CN113853062B - PCB warp magnetic carrier that prevents - Google Patents
PCB warp magnetic carrier that prevents Download PDFInfo
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- CN113853062B CN113853062B CN202111053907.0A CN202111053907A CN113853062B CN 113853062 B CN113853062 B CN 113853062B CN 202111053907 A CN202111053907 A CN 202111053907A CN 113853062 B CN113853062 B CN 113853062B
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- pcb
- magnetic carrier
- metal cover
- cover frame
- curling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Bearings For Parts Moving Linearly (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of semiconductor chip packaging, and provides a PCB anti-curling magnetic carrier, which comprises: magnetic carrier, PCB and metal cover frame; the PCB is arranged between the magnetic carrier and the metal cover frame, and a chip for fusion welding on the PCB is arranged at the top of the PCB; the metal cover frame is of a rectangular frame structure, and an anti-curling rolling mechanism is movably arranged in the metal cover frame; the magnetic carrier is internally provided with a group of cooling mechanisms for reducing the temperature of the bottom surface of the PCB, increasing the hardness of the bottom, and reducing the probability of local warping of the chip while not affecting the melting of the chip on the upper surface of the PCB by properly adjusting the temperature between the upper side and the lower side of the PCB; the driving mechanism is used for driving the anti-curling rolling mechanism to move in the metal cover frame. The invention has the advantages that: the adjustability is strong, the curling-proof capability is high, and the whole is comprehensive.
Description
Technical Field
The invention belongs to the technical field of semiconductor chip packaging, and particularly relates to a PCB anti-curling magnetic carrier.
Background
The flip chip technology is to deposit tin-lead balls on the I/Opad of the chip, then heat the chip, and mount the chip on the substrate by using the combination technology of the molten tin-lead balls and the substrate, wherein the reflow soldering is a conventional heating technology and has the characteristics of simplicity and high efficiency.
However, the substrate is directly heated, and because the thickness of the substrate is limited, warpage is very easy to occur while the substrate is heated completely, so that the levelness of the substrate is changed, the use of the substrate after the installation of the substrate element is affected, and particularly for some substrates with larger areas, the possibility of warpage is very high, and a corresponding solving device is required to be designed for the problem of warpage when the PCB is heated.
Disclosure of Invention
An objective of the embodiments of the present invention is to provide a PCB anti-curling magnetic carrier, which aims to solve the above-mentioned problems.
The invention is realized in that a PCB anti-curling magnetic carrier comprises: magnetic carrier, PCB and metal cover frame; the PCB is arranged between the magnetic carrier and the metal cover frame, a chip for fusion welding on the PCB is arranged at the top of the PCB, and the chip is fused on the PCB by heating after the PCB is stably clamped and fixed under the magnetic action between the magnetic carrier and the metal cover frame; the metal cover frame is arranged into a rectangular frame structure, an anti-curling rolling mechanism is movably arranged in the metal cover frame, and the PCB in a heating state is circularly rolled and pressed through the anti-curling rolling mechanism, so that curling of the PCB is prevented, and meanwhile, the rolling position of the anti-curling rolling mechanism is adjusted to prevent the chip from being crushed; the magnetic carrier is internally provided with a group of cooling mechanisms for reducing the temperature of the bottom surface of the PCB, increasing the hardness of the bottom, and reducing the probability of local warping of the chip while not affecting the melting of the chip on the upper surface of the PCB by properly adjusting the temperature between the upper side and the lower side of the PCB;
the driving mechanism is used for driving the anti-curling rolling mechanism to move in the metal cover frame;
the PCB to be processed is arranged between the magnetic carrier and the metal cover frame, the chip is arranged on the upper side of the PCB, then the PCB is stably limited through the magnetic effect between the magnetic carrier and the metal cover frame, and meanwhile, when the upper side of the PCB is heated, the chip and the PCB are heated and melted, so that the chip is arranged on the PCB, meanwhile, the driving mechanism drives the warping-preventing rolling mechanism to adjust the warping-preventing rolling mechanism to a PCB area of a non-chip, then the warping-preventing rolling mechanism rolls on the PCB, downward pressure is continuously applied to the PCB, the chip is prevented from being warped locally, meanwhile, the cooling mechanism inside the magnetic carrier is started, the temperature of the bottom of the PCB is reduced, the hardness of the PCB is increased, and the probability of the warping of the PCB is further reduced.
According to the PCB anti-curling magnetic carrier, the PCB is fixed through the magnetic effect between the plurality of magnet columns and the metal cover frame metal arranged in the magnetic carrier, so that the PCB is convenient to mount and dismount;
the rolling roller which circularly rolls is arranged in the metal cover frame, so that the rolling roller continuously rolls on the top of the PCB to apply pressure, and the probability of warping of the PCB is reduced; the roller is arranged in a state capable of moving freely locally, so that the position of the roller can be conveniently adjusted according to the position of the chip fused on the PCB, and the roller is prevented from exerting pressure on the chip;
through setting up the cooling mechanism that carries out the appropriate cooling to PCB lower surface in PCB bottom, mutually support with the roller at top, reduce the possibility that PCB takes place to warp jointly.
