CN113900008A - Test structure and test method - Google Patents
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- CN113900008A CN113900008A CN202111079609.9A CN202111079609A CN113900008A CN 113900008 A CN113900008 A CN 113900008A CN 202111079609 A CN202111079609 A CN 202111079609A CN 113900008 A CN113900008 A CN 113900008A
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- 238000012360 testing method Methods 0.000 title claims abstract description 77
- 238000010998 test method Methods 0.000 title claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims abstract description 99
- 238000003466 welding Methods 0.000 claims abstract description 65
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 11
- 238000011160 research Methods 0.000 abstract description 5
- 238000011161 development Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- General Engineering & Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a test structure and a test method, wherein the test structure comprises the following components: each radio frequency link comprises a plurality of welding spots and transmission lines which are positioned between adjacent welding spots and connected with the welding spots; and the lengths of the transmission lines corresponding to at least one position in different radio frequency links are different. The impedance test is carried out on each radio frequency link in the test structure to obtain an impedance-time curve of each radio frequency link, transmission lines with different lengths can be identified according to the impedance-time curve and the structure of each radio frequency link, so that welding spots and transmission lines in each radio frequency link are identified, if failure points exist in the radio frequency links at the moment, because the welding spots and the transmission lines are identified, the accurate positioning of the failure points can be realized, the failure positions of devices can be accurately analyzed, and the research requirements of novel radio frequency device development and application reliability are met.
Description
Technical Field
The present invention relates to the field of integrated circuit technology, and more particularly, to a test structure and a test method.
Background
At present, radio frequency devices are packaged by a novel high-density packaging technology represented by SiP (System In a Package), which generally occurs In a BGA (Ball Grid Array) Package, and a plurality of pads and transmission lines are connected In series and staggered In each radio frequency link. Because the transmission lines and the welding points on the radio frequency link are distributed in a staggered mode and the electrical length is very short, the welding points and the transmission lines are difficult to identify and position from the radio frequency link, the accurate positioning of the welding points and the transmission lines of the radio frequency link in the BGA packaging of the radio frequency device is realized, and a manufacturer is further instructed to accurately position failure positions, so that the radio frequency high-density packaging device is an important difficult problem needing attention in the research of the application fields of the radio frequency high-density packaging device, such as interconnection reliability, signal integrity and the like.
Disclosure of Invention
In order to solve the technical problems, the invention designs a test structure and a test method, which can identify and position welding points and transmission lines from a radio frequency link, and further guide manufacturers to accurately position failure positions.
The invention designs a test structure, which comprises: each radio frequency link comprises a plurality of welding spots and transmission lines which are positioned between adjacent welding spots and connected with the welding spots; and the lengths of the transmission lines corresponding to at least one position in different radio frequency links are different.
In the test structure provided by the invention, because the lengths of at least one corresponding transmission line in different radio frequency links are different, when impedance test signals are simultaneously applied to the same end of different radio frequency links, the obtained impedance-time change curves are different due to the difference of the lengths of the transmission lines, so that the transmission lines with different lengths can be identified according to the impedance-time curves, welding spots and the transmission lines in each radio frequency link can be identified, and a basis is provided for accurately positioning failure points.
In one embodiment, the number of the welding points in each radio frequency link is the same, and the number of the transmission lines in each radio frequency link is the same; the welding points in each radio frequency link are arranged in a one-to-one correspondence mode, and the transmission lines in each radio frequency link are arranged in a one-to-one correspondence mode.
In one embodiment, the transmission line comprises a microstrip line.
In one embodiment, the test structure comprises a ball grid array package structure.
In one embodiment, at least one of the radio frequency links has a point of failure therein.
Because in the different radio frequency links in the test structure of this application, the length of at least one department's corresponding transmission line is different, can discern the transmission line of length difference according to impedance-time curve to discern solder joint and transmission line in each radio frequency link, if there is the point of failure in the radio frequency link this moment, because solder joint and transmission line have been discerned, just can realize the accurate positioning to the point of failure, accurate analysis device failure position satisfies novel radio frequency device development and application reliability research demand.
The invention also provides a test method, which comprises the following steps:
providing a test structure as described above;
performing impedance testing on each radio frequency link in the test structure to obtain an impedance-time curve of each radio frequency link;
identifying the solder joint and the transmission line in each of the radio frequency links based on the impedance-time curve.
In the test structure adopted in the test method, because the lengths of at least one corresponding transmission line in different radio frequency links are different, when impedance test signals are simultaneously applied to the same end of different radio frequency links, the obtained impedance-time change curves are different due to the difference of the lengths of the transmission lines, so that the transmission lines with different lengths can be identified according to the impedance-time curves, welding spots and the transmission lines in the radio frequency links are further identified, and a basis is provided for accurately positioning failure points.
