CN113933945B - High-precision linear optical coupler based on variable ratio beam splitter - Google Patents
High-precision linear optical coupler based on variable ratio beam splitter Download PDFInfo
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- CN113933945B CN113933945B CN202111170124.0A CN202111170124A CN113933945B CN 113933945 B CN113933945 B CN 113933945B CN 202111170124 A CN202111170124 A CN 202111170124A CN 113933945 B CN113933945 B CN 113933945B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
Abstract
The invention belongs to the technical field of linear photoelectric isolation devices, and discloses a high-precision linear optocoupler based on a variable ratio beam splitter, which comprises: the device comprises a base, a photosensitive integration plate, a variable ratio beam splitter, a cover plate and a packaging tube shell; the photosensitive integration plate is arranged on the base; the variable ratio beam splitter is arranged on the photosensitive integration plate, and the signal output end of the device corresponds to the input end of the variable ratio beam splitter; the cover plate is arranged on the photosensitive integration plate and is electrically communicated with the photosensitive integration plate; the packaging tube shell is used for carrying out airtight packaging on the base, the photosensitive integrated plate, the variable ratio beam splitter and the cover plate; the invention designs a linear optical coupling structure comprising an LED, a photoelectric detector and a variable ratio beam splitter, which realizes high-precision transmission gain of the linear optical coupling through the transmission of a three-dimensional correlation optical structure and an optical fiber optical path in the variable ratio beam splitter, and simultaneously improves the anti-electromagnetic interference capability and the high reliability of a device.
Description
Technical Field
The invention belongs to the technical field of linear photoelectric isolation devices, and discloses a high-precision linear optocoupler based on a variable ratio beam splitter.
Background
In the field of signal isolation transmission, because photoelectric isolation uses optical signals as transmission media through a light-emitting device and a photosensitive device, the photoelectric isolation has the advantages of unidirectional transmission, strong anti-interference capability, long service life, no contact point and the like, and is widely used in various measurement systems. Wherein, in analog signal photoelectric isolation transmission field, the circuit commonly used comprises linear opto-coupler, feedback circuit and transimpedance amplification output circuit, and analog signal's transmission gain depends on the transmission gain of linear opto-coupler device, and the transmission gain of linear opto-coupler device depends on the ratio of output photoelectric detector and input photoelectric detector photocurrent.
At present, typical linear optocoupler products such as IL300 series of American VISIHY company, HCNR200/2001 of American Agilent company and TIL300/300A series of American TI company are plastic package device products, and due to the influence of production process, plastic package mold, internal structure and batch difference of photoelectric detectors, the transmission gain and distribution interval of each device are larger, and the transmission gain deviation is larger than 5%; for example, the transmission gain of HCNR200 is 0.85 to 1.15, the transmission gain of HCNR201 is 0.93 to 1.07, the transmission gain of il300 is 0.56 to 1.65, the transmission gain of til300 is 0.75 to 1.25, and the transmission gain of til300a is 0.9 to 1.1, and glue is injected inside the device to cause a large transmission gain deviation in high and low temperature environments, so that each linear optocoupler needs to be provided with different high-precision debugging resistors to solve the problem of insufficient transmission precision in actual circuit use, and the transmission gain is relatively complex to use, and cannot be adjusted according to an actually used circuit, and cannot meet the use requirement of flexible adjustment of analog signal transmission. Although the transmission accuracy of the linear optocoupler with the ceramic structure can be optimized and adjusted through a coupling process, the device structure is complex, the production efficiency is relatively low, the batch production is not convenient, and the technical problem that the transmission accuracy changes due to the fact that the LED light field changes unevenly under the high-temperature and low-temperature environments cannot be solved.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a high-precision linear optical coupler based on a variable ratio beam splitter, which comprises: the device comprises a base 1, a photosensitive integration plate 2, a variable ratio beam splitter 3, a cover plate 4 and a packaging tube shell 5; the photosensitive integration plate 2 is arranged on the base 1; the variable ratio beam splitter 3 is arranged on the photosensitive integration plate 2, and the signal output end of the variable ratio beam splitter 3 corresponds to the input end of the variable ratio beam splitter 3; the cover plate 4 is arranged on the photosensitive integration plate 2, and the cover plate 4 is electrically conducted with the photosensitive integration plate 2; the packaging tube shell 5 is used for hermetically packaging the base 1, the photosensitive integration plate 2, the variable ratio beam splitter 3 and the cover plate 4.
