CN113358934A - Synchronous online monitoring device and method for direct current resistance and radio frequency impedance of BGA link - Google Patents
Synchronous online monitoring device and method for direct current resistance and radio frequency impedance of BGA link Download PDFInfo
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- CN113358934A CN113358934A CN202110683370.XA CN202110683370A CN113358934A CN 113358934 A CN113358934 A CN 113358934A CN 202110683370 A CN202110683370 A CN 202110683370A CN 113358934 A CN113358934 A CN 113358934A
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
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Abstract
The device comprises a BGA sample to be monitored, an impedance conversion clamp, a vector network analyzer and a direct current resistance tester, wherein the BGA sample to be monitored is clamped on the impedance conversion clamp and is electrically connected with the impedance conversion clamp; the BGA sample to be monitored is connected with a vector network analyzer through an impedance conversion clamp, and the vector network analyzer is used for monitoring a TDR impedance signal of a radio frequency link of the BGA sample to be monitored; the BGA sample to be monitored is connected with a direct current resistance tester through an impedance conversion clamp, and the direct current resistance tester is used for collecting resistance signals of a direct current link of the BGA sample to be monitored. The direct current resistance and radio frequency impedance synchronous online monitoring device and method for the BGA link can achieve synchronous online monitoring of the direct current resistance and the radio frequency impedance of the BGA link, and can also reduce cost required by monitoring, reduce testing errors and guarantee testing effects.
Description
Technical Field
The application relates to the technical field of BGA links, in particular to a device and a method for synchronously monitoring direct current resistance and radio frequency impedance of a BGA link on line.
Background
The BGA package has been gradually applied to radio frequency applications, such as airborne, shipborne, space-borne, and vehicle-borne radar and communication systems, due to the short vertical leads, low self-inductance of the leads, low mutual inductance between the leads, and good frequency characteristics. Nowadays, a phenomenon that a radio frequency link and a direct current link coexist in one BGA package usually occurs in a novel high-density package radio frequency device represented by a system in package SiP, and how to realize synchronous online capture of a radio frequency link signal and a direct current link signal in the BGA package of the radio frequency device is an important difficult problem that needs attention in the application field of radio frequency high-density package devices, such as interconnection reliability, signal integrity and the like.
At present, most schemes for realizing online monitoring of BGA link samples are mainly realized based on BGA daisy chain design and dc resistance online test equipment, but such a method is only limited to the acquisition of dc signals, and for the acquisition of signals such as TDR impedance signals of BGA link samples, the scheme is mainly realized based on an offline radio frequency probe station, so that it is difficult to achieve the effect of synchronous online monitoring of dc resistance and rf impedance of BGA links.
Disclosure of Invention
An object of the embodiments of the present application is to provide a device and a method for synchronously monitoring a dc resistance and a radio frequency impedance of a BGA link on line, which can realize synchronous online monitoring of the dc resistance and the radio frequency impedance of the BGA link, and can also reduce the cost required for monitoring, reduce the test error, and ensure the test effect.
In a first aspect, the present application provides a synchronous online monitoring device for dc resistance and rf impedance of a BGA link, comprising a BGA sample to be monitored, an impedance transforming fixture, a vector network analyzer and a dc resistance tester,
the BGA sample to be monitored is clamped on the impedance conversion clamp and is electrically connected with the impedance conversion clamp;
the BGA sample to be monitored is connected with the vector network analyzer through the impedance conversion clamp, and the vector network analyzer is used for monitoring a TDR impedance signal of a radio frequency link of the BGA sample to be monitored;
the BGA sample to be monitored is connected with the direct current resistance tester through the impedance conversion clamp, and the direct current resistance tester is used for collecting resistance signals of a direct current link of the BGA sample to be monitored.
In the implementation process, the direct-current resistance and radio-frequency impedance synchronous online monitoring device for the BGA link in the embodiment of the application has the advantages that the BGA sample to be monitored is connected with the vector network analyzer through the impedance conversion clamp, and the vector network analyzer can monitor the TDR impedance signal of the radio-frequency link of the BGA sample to be monitored; the BGA sample to be monitored is connected with the direct current resistance tester through the impedance conversion clamp, the direct current resistance tester can collect resistance signals of a direct current link of the BGA sample to be monitored, so that the direct current resistance and the radio frequency impedance of the BGA link can be synchronously monitored on line, particularly, the direct current resistance and the radio frequency impedance of the BGA link can be synchronously monitored on line under a stress loading test condition, in addition, when the interconnection reliability, the signal integrity and other aspects are researched, the vector network analyzer is lighter, more convenient and faster than a radio frequency probe station, is simple to operate and convenient to move, can be transferred to a plurality of stress tests, realizes the monitoring under a plurality of stress environments, so that the cost required to be monitored can be reduced, the test error is reduced, and the test effect is guaranteed.
