CN113900324B - DMD assembly structure, assembly method and projection optical machine - Google Patents

DMD assembly structure, assembly method and projection optical machine Download PDF

Info

Publication number
CN113900324B
CN113900324B CN202111158993.1A CN202111158993A CN113900324B CN 113900324 B CN113900324 B CN 113900324B CN 202111158993 A CN202111158993 A CN 202111158993A CN 113900324 B CN113900324 B CN 113900324B
Authority
CN
China
Prior art keywords
circuit board
flexible circuit
dmd
shell
adapter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111158993.1A
Other languages
Chinese (zh)
Other versions
CN113900324A (en
Inventor
庞凤颖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Optical Technology Co Ltd
Original Assignee
Goertek Optical Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Optical Technology Co Ltd filed Critical Goertek Optical Technology Co Ltd
Priority to CN202111158993.1A priority Critical patent/CN113900324B/en
Publication of CN113900324A publication Critical patent/CN113900324A/en
Application granted granted Critical
Publication of CN113900324B publication Critical patent/CN113900324B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
    • G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a DMD assembly structure, an assembly method and a projector, wherein the DMD assembly structure comprises a shell, and a DMD chip, a adapter seat, a flexible circuit board and a heat dissipation piece which are sequentially arranged; the DMD chip is mounted on the shell, a boss is arranged on one side of the adapter seat, which faces the flexible circuit board, a positioning hole, a first mounting hole and a second mounting hole are respectively arranged on the flexible circuit board, and the boss penetrates through the positioning hole to be connected with the shell; the DMD device comprises a DMD chip, a flexible circuit board, a heat dissipation piece, a step screw and a step screw, wherein the DMD chip is arranged on the flexible circuit board, the step screw is connected with the shell through a first mounting hole from one side of the flexible circuit board, which is away from the DMD chip, and the step screw is connected with the shell through the heat dissipation piece and a second mounting hole from one side of the heat dissipation piece, which is away from the flexible circuit board. The DMD component structure has the advantages of reducing the number of threaded parts, improving the assembly efficiency and the assembly yield, and reserving more space for wiring of the flexible circuit board.