Preferably, the base 1 is a cuboid structure, and a groove is arranged in the center of the base and used for fixing the photosensitive integration plate 2 and the cover plate 3.
Preferably, the photosensitive integration plate 2 includes: a bottom plate 21, a left gold pad 22, a right gold pad 23, a left gold conduction band 24, a right gold conduction band 25, a left photodetector chip 26, a right photodetector chip 27, a first ceramic step 28, and a second ceramic step 29; the left gold pad 22, the right gold pad 23, the left gold tape 24, the right gold tape 25, the first ceramic step 28 and the second ceramic step 29 are arranged on the bottom plate 21, and metal layers are plated on the upper surfaces of the first ceramic step 28 and the second ceramic step 29; the left photoelectric detector chip 26 is arranged on the left gold bonding pad 22 and is conducted with the left gold conduction band 24 through a lead; the right photoelectric detector chip 27 is arranged on the right gold bonding pad 23 and is conducted with the right gold conduction band 25 through a lead; the left gold bonding pad 22, the right gold bonding pad 23, the left gold conduction band 24 and the right gold conduction band 25 are respectively connected with corresponding metal outer pins of the packaging shell.
Further, the photosensitive integration board 2 further includes a third ceramic step 281 and a fourth ceramic step 291; a third ceramic step 281 is fixed to a side of the first ceramic step 28, and a fourth ceramic step 291 is fixed to a side of the second ceramic step 29.
Further, fixing grooves are formed in the upper surfaces of the third ceramic step 281 and the fourth ceramic step 291, and a metal layer is plated on the surfaces of the fixing grooves.
Preferably, the beam splitter 3 includes a bracket 31, a left optical fiber 34, and a right optical fiber 35; the bracket 31 is a door-shaped structure with a hollow interior, and the left optical fiber 34 and the right optical fiber 35 are respectively arranged inside the bracket 31.
Further, the beam splitter 3 further includes a left support frame 32 and a right support frame 33; the left support frame 32 is fixed on the left side of the bracket 31, and the right support frame 33 is fixed on the right side of the bracket 31; when the beam splitter 3 is disposed on the photoalignment plate 2, the right support bracket 33 is fixed on the upper surface fixing groove of the fourth ceramic step 291 of the photoalignment plate 2 by fixing the left support bracket 32 on the fixing groove of the third ceramic step 281 of the photoalignment plate 2.
Preferably, the cover plate 4 includes: a fixing plate 41, a short gold conduction band 42, a long gold conduction band 43 and an LED chip 44; the short gold conduction band 42 and the long gold conduction band 43 are arranged on the fixing plate 41, and the short gold conduction band 42 and the long gold conduction band 43 are not conducted; the LED chip 44 is disposed on the long gold conductive tape 43 and connected to the short gold conductive tape 42 by a wire.
Further, the cover plate 4 is placed on the photo integration board 2, and the short gold conduction band 42 on the cover plate 4 is conducted with the metal layer on the first ceramic step 28, the long gold conduction band 43 on the cover plate 4 is conducted with the metal layer on the second ceramic step 29, and the LED chip 44 on the cover plate 4 corresponds to the fiber input port of the beam splitter 3.
Further, the LED chip 44 is a double heterojunction LED with AlGaAs/GaAs/AlGaAs front emitting.