In one embodiment, the performing an impedance test on each radio frequency link in the test structure to obtain an impedance-time curve of each radio frequency link includes:
simultaneously carrying out impedance test on each radio frequency link;
and obtaining the impedance-time curve of each radio frequency link in the same time-impedance value coordinate system.
In one embodiment, at least one of the radio frequency links has a failure point; after the welding point and the transmission line in each radio frequency link are identified based on the impedance-time curve, the method further comprises the following steps: and accurately positioning the failure point based on the identification result.
In the test structure used by the test method, the length of at least one corresponding transmission line in different radio frequency links is different, and the transmission lines with different lengths can be identified according to the impedance-time curve, so that welding spots and transmission lines in each radio frequency link are identified.
In one embodiment, the point in the impedance-time curve at which the impedance value deviates from the nominal impedance value is the point of failure.
In one embodiment, the point of the impedance-time curve where the impedance value is 0 or the point where the impedance value is infinite is a failure point.
Drawings
FIG. 1 is a schematic diagram of a test structure in one embodiment of the invention.
FIG. 2 is a flow chart of the steps of a test method in one embodiment of the invention.
Fig. 3 is a flowchart of the step of S12 in the test method of fig. 2.
Fig. 4 is an impedance versus time plot of different radio frequency links in the test structure of fig. 1.
Description of reference numerals:
1. a first radio frequency link; 11. 12, 13, 14, 15, 16, 17, 18, 21, 22, 23, 24, 25, 26, 27, 28, welds; 2. a second radio frequency link; 31. a transmission line.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
At present, a phenomenon that a plurality of radio frequency links exist in one BGA package and a phenomenon that a plurality of welding points and transmission lines are mutually staggered and connected in series exist on each radio frequency link usually occurs in a novel high-density package radio frequency device represented by a system in package SiP. How to accurately position a welding point and a transmission line of a radio frequency link in BGA (ball grid array) packaging of a radio frequency device and guide a manufacturer to accurately position a failure position is an important difficult problem which needs to be concerned when researching the application fields of radio frequency high-density packaging devices, such as interconnection reliability, signal integrity and the like. Due to the fact that transmission lines and welding points on the radio frequency link are distributed in a staggered mode and the electrical length is very short, the welding points and the transmission lines are difficult to position from the radio frequency link in the prior art. A positioning monitoring solution for welding spots and transmission lines based on radio frequency links is urgently needed to be found so as to meet the research requirements of novel radio frequency device development and application reliability.
The invention designs a test structure and a test method, which can identify and position welding points and transmission lines from a radio frequency link, and further guide manufacturers to accurately position failure positions. Fig. 1 is a schematic diagram of a radio frequency link in one embodiment. As shown in FIG. 1, the present invention contemplates a test structure comprising: each radio frequency link comprises a plurality of welding spots and transmission lines which are positioned between the adjacent welding spots and connected with the welding spots; the length of the corresponding transmission line at least one of the different radio frequency links may be different.
Specifically, because the lengths of the transmission lines corresponding to at least one of the different radio frequency links are different, when an impedance test signal is applied to the same end of the different radio frequency links at the same time, the obtained impedance-time change curves are different due to the difference of the lengths of the transmission lines, so that the transmission lines with different lengths can be identified according to the impedance-time curves, the welding spots and the transmission lines in the radio frequency links are further identified, and a basis is provided for accurate positioning of the failure point.
In one embodiment, the number of welding points in each radio frequency link may be the same, and the number of transmission lines in each radio frequency link may be the same; the welding points in each radio frequency link can be arranged in a one-to-one correspondence mode, and the transmission lines in each radio frequency link can be arranged in a one-to-one correspondence mode.
In one embodiment, the lengths of the corresponding transmission lines at the multiple locations in the different radio frequency links may be different.
Referring to fig. 1, the test structure in fig. 1 includes a first radio frequency link 1 and a second radio frequency link 2, where the number of welding points in the first radio frequency link 1 is the same as that of the welding points in the second radio frequency link 2, and the number of transmission lines is the same; specifically, the first radio frequency link 1 may include eight welding points, namely, a welding point 11, a welding point 12, a welding point 13, a welding point 14, a welding point 15, a welding point 16, a welding point 17, and a welding point 18; the second rf link 2 may include eight pads, including pad 23, pad 22, pad 23, pad 24, pad 25, pad 26, pad 27, and pad 28; the first rf link 1 and the second rf link 2 each comprise seven transmission lines 31. Two transmission lines 31, which are shown by dashed lines in fig. 1, are respectively a transmission line 31 between the pad 15 and the pad 16 in the first radio frequency link 1 and a transmission line 31 between the pad 25 and the pad 26 in the second radio frequency link 2, and the lengths of the transmission line 31 between the pad 15 and the pad 16 in the first radio frequency link 1 and the transmission line 31 between the pad 25 and the pad 26 in the second radio frequency link 2 are different.