Description

DMD assembly structure, assembly method and projection optical machine
Technical Field
The present invention relates to the field of projection optical machines, and in particular, to a DMD assembly structure, an assembly method, and a projection optical machine.
Background
In the prior art, the DMD component structure comprises a shell, a heat radiating piece, a flexible circuit board, an adapter seat and a DMD chip, and the installation and the fixation of the components are mainly realized by screw thread pieces. Along with the development of technology, miniaturization of a projection optical machine is a mainstream development trend, and the mechanism assembled and connected with the flexible circuit board through the adapter has higher requirements on the number of fixing holes of the flexible circuit board. In the prior art, 6 screws are needed for assembling the DMD to achieve the fixing effect, so that the assembling efficiency is difficult to improve, the assembling yield of products is reduced due to the excessive number of the screws, and the layout wiring space of the flexible circuit board is influenced.
In view of the foregoing, it is desirable to provide a novel DMD assembly structure, an assembling method and a projection light machine, which at least improve the above-mentioned technical problems.
Disclosure of Invention
The invention mainly aims to provide a DMD component structure, an assembly method and a projection optical machine, and aims to solve the technical problems of low assembly efficiency and low assembly yield caused by excessive screw quantity in the DMD component structure in the prior art.
To achieve the above object, according to one aspect of the present invention, there is provided a DMD assembly structure comprising:
the DMD module comprises a shell, a DMD chip, an adapter, a flexible circuit board and a heat dissipation piece, wherein the DMD chip, the adapter, the flexible circuit board and the heat dissipation piece are sequentially arranged;
the DMD chip is mounted on the shell, a boss is arranged on one side, facing the flexible circuit board, of the adapter seat, a positioning hole, a first mounting hole and a second mounting hole are respectively formed in the flexible circuit board, and the boss penetrates through the positioning hole to be connected with the shell;
the DMD device further comprises a pre-locking threaded piece and a step threaded piece, wherein the pre-locking threaded piece penetrates through the first mounting hole from one side, deviating from the DMD chip, of the flexible circuit board to be connected with the shell, and the step threaded piece penetrates through the heat radiating piece and the second mounting hole from one side, deviating from the flexible circuit board, of the heat radiating piece to be connected with the shell in sequence.
Optionally, the number of the boss and the number of the positioning holes are two, and the two bosses are respectively arranged at the opposite angles of the adapter seat.
Optionally, a thread is formed on an outer edge of one end of the boss away from the adapter, a threaded hole matched with the thread is formed on a position of the shell corresponding to the boss, and the boss is connected with the threaded hole.
Optionally, the number of the step screw members and the number of the pre-locking screw members are two, the two pre-locking screw members are respectively arranged at one diagonal position of the flexible circuit board, and the two step screw members are respectively arranged at the other diagonal position of the flexible circuit board.
Optionally, the number of the first mounting holes and the number of the second mounting holes are two, and the first centers of the connecting lines of the two first mounting holes and the second centers of the connecting lines of the two second mounting holes are overlapped with the geometric center of the DMD chip.
Optionally, the DMD assembly structure further includes an elastic member, the heat dissipation member is formed with an accommodating groove, the elastic member is at least partially disposed in the accommodating groove, and the step screw member sequentially passes through the elastic member, the heat dissipation member and the second mounting hole to be connected with the housing.
Optionally, the DMD assembly structure further includes a thermal pad mounted to a side of the DMD chip facing the flexible circuit board; the heat dissipation piece comprises a substrate and a heat transfer end arranged on the substrate, the heat transfer end is positioned on one side of the substrate, which is close to the flexible circuit board, and the heat transfer end sequentially penetrates through the flexible circuit board and the switching seat to be connected with the heat conduction rubber pad.
According to another aspect of the present invention, the present invention further provides an assembling method of a DMD assembly structure, for assembling the DMD assembly structure, the assembling method of the DMD assembly structure includes the following steps:
mounting the DMD chip on the shell;
installing a flexible circuit board and an adapter; the boss of the adapter penetrates through the positioning hole of the flexible circuit board to be connected with the shell;
connecting a pre-locking screw piece with the shell through a first mounting hole from one side of the flexible circuit board, which is away from the DMD chip;
mounting a heat dissipation element on a flexible circuit board;
and sequentially penetrating the step threaded piece from one side of the heat dissipation piece, which is away from the flexible circuit board, through the heat dissipation piece and the second mounting hole to be connected with the shell.
Optionally, the DMD assembly structure further includes a thermal conductive rubber pad and an elastic member, and after the step of mounting the DMD chip on the housing, the flexible circuit board and the adapter are sequentially mounted; before the step of connecting the boss of the adapter with the housing through the positioning hole of the flexible circuit board, the method further comprises the steps of:
