CN113873754A - Copper foil method soft and hard combined circuit board laminated structure and processing technology thereof - Google Patents
Copper foil method soft and hard combined circuit board laminated structure and processing technology thereof Download PDFInfo
- Publication number
- CN113873754A CN113873754A CN202111164270.2A CN202111164270A CN113873754A CN 113873754 A CN113873754 A CN 113873754A CN 202111164270 A CN202111164270 A CN 202111164270A CN 113873754 A CN113873754 A CN 113873754A
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- Prior art keywords
- circuit board
- copper foil
- flexible
- board body
- laminated structure
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 239000011889 copper foil Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000012545 processing Methods 0.000 title claims description 13
- 238000005516 engineering process Methods 0.000 title claims description 8
- 239000010408 film Substances 0.000 claims abstract description 72
- 230000001681 protective effect Effects 0.000 claims abstract description 41
- 238000003475 lamination Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000013039 cover film Substances 0.000 claims abstract description 17
- 238000005452 bending Methods 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 8
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 2
- 238000002679 ablation Methods 0.000 claims 1
- 230000037303 wrinkles Effects 0.000 abstract description 3
- 239000002390 adhesive tape Substances 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 239000003814 drug Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 description 2
- 238000005261 decarburization Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a copper foil method soft and hard combined circuit board laminated structure, which relates to the technical field of printed circuit boards and comprises a circuit board body, wherein the circuit board body comprises a flexible substrate, first copper foil layers are arranged on the front surface and the back surface of the flexible substrate, cover films are attached to the outer sides of the two first copper foil layers, and strippable protective films are attached to the outer sides of the two cover films; the strippable protective film is stripped, other structures of the circuit board body of the flexible area are removed to form flexible bending areas with front and back symmetry of the circuit board, and the cover film positioned in the flexible area can be exposed. According to the invention, the problem of copper foil wrinkle fracture caused by cavity region depression is solved by using the flowing prepreg and not hollowing out the flexible region, and meanwhile, the problem of cavity region layering caused by air pressure difference in the plasma process is improved because the prepreg is not hollowed out, no cavity is formed after lamination, and no air is left.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a copper foil method soft and hard combined circuit board laminated structure.
Background
With the precision and miniaturization of electronics, the HDI structure has occupied almost half of the rigid-flex circuit board type, and HDI is mainly classified into blind holes or buried holes, wherein the buried holes are both formed by mechanical drilling, and the blind holes are formed by laser drilling. At present, laser drilling mainly comprises UV and CO2, the working principle is that a laser beam (laser beam) is converted into heat energy, the processing thickness is within 0.15mm, and the aperture is generally between 0.1mm and 0.15 mm. Therefore, in the laminated structure of the circuit board, all micro blind holes are processed in a copper foil pressing mode. In addition, the structure is also adopted for the rigid-flex circuit board with the thickness of the finished board less than 0.5 mm.
In the multilayer flex-rigid circuit board, a prepreg is required for bonding, but in order to avoid bonding the rigid layers, the prepreg in the flexible region is removed by laser or mechanical means before production and then used. However, when the prepreg in the flexible area is hollowed out, the copper foil in the flexible area is wrinkled or cracked after lamination due to the formed steps, and in the later process, the liquid medicine will remain in the flexible cavity area through the cracked copper foil, so as to bite into the cover film of the flexible layer.
In addition, in the process of manufacturing the rigid-flex circuit board, since the flexible substrate is a PI (polyimide) film, the hole wall is subjected to fiberization to cause hole wall drilling fouling and resin residue. Therefore, the walls of the holes must be cleaned using plasma, which is a process of removing all organic substances from the surface of the material using an ionized gas called plasma, typically oxygen and argon in a vacuum chamber. The prepreg is hollowed out to form a cavity after lamination, and the atmospheric air remained in the cavity can expand and cause a layering phenomenon due to large pressure difference under a plasma vacuum environment
At present, two methods are mainly adopted to solve the problem:
the first method comprises the following steps: that is, before plasma, a vent hole is drilled in the cavity area, but after plasma, the hole needs to be sealed by an acid and alkali resistant liquid medicine adhesive tape, and 100% of the hole needs to be free of liquid medicine permeation, otherwise the liquid medicine enters the cavity from the vent hole. In addition, after the tape is attached, the thickness of the area is higher than that of the board surface, and when a photo-imaging film pressing and exposure are carried out, the hidden troubles of unreal film pressing and poor exposure are brought due to the fact that the board surface is uneven.