The invention has the advantages that: the adjustability is strong, the curling-proof capability is high, and the whole is comprehensive.
Drawings
Fig. 1 is a schematic perspective view of a magnetic carrier for preventing warpage of a PCB.
Fig. 2 is a schematic top view of a PCB anti-curling magnetic carrier.
Fig. 3 is a schematic diagram of a front view of a magnetic carrier for preventing warpage of a PCB.
Fig. 4 is a schematic top view of a PCB in a PCB anti-warp magnetic carrier.
Fig. 5 is a schematic structural view of an adjusting support bar in a PCB anti-curling magnetic carrier.
FIG. 6 is an enlarged schematic view of the structure of A1 in FIG. 3;
in the accompanying drawings: the magnetic carrier 10, the PCB11, the metal cover frame 12, the support legs 13, the fixing seat 14, the adjusting support rod 15, the chip 16, the ball screw 17, the nut 18, the roller 19, the buffer layer 20, the locating pin 21, the sliding chute 22, the sliding block 23, the sliding opening 24, the magnet column 25, the refrigerator 27, the heat conducting plate 28, the cold air bin 29, the connecting rotating groove 30, the connecting rotating rod 31, the fastening block 32, the locking bolt 33 and the servo motor 34.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Specific implementations of the invention are described in detail below in connection with specific embodiments.
As shown in fig. 1-3, a structure diagram of a PCB anti-curling magnetic carrier according to an embodiment of the present invention includes: a magnetic carrier 10, a PCB11, and a metal lid frame 12; the PCB11 is arranged between the magnetic carrier 10 and the metal cover frame 12, a chip 16 for fusion welding on the PCB11 is arranged at the top of the PCB11, and the chip 16 is fused on the PCB11 by heating after the PCB11 is stably clamped and fixed under the magnetic action between the magnetic carrier 10 and the metal cover frame 12; the metal cover frame 12 is arranged into a rectangular frame structure, an anti-curling rolling mechanism is movably arranged in the metal cover frame 12, and the PCB11 in a heating state is circularly and rollingly pressed through the anti-curling rolling mechanism, so that curling of the PCB11 is prevented, and meanwhile, the rolling position of the anti-curling rolling mechanism is adjusted to prevent the chip 16 from being crushed; the magnetic carrier 10 is internally provided with a set of cooling mechanisms for reducing the temperature of the bottom surface of the PCB11, increasing the hardness of the bottom, and reducing the probability of local warping of the chip 16 while not affecting the melting of the chip 16 on the upper surface of the PCB11 by properly adjusting the temperature between the upper side and the lower side of the PCB 11;
the driving mechanism is used for driving the anti-curling rolling mechanism to move in the metal cover frame 12;
the PCB11 to be processed is arranged between the magnetic carrier 10 and the metal cover frame 12, the chip 16 is arranged on the upper side of the PCB11, the PCB11 is stably limited through the magnetic action between the magnetic carrier 10 and the metal cover frame 12, and meanwhile, when the upper side of the PCB11 is heated, the chip 16 and the PCB11 are heated and melted, so that the chip 16 is arranged on the PCB11, and meanwhile, the anti-curling rolling mechanism is driven by the driving mechanism to adjust the chip 16 to the PCB11 area of the non-chip 16, then rolls on the PCB11, downward pressure is continuously applied to the PCB11, the chip 16 is prevented from being locally warped, meanwhile, the cooling mechanism inside the magnetic carrier 10 is started, the temperature of the bottom of the PCB11 is reduced, the hardness of the PCB11 is increased, and the probability of the PCB11 warping is further reduced.
In one example of the present invention, the two sides of the bottom of the magnetic carrier 10 are fixedly provided with legs 13 for supporting the magnetic carrier 10 for stable placement; the transverse area of the magnetic carrier 10 and the metal cover frame 12 is larger than that of the PCB11, so that the PCB11 arranged between the magnetic carrier 10 and the metal cover frame 12 can be subjected to comprehensive magnetic extrusion fixing effect. A plurality of magnet columns 25 with cylindrical structures are uniformly arranged on the magnetic carrier 10, and a magnetic fixing function is realized through the magnetic action between the magnet columns 25 and the metal of the metal cover frame 12; the two sides of the top of the metal cover frame 12 are symmetrically provided with fixing seats 14.
As a preferred embodiment of the present invention, the anti-curling rolling mechanism comprises a plurality of rolling rollers 19 connected on the inner side of the metal cover frame 12 in a rolling way, wherein the diameter of the rolling rollers 19 is larger than the thickness of the metal cover frame 12, and the bottom of the rolling rollers 19 can apply pressure on the upper surface of the PCB11 in a rolling way when the metal cover frame 12 is pressed on the top of the PCB 11; the axes of the rolling rollers 19 jointly pass through a rotating rod in a movable way, two ends of the rotating rod are rotatably connected inside the fixed seats 14 on two sides through bearings, the driving mechanism is arranged inside the fixed seat 14 on one side of the rotating rod, and the driving mechanism is rotatably connected with one end of the rotating rod and used for driving the rotating rod to circularly move;
a locating pin 21 is fixedly arranged on a rotating rod at the position of the roller 19, and a locating groove clamped with the locating pin 21 is formed in the roller 19, so that the roller 19 can roll along with the rotating rod under the limiting action of the locating pin 21 and the locating groove; the circumferential outer surface of the roller 19 is provided with a buffer layer 20 for reducing partial pressure when the top of the PCB11 is in contact, and preventing the PCB11 from being damaged due to excessive pressure. Locking bolts 33 are arranged on the rotating rods on both sides of each set of the positioning pins 21, and are used for limiting the position movement of the roller 19 on the rotating rods.