the heat-conducting rubber pad is arranged on one side of the DMD chip facing the flexible circuit board;
after the step of installing the heat dissipation part on the flexible circuit board, before the step of sequentially penetrating the step screw part from one side of the heat dissipation part away from the flexible circuit board through the heat dissipation part and the second installation hole to be connected with the shell, the method further comprises the steps of:
the step screw is passed through the elastic member.
According to still another aspect of the present invention, a projection optical engine is provided, and the projector includes the DMD assembly structure described above.
In the technical scheme of the invention, the DMD component structure comprises a shell, and a DMD chip, an adapter, a flexible circuit board and a heat dissipation piece which are sequentially arranged; the DMD chip is mounted on the shell, a boss is arranged on one side of the adapter seat, which faces the flexible circuit board, a positioning hole, a first mounting hole and a second mounting hole are respectively arranged on the flexible circuit board, and the boss penetrates through the positioning hole to be connected with the shell; the DMD device comprises a DMD chip, a flexible circuit board, a heat dissipation piece, a step screw and a step screw, wherein the DMD chip is arranged on the flexible circuit board, the step screw is connected with the shell through a first mounting hole from one side of the flexible circuit board, which is away from the DMD chip, and the step screw is connected with the shell through the heat dissipation piece and a second mounting hole from one side of the heat dissipation piece, which is away from the flexible circuit board. In the scheme, the DMD chip is arranged on the shell, the boss is arranged on the adapter seat, the positioning hole is arranged on the flexible circuit board, and the boss penetrates through the positioning hole to be connected with the shell and is used for fixing the adapter seat on the shell; the pre-locking screw piece is used for locking the flexible circuit board, so that the signal connection between the flexible circuit board and the adapter and the signal connection between the adapter and the DMD chip are realized, and poor assembly contact of the adapter can be effectively improved; the step screw member is used for fixedly connecting the radiator to the flexible circuit board and the shell. Through setting up the connection of boss and locating hole, can reduce the quantity of screw, both can improve packaging efficiency like this, also can reduce the equipment that causes in-process of installing screw poor. The invention has the advantages of reducing the number of screw parts, improving the assembly efficiency and the assembly yield and reserving more space for wiring of the flexible circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an exploded view of a DMD assembly according to an embodiment of the present invention;
FIG. 2 is an exploded view of another view of the DMD assembly structure according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of the DMD assembly of the present invention;
FIG. 4 is a schematic view of a portion of a DMD assembly according to the present invention;
FIG. 5 is a schematic perspective view of a stepped screw according to an embodiment of the present invention;
fig. 6 is a flowchart illustrating an assembly method of a DMD assembly structure according to another embodiment of the present invention.
Description of the embodiments reference numerals:
1. a housing; 2. a DMD chip; 3. an adapter; 31. a second through hole site; 4. a flexible circuit board; 41. positioning holes; 42. a first mounting hole; 43. a second mounting hole; 44. a first through hole site; 5. a heat sink; 51. a substrate; 52. a through hole; 53. a heat transfer end; 6. pre-locking the screw; 7. a step screw; 71. a head; 72. a step portion; 73. a threaded section; 8. an elastic member; 9. a boss.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1-5, according to one aspect of the present invention, the present invention provides a DMD assembly structure comprising:
the DMD chip comprises a shell 1, a DMD chip 2, an adapter 3, a flexible circuit board 4 and a heat dissipation piece 5 which are sequentially arranged;
the DMD chip 2 is mounted on the shell 1, a boss 9 is arranged on one side of the adapter 3 facing the flexible circuit board 4, a positioning hole 41, a first mounting hole 42 and a second mounting hole 43 are respectively arranged on the flexible circuit board 4, and the boss 9 passes through the positioning hole 41 to be connected with the shell 1;
the DMD device further comprises a pre-locking screw 6 and a step screw 7, wherein the pre-locking screw 6 penetrates through the first mounting hole 42 from one side of the flexible circuit board 4, which is away from the DMD chip 2, to be connected with the shell 1, and the step screw 7 penetrates through the heat dissipation piece 5 and the second mounting hole 43 from one side of the heat dissipation piece 5, which is away from the flexible circuit board 4, to be connected with the shell 1.