Furthermore, the impedance conversion clamp is manufactured by adopting a PCB (printed circuit board) manufacturing technology, and comprises a radio frequency channel and a direct current channel.
In the implementation process, the structure of the impedance conversion clamp can facilitate the synchronous online monitoring of the direct current resistance and the radio frequency impedance of the BGA link.
Furthermore, the impedance conversion clamp has a plurality of radio frequency channels and a plurality of direct current channels.
In the implementation process, the radio frequency channels and the direct current channels of the impedance conversion clamp are multiple, so that the impedance conversion clamp can be conveniently used, and the practicability of the impedance conversion clamp is improved.
Furthermore, the impedance conversion clamp is provided with a microstrip line and a connector,
the microstrip line is used for widening a probe pin of the BGA sample radio frequency link to be monitored;
the connector is arranged on a probe pin of the widened BGA sample radio frequency link to be monitored;
the connector is connected with the vector network analyzer through a radio frequency connecting line.
In the implementation process, the radio frequency link of the BGA sample to be monitored can be led out better through the microstrip line, the connector and the radio frequency connecting line which are arranged on the impedance conversion clamp, and the connection with the vector network analyzer is better facilitated.
Further, the connector is an SMA connector.
In the implementation process, the connector adopts the SMA connector, so that the radio frequency link of the BGA sample to be monitored can be well connected with the vector network analyzer.
Further, the impedance conversion clamp is connected with the direct current resistance tester through a direct current connecting line.
In the implementation process, the direct-current connecting wire is adopted, so that the monitoring effect of the direct-current resistance of the BGA link can be well guaranteed.
Further, the vector network analyzer comprises a step signal generator and an oscilloscope.
In the implementation process, the vector network analyzer comprises the step signal generator and the oscilloscope, so that the characteristic impedance in the transmission process can be measured, and the position and the characteristic of each impedance discontinuous point are displayed, so that the radio frequency impedance of the BGA link can be better monitored.
Further, the direct current resistance tester is a four-probe resistance tester.
In the implementation process, the direct current resistance tester adopts a four-probe resistance tester, so that the measurement precision can be better guaranteed, and the influence of a line and contact resistance is eliminated.
In a second aspect, an embodiment of the present application provides a synchronous online monitoring method for a dc resistance and a radio frequency impedance of a BGA link, which is applied to the synchronous online monitoring device for a dc resistance and a radio frequency impedance of a BGA link, and the method includes:
the vector network analyzer monitors the TDR impedance signal of the BGA sample radio frequency link to be monitored;
and the direct current resistance tester collects the resistance signal of the direct current link of the BGA sample to be monitored.
In the implementation process, in the synchronous online monitoring method for the direct current resistance and the radio frequency impedance of the BGA link according to the embodiment of the present application, the vector network analyzer can monitor the TDR impedance signal of the radio frequency link of the BGA sample to be monitored, and the direct current resistance tester can collect the resistance signal of the direct current link of the BGA sample to be monitored, so as to realize synchronous online monitoring of the direct current resistance and the radio frequency impedance of the BGA link, especially, realize synchronous online monitoring of the direct current resistance and the radio frequency impedance of the BGA link under the stress loading test condition, and, when performing research on interconnection reliability, signal integrity and the like, the vector network analyzer is lighter, more convenient, simpler and more convenient to operate than a radio frequency probe station and move, and can be transferred to a plurality of stress tests to realize monitoring under a plurality of stress environments, thereby reducing the cost required for monitoring, and the test error is reduced, and the test effect is guaranteed.
Further, the method further comprises:
performing failure monitoring and failure welding point nondestructive positioning on the radio frequency link of the BGA sample to be monitored according to the TDR impedance signal;
and carrying out welding spot fracture monitoring on the direct-current link of the BGA sample to be monitored according to the resistance signal.
