CN113878320A - Manufacturing method of radiator and radiator - Google Patents
Manufacturing method of radiator and radiator Download PDFInfo
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- CN113878320A CN113878320A CN202111170736.XA CN202111170736A CN113878320A CN 113878320 A CN113878320 A CN 113878320A CN 202111170736 A CN202111170736 A CN 202111170736A CN 113878320 A CN113878320 A CN 113878320A
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- radiator
- base plate
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- solder layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 58
- 229910000679 solder Inorganic materials 0.000 claims abstract description 56
- 238000010438 heat treatment Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 30
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 29
- 238000013461 design Methods 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 110
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000011135 tin Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000005240 physical vapour deposition Methods 0.000 claims description 5
- 238000003698 laser cutting Methods 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 238000012360 testing method Methods 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018082 Cu3Sn Inorganic materials 0.000 description 1
- 229910000943 NiAl Inorganic materials 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a manufacturing method of a radiator and the radiator, comprising the following steps: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and manufacturing corresponding basic plates according to each layer of the divided substructures; selecting one of every two adjacent base plates, forming a solder layer on a contact surface of the base plate, which is used for contacting with the other base plate, and manufacturing an intermediate plate; and (3) assembling the intermediate plate and the base plate according to the design structure of the radiator, heating after assembling, and enabling the material of the solder layer and the material of the base plate to form an intermetallic compound after contacting at the heating temperature. According to the manufacturing method, the intermetallic compound is generated between the solder layer material and the base plate material during heating, so that effective connection between the plate parts of the radiator is realized, and the problem that the channel of the radiator is possibly blocked in the traditional welding process or the problem that the cavity structure in the radiator, namely the radiating channel is deformed by pressurizing during welding is also avoided.
Description
Technical Field
The invention relates to the technical field of device processing, in particular to a manufacturing method of a radiator and the radiator.
Background
Many equipment can produce a large amount of heats at the during operation, in order to avoid influencing the stability of equipment work, set up the radiator in order to go out these heats dissipation more fast in equipment inside usually, ensure the normal work of equipment. For example, as the integration of electronic devices is continuously improved, the internal power density of electronic devices is also continuously higher, so that the heat productivity of electronic devices is larger and larger, and the service life of electronic devices is seriously affected. The failure probability of the electronic device is increased sharply along with the increase of the working temperature, and the working life of the electronic device is reduced to half of the service life of the previous working temperature every time the working environment temperature of the electronic device is increased by 10 ℃, so that the reliability of the electronic device can be ensured only when the electronic device works in a lower-temperature environment. The increasing heat generation of electronic devices has become a bottleneck limiting the electronic devices to further increase the integration level and improve the performance along moore's law. Therefore, it is necessary to design an efficient heat dissipation means to take out the heat accumulated inside the electronic device and dissipate the heat to the external environment, so as to control the internal operating temperature of the system within the limit of ensuring safe, reliable and high-performance operation. Failure to control the operating temperature of an electronic device within an acceptable range can cause a number of potential problems if the heat dissipation management system is improperly designed, with the most immediate consequences of poor operation, reduced reliability, and even premature failure of the electronic device.
In the conventional radiator manufacturing, a three-dimensional radiator structure is generally divided into a plurality of substructures for welding, and the adoption of hot-press diffusion welding requires large pressure, so that an internal cavity structure, namely a radiating channel, is easy to deform; in addition, when brazing, the brazing filler metal is melted and easily enters the inside of a flow channel in the radiator to cause blockage, and the heat dissipation effect of the radiator is affected.
Disclosure of Invention
Accordingly, there is a need for a method of manufacturing a heat sink and a heat sink that are not prone to blocking a heat sink channel and deformation.
The invention provides a manufacturing method of a radiator, which comprises the following steps:
s10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and manufacturing corresponding basic plates according to each layer of the divided substructures;
s20: selecting one of every two adjacent base plates, forming a solder layer on a contact surface of the base plate, which is used for contacting with the other base plate, and manufacturing an intermediate plate;
s30: and assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembling, wherein the heating temperature is lower than the melting point of the material of the base plate and lower than the melting point of the material of the solder layer, and the material of the solder layer and the material of the base plate can form an intermetallic compound after contacting at the heating temperature.
In one embodiment, the material of the base plate is selected from at least one of copper, aluminum, nickel, silver, and iron.
In one embodiment, the solder layer is made of a material selected from at least one of tin, nickel, titanium, indium, chromium, antimony, and zinc.
In one embodiment, the heating temperature is 0.6Tm～0.95TmWherein T ismIs the melting point of the solder layer material.