In the above embodiment, the DMD chip 2 is mounted on the housing 1, and the boss 9 is disposed on the adapter 3, and the positioning hole 41 is disposed on the flexible circuit board 4, where the boss 9 passes through the positioning hole 41 and is connected with the housing 1, so as to fix the adapter 3 on the housing 1; the pre-locking screw 6 is used for locking the flexible circuit board 4 to the shell 1, because the adapter 3 and the DMD chip 2 are precisely positioned through the shell 1 and are mounted on the shell 1, the adapter 3 is tightly contacted with the DMD chip 2 by locking the flexible circuit board 4 to the shell 1, so that signal connection between the flexible circuit board 4 and the adapter 3 and signal connection between the adapter 3 and the DMD chip 2 are realized, and poor assembly contact of the adapter 3 can be effectively improved; the stepped screw 7 is used to fixedly connect the heat sink 5 to the flexible circuit board 4 and the housing 1. Through setting up the connection of boss 9 and locating hole 41, can reduce the quantity of screw, both can improve packaging efficiency like this, also can reduce the equipment that causes in the installation screw process and poorly to more space has been reserved for flexible circuit board 4 wiring. This embodiment has the advantage that the number of screw members can be reduced, the assembly efficiency and the assembly yield are improved, and more space is reserved for wiring the flexible circuit board 4. Of course, the flexible circuit board 4 may be replaced by a conventional printed circuit board, and the pre-locking screw 6 and the step screw 7 may be screws.
Further, the boss 9 is formed with a thread at an outer edge of one end far away from the adapter 3, a threaded hole matched with the thread is formed at a position of the casing 1 corresponding to the boss 9, and the boss 9 is connected to the threaded hole. Specifically, the length of the boss 9 is greater than the thickness of the flexible circuit board 4, and the threaded end of the boss 9 passes through the flexible circuit board 4 to be in threaded engagement with the threaded hole on the housing 1, so as to fix the adapter 3 and the flexible circuit board 4 to the housing 1. This embodiment can realize the firm connection of boss 9 and casing 1, and then install adapter 3 on casing 1 to the equipment is convenient.
Further, the number of the bosses 9 and the positioning holes 41 is two, and the two bosses 9 are respectively arranged at the opposite corners of the adapter seat 3. The connection of the adapter 3 to the housing 1 can be achieved more stably by arranging the two bosses 9 on the diagonal. Of course, this embodiment does not limit the number of bosses 9, and those skilled in the art will understand that any number of bosses 9 that can achieve the effects of the present invention is within the scope of the present invention. Of course, in order to prevent a positional installation error, the two bosses 9 may be provided at different heights.
As a specific embodiment of the present invention, the number of the step screw members 7 and the pre-lock screw members 6 is two, the two pre-lock screw members 6 are respectively disposed at one diagonal of the flexible circuit board 4, and the two step screw members 7 are respectively disposed at the other diagonal of the flexible circuit board 4, however, as described above, the number of the bosses 9 may be two. In this embodiment, through setting up the cooperation of two boss 9 and locating hole 41, only need four screw thread spare can realize the fixed of DMD subassembly, compares in prior art and adopts six screw thread spare, has reduced the quantity of two screw thread spare, has improved packaging efficiency and equipment yield. The number of the first mounting holes 42 and the number of the second mounting holes 43 may be two, and the first centers of the wires of the two first mounting holes 42 and the second centers of the wires of the two second mounting holes 43 are overlapped with the geometric center of the DMD chip 2. I.e. the first center, the second center and the geometric center are combined into a whole. The centers of the step screw 7 and the locking screw are overlapped and overlapped with the center of the DMD chip 2, so that the DMD chip 2 is stressed uniformly, and damage to the DMD chip 2 is avoided. Specifically, the connection lines of the four mounting holes (the two first mounting holes 42 and the two second mounting holes 43) may constitute a rectangle or square, so that the balance of the forces can be ensured.
Further, the DMD assembly structure further includes an elastic member 8, the heat sink member 5 is formed with a receiving groove, the elastic member 8 is at least partially disposed in the receiving groove, and the step screw member 7 is connected to the housing 1 through the elastic member 8, the heat sink member 5 and the second mounting hole 43 in sequence. Specifically, the heat sink 5 has a through hole 52 formed at the position of the receiving groove, and the step screw 7 is connected to the flexible circuit board 4 through the through hole 52. The elastic piece 8 can be a spring or rubber, and when the spring is adopted, the spring can be sleeved on the threaded piece, firstly, the compression effect on the radiating fins is realized through the spring, and secondly, the damage to the DMD chip 2 caused by overlarge acting force of the step threaded piece 7 can be reduced through the buffer effect of the spring.
Further, the DMD assembly structure further comprises a thermal conductive rubber pad, which is mounted on one side of the DMD chip 2 facing the flexible circuit board 4; the heat dissipation element 5 comprises a base plate 51 and a heat transfer end 53 arranged on the base plate 51, the heat transfer end 53 is positioned on one side of the base plate 51 close to the flexible circuit board 4, and the heat transfer end 53 sequentially penetrates through the flexible circuit board 4 and the adapter 3 to be connected with the heat conduction rubber pad. Specifically, the center positions of the flexible circuit board 4 and the adapter 3 are respectively provided with a first through hole site 44 and a second through hole site 31, the heat transfer end 53 of the heat dissipation part 5 passes through the first through hole site 44 and the second through hole site 31 to be connected with a heat conduction rubber pad, the heat transfer end 53 can be made of metal, the heat dissipation part 5 is connected with the DMD chip 2 through the heat conduction rubber pad, and the heat dissipation effect of the heat dissipation part 5 on the DMD chip 2 is achieved. In addition, referring to fig. 5, the step screw 7 may include a head 71, a step 72 and a thread section 73 connected in sequence, the diameter of the step 72 is larger than that of the thread section 73, the step 72 passes through the spring and the heat sink 5, the thread section 73 passes through the second mounting hole 43 of the flexible circuit board 4, the diameter of the step 72 is set larger, the sleeving of the spring can be effectively realized, the diameter of the thread section 73 is set smaller, the aperture of the second mounting hole of the flexible circuit board 4 can be reduced, the punching area on the flexible circuit board 4 is reduced, and the signal trace on the flexible circuit board 4 is facilitated.