In the implementation process, the TDR impedance signal of the radio frequency link of the BGA sample to be monitored is monitored, so that the failure monitoring and the non-destructive positioning of the failure welding point of the radio frequency link of the BGA sample to be monitored can be realized; the resistance signal of the direct-current link of the BGA sample to be monitored is collected, and the welding spot fracture monitoring of the direct-current link of the BGA sample to be monitored can be achieved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a dc resistance and rf impedance synchronous online monitoring device for a BGA link according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram illustrating a TDR testing principle provided in an embodiment of the present application;
FIG. 3 is a schematic diagram of resistance measurement by a four-probe method according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram of a simulation result of a transition structure provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of an impedance conversion fixture of a simulation design provided in an embodiment of the present application;
fig. 6 is a printed layout of the impedance conversion jig provided in the embodiment of the present application.
Icon: 11-BGA samples to be monitored; 12-impedance transformation clamp; 121-microstrip line; 122-a connector; 13-a vector network analyzer; 14-direct current resistance tester.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or a point connection; either directly or indirectly through intervening media, or may be an internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a dc resistance and rf impedance synchronous online monitoring device for a BGA link according to an embodiment of the present application.
The synchronous online monitoring device for the direct current resistance and the radio frequency impedance of the BGA link comprises a BGA sample 11 to be monitored, an impedance conversion clamp 12, a vector network analyzer 13 and a direct current resistance tester 14,
the BGA sample to be monitored 11 is clamped on an impedance conversion clamp 12 and is electrically connected with the impedance conversion clamp 12;
the BGA sample 11 to be monitored is connected with a vector network analyzer 13 through an impedance conversion clamp 12, and the vector network analyzer 13 is used for monitoring a TDR impedance signal of a radio frequency link of the BGA sample 11 to be monitored;
the BGA sample 11 to be monitored is connected with a direct current resistance tester 14 through an impedance conversion clamp 12, and the direct current resistance tester 14 is used for collecting resistance signals of a direct current link of the BGA sample 11 to be monitored.
In this embodiment, the BGA sample 11 to be monitored has both a radio frequency link and a dc link.
The rf interconnection structure of the BGA sample 11 to be monitored is connected to the vector network analyzer 13 through the impedance conversion fixture 12, and the vector network analyzer 13 is used to perform a TDR (Time domain reflectometry), which is an impedance test, on the rf link of the BGA sample 11 to be monitored, so as to measure transmission characteristic parameters of the rf interconnection structure, for example, TDR impedance signals.
Understandably, the vector network analyzer 13 is lighter in weight, more convenient, simpler to operate and more convenient to move than the radio frequency probe station, so that the vector network analyzer 13 can be transferred to a plurality of stress test rooms, and measurement of transmission characteristic parameters of the radio frequency interconnection structure of the BGA sample 11 to be monitored in a multi-stress environment is realized.
According to the synchronous online monitoring device for the direct-current resistance and the radio-frequency impedance of the BGA link, a BGA sample 11 to be monitored is connected with a vector network analyzer 13 through an impedance conversion clamp 12, and the vector network analyzer 13 can monitor a TDR impedance signal of the radio-frequency link of the BGA sample 11 to be monitored; the BGA sample 11 to be monitored is connected with a direct current resistance tester 14 through an impedance conversion clamp 12, the direct current resistance tester 14 can collect resistance signals of a direct current link of the BGA sample 11 to be monitored, so that the direct current resistance and the radio frequency impedance of the BGA link can be synchronously monitored on line, especially, the direct current resistance and the radio frequency impedance of the BGA link can be synchronously monitored on line under a stress loading test condition, and in the process of research on interconnection reliability, signal integrity and the like, the vector network analyzer 13 is lighter, more convenient and faster than a radio frequency probe station, is simple to operate and convenient to move, can be transferred to a plurality of stress test rooms, realizes monitoring under a plurality of stress environments, can reduce the cost required by monitoring, reduces the test error and ensures the test effect.
The method can be understood that the TDR impedance signal of the radio frequency link of the BGA sample 11 to be monitored is monitored, so that the failure monitoring and the failure welding point nondestructive positioning of the radio frequency link of the BGA sample 11 to be monitored can be realized; and collecting a resistance signal of the direct-current link of the BGA sample to be monitored, so that the welding spot fracture monitoring of the direct-current link of the BGA sample to be monitored 11 can be realized.
Referring to fig. 1, in some embodiments of the present application, vector network analyzer 13 comprises a step signal generator and an oscilloscope.