In one embodiment, the heating time is 3 hours to 72 hours.
In one embodiment, in step S10, the method for manufacturing the base plate material is at least one selected from the group consisting of laser cutting, wire cutting, machining, flame cutting, plasma cutting and etching.
In one embodiment, in step S20, the solder layer is a plating layer, a chemical vapor deposition layer, a physical vapor deposition layer, a spray coating layer, a metal powder, a powder sintered body, or a flake structure.
In one embodiment, the thickness of the base plate is 0.1 mm-20 mm.
In one embodiment, the thickness of the solder layer is 0.01-50 μm, and the thickness of the solder layer is smaller than that of the base plate.
In one embodiment, the method further includes a step of removing a surface oxidation layer of the intermediate plate and the base plate and/or performing a cleaning process on the intermediate plate and the base plate after step S20 and before step S30.
Further, the invention also provides a radiator, which is obtained by adopting the manufacturing method of the radiator.
In one embodiment, the connecting layer connects adjacent base plates, and the volume content of the intermetallic compound in the connecting layer is 20-60%.
In the manufacturing method of the radiator, the temperature is lower than the melting points of the solder layer material and the base plate material in the heating process, so that intermetallic compounds are generated between the solder layer material and the base plate material, the effective connection between the plate parts of the radiator is realized, and the strength of the radiator is improved. In addition, the manufacturing method of the radiator also avoids the problem that the channel of the radiator is possibly blocked by melting of metal plate materials in the traditional welding process or the problem that the cavity structure in the radiator, namely the radiating channel is deformed by pressurizing in order to realize effective connection during welding to a certain extent.
Detailed Description
The present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein for the purpose of facilitating an understanding thereof. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise. In the description of the present invention, "a plurality" means at least one, e.g., one, two, etc., unless specifically limited otherwise.
The words "preferably," "more preferably," and the like, in the present disclosure mean embodiments of the disclosure that may, in some instances, provide certain benefits. However, other embodiments may be preferred, under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
When a range of values is disclosed herein, the range is considered to be continuous and includes both the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values of the range is included. Further, when multiple range-describing features or characteristics are provided, the ranges may be combined. In other words, unless otherwise indicated, all ranges disclosed herein are to be understood to encompass any and all subranges subsumed therein.
It should be noted that in the description of the present invention, for the orientation words, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and positional relationship indicated are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and should not be construed as limiting the specific scope of protection of the present invention.
In describing positional relationships, unless otherwise specified, when an element such as a layer, film or substrate is referred to as being "on" another layer, it can be directly on the other layer or intervening layers may also be present. Further, when a layer is referred to as being "under" another layer, it can be directly under, or one or more intervening layers may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
Where the terms "comprising," "having," and "including" are used herein, it is intended to cover a non-exclusive inclusion, as another element may be added, unless an explicit limitation is used, such as "only," "consisting of … …," etc.
Unless mentioned to the contrary, terms in the singular may include the plural and are not to be construed as being one in number.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention provides a manufacturing method of a radiator, which comprises the following steps of S10-S30.
Step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and manufacturing corresponding basic plates according to each layer of the divided substructures.
In a specific example, in step S10, the method of preparing the base plate material is selected from at least one of laser cutting, wire cutting, machining, flame cutting, plasma cutting, and etching.
Step S20: one of every two adjacent base plates is selected, and a solder layer is formed on a contact surface of the base plate for contacting the other base plate, thereby manufacturing an intermediate plate.
In a specific example, in step S20, the solder layer is a plating layer, a chemical vapor deposition layer, a physical vapor deposition layer, a spray coating layer, a metal powder, a powder sintered body, or a flake structure.
It will be appreciated that the better the flatness of the surface and the more uniform the thickness of the solder layer will be to provide good contact with the base sheet.
In a specific example, the method further includes a step of removing a surface oxidation layer of the intermediate plate and the base plate and/or performing a cleaning process on the intermediate plate and the base plate after the step S20 and before the step S30.
Step S30: and assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembly, wherein the heating temperature is lower than the melting point of the material of the base plate and lower than the melting point of the material of the solder layer, and the material of the solder layer and the material of the base plate can form an intermetallic compound after contacting at the heating temperature.
In a specific example, the material of the base plate material is selected from at least one of copper, aluminum, nickel, silver, and iron.
It is understood that the material of the base plate material is a metal having high thermal conductivity.
In a specific example, the material of the solder layer is selected from at least one of nickel, tin, titanium, indium, chromium, antimony, and zinc.
It will be appreciated that the material of the solder layer may form a solid intermetallic material with the material of the base sheet material, which may form a reliable connection.