It should be noted that fig. 1 is only an example, in an actual example, the number of the pads in the first radio frequency link 1 and the second radio frequency link 2 and the number of the transmission lines 31 are not limited to the number in fig. 1, and the specific number thereof may be adaptively adjusted according to actual needs, and is not limited herein. Similarly, the number and specific positions of the transmission lines 31 with different lengths in the first radio frequency link 1 and the second radio frequency link 2 are not limited by those in fig. 1, and may be set according to actual needs in a specific embodiment, which is not limited herein.
As an example, the transmission line 31 may include, but is not limited to, a microstrip line.
In one embodiment, the transmission line 31 may include, but is not limited to, a copper line or a silver line;
in one embodiment, the transmission lines 31 of the first rf link 1 may be located at the same layer of the test structure, or may be located at different layers of the test structure.
In one embodiment, the transmission lines 31 of the second rf link 2 may be located at the same layer of the test structure or at different layers of the test structure.
In one embodiment, the test structure may include, but is not limited to, a ball grid array package structure.
In one embodiment, the shape of the spot weld may include, but is not limited to, a hemispherical shape or a cylindrical shape.
In one embodiment, the diameter of the weld spot may be 0.3mm to 0.6 mm; in particular, the diameter of the weld spot may be, but is not limited to, 0.3mm, 0.45mm, 0.5mm, or 0.6 mm.
In one embodiment, the material of the solder joint may include, but is not limited to, tin, lead, copper, or silver, i.e., the solder joint may include, but is not limited to, a solder joint, a lead joint, a copper joint, or a silver joint.
In one embodiment, the composition of the solder joint may include, but is not limited to, 95.5% tin/3.8% silver/0.7% copper, i.e., the solder joint may include 95.5% tin, 3.8% silver, and 0.7% copper by mass.
In one embodiment, the composition of the solder joint may also include, but is not limited to, 96.5 tin/3.5 silver, i.e., the solder joint may include 96.5% tin and 3.5% silver by mass.
In one embodiment, at least one of the radio frequency links may have a point of failure therein. Of course, the number of the radio frequency links having failure points may also be set according to needs, and may be one radio frequency link having failure points (not shown), or two or more radio frequency links having failure points. The number of the failure points in the radio frequency link can also be set according to actual needs, and the number of the failure points in each radio frequency link can be one or two or more.
Referring to fig. 2 in conjunction with fig. 1, the present invention also contemplates a testing method, as shown in fig. 2, comprising:
s11, providing a test structure as described in the previous embodiment;
s12, performing impedance test on each radio frequency link in the test structure to obtain an impedance-time curve of each radio frequency link;
and S13, identifying welding points and transmission lines in each radio frequency link based on the impedance-time curve.
In the test structure adopted in the test method, because the lengths of at least one corresponding transmission line in different radio frequency links are different, when impedance test signals are simultaneously applied to the same end of different radio frequency links, the obtained impedance-time change curves are different due to the difference of the lengths of the transmission lines, so that the transmission lines with different lengths can be identified according to the impedance-time curves, welding spots and the transmission lines in the radio frequency links are further identified, and a basis is provided for accurately positioning failure points. In particular, the test structure may be impedance tested using, but not limited to, a TDR (time domain reflectometry) test technique based on a vector network analyzer to monitor impedance changes in the link. By using the TDR testing technology, all information can be displayed on an oscilloscope in real time, and each point along the time axis corresponds to an impedance value at different positions on a tested line. In one example, at a short circuit of the radio frequency link, the measurement results show an impedance value of 0; at the open circuit position of the radio frequency link, the impedance value displayed by the measurement result is infinite; at 50 ohm impedance matching, the measurement results show an impedance of 50 ohms; different line widths correspond to specific impedance values.
Specifically, the TDR testing technique based on the vector network analyzer inputs an excitation signal to a device under test during measurement, and then obtains a measurement result by calculating a vector magnitude ratio between the input signal and a transmission signal or a reflection signal; the use of a band pass filter in the measurement receiver removes noise and unwanted signals from the measurement and improves measurement accuracy.