Specifically, with reference to fig. 2, fig. 2 is a schematic diagram of a TDR testing principle provided in this embodiment of the present application, and a step signal generator of the vector network analyzer 13 may send a fast rising edge on a transmission line to be tested, and observe a reflected voltage waveform at a specific point with an oscilloscope, in this way, a characteristic impedance in a transmission process may be measured, and a position and characteristics (for example, impedance, inductive reactance, and capacitive reactance) of each impedance discontinuity point are displayed; because the signal amplitude, the test cable impedance and the instrument output impedance generated by the TDR are determined, the numerical value of the discontinuous impedance can be calculated according to the reflected signal amplitude and the time axis data received by the vector network analyzer 13.
In the above process, the vector network analyzer 13 includes a step signal generator and an oscilloscope, so that the characteristic impedance in the transmission process can be measured, and the position and the characteristic of each impedance discontinuity can be displayed, thereby better monitoring the radio frequency impedance of the BGA link.
It should be noted that, by using the TDR testing technology, all the amplitude and phase information can be displayed on the oscilloscope in real time, and compared with the prior art, the TDR can provide more corresponding information about the system broadband, and by using the TDR testing technology, the accurate positioning of the failure welding point can be quickly realized, thereby facilitating the subsequent failure analysis of the failure point.
Referring to fig. 1, in some embodiments of the present application, the dc resistance tester 14 is a four-probe resistance tester.
It can be understood that the four-probe resistance tester adopts the principle of four-probe method measurement, and referring to fig. 3, fig. 3 is a schematic diagram of the resistance measurement by the four-probe method provided in the embodiment of the present application, in fig. 3, R1, R2, R3, and R4 respectively represent contact resistances between the probes 1, 2, 3, and 4 and the sample, and Rx is a resistance to be measured, and since the voltmeter has a very high output impedance, currents passing through the contact resistances R2 and R3 are approximately 0, thereby better ensuring the measurement accuracy and eliminating the influence of the line and the contact resistance.
Optionally, for the direct-current link of the BGA sample 11 to be monitored, before the stress test is loaded, the direct-current link of the BGA sample 11 to be monitored can be led out through the impedance conversion fixture 12 according to a four-probe method and connected with the electrical monitoring circuit, so as to confirm that the communication state of the electrical performance is good; in the stress loading test process, the on-line resistance is continuously monitored in real time, and whether the welding point of the direct current link fails or not can be judged by increasing 20% rated resistance value for 5 times at most continuously.
Referring to fig. 1, in some embodiments of the present application, the impedance transformation fixture 12 is fabricated by PCB board manufacturing technology, and the impedance transformation fixture 12 includes a radio frequency channel and a direct current channel.
The impedance conversion clamp 12 is structurally arranged to facilitate synchronous on-line monitoring of the direct current resistance and the radio frequency impedance of the BGA link.
Optionally, the impedance conversion clamp 12 has a plurality of rf channels and dc channels.
The impedance conversion clamp 12 has a plurality of radio frequency channels and a plurality of direct current channels, which is convenient for using the impedance conversion clamp 12 and improves the practicability of the impedance conversion clamp 12.
Alternatively, the impedance converting jig 12 is provided with a microstrip line 121 and a connector 122,
the microstrip line 121 is used for widening a probe pin of a radio frequency link of the BGA sample 11 to be monitored;
the connector 122 is arranged on a probe pin of the widened radio frequency link of the BGA sample 11 to be monitored;
the connector 122 is connected to the vector network analyzer 13 via a radio frequency connection.
Through the microstrip line 121, the connector 122 and the radio frequency connection line arranged on the impedance conversion clamp 12, the radio frequency link of the BGA sample 11 to be monitored can be led out better, which is better convenient for connection with the vector network analyzer 13.
Illustratively, the connector 122 may be an SMA connector.
The connector 122 is an SMA connector, which allows the rf link of the BGA sample 11 to be monitored to be better connected to the vector network analyzer 13.