In one specific example, the heating temperature is 0.6Tm～0.95TmWherein T ismIs the melting point of the solder layer material.
Specifically, the higher the temperature, the faster the growth rate of the intermetallic compound, and the shorter the required heat welding time.
In one specific example, the heating time is 3 hours to 72 hours.
It is understood that the heating time may be, but is not limited to, 3 hours, 9 hours, 15 hours, 21 hours, 27 hours, 3 hours, 39 hours, 45 hours, 51 hours, 57 hours, 63 hours, 69 hours, or 72 hours.
Further, the intermetallic compound is generated more as the heating time is longer.
In a specific example, the thickness of the base sheet material is 0.1mm to 20 mm.
Specifically, the thickness of the base sheet material may be, but is not limited to, 0.1mm, 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm, 19mm, or 20 mm.
In a specific example, the thickness of the solder layer is 0.01 μm to 50 μm, and the thickness of the solder layer is smaller than the thickness of the base plate material.
It is understood that the thickness of the solder layer is preferably 3 μm to 5 μm, and particularly, the thickness of the solder layer may be, but is not limited to, 3 μm, 3.5 μm, 4 μm, 4.5 μm, or 5 μm.
In the manufacturing method of the radiator, the temperature is lower than the melting points of the solder layer material and the base plate material in the heating process, so that intermetallic compounds are generated between the solder layer material and the base plate material, the effective connection between the plate parts of the radiator is realized, and the strength of the radiator is improved. In addition, the manufacturing method of the radiator also avoids the problem that the channel of the radiator is possibly blocked by melting of metal plate materials in the traditional welding process or the problem that the cavity structure in the radiator, namely the radiating channel is deformed by pressurizing in order to realize effective connection during welding to a certain extent.
It should be noted that in the case where the contact surface is not flat during the assembly of the panels, a certain pressure is applied to make the contact completely.
The invention also provides a radiator which is obtained by adopting the manufacturing method of the radiator.
In a specific example, the volume content of the intermetallic compound in the connection layer is 20% to 60%.
Specifically, the content by volume of the above intermetallic compound may be, but is not limited to, 20%, 30%, 40%, 50%, or 60%.
It can be understood that the connection layer is a structure for connecting adjacent base plates after the heat sink is manufactured, and the material of the connection layer includes the material of the welding layer and an intermetallic compound generated by the material of the welding layer and the material of the base plates.
Furthermore, in the radiator structure, the thinner the solder layer on the plate, the more the content of the intermetallic compound in the whole connecting layer is, and the higher the strength is, but the brittleness of the plate is larger due to the excessively high content of the intermetallic compound; the smaller the content of the intermetallic compound, the better the toughness of the joint between the sheets, but the too low content results in insufficient joint strength.
Specifically, the method for measuring the volume content of the intermetallic compound is as follows:
grinding and polishing the cross section of the welding line to a mirror surface, corroding a metallographic phase by using acid liquor, shooting a typical section picture by using a scanning electron microscope or an optical microscope, counting the total number A of pixels of the intermetallic compound of the section and the total number B of pixels contained in the connecting layer part in the section picture, wherein A/B is the area fraction of the intermetallic compound, and taking the value as the volume fraction of the intermetallic compound in the connecting layer. At least three different positions of the same welding line are measured, and an average value is obtained.
The following provides specific examples to further explain in detail the method for manufacturing the heat sink of the present invention. In the following examples, all the starting materials are commercially available unless otherwise specified.
Example 1
The embodiment provides a method for manufacturing a radiator, which specifically comprises the following steps:
step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and respectively manufacturing corresponding base plates by utilizing linear cutting according to each layer of the divided substructures, wherein the base plates are made of Al and have the thickness of 5 mm;
step S20: selecting one of every two adjacent base plates, and forming a solder layer on the contact surface of the base plate, which is used for being in contact with the other base plate, by using Ni solder through electroplating, wherein the thickness of the solder layer is 4 microns, and preparing an intermediate plate;
step S30: and (3) assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembly, wherein the heating temperature is 500 ℃, and the heating time is 36 hours.
In the radiator obtained by the manufacturing method of the radiator, the volume fraction of intermetallic compounds (NiAl) at the joints between the plates accounts for 53.4 percent of the volume fraction of the connecting layer.
