CN113921435A - 一种芯片拾取中转台装置 - Google Patents

一种芯片拾取中转台装置 Download PDF

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CN113921435A
CN113921435A CN202111302311.XA CN202111302311A CN113921435A CN 113921435 A CN113921435 A CN 113921435A CN 202111302311 A CN202111302311 A CN 202111302311A CN 113921435 A CN113921435 A CN 113921435A
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刘维强
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Shenzhen Silicon Valley Semiconductor Equipment Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

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Abstract

本发明公开了一种芯片拾取中转台装置，设置于外界的芯片拾取摆臂与外界的固晶装置之间，其包括中转台、X轴调节机构、Y轴调节机构以及分别设置于中转台上方和下方的视觉检测机构，中转台设置有中转基座、对位承载台以及安装于对位承载台的吸盘组件，X轴调节机构用于弥补中转台与固晶装置在X轴向的位置偏差，Y轴调节机构用于弥补中转台与固晶装置在Y轴向的位置偏差。这样的结构在芯片拾取摆臂与固晶装置的摆臂存在位置偏差时，能够通过中转台弥补芯片的位置偏差，通过位于吸盘组件上方的视觉检测机构实时检测芯片的位置和角度，通过位于吸盘组件下方的视觉检测机构对芯片的外观以及芯片角度进行实时检测，提高产品良率。

Description

一种芯片拾取中转台装置
技术领域
本发明涉及半导体封装工艺技术领域，尤其是涉及一种芯片拾取中转台装置。
背景技术
现有的半导体固晶设备通常是通过摆臂拾取芯片将芯片封装在直线运动式的固晶装置中，这样的结构设计对摆臂以及直线驱动源的控制精度要求，导致成本上升，难以满足日益增长的生产需求，因此有必要予以改进。
发明内容
针对现有技术存在的不足，本发明的目的是提供一种芯片拾取中转台装置，能够通过中转台弥补芯片的位置偏差，并且通过位于吸盘组件上方的视觉检测机构实时检测芯片的位置和角度，对弥补后的精度进一步地进行确认，保证芯片固晶封装的准确性，通过位于吸盘组件下方的视觉检测机构对芯片的外观进行实时检测，提高产品良率。
为了实现上述目的，本发明所采用的技术方案是：一种芯片拾取中转台装置，设置于外界的芯片拾取摆臂与外界的固晶装置之间，其包括中转台、X轴调节机构、Y轴调节机构以及分别设置于中转台上方和/或下方的视觉检测机构，中转台设置有中转基座、安装于中转基座的对位承载台以及安装于对位承载台的吸盘组件，吸盘组件用于吸附由芯片拾取摆臂所拾取的芯片，X轴调节机构用于弥补中转台与固晶装置在X轴向的位置偏差，Y轴调节机构用于弥补中转台与固晶装置在Y轴向的位置偏差。
进一步的技术方案中，所述X轴调节机构设置有X轴基座和X轴驱动源，Y轴调节机构设置有Y轴基座以及Y轴驱动源，Y轴基座的左右两侧分别设置Y轴滑轨，X轴基座的上下两侧分别设置有X轴滑轨，所述中转基座的左右两侧分别设置有Y轴滑块，Y轴基座的上下两侧分别设置有Z轴滑块，所述中转台经由Y轴滑块滑动安装于Y轴滑轨，所述Y轴基座滑动安装于X轴滑轨。
进一步的技术方案中，所述Y轴基座设置有Y轴到位开关，所述中转基座安装有与Y轴到位开关触发配合的Y轴触发弹片。
进一步的技术方案中，所述X轴基座设置有X轴到位开关，所述Y轴基座安装有与X轴到位开关触发配合的X轴触发弹片。
进一步的技术方案中，所述Y轴基座的中部安装有Y轴导向座，Y轴导向座的中部掏空成型有Y轴导槽，所述中转基座安装有一滑动设置在Y轴导槽内的Y轴滑板，Y轴滑板的左右两侧分别延伸至两个Y轴滑块处。
进一步的技术方案中，所述对位承载台对应吸盘组件的位置处设置有压力传感器。
采用上述结构后，本发明和现有技术相比所具有的优点是：
/1、这样的结构在芯片拾取摆臂与固晶装置的摆臂存在位置偏差时，能够通过中转台弥补芯片的位置偏差，并且通过位于吸盘组件上方的视觉检测机构实时检测芯片的位置和角度，对弥补后的精度进一步地进行确认，保证芯片固晶封装的准确性，通过位于吸盘组件下方的视觉检测机构对芯片的外观进行实时检测，提高产品良率。
2、对位承载台对应吸盘组件的位置处设置有压力传感器，通过承载台上的压力传感器实时或定时校正、监测外界摆臂吸头或外界固晶吸头的力。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明的结构示意图；
图2是中转台以及Y轴调节机构的结构示意图。
具体实施方式
以下仅为本发明的较佳实施例，并不因此而限定本发明的保护范围。
如图1至2所示，本发明提供的一种芯片拾取中转台装置，设置于外界的芯片拾取摆臂与外界的固晶装置之间，其包括中转台、X轴调节机构2、Y轴调节机构3以及分别设置于中转台上方和/或下方的视觉检测机构，中转台设置有中转基座10、安装于中转基座10的对位承载台11以及安装于对位承载台11的吸盘组件12，吸盘组件12用于吸附由芯片拾取摆臂所拾取的芯片，X轴调节机构2用于弥补中转台与固晶装置在X轴向的位置偏差，Y轴调节机构3用于弥补中转台与固晶装置在Y轴向的位置偏差。这样的结构在芯片拾取摆臂与固晶装置的摆臂存在位置偏差时，能够通过中转台弥补芯片的位置偏差，并且通过位于吸盘组件12上方的视觉检测机构实时检测芯片的位置和角度，对弥补后的精度进一步地进行确认，保证芯片固晶封装的准确性，通过位于吸盘组件12下方的视觉检测机构对芯片的外观进行实时检测，提高产品良率。
具体地，所述X轴调节机构2设置有X轴基座20和X轴驱动源，Y轴调节机构3设置有Y轴基座30以及Y轴驱动源，Y轴基座30的左右两侧分别设置Y轴滑轨，X轴基座20的上下两侧分别设置有X轴滑轨，所述中转基座10的左右两侧分别设置有Y轴滑块，Y轴基座30的上下两侧分别设置有Z轴滑块，所述中转台经由Y轴滑块滑动安装于Y轴滑轨，所述Y轴基座30滑动安装于X轴滑轨。
具体地，所述Y轴基座30设置有Y轴到位开关31，所述中转基座10安装有与Y轴到位开关31触发配合的Y轴触发弹片，所述X轴基座20设置有X轴到位开关，所述Y轴基座30安装有与X轴到位开关触发配合的X轴触发弹片。这样的结构设计使得设备整体的精密度更加，位置弥补更加精准。
具体地，所述Y轴基座30的中部安装有Y轴导向座32，Y轴导向座32的中部掏空成型有Y轴导槽，所述中转基座10安装有一滑动设置在Y轴导槽内的Y轴滑板33，Y轴滑板33的左右两侧分别延伸至两个Y轴滑块处。通过设置Y轴导向座32和Y轴滑板33，以确保中转台移动过程更加平稳。
具体地，所述对位承载台11对应吸盘组件12的位置处设置有压力传感器13，通过承载台1111上的压力传感器13实时或定时校正、监测外界摆臂吸头或外界固晶吸头的力。
以上内容仅为本发明的较佳实施例，对于本领域的普通技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，本说明书内容不应理解为对本发明的限制。