The second method comprises the following steps: in the process, before plasma is carried out, rigid layers of copper foils or flexible areas are removed in a depth-controlled laser cutting or mechanical mode, although the method solves the problem of air expansion of a cavity area in a plasma process, a polyimide tape and a part of a covering film attached to the covering film are exposed, the distance between the area attached with the polyimide tape and a soft and hard joint is 0.2-1.0mm, therefore, an actual covering film is exposed at 0.2-1.0mm, and the covering film in the area is bitten when plasma is used for removing glue and chemical copper, so that potential reliability hazards are caused. In addition, the polyimide adhesive tape is a strippable protective adhesive tape, so that the polyimide adhesive tape and the cover film have no bonding force, and in a chemical treatment process after plasma, liquid medicine can permeate between the polyimide adhesive tape and the cover film and cannot be dried by drying equipment of a cleaning line, so that secondary corrosion to the surface of the cover film for a long time is caused. Meanwhile, due to the fact that the copper foil of the flexible area is removed in advance, a pit is formed in the area, in the light imaging film pressing process, the dry film is broken due to the drop at the edge of the pit, and therefore connection open circuit and a bonding pad gap are caused due to dry film residues, and serious hidden danger is caused to quality.
Disclosure of Invention
In order to solve the problems of the prior art, the invention provides a copper foil method soft and hard combined circuit board laminated structure, which comprises a circuit board body, wherein the circuit board body comprises a flexible substrate, the front surface and the back surface of the flexible substrate are respectively provided with a first copper foil layer, cover films are attached to the outer sides of the two first copper foil layers, and strippable protective films are attached to the outer sides of the two cover films;
laminating and laser depth control cutting are respectively carried out on the circuit board body corresponding to the positions of the two sides of the peelable protective film to form flexible regions, and the circuit board body positioned on the two sides of the flexible regions forms rigid regions;
the peelable protective film is peeled off, other structures of the circuit board body of the flexible area are removed, the flexible bending area with symmetrical front and back surfaces of the circuit board is formed, and the covering film positioned in the flexible area can be exposed.
The outer sides of the two first copper foil layers are respectively provided with a flowing prepreg layer, and the outer sides of the two flowing prepreg layers are respectively provided with a second copper foil layer;
the flexible substrate, the first copper foil layer, the flowing prepreg layer and the second copper foil layer are sequentially overlapped from bottom to top and then are firmly combined through lamination.
In a further aspect, the upper end surface of the flexible bending region extends to the uppermost end surface of the circuit board body.
According to a further scheme, two side faces of the two flowing prepreg layers are not hollowed out along the height direction of the flowing prepreg layers.
The strippable protective film is a polyimide strippable protective film.
The invention also provides a processing technology of the circuit board laminated structure, which comprises the following steps:
s1: browning the circuit board body after covering films are attached to the outer sides of the two first copper foil layers;
s2: attaching peelable protective films to the outer sides of the two cover films;
s3: cutting the strippable protective film;
s4: the flexible substrate, the first copper foil layer, the flowing prepreg layer and the second copper foil layer are sequentially overlapped from bottom to top and then are firmly combined through lamination;
s5: after pressing, the prepreg completely fills the cavity area, and air residue is avoided.
Further, the peelable protective film described in S3 may not be cut to the cover film.
Further, the cutting in S3 is performed by UV laser ablation or controlled depth milling.
The invention has the beneficial effects that:
according to the invention, the problem of copper foil wrinkle fracture caused by cavity region depression is solved by using the flowing prepreg and not hollowing out the flexible region, and meanwhile, the problem of cavity region layering caused by air pressure difference in the plasma process is improved because the prepreg is not hollowed out, no cavity is formed after lamination, and no air is left.