Example 2
The embodiment provides a method for manufacturing a radiator, which specifically comprises the following steps:
step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and respectively manufacturing corresponding base plates by utilizing an etching method according to each layer of the divided substructures, wherein the base plates are made of copper and have the thickness of 0.4mm
Step S20: selecting one of every two adjacent base plates, and forming a solder layer on a contact surface of the base plate, which is used for being in contact with the other base plate, by using Sn solder through electroplating, wherein the thickness of the solder layer is 6 microns, and preparing an intermediate plate;
step S30: and (3) assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembly, wherein the heating temperature is 220 ℃, and the heating time is 48 hours.
The radiator obtained by the manufacturing method of the radiator and the intermetallic compound (Cu) at the joint between the plates6Sn5And Cu3Sn) was 35.7% by volume of the connection layer.
Example 3
The embodiment provides a method for manufacturing a radiator, which specifically comprises the following steps:
step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and respectively manufacturing corresponding base plates according to each layer of the divided substructures by using an etching method, wherein the base plates are made of copper and have the thickness of 0.4 mm;
step S20: selecting one of every two adjacent base plates, and forming a solder layer on a contact surface of the base plate, which is used for being in contact with the other base plate, by using Sn solder through electroplating, wherein the thickness of the solder layer is 6 microns, and preparing an intermediate plate;
step S30: and (3) assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembly, wherein the heating temperature is 200 ℃, and the heating time is 36 hours.
In the radiator obtained by the manufacturing method of the radiator, the intermetallic compound at the joint between the plates accounts for 24.5 percent of the volume fraction of the connecting layer.
Example 4
The embodiment provides a method for manufacturing a radiator, which specifically comprises the following steps:
step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and respectively manufacturing corresponding base plates according to each layer of the divided substructures by using an etching method, wherein the base plates are made of copper and have the thickness of 0.4 mm;
step S20: selecting one of every two adjacent base plates, and forming a solder layer on a contact surface of the base plate, which is used for being in contact with the other base plate, by using Sn solder through PVD (physical vapor deposition) coating, wherein the thickness of the solder layer is 2 microns, and preparing an intermediate plate;
step S30: and (3) assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembly, wherein the heating temperature is 220 ℃, and the heating time is 48 hours.
In the radiator obtained by the manufacturing method of the radiator, the intermetallic compound at the joint between the plates accounts for 58.7 percent of the volume fraction of the connecting layer.
Comparative example 1
The comparative example provides a manufacturing method of a radiator, which comprises the following specific steps:
step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and respectively manufacturing corresponding base plates according to each layer of the divided substructures by using a laser cutting method, wherein the base plates are made of Cu, and the thickness of the base plates is 0.4 mm;
step S20: selecting one of every two adjacent base plates, and forming a solder layer on a contact surface of the base plate, which is used for being in contact with the other base plate, by using Sn solder through electroplating, wherein the thickness of the solder layer is 2 microns, and preparing an intermediate plate;
step S30: and (3) assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembly, wherein the heating temperature is 100 ℃, and the heating time is 60 hours.
In the radiator obtained by the manufacturing method of the radiator, the volume fraction of the intermetallic compound at the joint between the plates in the connecting layer is 12.3%.
Comparative example 2
The comparative example provides a manufacturing method of a radiator, which comprises the following specific steps:
step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and respectively manufacturing corresponding base plates by utilizing linear cutting according to each layer of the divided substructures, wherein the base plates are made of Cu, and the thickness of the base plates is 5 mm;
step S20: assembling the base plate, pressing under the pressure of 10MPa, manufacturing into a radiator, and heating, wherein the heating temperature is 900 ℃, and the heating time is 2 hours.
Comparative example 3
The comparative example provides a manufacturing method of a radiator, which comprises the following specific steps:
step S10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and respectively manufacturing corresponding base plates by utilizing linear cutting according to each layer of the divided substructures, wherein the base plates are made of Cu, and the thickness of the base plates is 5 mm;
step S20: preparing a Sn3Ag0.5Cu (SAC305) solder sheet with the thickness of 0.1mm according to the connection shape of the plates, and placing the solder sheet between two basic plates;
step S30: and (3) assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembly, wherein the heating temperature is 300 ℃, and the heating time is 8 min.
In the radiator obtained by the manufacturing method of the radiator, the intermetallic compound at the joint between the plates accounts for 10% of the volume fraction of the connecting layer.
Performance testing and results analysis
The method for testing the brittleness of the heat radiator provided by the embodiment and the comparative example specifically comprises the following steps:
the two sheet materials are butted, the contact surface is provided with a solder layer, the two sheet materials are welded by the method to prepare a tensile sample, a universal mechanical testing machine is utilized to test the stress and strain curve of the tensile sample to obtain the elongation of the joint, and the deformation is mainly concentrated on the connecting layer, so the elongation at the position is the integral displacement deformation/the thickness of the connecting layer when the sample is broken by pulling.