Claims (6)

1.一种芯片拾取中转台装置，设置于外界的芯片拾取摆臂与外界的固晶装置之间，其特征在于：包括中转台、X轴调节机构(2)、Y轴调节机构(3)以及分别设置于中转台上方和/或下方的视觉检测机构，中转台设置有中转基座(10)、安装于中转基座(10)的对位承载台(11)以及安装于对位承载台(11)的吸盘组件(12)，吸盘组件(12)用于吸附由芯片拾取摆臂所拾取的芯片，X轴调节机构(2)用于弥补中转台与固晶装置在X轴向的位置偏差，Y轴调节机构(3)用于弥补中转台与固晶装置在Y轴向的位置偏差。
2.根据权利要求1所述的一种芯片拾取中转台装置，其特征在于：所述X轴调节机构(2)设置有X轴基座(20)和X轴驱动源，Y轴调节机构(3)设置有Y轴基座(30)以及Y轴驱动源，Y轴基座(30)的左右两侧分别设置Y轴滑轨，X轴基座(20)的上下两侧分别设置有X轴滑轨，所述中转基座(10)的左右两侧分别设置有Y轴滑块，Y轴基座(30)的上下两侧分别设置有Z轴滑块，所述中转台经由Y轴滑块滑动安装于Y轴滑轨，所述Y轴基座(30)滑动安装于X轴滑轨。
3.根据权利要求2所述的一种芯片拾取中转台装置，其特征在于：所述Y轴基座(30)设置有Y轴到位开关(31)，所述中转基座(10)安装有与Y轴到位开关(31)触发配合的Y轴触发弹片。
4.根据权利要求2所述的一种芯片拾取中转台装置，其特征在于：所述X轴基座(20)设置有X轴到位开关，所述Y轴基座(30)安装有与X轴到位开关触发配合的X轴触发弹片。
5.根据权利要求2所述的一种芯片拾取中转台装置，其特征在于：所述Y轴基座(30)的中部安装有Y轴导向座(32)，Y轴导向座(32)的中部掏空成型有Y轴导槽，所述中转基座(10)安装有一滑动设置在Y轴导槽内的Y轴滑板(33)，Y轴滑板(33)的左右两侧分别延伸至两个Y轴滑块处。
6.根据权利要求1所述的一种芯片拾取中转台装置，其特征在于：所述对位承载台(11)对应吸盘组件(12)的位置处设置有压力传感器(13)。
CN202111302311.XA 2021-11-04 2021-11-04 一种芯片拾取中转台装置 Pending CN113921435A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116417392A (zh) * 2023-06-12 2023-07-11 上海新创达半导体设备技术有限公司 一种用于晶圆料盒搬运的中转设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116417392A (zh) * 2023-06-12 2023-07-11 上海新创达半导体设备技术有限公司 一种用于晶圆料盒搬运的中转设备
CN116417392B (zh) * 2023-06-12 2023-08-04 上海新创达半导体设备技术有限公司 一种用于晶圆料盒搬运的中转设备

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