Specifically, the measurement function of the TDR test technology based on the vector network analyzer is realized by a narrow-band receiver, and the method can reduce the influence of the signal of the transmitter of the vector network analyzer on the measurement result to the maximum extent; the "spurious avoidance" feature of vector network analyzer based TDR testing techniques allows the frequency of spurious signal occurrences to be inferred from the data rate input by the user and set the optimum frequency sweep method in order to minimize measurement errors.
As shown in fig. 3, in one embodiment, performing an impedance test on each rf link in the test structure to obtain an impedance-time curve of each rf link includes:
s121, simultaneously carrying out impedance test on each radio frequency link;
and S122, obtaining an impedance-time curve of each radio frequency link in the same time-impedance value coordinate system.
In one embodiment, at least one radio frequency link has a failure point therein; after identifying the welding points and the transmission lines in each radio frequency link based on the impedance-time curve, the method further comprises the following steps: and accurately positioning the failure point based on the identification result.
Specifically, in the test structure used by the test method, at least one corresponding transmission line in different radio frequency links has different lengths, and the transmission lines with different lengths can be identified according to the impedance-time curve and the structure of the radio frequency links, so that welding spots and transmission lines in each radio frequency link are identified.
In one embodiment, the comparison test result shows that the signal in the short link of the transmission line is earlier than the signal in the long link of the transmission line, so that the signal in the short link of the transmission line reaches the solder joint connected to the rear end first, and the solder joint and the transmission line can be quickly and accurately distinguished through comparison analysis, thereby capturing the signal of the radio frequency link of the device.
Referring to fig. 4 in combination with fig. 1, impedance-time curves of the first radio frequency link 1 and the second radio frequency link 2 are compared, where the curve is an impedance-time curve of the first radio frequency link 1 in fig. 1, and the curve is an impedance-time curve of the second radio frequency link 2 in fig. 1, and since the lengths of the transmission line 31 between the welding point 15 and the welding point 16 in the first radio frequency link 1 and the transmission line 31 between the welding point 25 and the welding point 26 in the second radio frequency link 2 are different, it can be seen that the time for a signal to reach the welding point 16 on the first radio frequency link 1 is significantly shorter than the time for a signal to reach the welding point 26 on the second radio frequency link 2; as can be seen from comparison with fig. 1, the transmission line 31 between the solder point 15 and the solder point 16 on the first radio frequency link 1 is significantly shorter than the transmission line 31 between the solder point 25 and the solder point 26 on the second radio frequency link 2, so that impedance-time curves of the two links can be analyzed by comparison, and the trough of the impedance-time curves of the first radio frequency link 1 and the second radio frequency link 2 is the solder point, and the peak is the transmission line. Therefore, the test results have stable consistency with the actual structural diagram.
It should be noted that the trough and the peak of the impedance-time curve of the rf link depend on the actual rf link structure, and in other embodiments, the trough may be a transmission line, and the peak may be a solder joint, which is not limited by the above embodiments.
In one embodiment, the point in the impedance-time curve at which the impedance value deviates from the nominal impedance value is a point of failure.
In one embodiment, the point in the impedance-time curve where the impedance value is 0 or the point where the impedance value is infinite is the failure point.
Specifically, if the radio frequency link includes both a point where the impedance value deviates from the rated impedance value and a point where the impedance value is 0, when the impedance test is performed on the radio frequency link, if the signal reaches the point where the impedance value deviates from the rated impedance value first, the signal can still continue to be transmitted until the signal reaches the point where the impedance value is 0.
Specifically, if the radio frequency link includes both a point at which the impedance value deviates from the rated impedance value and a point at which the impedance value is 0, when the impedance test is performed on the radio frequency link, if the signal reaches the point at which the impedance value is 0 first, the signal stops being transmitted.
Specifically, if the radio frequency link simultaneously includes a point where the impedance value deviates from the rated impedance value and a point where the impedance value is infinite, when the impedance test is performed on the radio frequency link, if the signal reaches the point where the impedance value deviates from the rated impedance value first, the signal can still be transmitted until the signal reaches the point where the impedance value is infinite.
Specifically, if the radio frequency link simultaneously includes a point where the impedance value deviates from the rated impedance value and a point where the impedance value is infinite, when the impedance test is performed on the radio frequency link, if the signal reaches the point where the impedance value is infinite, the signal stops transmission.
Specifically, if the radio frequency link includes both a point with an impedance value of 0 and a point with an impedance value of infinity, when the impedance test is performed on the radio frequency link, if the signal reaches the point with the impedance value of 0 first, the signal stops transmitting.