Drawings
Fig. 1 is a schematic structural view of a laminated structure of a rigid-flex circuit board according to an embodiment of the present invention, which is not processed according to the processing technique of the embodiment;
FIG. 2 is a schematic structural diagram of a circuit board stacked structure according to an embodiment of the present invention after being processed by the processing process of the present embodiment;
the attached drawings are marked as follows: 1-a rigid region; 2-a flexible zone; 10-a flexible substrate; 11-a first copper foil layer; 12-a flowing prepreg layer; 13-a second copper foil layer; 3-covering the membrane; and 4, stripping the protective film.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1-2, an embodiment 1 of the present invention discloses a laminated structure of a flexible-rigid circuit board by a copper foil method, comprising a circuit board body;
the circuit board body comprises a flexible substrate 10, wherein first copper foil layers 11 are arranged on the front surface and the back surface of the flexible substrate 10, cover films 3 are attached to the outer sides of the two first copper foil layers 11, and peelable protective films 4 are attached to the outer sides of the two cover films 3;
laminating and laser depth control cutting are respectively carried out on the positions of the circuit board body corresponding to the two sides of the peelable protective film 4 to form flexible regions 2, and the circuit board body positioned on the two sides of the flexible regions 2 forms rigid regions 1;
the peelable protective film 4 is peeled off, and other structures of the circuit board body of the flexible area 2 are removed to form flexible bending areas with front and back symmetry of the circuit board, and the cover film 3 positioned on the flexible area 2 can be exposed.
Since the lamination temperature is at least 200 ℃ or higher, a peelable protective film that can resist high temperature and has low viscosity needs to be selected. The high temperature resistance of the protective film is over 400 ℃, and the required characteristics of the strippable protective film in the embodiment are completely met, but the strippable protective film in the application is not limited to the polyimide strippable protective film. The peelable protective film of this embodiment needs to be completely attached to the cover film.
In the embodiment, the flowable prepreg is used, and the flexible area is not hollowed out, so that a cavity is not formed after lamination, and air is not left, and the problem of cavity area layering caused by air pressure difference in the plasma process of production and manufacturing of the printed circuit board is solved.
In this embodiment 1, in order to avoid the phenomenon that the peelable protective film cannot be removed due to the deviation when the rigid segment of the flexible region is removed by depth control cutting or mechanical routing, the distance between both sides of the peelable protective film 4 and the joint of the flexible region 2 and the rigid region 1 on the same side thereof is 0.5mm to 1 mm.
In this embodiment 1, the outer sides of the two first copper foil layers 11 are respectively provided with a flowing prepreg layer 12, and the outer sides of the two flowing prepreg layers 12 are respectively provided with a second copper foil layer 13;
the flexible substrate 10, the first copper foil layer 11, the fluidized prepreg layer 12, and the second copper foil layer 13 are laminated in this order from the bottom to the top, and then are firmly bonded by lamination.
In this embodiment 1, the upper end surface of the flexible bending region extends to the uppermost end surface of the circuit board body.
In example 1, both side surfaces of both the flowing prepreg layers 12 were not hollowed out in the height direction thereof. In the embodiment, the flexible region does not form a cavity after lamination by not performing hollowing on two sides of the flowing prepreg layer.
An embodiment 2 of the present invention discloses a processing technology of a copper foil method soft and hard combined circuit board laminated structure based on the embodiment 1, and the whole flow is as follows:
cutting a flexible substrate, imaging with internal light, etching the inner layer, AOI (argon oxygen decarburization) processing, pasting a covering film, quickly pressing the covering film, browning, pasting and uncovering the covering film, cutting the uncovering film, laminating, drilling, plasma, copper deposition, negative electroplating, imaging with external light, etching the outer layer, AOI (argon oxygen decarburization) processing, solder resist imaging, character deposition, laser controlled deep cutting, uncovering the covering film, shape, electrical measurement, final inspection and packaging.
The invention is characterized in that the invention comprises the following steps of browning, pasting and uncovering a cover film, cutting and laminating the cover film, controlling depth by laser, uncovering and uncovering the cover film, and the rest processes adopt the conventional methods in the field.