The invention has the beneficial effects that:
(1) An LED light-emitting diode chip is adopted as a double heterojunction light-emitting diode with AlGaAs/GaAs/AlGaAs front surface light emitting, gaAs is used as an active region, and AlGaAs with different components is used as a limiting layer; growing a Distributed Bragg Reflector (DBR) on a substrate; the circular electrode structure is adopted to provide uniformly distributed current for the light source, so that the precision and the nonlinearity of the linear optocoupler can be improved;
(2) The PIN silicon-based photoelectric detector chip optimizes the process conditions of the annealing temperature and annealing time of the chip, ion implantation energy, dosage and the like, optimizes the spectral response consistency and quantum efficiency, effectively reduces the dark current, adopts the same batch of wafer chips, improves the parameter consistency, and is beneficial to improving the precision of linear optical coupler transmission gain and reducing the temperature drift;
(3) The invention has designed a variable ratio beam splitter, the outer frame is the metal construction, the light path transmission uses the multimode fiber with the bore diameter of 100 μm to carry on, fix the fiber inside the metal frame, while implementing specifically, the light source chip light-emitting area locates over two entrances, and cover two light-in mouths completely, two fiber bore diameters are equal, guarantee the equal proportional light beam to pass the fiber exit and incide to the detector smooth surface, change into the equal proportional light current through the detector, the ratio of two light currents is the transmission gain of the linear light coupler, based on this innovative design, can solve the coupling process problem of the linear light coupler effectively, raise transmission precision and production efficiency, the transmission precision is reduced to within 0.5%, in addition, through adjusting the internal fiber diameter size of the variable ratio beam splitter, can form the linear light coupler of different transmission gains, through the internal fiber transmission, can solve the input current change, the influence of the temperature change on the transmission precision of the linear light coupler effectively;
(4) The invention designs a linear optocoupler structure comprising an AlGaAs LED, a PIN photoelectric detector and a variable ratio beam splitter, which is based on a ceramic inner cavity structure, realizes high-precision transmission gain of the linear optocoupler through the transmission of a three-dimensional correlation optical structure and an optical fiber light path in the variable ratio beam splitter, and simultaneously improves the anti-electromagnetic interference capability and high reliability of a device.
Drawings
FIG. 1 is a schematic structural diagram of a photosensitive integrated plate in a linear optical coupler according to the present invention;
FIG. 2 is a schematic diagram of a variable ratio beam splitter in a linear optocoupler according to the invention;
FIG. 3 is an inside view of a variable ratio beam splitter in a linear optocoupler of the invention;
FIG. 4 is a schematic diagram of the construction of the photoalignment plate and variable ratio beam splitter of the present invention;
FIG. 5 is a diagram of a cover plate structure in the linear optical coupler of the present invention;
FIG. 6 is a schematic diagram of an internal structure of a linear optocoupler of the invention;
FIG. 7 is a schematic view of the fixing position of the cover plate and the photosensitive integration plate according to the present invention;
FIG. 8 is a schematic diagram of the overall structure of the linear optocoupler of the present invention;
wherein, 1, a base; 2. the photoelectric detector comprises a photosensitive integrated board, 21, a bottom board, 22, a left gold bonding pad, 23, a right gold bonding pad, 24, a left gold conduction band, 25, a right gold conduction band, 26, a left photoelectric detector chip, 27, a right photoelectric detector chip, 28, a first ceramic step, 29, a second ceramic step, 281, a third ceramic step, 291 and a fourth ceramic step; 3. the variable ratio beam splitter 31, the bracket 32, the left support frame 33, the right support frame 34, the left optical fiber 35, the right optical fiber 36, the left optical fiber light inlet 37, the left optical fiber light outlet 38, the right optical fiber light outlet 39 and the right optical fiber light inlet; 4. the LED light-emitting diode comprises a cover plate 41, a fixing plate 42, a short gold conduction band 43, a long gold conduction band 44 and an LED light-emitting diode chip; 5. and packaging the tube shell.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings, and the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art based on the embodiments of the present invention without inventive step, are within the scope of the present invention.
A high precision linear optocoupler based on a variable ratio beam splitter, the device comprising: the device comprises a base 1, a photosensitive integration plate 2, a variable ratio beam splitter 3, a cover plate 4 and a packaging tube shell 5; the photosensitive integration plate 2 is arranged on the base 1; the variable ratio beam splitter 3 is arranged on the photosensitive integration plate 2, and the signal output end of the variable ratio beam splitter 3 corresponds to the input end of the variable ratio beam splitter 3; the cover plate 4 is arranged on the photosensitive integration plate 2, and the cover plate 4 is electrically conducted with the photosensitive integration plate 2; the packaging tube shell 5 is used for hermetically packaging the base 1, the photosensitive integration plate 2, the variable ratio beam splitter 3 and the cover plate 4.
A base concrete implementation mode of high-precision linear optical coupler based on variable ratio beam splitter, the base is a cuboid structure; the base is provided with a groove for placing the photosensitive integration plate 2 and the cover plate 3.