Specifically, for the impedance conversion clamp 12, the structure of the impedance conversion clamp 12 is determined by the size of the external direct current and radio frequency port of the BGA sample 11 to be monitored, and the impedance conversion clamp 12 mainly aims to convert the direct current and radio frequency port of the BGA sample 11 to be monitored from a narrow coplanar waveguide structure to a wide coplanar waveguide structure, connect with a coaxial connector, and conveniently connect to the vector network analyzer 13 for monitoring and testing;
the design process of the impedance conversion clamp 12 can include ANSYS HFSS electromagnetic model simulation, model object processing and PCB board level test debugging, firstly, determining the size parameter of the transition structure of the narrow coplanar waveguide to wide coplanar waveguide structure, establishing an initial geometric structure by using ANSYSHFSS, performing electromagnetic simulation calculation, optimizing the structure size according to the return loss result, referring to fig. 4 for the simulation result of the transition structure, fig. 4 is a schematic diagram of the simulation result of the transition structure, as can be seen from fig. 4, the transition structure basically meets the application requirement at 2-16GHz, and 99% of power energy can be transmitted from the narrow port to the wide port;
secondly, determining the size of the overall structure, determining the size of a single channel and the structural characteristics of the BGA sample 11 to be monitored according to the above manner, and drawing the overall structure of the impedance conversion fixture 12 by using ANSYSHFSS, for this, referring to fig. 5, fig. 5 is a schematic structural diagram of the impedance conversion fixture 12 of the simulation design provided in the embodiment of the present application, where the impedance conversion fixture 12 includes a direct current channel and a radio frequency channel, and the number of the two types of channels can be adjusted according to the link condition and the test requirement of the BGA sample 11 to be monitored;
finally, the PCB printed layout is determined, and according to the structural diagram designed by ANSYSHFSS, the PCB printed layout is imported into printed layout manufacturing software, for example, an Altium Designer, and a ground via is added and a part of the structure is slightly processed to form a final PCB layout, which is shown in fig. 6, and fig. 6 is the printed layout of the impedance conversion fixture 12 provided in the embodiment of the present application, so that the impedance conversion fixture 12 can be processed and manufactured according to the printed layout of the impedance conversion fixture 12.
Referring to fig. 1, in some embodiments of the present application, an impedance conversion fixture 12 is connected to a dc resistance tester 14 via a dc link.
And the direct-current connecting wire is adopted, so that the monitoring effect of the direct-current resistance of the BGA link can be better ensured.
The embodiment of the present application further provides a method for synchronously monitoring the dc resistance and the rf impedance of the BGA link on line, which is applied to the device for synchronously monitoring the dc resistance and the rf impedance of the BGA link on line, and includes the following steps:
the vector network analyzer 13 monitors the TDR impedance signal of the radio frequency link of the BGA sample 11 to be monitored;
the dc resistance tester 14 collects the resistance signal of the dc link of the BGA sample 11 to be monitored.
In the synchronous online monitoring method for the direct current resistance and the radio frequency impedance of the BGA link, the vector network analyzer 13 can monitor the TDR impedance signal of the radio frequency link of the BGA sample 11 to be monitored, the direct current resistance tester 14 can collect the resistance signal of the direct current link of the BGA sample 11 to be monitored, so that the synchronous online monitoring of the direct current resistance and the radio frequency impedance of the BGA link can be realized, particularly, the synchronous online monitoring of the direct current resistance and the radio frequency impedance of the BGA link can be realized under the stress loading test condition, and when the research on the interconnection reliability, the signal integrity and the like is carried out, the vector network analyzer 13 is lighter, more convenient and simpler to operate and more convenient to move than a radio frequency probe station, the vector network analyzer 13 can be transferred to a plurality of stress tests, the monitoring under a plurality of stress environments can be realized, the cost required by the monitoring can be reduced, the testing error can be reduced, and the test effect is guaranteed.
In some embodiments of the present application, the method for synchronously monitoring the dc resistance and the rf impedance of the BGA link in an online manner according to an embodiment of the present application may further include the following steps:
performing failure monitoring and failure welding point nondestructive positioning on the radio frequency link of the BGA sample 11 to be monitored according to the TDR impedance signal;
and monitoring the direct current link of the BGA sample 11 to be monitored for solder joint fracture according to the resistance signal.
In the process, the TDR impedance signal of the radio frequency link of the BGA sample 11 to be monitored is monitored, so that failure monitoring and failure welding point nondestructive positioning of the radio frequency link of the BGA sample 11 to be monitored can be realized; and collecting a resistance signal of the direct-current link of the BGA sample to be monitored, so that the welding spot fracture monitoring of the direct-current link of the BGA sample to be monitored 11 can be realized.
In all the above embodiments, the terms "large" and "small" are relative terms, and the terms "more" and "less" are relative terms, and the terms "upper" and "lower" are relative terms, so that the description of these relative terms is not repeated herein.