According to another aspect of the present invention, referring to fig. 6, the present invention further provides an assembling method of a DMD assembly structure, for assembling the DMD assembly structure, the assembling method of the DMD assembly structure includes the following steps:
s100, mounting the DMD chip 2 on the shell 1;
specifically, a mounting groove may be provided on the housing 1, and the DMD chip 2 may be provided in the mounting groove, thereby achieving preliminary mounting and fixing of the DMD chip 2.
S200, installing the flexible circuit board 4 and the adapter 3; wherein, the boss 9 of the adapter 3 passes through the positioning hole 41 of the flexible circuit board 4 to be connected with the shell 1;
the positioning hole 41 of the flexible circuit board 4 can be aligned with the threaded hole of the shell 1, and then the boss 9 of the adapter 3 passes through the positioning hole 41 to be connected with the threaded hole; the boss 9 may be mounted in alignment with the screw hole of the housing 1 after the pre-mounting of the adapter 3 and the flexible circuit board 4 is completed.
S300, connecting the pre-locking screw 6 with the shell 1 from one side of the flexible circuit board 4, which is away from the DMD chip 2, through the first mounting hole 42;
the screw connection is achieved by screwing a common tool, and the pre-locking screw 6 is used for locking the flexible circuit board 4, so that the signal connection between the flexible circuit board 4 and the adapter 3 and the signal connection between the adapter 3 and the DMD chip 2 are achieved.
S400, mounting the heat dissipation element 5 on the flexible circuit board;
the heat sink 5 includes a substrate 51 and a heat transfer end 53, the heat transfer end 53 extending toward the DMD chip 2 through the flexible circuit board 4 and the adaptor 3 in order.
S500, the step screw 7 penetrates through the heat dissipation piece 5 and the second mounting hole 43 in sequence from one side of the heat dissipation piece 5 away from the flexible circuit board 4 to be connected with the shell 1.
The stepped screw 7 is used to fixedly connect the radiator to the flexible circuit board 4 and the housing 1.
In the above embodiment, the number of screw members can be reduced by the connection of the boss 9 and the positioning hole 41, so that the assembly efficiency can be improved, and the assembly defect caused in the process of installing the screw members can be reduced. This embodiment has the advantage that the number of screws can be reduced, and the assembly efficiency and the assembly yield can be improved. The pre-lock screw 6 and the step screw 7 may be screws.
Further, the DMD assembly structure further comprises a heat conductive rubber pad and an elastic member 8, after the step of mounting the DMD chip 2 on the housing 1, the flexible circuit board 4 and the adaptor 3 are sequentially mounted; before the step of connecting the boss 9 of the adapter 3 with the housing 1 through the positioning hole 41 of the flexible circuit board 4, the method further includes the steps of:
the heat conducting rubber pad is arranged on one side of the DMD chip 2 facing the flexible circuit board 4;
the heat conducting rubber pad can be connected with the position of the DMD chip 2 needing heat dissipation, the middle positions of the flexible circuit board 4 and the adapter seat 3 are provided with the first through hole position 44 and the second through hole position 31, the heat transfer end 53 of the heat dissipation piece 5 penetrates through the first through hole position 44 and the second through hole position 31 to be connected with the heat conducting rubber pad, the heat dissipation piece 5 is connected with the DMD chip 2 through the heat conducting rubber pad, the heat dissipation effect is improved, and the heat dissipation of the DMD chip 2 is realized. The installation is simple and convenient, and the installation space can be saved by arranging the first through hole position 44 and the second through hole position 31.
After the step of mounting the heat sink 5 on the flexible circuit board, before the step of sequentially passing the step screw 7 from the side of the heat sink 5 facing away from the flexible circuit board 4 through the heat sink 5 and the second mounting hole 43 to be connected with the housing 1, the method further comprises the steps of:
the step screw 7 is passed through the elastic member 8.
The elastic piece 8 can be a spring, and when the spring is installed, the spring can be sleeved on the step screw piece 7, and then the step screw piece 7 passes through the heat dissipation piece 5; the step screw member 7 may be inserted into the receiving groove of the heat sink 5 directly through the spring member and the heat sink 5 in this order. This way is easy to install and does not require additional equipment assistance.
According to still another aspect of the present invention, a projection light engine is provided, and the projection light engine includes the DMD assembly structure described above. Because the projection optical machine adopts all the technical schemes of all the embodiments of the DMD component structure, the projection optical machine at least has all the beneficial effects brought by the technical schemes of all the embodiments, and the description is omitted.
The foregoing description of the preferred embodiments of the present invention should not be construed as limiting the scope of the invention, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).