An embodiment of the photoalignment plate based on high precision linear optical coupling of a variable ratio beam splitter, as shown in fig. 1, comprises: a bottom plate 21, a left gold pad 22, a right gold pad 23, a left gold conduction band 24, a right gold conduction band 25, a left photodetector chip 26, a right photodetector chip 27, a first ceramic step 28, and a second ceramic step 29; the left gold pad 22, the right gold pad 23, the left gold tape 24, the right gold tape 25, the first ceramic step 28 and the second ceramic step 29 are arranged on the bottom plate 21, and metal layers are plated on the upper surfaces of the first ceramic step 28 and the second ceramic step 29; the left photoelectric detector chip 26 is arranged on the left gold bonding pad 22 and is conducted with the left gold conduction band 24 through a lead; the right photoelectric detector chip 27 is arranged on the right gold bonding pad 23 and is communicated with the right gold conduction band 25 through a wire; the left gold bonding pad 22, the right gold bonding pad 23, the left gold conduction band 24 and the right gold conduction band 25 are respectively connected with corresponding metal outer pins of the packaging shell.
Optionally, the photosensitive integration plate 2 further comprises a third ceramic step 281 and a fourth ceramic step 291; a third ceramic step 281 is fixed to a side of the first ceramic step 28, and a fourth ceramic step 291 is fixed to a side of the second ceramic step 29. The third ceramic step 281 and the fourth ceramic step 291 are used to fix the beam splitter 3.
Further, fixing grooves are formed in the upper surfaces of the third ceramic step 281 and the fourth ceramic step 291, and a metal layer is plated on the surfaces of the fixing grooves. The beam splitter 3 is fixed at a prescribed position by a fixing groove provided.
Preferably, the photosensitive integration plate 2 has a left-right symmetrical structure.
Preferably, the photodetector chip is a PIN photodetector chip. The PIN silicon-based photoelectric detector chip optimizes the annealing temperature and annealing time of the chip, ion implantation energy, dosage and other process conditions, optimizes the spectral response consistency and quantum efficiency, effectively reduces dark current, adopts the same batch of wafer chips, improves parameter consistency, and is beneficial to improving the precision of linear optical coupler transmission gain and reducing temperature drift.
Preferably, the left gold pad 22, the right gold pad 23, the left gold conduction band 24 and the right gold conduction band 25 of the photosensitive integrated board 2 are all arranged on the upper plane of the bottom board 21, and the left gold pad 22, the right gold pad 23, the left gold conduction band 24 and the right gold conduction band 25 are connected with corresponding metal outer pins of the package housing; the left PIN photoelectric detector chip 26 and the right PIN photoelectric detector chip 27 are respectively arranged on the left gold bonding pad 22 and the right gold bonding pad 23, back electrodes of the left PIN photoelectric detector chip and the right PIN photoelectric detector chip are respectively connected with corresponding metal outer PINs of the packaging shell through the left gold bonding pad and the right gold bonding pad, and front electrodes are bonded to the left gold conduction band 24 and the right gold conduction band 25 through gold wires and are respectively connected with the corresponding metal outer PINs of the packaging shell.
A specific embodiment of a beam splitter based on a high precision linear optocoupler of a variable ratio beam splitter, as shown in fig. 2, comprises a bracket 31, a left optical fiber 34 and a right optical fiber 35; the bracket 31 is a door-shaped structure with a hollow interior, and the left optical fiber 34 and the right optical fiber 35 are respectively arranged inside the bracket 31.
Optionally, the beam splitter 3 further includes a left support frame 32 and a right support frame 33; the left support frame 32 is fixed on the left side of the bracket 31, and the right support frame 33 is fixed on the right side of the bracket 31; as shown in fig. 4, the left support frame 32 and the right support frame 33 are respectively installed in the grooves formed at the upper sections of the tops of the third ceramic step 281 and the fourth ceramic step 291, and are fixed by welding. The left optical fiber light outlet 37 and the right optical fiber light outlet 38 are respectively positioned right above the photosensitive surfaces of the left PIN photoelectric detector chip 26 and the right PIN photoelectric detector chip 27.
As shown in fig. 3, two fiber channels are arranged inside the bracket 31 of the beam splitter 3, and a fiber entrance is arranged at the top of the bracket 31 and divided into a left fiber entrance 36 and a right fiber entrance 39; two fiber outlets, a left fiber light outlet 37 and a right fiber light outlet 38, are provided at the bottom of the bracket 31.