It should be appreciated that reference throughout this specification to "in this embodiment," "in an embodiment of the present application," or "as an alternative implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in this embodiment," "in the examples of the present application," or "as an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are all alternative embodiments and that the acts and modules involved are not necessarily required for this application.
In various embodiments of the present application, it should be understood that the size of the serial number of each process described above does not mean that the execution sequence is necessarily sequential, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A synchronous on-line monitoring device for the DC resistance and RF impedance of BGA link is composed of the BGA sample to be monitored, an impedance converting fixture, a vector network analyzer and a DC resistance tester,
the BGA sample to be monitored is clamped on the impedance conversion clamp and is electrically connected with the impedance conversion clamp;
the BGA sample to be monitored is connected with the vector network analyzer through the impedance conversion clamp, and the vector network analyzer is used for monitoring a TDR impedance signal of a radio frequency link of the BGA sample to be monitored;
the BGA sample to be monitored is connected with the direct current resistance tester through the impedance conversion clamp, and the direct current resistance tester is used for collecting resistance signals of a direct current link of the BGA sample to be monitored.
2. The device of claim 1, wherein the impedance conversion fixture is fabricated by PCB board manufacturing technology, and comprises a RF channel and a DC channel.
3. The device for synchronously monitoring the direct current resistance and the radio frequency impedance of the BGA link according to claim 2, wherein the impedance conversion jig has a plurality of radio frequency channels and a plurality of direct current channels.
4. The device for synchronously monitoring the direct current resistance and the radio frequency impedance of the BGA link according to claim 2, wherein the impedance conversion jig is provided with a microstrip line and a connector,
the microstrip line is used for widening a probe pin of the BGA sample radio frequency link to be monitored;
the connector is arranged on a probe pin of the widened BGA sample radio frequency link to be monitored;
the connector is connected with the vector network analyzer through a radio frequency connecting line.
5. The device for synchronously monitoring the direct current resistance and the radio frequency impedance of the BGA link of claim 4, wherein the connector is an SMA connector.
6. The device for synchronously monitoring the direct current resistance and the radio frequency impedance of the BGA link according to claim 2, wherein the impedance conversion fixture is connected with the direct current resistance tester through a direct current connection line.
7. The device for synchronously monitoring the direct-current resistance and the radio-frequency impedance of the BGA link, according to claim 1, wherein the vector network analyzer comprises a step signal generator and an oscilloscope.
8. The device for synchronously monitoring the direct current resistance and the radio frequency impedance of the BGA link of claim 1, wherein the direct current resistance tester is a four-probe resistance tester.
9. A synchronous online monitoring method for DC resistance and radio frequency impedance of a BGA link, which is applied to the synchronous online monitoring device for DC resistance and radio frequency impedance of the BGA link of any one of claims 1 to 8, the method comprises:
the vector network analyzer monitors the TDR impedance signal of the BGA sample radio frequency link to be monitored;
and the direct current resistance tester collects the resistance signal of the direct current link of the BGA sample to be monitored.
10. The method of claim 9, wherein the method further comprises the steps of:
performing failure monitoring and failure welding point nondestructive positioning on the radio frequency link of the BGA sample to be monitored according to the TDR impedance signal;
and carrying out welding spot fracture monitoring on the direct-current link of the BGA sample to be monitored according to the resistance signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110683370.XA CN113358934A (en) | 2021-06-18 | 2021-06-18 | Synchronous online monitoring device and method for direct current resistance and radio frequency impedance of BGA link |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110683370.XA CN113358934A (en) | 2021-06-18 | 2021-06-18 | Synchronous online monitoring device and method for direct current resistance and radio frequency impedance of BGA link |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113358934A true CN113358934A (en) | 2021-09-07 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113740612A (en) * | 2021-11-05 | 2021-12-03 | 成都佳驰电子科技股份有限公司 | Conductive adhesive tape contact resistance test system and test method |
| CN113900008A (en) * | 2021-09-15 | 2022-01-07 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Test structure and test method |
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2021
- 2021-06-18 CN CN202110683370.XA patent/CN113358934A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113900008A (en) * | 2021-09-15 | 2022-01-07 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Test structure and test method |
| CN113740612A (en) * | 2021-11-05 | 2021-12-03 | 成都佳驰电子科技股份有限公司 | Conductive adhesive tape contact resistance test system and test method |
| CN113740612B (en) * | 2021-11-05 | 2022-01-25 | 成都佳驰电子科技股份有限公司 | Conductive adhesive tape contact resistance test system and test method |
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