Claims (10)

1. A DMD assembly structure, comprising:
the DMD module comprises a shell, a DMD chip, an adapter, a flexible circuit board and a heat dissipation piece, wherein the DMD chip, the adapter, the flexible circuit board and the heat dissipation piece are sequentially arranged;
the DMD chip is mounted on the shell, a boss is arranged on one side, facing the flexible circuit board, of the adapter seat, a positioning hole, a first mounting hole and a second mounting hole are respectively formed in the flexible circuit board, and the boss penetrates through the positioning hole to be connected with the shell so as to fix the adapter seat to the shell;
the DMD device further comprises a pre-locking threaded piece and a step threaded piece, wherein the pre-locking threaded piece penetrates through the first mounting hole from one side, deviating from the DMD chip, of the flexible circuit board to be connected with the shell, and the step threaded piece penetrates through the heat radiating piece and the second mounting hole from one side, deviating from the flexible circuit board, of the heat radiating piece to be connected with the shell in sequence.
2. The DMD assembly structure as in claim 1 wherein the number of bosses and locating holes is two, the two bosses being disposed at opposite corners of the adaptor.
3. The DMD assembly structure as in claim 1, wherein the boss is formed with a thread at an outer edge of an end thereof remote from the adapter, a threaded hole is formed at a position of the housing corresponding to the boss, and the boss is connected to the threaded hole.
4. The DMD assembly structure as in claim 1 wherein the number of step screws and pre-lock screws is two, two of the pre-lock screws are disposed at one pair of corners of the flexible circuit board, and two of the step screws are disposed at the other pair of corners of the flexible circuit board.
5. The DMD assembly structure of claim 4 wherein the number of first mounting holes and the number of second mounting holes are two, and the first centers of the connecting lines of the two first mounting holes and the second centers of the connecting lines of the two second mounting holes are coincident with the geometric centers of the DMD chip.
6. The DMD assembly structure as in any one of claims 1-5 further comprising an elastic member, wherein the heat sink member is formed with a receiving groove, wherein the elastic member is at least partially disposed in the receiving groove, and wherein the stepped screw member is connected to the housing through the elastic member, the heat sink member, and the second mounting hole in sequence.
7. The DMD assembly structure as in any one of claims 1-5 further comprising a thermal pad mounted to a side of the DMD chip facing the flexible circuit board; the heat dissipation piece comprises a substrate and a heat transfer end arranged on the substrate, the heat transfer end is positioned on one side of the substrate, which is close to the flexible circuit board, and the heat transfer end sequentially penetrates through the flexible circuit board and the switching seat to be connected with the heat conduction rubber pad.
8. A method of assembling a DMD assembly structure as claimed in any one of claims 1-7, characterized in that the method of assembling a DMD assembly structure comprises the steps of:
mounting the DMD chip on the shell;
installing a flexible circuit board and an adapter; the boss of the adapter penetrates through the positioning hole of the flexible circuit board to be connected with the shell;
connecting a pre-locking screw piece with the shell through a first mounting hole from one side of the flexible circuit board, which is away from the DMD chip;
mounting a heat dissipation element on a flexible circuit board;
and sequentially penetrating the step threaded piece from one side of the heat dissipation piece, which is away from the flexible circuit board, through the heat dissipation piece and the second mounting hole to be connected with the shell.
9. The method of assembling a DMD assembly structure as in claim 8, further comprising a thermally conductive pad and an elastic member, wherein after the step of mounting the DMD chip to the housing, the mounting flexible circuit board and the adapter; before the step of connecting the boss of the adapter with the housing through the positioning hole of the flexible circuit board, the method further comprises the steps of:
the heat-conducting rubber pad is arranged on one side of the DMD chip facing the flexible circuit board;
after the step of installing the heat dissipation part on the flexible circuit board, before the step of sequentially penetrating the step screw part from one side of the heat dissipation part away from the flexible circuit board through the heat dissipation part and the second installation hole to be connected with the shell, the method further comprises the steps of:
the step screw is passed through the elastic member.
10. A projection light engine, characterized in that the projector comprises a DMD assembly structure as claimed in any one of claims 1-7.
CN202111158993.1A 2021-09-30 2021-09-30 DMD assembly structure, assembly method and projection optical machine Active CN113900324B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111158993.1A CN113900324B (en) 2021-09-30 2021-09-30 DMD assembly structure, assembly method and projection optical machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111158993.1A CN113900324B (en) 2021-09-30 2021-09-30 DMD assembly structure, assembly method and projection optical machine