Preferably, the left optical fiber 34 and the right optical fiber 35 are the same, and both the left optical fiber 34 and the right optical fiber 35 are arranged in a zigzag shape of '12579'.
Preferably, the holder 31, the left holder 32, and the right holder 33 of the variable ratio beam splitter 3 are all metal frames, and the left optical fiber 34 and the right optical fiber 35 are all multimode optical fibers, and the diameter of the optical fibers is designed to be 100 μm in order to ensure the incident efficiency of the light source.
In the variable ratio beam splitter designed by the invention, an outer frame is of a metal structure, optical path transmission is carried out by adopting a multimode optical fiber with the inner diameter of 100 mu m, the optical fiber is fixed in the metal frame, when the variable ratio beam splitter is implemented specifically, a light emitting surface of a light source chip is positioned right above two inlets and completely covers the two light inlets, the inner diameters of the two optical fibers are equal, the equal-proportion light beams are ensured to be incident on a light surface of a detector through an optical fiber outlet, the equal-proportion light beams are converted into equal-proportion light currents through the detector, and the ratio of the two light currents is the transmission gain of a linear optocoupler; can effectively solve linear opto-coupler coupling technology problem through this variable ratio beam splitter, improve transmission precision and production efficiency, the transmission precision reduces to within 0.5%, in addition, through to the inside fiber diameter size adjustment of variable ratio beam splitter, can form the linear opto-coupler of different transmission gains, through inside fiber transmission, can effectively solve input current change, temperature variation to the influence of linear opto-coupler transmission precision.
A cover plate of high precision linear optical coupler based on variable ratio beam splitter, as shown in FIG. 5, the cover plate 4 comprises a fixing plate 41, a short gold conducting strip 42, a long gold conducting strip 43 and an LED light emitting diode chip 44; the short metal guide plate 42 is arranged at the lower part of the upper plane of the fixing plate 41; the long metal guide plate 43 is arranged on the upper part of the upper plane of the fixing plate 41; the LED chip 44 is disposed on the long gold conduction band 43, the back electrode of the chip is connected to the long gold conduction band 43, and the front electrode is connected to the short gold conduction band 42 through a gold wire.
As shown in fig. 6 to 7, one side of the cover plate 4 provided with the metal guide sheet is placed right above the photosensitive integration plate 2, and the short metal guide sheet 42 on the cover plate 4 is in contact conduction with the metal guide sheet on the first ceramic step 28 of the photosensitive integration plate 2, and the long metal guide sheet 43 on the cover plate is in contact conduction with the metal guide sheet on the second ceramic step 29 of the photosensitive integration plate; the light emitting positions of the LED chips 44 on the cover plate 4 are located right above the left and right optical fiber light inlets 33, 34.
Preferably, the LED chip 44 is a double-heterojunction LED with AlGaAs/GaAs/AlGaAs front-emitting, with GaAs as the active region and AlGaAs of different composition as the confinement layer; growing a distributed Bragg reflection layer on a substrate; the circular electrode structure is adopted to provide uniformly distributed current for the light source, simultaneously, the distribution range of the light source square is enlarged, and the light emitting surface of the light source is designed to be a circular structure with the diameter of 400 mu m. Adopting a double heterojunction light emitting diode with AlGaAs/GaAs/AlGaAs front light emitting, taking GaAs as an active region and taking AlGaAs with different components as a limiting layer; growing a distributed Bragg reflector DBR on a substrate; the circular electrode structure is adopted to provide uniformly distributed current for the light source, so that the precision and the nonlinearity of the linear optocoupler can be improved
Further, when the LED light source chip 44 is placed, the light emitting surface of the LED light source chip 44 is located right above the left optical fiber light inlet 33 and the right optical fiber light inlet 34, and the light emitting surface completely covers the left and right optical fiber light inlets.
In order to ensure the response consistency of the output photocurrent of the detector, the left PIN photoelectric detector chip and the right PIN photoelectric detector chip are taken from the same wafer, the photosensitive surface of the detector chip is designed to be a circular structure, the diameter of the photosensitive surface is larger than the diameters of the left optical fiber light outlet 37 and the right optical fiber light outlet 38, and the diameter of the photosensitive surface is designed to be 300 mu m.
As shown in fig. 8, the package housing 5 is a leadless surface mount type sealable ceramic metalized casing, and the metal outer pins on the casing are electrically connected with the LED light source chip 44 and the two photodetectors respectively through an inner metal pad and a metal conduction band.
