure according to another exemplary embodiment of the present invention. Fig. 11 is a schematic view illustrating an electrode lead structure according to another exemplary embodiment of the present invention.
In some embodiments of the present invention, as shown in fig. 10, the structure of the electrode lead 303 is in the form of a single metal strip.
In some embodiments of the present invention, as shown in fig. 11, the structure of the electrode lead 303 is a metal grid strip, wherein the metal grid strip includes one or more of a rectangle, a rhombus, a regular polygon, or a combination of any polygons. The electrode lead of the metal grid strip can ensure the reliability of electric connection, and even if any part of the electrode lead has a breakpoint due to production factors, such as insufficient filling of metal slurry, or use abrasion and the like, the electric connection of the whole electrode lead cannot be influenced, so that the electric connection reliability is improved.
Further, the thickness of the electrode lead 303 is less than that of the insulating dielectric layer 2030, which can prevent the electrode lead from being worn during use, improve the life cycle of the electrode lead, and improve the production yield of the electrode lead. Preferably, the thickness of the electrode lead is 2-12 micrometers, and the thickness of the insulating medium layer is 3-15 micrometers.
In some embodiments of the present invention, the sensing electrode strip 301 includes a plurality of electrode blocks 304, and a connecting portion 305 for connecting any two adjacent electrode blocks 304 of the plurality of electrode blocks, wherein the connecting portion 305 is provided with a hollow structure, and preferably, the hollow structure may be asymmetric, or the boundary of the hollow structure may be formed by at least one or more of a straight line, a broken line and a curved line.
When the touch conductive film layer structure realizes a touch function, the two conductive layers are arranged at an interval, so that a double-layer structure appears at the connecting portion 305, and chromatic aberration is easily generated because the double-layer structure and the single-layer structure have differences in optical properties such as light transmittance, reflectivity, refractive index and the like. By arranging the connecting portion 305 to include a hollow structure, the area of the double-layer structure of the cross overlapping portion can be reduced, and the difference of the conductive film layer structure in terms of optical properties such as light transmittance, reflectivity, and refractive index can be reduced, thereby reducing chromatic aberration.
Fig. 3B is a schematic diagram illustrating an electrode pattern structure of a touch area according to another exemplary embodiment of the invention.
In some embodiments of the present invention, as shown in fig. 3B, the boundary of the conductive electrode comprises an irregular boundary comprised of at least one or more of a straight line, a polygonal line, and a curved line. The boundary shape of the sensing electrode bar 301 and the connection part 305 may be zigzag or wave-shaped. The zigzag or wavy boundaries can form gaps with different widths between the conductive electrode and the compensation block 302, and since the diffracted light generally changes periodically, the gaps with different widths are more favorable for the superposition cancellation of the diffracted light, thereby further reducing the chromatic aberration caused by the diffracted light.
Fig. 3C is a schematic diagram illustrating an electrode pattern structure of a touch area according to another exemplary embodiment of the invention.
In some embodiments of the present invention, as shown in FIG. 3C, the compensation block 302 comprises a regular-type compensation block, and/or an irregular-type compensation block. The regular-type compensation block may be a compensation block whose boundary is an isosceles triangle, a regular polygon, or a circle. The irregular type compensation block may be a compensation block whose boundary includes a closed figure composed of a plurality of straight lines and a plurality of curved lines. By including the regular-type compensation blocks and/or the irregular-type compensation blocks in the compensation blocks 302, gaps with different widths can be formed between adjacent compensation blocks 302 and/or between the conductive electrode and the compensation blocks 302, thereby reducing chromatic aberration and diffraction fringes caused by diffracted light.
An embodiment of the present invention provides a touch sensor, which includes a touch film structure, and the touch film structure adopts the touch film structure mentioned in any of the above embodiments, and the touch sensor has the advantages of improving the visibility of the surface color difference of the touch screen, improving the reliability of electrical connection, and facilitating the design of the narrow frame of the touch screen.
An embodiment of the present invention provides a touch screen, where the touch screen includes the above-mentioned touch sensor, and the touch screen has the advantages of improving visibility of surface color difference of the touch screen, improving reliability of electrical connection, and facilitating design of a narrow frame of the touch screen.
The technical features of all the above embodiments can be combined arbitrarily to form alternative embodiments of the present invention, and are not described in detail herein.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "certain embodiments," "examples," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defining "first", "second" may explicitly or implicitly include at least one such feature.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.
Claims (12)
1. A method for manufacturing a conductive film layer is characterized by comprising the following steps:
providing a conductive material film to be etched, wherein the conductive material film is obtained by processing a conductive material layer on the surface of a first area of a carrier layer, the first area of the carrier layer corresponds to a sensing area of the conductive film layer, and a second area of the carrier layer corresponds to a lead area of the conductive film layer;
etching the conductive material layer to form a patterned conductive layer, wherein the patterned conductive layer comprises a conductive electrode and a compensation electrode, and the conductive electrode and the compensation electrode are insulated from each other;
forming a medium layer with a groove body on the surface of the second area of the carrier layer;
and filling metal slurry into the groove body to form an electrode lead.
2. The method of manufacturing according to claim 1, wherein the conductive material layer completely covers the first region and partially covers the second region, and the conductive electrode and the electrode lead have an overlap joint portion in the second region.