Publications (2)

Publication Number Publication Date
CN113900324A CN113900324A (en) 2022-01-07
CN113900324B true CN113900324B (en) 2023-07-14

Family

ID=79189629

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111158993.1A Active CN113900324B (en) 2021-09-30 2021-09-30 DMD assembly structure, assembly method and projection optical machine

Country Status (1)

Country Link
CN (1) CN113900324B (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100766075B1 (en) * 2005-12-05 2007-10-11 삼성전자주식회사 Digital micro-mirror device assembly and optical projection system using the same
CN101621908A (en) * 2008-07-04 2010-01-06 富准精密工业(深圳)有限公司 Heat sink and method for mounting heat sink
DE102014218480A1 (en) * 2014-09-15 2016-03-17 Continental Automotive Gmbh Spatial light modulator
US10082665B2 (en) * 2016-10-31 2018-09-25 Hisense Co., Ltd. DMD assembly, DLP optical engine and DLP projection device
CN112839424A (en) * 2019-11-22 2021-05-25 深圳市安华光电技术有限公司 DMD packaging structure mounting assembly and electronic equipment
CN212694231U (en) * 2020-08-18 2021-03-12 深圳市安华光电技术有限公司 DMD assembly and projection optical machine

Also Published As

Publication number Publication date
CN113900324A (en) 2022-01-07

Similar Documents

Publication Publication Date Title
US7272001B2 (en) External conductive heat dissipating device for microcomputers
US7595992B2 (en) Substrate unit, cooling device, and electronic device
JP4169561B2 (en) Electronic control unit
CN112004372B (en) Heat sink device
EP3654441B1 (en) Cell supervision circuit and battery pack
KR200485269Y1 (en) Heat conduction and radiation assembly structure of detachable module
CN113900324B (en) DMD assembly structure, assembly method and projection optical machine
US20070025086A1 (en) Electronic device with sliding type heatsink
JPH09283886A (en) Substrate mounting method, mounting substrate structure and electronic apparatus using mounting substrate structure
JP3637176B2 (en) Electronics
JP3748733B2 (en) Heat dissipation device for electronic equipment
CN218158692U (en) DMD packaging and heat dissipation structure for optical machine, heat dissipation pressing plate and projection optical machine
CN113825308B (en) Heating chip fixing structure, vehicle-mounted navigation host and assembling method thereof
CN212135321U (en) Heat radiator and microcomputer
CN216721854U (en) High power chip heat radiation structure and vehicle navigation host computer that generates heat
CN221043049U (en) Vehicle-mounted camera
CN219553621U (en) Heat dissipation structure
CN217608037U (en) Circuit board assembly and multifunctional radiator thereof
CN111654972B (en) Circuit board packaging structure and packaging method
CN220586498U (en) Heat dissipation structure
CN220242971U (en) Radiator for hydrogen fuel cell automobile and hydrogen fuel cell automobile
JP2012064705A (en) Radiator attachment structure and electronic apparatus
CN217849760U (en) Controller
CN219437446U (en) Circuit board assembly
EP4333579A1 (en) Elastic assembly, heat dissipation apparatus, electronic device, circuit module, and assembly method therefor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant