CN113873761B - 印制电路板的制作方法及印制电路板 - Google Patents
印制电路板的制作方法及印制电路板 Download PDFInfo
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- CN113873761B CN113873761B CN202111074396.0A CN202111074396A CN113873761B CN 113873761 B CN113873761 B CN 113873761B CN 202111074396 A CN202111074396 A CN 202111074396A CN 113873761 B CN113873761 B CN 113873761B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202111074396.0A CN113873761B (zh) | 2021-09-14 | 2021-09-14 | 印制电路板的制作方法及印制电路板 |
Applications Claiming Priority (1)
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CN202111074396.0A CN113873761B (zh) | 2021-09-14 | 2021-09-14 | 印制电路板的制作方法及印制电路板 |
Publications (2)
Publication Number | Publication Date |
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CN113873761A CN113873761A (zh) | 2021-12-31 |
CN113873761B true CN113873761B (zh) | 2022-09-06 |
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CN202111074396.0A Active CN113873761B (zh) | 2021-09-14 | 2021-09-14 | 印制电路板的制作方法及印制电路板 |
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CN (1) | CN113873761B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1457227A (zh) * | 2002-05-10 | 2003-11-19 | 华通电脑股份有限公司 | 以二次或二次以上压合制成印刷电路板使用的靶位制造方法 |
CN111372382A (zh) * | 2020-04-15 | 2020-07-03 | 黄石广合精密电路有限公司 | 一种pcb板的子母板压合对位设计工艺方法 |
CN111683474A (zh) * | 2020-05-28 | 2020-09-18 | 苏州浪潮智能科技有限公司 | 一种盲孔板加工方法 |
-
2021
- 2021-09-14 CN CN202111074396.0A patent/CN113873761B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1457227A (zh) * | 2002-05-10 | 2003-11-19 | 华通电脑股份有限公司 | 以二次或二次以上压合制成印刷电路板使用的靶位制造方法 |
CN111372382A (zh) * | 2020-04-15 | 2020-07-03 | 黄石广合精密电路有限公司 | 一种pcb板的子母板压合对位设计工艺方法 |
CN111683474A (zh) * | 2020-05-28 | 2020-09-18 | 苏州浪潮智能科技有限公司 | 一种盲孔板加工方法 |
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CN113873761A (zh) | 2021-12-31 |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20211231 Assignee: Jingwang Electronic Technology (Zhuhai) Co.,Ltd. Assignor: KINWONG ELECTRONIC TECHNOLOGY (LONGCHUAN) Co.,Ltd. Contract record no.: X2023980039155 Denomination of invention: Production method and printed circuit board Granted publication date: 20220906 License type: Common License Record date: 20230808 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20211231 Assignee: SHENZHEN KINWONG ELECTRONIC Co.,Ltd. Assignor: KINWONG ELECTRONIC TECHNOLOGY (LONGCHUAN) Co.,Ltd. Contract record no.: X2023980040598 Denomination of invention: Production method and printed circuit board Granted publication date: 20220906 License type: Common License Record date: 20230828 |
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EE01 | Entry into force of recordation of patent licensing contract |