The linear optocoupler structure comprises an AlGaAs LED, a PIN photoelectric detector and a variable ratio beam splitter, and is based on a ceramic inner cavity structure, and high-precision transmission gain of the linear optocoupler is realized through the three-dimensional correlation optical structure and optical fiber optical path transmission inside the variable ratio beam splitter, and meanwhile, the anti-electromagnetic interference capability and the high reliability of the device are improved.
In the description of the present invention, it is to be understood that the terms "top," "bottom," "end," "upper," "side," "inner," "front," "rear," "center," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of description and simplicity of description, but do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be constructed in a particular manner of operation, and are not to be construed as limiting the invention.
In the present invention, unless otherwise explicitly stated or limited, the terms "disposed," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A high precision linear optocoupler based on a variable ratio beam splitter, comprising: the device comprises a base (1), a photosensitive integration plate (2), a variable ratio beam splitter (3), a cover plate (4) and a packaging tube shell (5); the photosensitive integration plate (2) is arranged on the base (1); the variable ratio beam splitter (3) is arranged on the photosensitive integration plate (2), and the signal output end of the variable ratio beam splitter (3) corresponds to the input end of the variable ratio beam splitter (3); the cover plate (4) is arranged on the photosensitive integration plate (2), and the cover plate (4) is electrically conducted with the photosensitive integration plate (2); the packaging tube shell (5) is used for hermetically packaging the base (1), the photosensitive integration plate (2), the variable ratio beam splitter (3) and the cover plate (4); the beam splitter (3) comprises a bracket (31), a left optical fiber (34) and a right optical fiber (35); the bracket (31) is of a door-shaped structure, and the left optical fiber (34) and the right optical fiber (35) are respectively arranged inside the bracket (31); the diameter of the optical fiber in the bracket (31) can be adjusted, so that linear optical couplers with different transmission gains are formed.
2. A high precision linear optocoupler based on a variable ratio beam splitter according to claim 1, characterized in that the base (1) is a cuboid structure with a recess in the center for fixing the photo integrator plate (2) and the cover plate (4).
3. A high precision linear optocoupler based on a variable ratio beam splitter according to claim 1, characterized in that the photosensitive integration board (2) comprises: the photoelectric detector comprises a bottom plate (21), a left gold bonding pad (22), a right gold bonding pad (23), a left gold conduction band (24), a right gold conduction band (25), a left photoelectric detector chip (26), a right photoelectric detector chip (27), a first ceramic step (28) and a second ceramic step (29); the left gold bonding pad (22), the right gold bonding pad (23), the left gold conduction band (24), the right gold conduction band (25), the first ceramic step (28) and the second ceramic step (29) are arranged on the bottom plate (21), and metal layers are plated on the upper surfaces of the first ceramic step (28) and the second ceramic step (29); the left photoelectric detector chip (26) is arranged on the left gold bonding pad (22) and is conducted with the left gold conduction band (24) through a lead; the right photoelectric detector chip (27) is arranged on the right gold bonding pad (23) and is communicated with the right gold conduction band (25) through a wire; the left gold bonding pad (22), the right gold bonding pad (23), the left gold conduction band (24) and the right gold conduction band (25) are respectively connected with corresponding metal outer pins of the packaging shell.
4. A high accuracy linear light coupler based on variable ratio beam splitter according to claim 3, characterized in that the light sensitive integration plate (2) further comprises a third ceramic step (281) and a fourth ceramic step (291); the third ceramic step 281 is fixed to the side surface of the first ceramic step 28, and the fourth ceramic step 291 is fixed to the side surface of the second ceramic step 29.
5. A high precision linear optical coupler based on variable ratio beam splitter according to claim 4 characterized in that the upper surface of the third ceramic step 281 and the fourth ceramic step 291 are provided with fixing grooves, and the surface of the fixing grooves is plated with metal layer.
6. A high precision linear optocoupler based on a variable ratio beam splitter according to claim 1, characterized in that the beam splitter (3) further comprises a left support (32) and a right support (33); the left support frame (32) is fixed on the left side of the support (31), and the right support frame (33) is fixed on the right side of the support (31).