The specific implementation processes of the procedures of browning, pasting and uncovering the cover film, cutting, laminating, laser depth control cutting, uncovering the cover film and the like are as follows:
browning: browning the circuit board body after covering films are attached to the outer sides of the two first copper foil layers;
the purpose of browning is to clean the surface of a circuit board before lamination, roughen the copper surface, increase the binding force between a prepreg and the copper surface during pressing, and in the conventional circuit board process, because certain control requirements are provided for time and environmental temperature after browning, the process needs to be carried out before lamination. However, in this embodiment, the peelable protective film needs to be attached to the flexible substrate, and when the peelable protective film passes through the browning horizontal production line after being attached, the peelable protective film may fall off due to the water pressure flushing.
Pasting and uncovering a cover film: attaching peelable protective films to the outer sides of the two cover films;
uncovering and cutting a cover film: cutting the strippable protective film in a laser control depth mode;
the size of the strippable protective film is 0.5mm-1.0mm larger than the single side of the cover film. And cutting the strippable protective film in a depth control mode, but not cutting the covering film, so that the energy and parameters of laser cutting are adjusted, and inspection is well performed in the cutting process.
Laminating: laminating the flexible substrate, the first copper foil layer, the flowing prepreg layer and the second copper foil layer from bottom to top in sequence to realize firm bonding;
after the laminating, the prepreg is completely filled in the cavity area, the prepreg and the strippable protective film are completely adhered together, and the strippable protective film is not adhered to the covering film due to the characteristics of high temperature resistance and non-adhesiveness, so that the strippable effect is formed. Air residue is avoided, and the problem of cavity region delamination caused by air pressure difference in the plasma process is solved.
The fluid prepreg is adopted in the embodiment of the invention, and the fluid prepreg does not need to be hollowed out, because the outer layer of copper foil is too thin (generally 18 mu m), and the milled grooves can cause the phenomenon that the copper foil is folded during pressing.
The lamination process comprises the processes of browning pretreatment, lamination, riveting, lamination of a front board, pressing and the like; since the browning process is performed before the peelable protective film is attached, this process is skipped before lamination.
In the lamination stage, the flowing prepreg and other layers of the circuit board are laminated in sequence according to the structural requirements.
It should be noted that, the disclosure of the present application is only related to the processing technology of the circuit board to be solved by the present application, and other technologies for processing the circuit board in the present application are all existing processing technologies.
According to the invention, the problem of copper foil wrinkle fracture caused by cavity region depression is solved by using the flowing prepreg and not hollowing out the flexible region, and meanwhile, the problem of cavity region layering caused by air pressure difference in the plasma process is improved because the prepreg is not hollowed out, no cavity is formed after lamination, and no air is left.
Finally, only specific embodiments of the present invention have been described in detail above. The invention is not limited to the specific embodiments described above. Equivalent modifications and substitutions by those skilled in the art are also within the scope of the present invention. Accordingly, equivalent alterations and modifications are intended to be included within the scope of the invention, without departing from the spirit and scope of the invention.
Claims (8)
1. The utility model provides a copper foil method soft or hard combines circuit board laminated structure, includes the circuit board body, its characterized in that:
the circuit board body comprises a flexible substrate (10), wherein first copper foil layers (11) are arranged on the front surface and the back surface of the flexible substrate (10), cover films (3) are attached to the outer sides of the two first copper foil layers (11), and peelable protective films (4) are attached to the outer sides of the two cover films (3);
laminating and laser depth control cutting are respectively carried out on the circuit board body corresponding to the positions of two sides of the peelable protective film (4) to form flexible regions (2), and the circuit board body positioned on two sides of the flexible regions (2) forms rigid regions (1);
the peelable protective film (4) is peeled off, other structures of the circuit board body of the flexible area (2) are removed, the flexible bending area with symmetrical front and back surfaces of the circuit board is formed, and the covering film (3) positioned on the flexible area (2) can be exposed.
2. The laminated structure of the copper foil soft and hard combined circuit board of claim 1, wherein:
flowing prepreg layers (12) are respectively arranged on the outer sides of the two first copper foil layers (11), and second copper foil layers (13) are respectively arranged on the outer sides of the two flowing prepreg layers (12);
the flexible substrate (10), the first copper foil layer (11), the flowing prepreg layer (12) and the second copper foil layer (13) are laminated in sequence from bottom to top and then are firmly combined through lamination.