Specifically, if the radio frequency link includes both a point with an impedance value of 0 and a point with an impedance value of infinity, when the impedance test is performed on the radio frequency link, if the signal reaches the point with an impedance value of infinity first, the signal stops transmitting.
Specifically, if the radio frequency link simultaneously includes a point at which the impedance value deviates from the rated impedance value, a point at which the impedance value is 0, and a point at which the impedance value is infinite, when the impedance test is performed on the radio frequency link, if the signal reaches the point at which the impedance value deviates from the rated impedance value first, the signal can still be transmitted until the signal reaches the point at which the impedance value is 0 or the point at which the impedance value is infinite.
Specifically, if the radio frequency link simultaneously includes a point at which the impedance value deviates from the rated impedance value, a point at which the impedance value is 0, and a point at which the impedance value is infinite, when the impedance test is performed on the radio frequency link, if the signal reaches the point at which the impedance value is 0 or the point at which the impedance value is infinite, the signal stops transmission.
And further, after the failure point is confirmed, repairing the failure point and confirming the repairing condition, if the failure point is repaired normally, the signal on the radio frequency link can be continuously transmitted until the signal is transmitted to the next failure point, and by analogy, the next failure point is continuously repaired, so that the signal on the link can be continuously transmitted until the end point of the radio frequency link.
Specifically, the failure cause of the failure point may include cold welding, poor electrical contact of the solder joint, solder fatigue failure of the solder joint, short circuit of the transmission line, or open circuit of the transmission line.
In particular, the method of repairing the failure point may include repair welding or transmission line repair.
The test structure and the test method have the following beneficial effects: the invention provides a test structure, which comprises a plurality of radio frequency links, wherein each radio frequency link comprises a plurality of welding spots and transmission lines which are positioned between adjacent welding spots and connected with the welding spots, and the lengths of the transmission lines corresponding to at least one position in different radio frequency links are different. The impedance test is carried out on the test structure to obtain an impedance-time curve, welding spots and transmission lines in each radio frequency link are identified based on the impedance-time curve, signals of the short links of the transmission lines reach the welding spots connected with the rear end at first, the welding spots and the transmission lines can be identified quickly and accurately through comparison and analysis, then the welding spots of the radio frequency links and failure points on the transmission lines can be positioned, failure positions of devices can be analyzed accurately, and research requirements of development and application reliability of novel radio frequency devices are met.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A test structure, characterized in that the test structure comprises:
each radio frequency link comprises a plurality of welding spots and transmission lines which are positioned between adjacent welding spots and connected with the welding spots; and the lengths of the transmission lines corresponding to at least one position in different radio frequency links are different.
2. The test structure of claim 1, wherein the number of the solder joints in each of the radio frequency links is the same, and the number of the transmission lines in each of the radio frequency links is the same; the welding points in each radio frequency link are arranged in a one-to-one correspondence mode, and the transmission lines in each radio frequency link are arranged in a one-to-one correspondence mode.
3. The test structure of claim 1, wherein the transmission line comprises a microstrip line.
4. The test structure of claim 1, wherein the test structure comprises a solder ball array package structure.
5. The test structure of claim 1, wherein at least one of the radio frequency links has a point of failure therein.
6. A method of testing, the method comprising:
providing a test structure according to any one of claims 1 to 5;
performing impedance testing on each radio frequency link in the test structure to obtain an impedance-time curve of each radio frequency link;
identifying the solder joint and the transmission line in each of the radio frequency links based on the impedance-time curve.
7. The method of claim 6, wherein the performing an impedance test on each of the radio frequency links in the test structure to obtain an impedance-time curve of each of the radio frequency links comprises:
simultaneously carrying out impedance test on each radio frequency link;
and obtaining the impedance-time curve of each radio frequency link in the same time-impedance value coordinate system.
8. The test method of claim 7, wherein at least one of the radio frequency links has a failure point therein; after the welding point and the transmission line in each radio frequency link are identified based on the impedance-time curve, the method further comprises the following steps: and accurately positioning the failure point based on the identification result.
9. The test method of claim 8, wherein the point in the impedance-time curve at which the impedance value deviates from a nominal impedance value is the failure point.
10. The test method according to claim 8, wherein a point in the impedance-time curve where the impedance value is 0 or a point where the impedance value is infinite is a failure point.
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| CN202111079609.9A CN113900008A (en) | 2021-09-15 | 2021-09-15 | Test structure and test method |
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| CN202111079609.9A CN113900008A (en) | 2021-09-15 | 2021-09-15 | Test structure and test method |
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