The method for testing the pressure drop loss of the radiator provided by the embodiment and the comparative example specifically comprises the following steps:
and introducing a certain amount of water into the radiator to keep flowing, and measuring the pressure difference between the inlet and the outlet of the radiator and the water outlet by using a differential pressure gauge to obtain a numerical value, namely the pressure drop.
Table 1 comparative radiator performance tables provided in examples and comparative examples
The content of intermetallic compounds in a part of areas of the radiator manufactured in the comparative example 1 is too low and is unevenly distributed, so that the bonding strength is insufficient, the elongation is low, the brittleness is high, the radiator manufactured in the comparative example 2 is seriously deformed and has large pressure drop due to pressurization for realizing effective connection, and the brazing filler metal in the brazing of the radiator manufactured in the comparative example 3 is melted to block a channel, so that the pressure drop is high.
In the manufacturing method of the radiator provided by the invention, the temperature is lower than the melting points of the solder layer material and the base plate material in the heating process, so that intermetallic compounds are generated between the solder layer material and the base plate material, the effective connection between the plate parts of the radiator is realized, and the strength of the radiator is improved. In addition, the manufacturing method of the radiator also avoids the problem that the channel of the radiator is possibly blocked by melting of metal plate materials in the traditional welding process or the problem that the cavity structure in the radiator, namely the radiating channel is deformed by pressurizing in order to realize effective connection during welding to a certain extent.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, so as to facilitate the detailed and detailed understanding of the technical solutions of the present invention, but not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. It should be understood that the technical solutions provided by the present invention and obtained by logical analysis, reasoning or limited experiments by those skilled in the art are all within the scope of the appended claims. Therefore, the protection scope of the patent of the invention is subject to the content of the appended claims, and the description can be used for explaining the content of the claims.
Claims (12)
1. A manufacturing method of a radiator is characterized by comprising the following steps:
s10: dividing the radiator into a plurality of layers of substructures along a preset direction according to the design structure of the radiator, and manufacturing corresponding basic plates according to each layer of the divided substructures;
s20: selecting one of every two adjacent base plates, forming a solder layer on a contact surface of the base plate, which is used for contacting with the other base plate, and manufacturing an intermediate plate;
s30: and assembling the intermediate plate and the base plate according to the design structure of the radiator, and heating after assembling, wherein the heating temperature is lower than the melting point of the material of the base plate and lower than the melting point of the material of the solder layer, and the material of the solder layer and the material of the base plate can form an intermetallic compound after contacting at the heating temperature.
2. The method of manufacturing a heat sink as claimed in claim 1, wherein the base plate is made of at least one material selected from the group consisting of copper, aluminum, nickel, silver, and iron.
3. The method for manufacturing a heat sink according to claim 1, wherein the solder layer is made of at least one material selected from the group consisting of tin, nickel, titanium, indium, chromium, antimony, and zinc.
4. The method of claim 1, wherein the heating temperature is 0.6Tm～0.95TmWherein T ismIs that it isMelting point of the solder layer material.
5. The method of claim 1, wherein the heating time is 3 to 72 hours.
6. The method of manufacturing a heat sink as claimed in claim 1, wherein the base plate is manufactured by at least one method selected from the group consisting of laser cutting, wire cutting, machining, flame cutting, plasma cutting and etching in step S10.
7. The method of manufacturing a heat sink as claimed in claim 1, wherein in step S20, the solder layer is a plating layer, a chemical vapor deposition layer, a physical vapor deposition layer, a spray coating layer, a metal powder, a powder sintered body, or a sheet structure.
8. The method of manufacturing a heat sink as claimed in claim 1, wherein the thickness of the base plate is 0.1mm to 20 mm.
9. The method for manufacturing a heat sink according to claim 1, wherein the thickness of the solder layer is 0.01 μm to 50 μm, and the thickness of the solder layer is smaller than the thickness of the base plate.
10. The method for manufacturing a heat sink as claimed in any one of claims 1 to 9, further comprising a step of removing a surface oxide layer on and/or cleaning the intermediate plate and the base plate after step S20 and before step S30.
11. A heat sink obtained by the method of any one of claims 1 to 10.
12. The heat sink of claim 11, wherein a tie layer connects adjacent base plates, the volume content of the intermetallic compound in the tie layer being 20% to 60%.
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| CN115502500A (en) * | 2022-09-13 | 2022-12-23 | 佛山华智新材料有限公司 | Aluminum product with multilayer structure and manufacturing method thereof |
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