3. The method according to claim 1 or 2, wherein the etching the conductive material layer to form a patterned conductive layer comprises:
printing an etchant on the conductive material layer using a gravure roll mold to etch the patterned conductive layer on the conductive material layer, or,
preparing a light resistance layer on the surface of the conductive material layer far away from the carrier layer, wherein the light resistance layer is provided with a first hollow pattern;
a screen plate jig with a second hollow pattern is arranged on the surface, far away from the conductive material layer, of the light resistance layer in a stacking mode, wherein the second hollow pattern at least partially overlaps the first hollow pattern in an orthographic projection area of the conductive material layer;
and etching the conductive material layer based on the screen jig and the photoresist layer to form the patterned conductive layer.
4. The manufacturing method of claim 1 or 2, wherein the forming of the medium layer with grooves on the surface of the second region of the carrier layer comprises:
coating a photosensitive resin layer on the surface of the second region of the carrier layer;
carrying out exposure and development process flow treatment on the photosensitive resin layer to form the photosensitive resin layer with a groove; alternatively, the first and second electrodes may be,
and printing and forming a colloid layer with a groove body on the surface of the second area of the carrier layer by using a printing process.
5. The manufacturing method according to claim 1 or 2, wherein the filling of the metal paste into the inside of the tank body to form the electrode lead includes:
accurately aligning the hollow patterns of the screen plate jig with the tank body and covering the screen plate on the surface of the dielectric layer far away from the carrier layer so that the orthographic projection area formed by the hollow patterns of the screen plate jig on the plane of the dielectric layer at least partially coincides with the orthographic projection area formed by the tank body on the plane of the dielectric layer;
and filling metal slurry into the groove body through the hollow pattern of the screen jig to form the electrode lead.
6. A conductive film layer structure, comprising:
the conductive electrode is arranged in the sensing area of the conductive film layer and comprises at least one sensing electrode strip;
the compensation electrode comprises one or more compensation blocks and is arranged in a compensation area around the at least one induction electrode strip, and the compensation electrode is insulated from the conductive electrode;
the electrode lead is positioned in a lead area of the conductive film layer and electrically connected with the conductive electrode;
the insulating medium is positioned in a lead wire area of the conductive film layer, the insulating medium is provided with a groove body, and the electrode lead wire is arranged inside the groove body; and
a carrier for carrying the conductive electrode, the compensation electrode, the electrode lead and the insulating medium.
7. The conductive film layer structure of claim 6, wherein at least one end of the conductive electrode extends to the lead region through the edge of the sensing region to form an extension of the conductive electrode, and the extension of the conductive electrode overlaps with an end of the adjacent electrode lead.
8. The conductive film layer structure of claim 6 or 7, wherein the electrode lead comprises at least two parts, one end of a first part of the electrode lead is electrically connected to the conductive electrode, and one end of a second part of the electrode lead is electrically connected to the other end of the first part of the electrode lead, wherein the width of the first part of the electrode lead is greater than the width of the first part of the electrode lead.
9. The conductive film layer structure of claim 6 or 7, wherein the structure of the electrode lead is a single metal strip, and/or a metal grid strip, wherein the metal grid strip comprises one or more of a rectangle, a diamond, a regular polygon, or a combination of any polygons.
10. The conductive film layer structure of claim 6, wherein the conductive electrode comprises:
a plurality of electrode blocks; and
the connecting part is used for connecting any two adjacent electrode blocks in the plurality of electrode blocks and is provided with a hollow structure.
11. A touch sensor, comprising a touch film structure, wherein the touch film structure is the touch film structure of any one of claims 6 to 10.
12. A touch screen comprising the touch sensor of claim 11.
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| CN202111387184.8A CN113963857A (en) | 2021-11-22 | 2021-11-22 | Manufacturing method of conductive film layer, conductive film layer structure and touch sensor |
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| CN202111387184.8A CN113963857A (en) | 2021-11-22 | 2021-11-22 | Manufacturing method of conductive film layer, conductive film layer structure and touch sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116959783A (en) * | 2023-05-25 | 2023-10-27 | 江苏纳美达光电科技有限公司 | Conductive film, touch electrode and preparation method of conductive film |
| WO2024020721A1 (en) * | 2022-07-25 | 2024-02-01 | 京东方科技集团股份有限公司 | Optical structure and method for manufacturing optical structure |
| CN116959783B (en) * | 2023-05-25 | 2024-05-17 | 江苏纳美达光电科技有限公司 | Conductive film, touch electrode and preparation method of conductive film |
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2021
- 2021-11-22 CN CN202111387184.8A patent/CN113963857A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024020721A1 (en) * | 2022-07-25 | 2024-02-01 | 京东方科技集团股份有限公司 | Optical structure and method for manufacturing optical structure |
| CN116959783A (en) * | 2023-05-25 | 2023-10-27 | 江苏纳美达光电科技有限公司 | Conductive film, touch electrode and preparation method of conductive film |
| CN116959783B (en) * | 2023-05-25 | 2024-05-17 | 江苏纳美达光电科技有限公司 | Conductive film, touch electrode and preparation method of conductive film |
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