3. The laminated structure of the copper foil soft and hard combined circuit board of claim 1, wherein:
the upper end surface of the flexible bending area extends to the uppermost end surface of the circuit board body.
4. The laminated structure of the copper foil soft and hard combined circuit board according to claim 2, wherein:
two side surfaces of the two flowing prepreg layers (12) are not hollowed out along the height direction of the flowing prepreg layers.
5. The laminated structure of the copper foil soft and hard combined circuit board of claim 1, wherein:
the strippable protective film (4) is a polyimide strippable protective film.
6. A processing technology of a laminated structure of a soft and hard combined circuit board based on a copper foil method according to any one of claims 1 to 5 is characterized in that: the method comprises the following steps:
s1: browning the circuit board body after covering films are attached to the outer sides of the two first copper foil layers;
s2: attaching peelable protective films to the outer sides of the two cover films;
s3: cutting the strippable protective film;
s4: the flexible substrate (10), the first copper foil layer (11), the flowing prepreg layer (12) and the second copper foil layer (13) are sequentially overlapped from bottom to top and then are firmly combined through lamination;
s5: after pressing, the prepreg completely fills the cavity area, and air residue is avoided.
7. The process of claim 6, wherein:
the peelable protective film described in S3 was not cut to the cover film.
8. The process of claim 6, wherein:
the cutting in S3 is performed by UV laser cutting ablation or controlled depth milling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111164270.2A CN113873754A (en) | 2021-09-30 | 2021-09-30 | Copper foil method soft and hard combined circuit board laminated structure and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111164270.2A CN113873754A (en) | 2021-09-30 | 2021-09-30 | Copper foil method soft and hard combined circuit board laminated structure and processing technology thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113873754A true CN113873754A (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111164270.2A Pending CN113873754A (en) | 2021-09-30 | 2021-09-30 | Copper foil method soft and hard combined circuit board laminated structure and processing technology thereof |
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| CN (1) | CN113873754A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114615814A (en) * | 2022-03-18 | 2022-06-10 | 信丰迅捷兴电路科技有限公司 | Manufacturing process of circuit pattern of outer-layer flexible rigid-flexible combined circuit board |
| CN114828459A (en) * | 2022-06-07 | 2022-07-29 | 信丰迅捷兴电路科技有限公司 | Preparation process of laminated structure of outer-layer flexible rigid-flexible combined circuit board |
| CN116828737A (en) * | 2023-08-30 | 2023-09-29 | 圆周率半导体(南通)有限公司 | PCB processing method capable of reducing press fit sagging |
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| CN104349570A (en) * | 2013-08-07 | 2015-02-11 | 富葵精密组件(深圳)有限公司 | Rigid-flexible-combined circuit board and manufacturing method thereof |
| CN104582309A (en) * | 2013-10-14 | 2015-04-29 | 北大方正集团有限公司 | Rigid-flex circuit board and production method thereof |
| CN106793567A (en) * | 2016-12-23 | 2017-05-31 | 东莞康源电子有限公司 | A kind of preparation method of rigid and flexibility plate |
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- 2021-09-30 CN CN202111164270.2A patent/CN113873754A/en active Pending
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| JP2005175114A (en) * | 2003-12-10 | 2005-06-30 | Matsushita Electric Ind Co Ltd | Multilayer printed wiring board and its manufacturing method |
| CN104349570A (en) * | 2013-08-07 | 2015-02-11 | 富葵精密组件(深圳)有限公司 | Rigid-flexible-combined circuit board and manufacturing method thereof |
| CN104582309A (en) * | 2013-10-14 | 2015-04-29 | 北大方正集团有限公司 | Rigid-flex circuit board and production method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114615814A (en) * | 2022-03-18 | 2022-06-10 | 信丰迅捷兴电路科技有限公司 | Manufacturing process of circuit pattern of outer-layer flexible rigid-flexible combined circuit board |
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Application publication date: 20211231 |