7. A high precision linear optocoupler based on a variable ratio beam splitter according to claim 1, characterized in that the cover plate (4) comprises: the LED light-emitting diode comprises a fixing plate (41), a short gold conduction band (42), a long gold conduction band (43) and an LED light-emitting diode chip (44); the short gold conduction band (42) and the long gold conduction band (43) are arranged on the fixing plate (41), and the short gold conduction band (42) and the long gold conduction band (43) are not conducted; the LED chip (44) is arranged on the long gold conduction band (43) and is connected with the short gold conduction band (42) through a lead.
8. A high accuracy linear optocoupler based on a variable ratio beam splitter according to claim 7, characterized in that the cover plate (4) is placed on the photo-sensitive integration plate (2) and the short gold strip (42) on the cover plate (4) is in contact with the metal layer on the first ceramic step (28), the long gold strip (43) on the cover plate (4) is in contact with the metal layer on the second ceramic step (29), and the LED light emitting diode chip (44) on the cover plate (4) corresponds to the fiber input port of the beam splitter (3).
9. A high precision linear optocoupler based on a variable ratio beam splitter according to claim 7, characterized in that the LED chip (44) is a double heterojunction light emitting diode with AlGaAs/GaAs/AlGaAs front side emission.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4859029A (en) * | 1986-07-03 | 1989-08-22 | Durell William E | Variable ratio beam splitter and beam launcher |
| CN209046614U (en) * | 2018-12-06 | 2019-06-28 | 陕西群力电工有限责任公司 | A kind of narrow lead spacing light MOS solid-state relay of 1.27mm |
| CN211828768U (en) * | 2020-08-11 | 2020-10-30 | 北京瑞普北光电子有限公司 | Double-channel low-voltage photoelectric coupler |
| CN112162352A (en) * | 2020-09-09 | 2021-01-01 | 山东建筑大学 | Continuously adjustable splitting ratio directional coupler based on space scale-time symmetry |
| CN112271163A (en) * | 2020-10-23 | 2021-01-26 | 中国电子科技集团公司第四十四研究所 | High-precision linear photoelectric coupler structure |
| CN112331644A (en) * | 2020-11-09 | 2021-02-05 | 中国电子科技集团公司第四十四研究所 | Anti-irradiation high-speed photoelectric coupler and manufacturing method thereof |
| CN112505847A (en) * | 2020-11-26 | 2021-03-16 | 华为技术有限公司 | Optical splitter with adjustable splitting ratio, optical fiber splitting box and optical distribution network |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3860782B2 (en) * | 2002-03-18 | 2006-12-20 | 松下電器産業株式会社 | Optical device |
| US6782167B2 (en) * | 2002-05-14 | 2004-08-24 | Health Research, Inc. | Light beam splitter |
| CN101216606B (en) * | 2008-01-07 | 2011-06-08 | 岑松原 | Splitting ratio adjustable white light beam splitter |
| US10557990B2 (en) * | 2017-11-27 | 2020-02-11 | Cisco Technology, Inc. | Dynamic photonic waveguide splitter/coupler |
-
2021
- 2021-10-08 CN CN202111170124.0A patent/CN113933945B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4859029A (en) * | 1986-07-03 | 1989-08-22 | Durell William E | Variable ratio beam splitter and beam launcher |
| CN209046614U (en) * | 2018-12-06 | 2019-06-28 | 陕西群力电工有限责任公司 | A kind of narrow lead spacing light MOS solid-state relay of 1.27mm |
| CN211828768U (en) * | 2020-08-11 | 2020-10-30 | 北京瑞普北光电子有限公司 | Double-channel low-voltage photoelectric coupler |
| CN112162352A (en) * | 2020-09-09 | 2021-01-01 | 山东建筑大学 | Continuously adjustable splitting ratio directional coupler based on space scale-time symmetry |
| CN112271163A (en) * | 2020-10-23 | 2021-01-26 | 中国电子科技集团公司第四十四研究所 | High-precision linear photoelectric coupler structure |
| CN112331644A (en) * | 2020-11-09 | 2021-02-05 | 中国电子科技集团公司第四十四研究所 | Anti-irradiation high-speed photoelectric coupler and manufacturing method thereof |
| CN112505847A (en) * | 2020-11-26 | 2021-03-16 | 华为技术有限公司 | Optical splitter with adjustable splitting ratio, optical fiber splitting box and optical distribution network |
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| CN113933945A (en) | 2022-01-14 |
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