Referring to fig. 4, as a preferred embodiment of the present invention, an adjusting support rod 15 with a rectangular structure is disposed on the metal cover frame 12 between adjacent rollers 19, sliding openings 24 with the same direction as the circulating movement direction of the driving mechanism driving positioning pins 21 are formed in the adjusting support rod 15, sliding openings 24 are formed on opposite side walls of the fixing seats 14 at two ends, sliding blocks 23 are fixedly mounted at the bottoms of two ends of the adjusting support rod 15, the sliding blocks 23 are slidably connected in sliding grooves 22 on two top walls of the metal cover frame 12, and the distance between the adjusting support rods 15 can be adjusted by slidably connecting the sliding blocks 23 with the sliding grooves 22, so that fine adjustment of the distance between the adjacent rollers 19 can be performed. The top side of the slider 23 is provided with a fastening block 32 for restricting the slider 23 from sliding inside the chute 22.
Referring to fig. 5, as a preferred embodiment of the present invention, the driving mechanism includes a ball screw 17 rotatably connected to the inside of the fixed seat 14, a servo motor 34 rotatably connected to one end of the ball screw 17, a nut 18 movably connected to the ball screw 17, a connection post fixedly installed on one side of the nut 18 facing the roller 19, a connection rotating groove 30 formed in the connection post, a connection rotating rod 31 rotatably connected to the inside of the connection rotating groove 30, and an outer end of the connection rotating rod 31 fixedly connected to one end of the rotating rod, wherein the ball screw 17 is driven to rotate by starting the servo motor 34, then the nut 18 is driven to move circularly, and then the rotating rod is driven to rotate together with the roller 19 at the top of the PCB11 under the rotational connection of the connection rotating groove 30 and the connection rotating rod 31.
As a preferred embodiment of the present invention, the cooling mechanism includes a heat conducting plate 28 disposed on the top wall of the magnetic carrier 10, a cold air bin 29 is disposed inside the magnetic carrier 10 at the bottom of the heat conducting plate 28, a refrigerator 27 fixed at the outer bottom of the magnetic carrier 10 is connected to the bottom of the cold air bin 29, cold air is generated by operation of the refrigerator 27 and transmitted to the inside of the cold air bin 29, and then the bottom of the PCB11 is cooled by using the heat conducting property of the heat conducting plate 28, so as to increase the hardness thereof, thereby reducing the probability of warpage.
In the above embodiment of the present invention, when in use, the PCB11 is firstly placed on the upper side of the magnetic carrier 10, then the metal cover 12 is attached to the top of the PCB11, the PCB11 is tightly attached between the magnetic carrier 10 and the metal cover 12 by the magnetic action between the plurality of magnet posts 25 inside the magnetic carrier 10 and the metal cover 12, then when in heating, according to the position of the chip 16 placed on the PCB11, the rolling roller 19 is separated from the chip 16 as far as possible by sliding between the sliding block 23 and the sliding groove 22, meanwhile, the servo motor 34 is started to operate, the ball screw 17 is driven to rotate to drive the nut 18 to move circularly, then under the rotational connection of the rotary groove 30 and the rotary rod 31, the rotary rod is driven to move circularly inside the metal cover 12, meanwhile, the rolling roller 19 rolls on the top of the PCB11 under the action of friction force, meanwhile, the upper surface of the PCB11 is applied with downward pressure, the upper surface of the PCB11 is prevented from warping due to temperature rise, and meanwhile, the rolling roller 19 is started to the bottom of the PCB11 is started to operate through the sliding between the sliding block 23 and the sliding plate 22, and then the rolling roller 19 is prevented from warping by the soft heat conduction plate 28, and then the rolling roller 19 is cooled down to the top of the PCB is prevented from being matched with the top of the PCB 11.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (3)
1. A PCB anti-curling magnetic carrier, the PCB anti-curling magnetic carrier comprising:
magnetic carrier, PCB and metal cover frame; the PCB is arranged between the magnetic carrier and the metal cover frame, and a chip for fusion welding on the PCB is arranged at the top of the PCB;
the metal cover frame is of a rectangular frame structure, an anti-curling rolling mechanism is movably arranged in the metal cover frame, the anti-curling rolling mechanism circularly rolls and presses the PCB in a heating state, curling of the PCB is prevented, and meanwhile, the rolling position of the anti-curling rolling mechanism is adjusted to prevent the chip from being crushed;
the magnetic carrier is internally provided with a group of cooling mechanisms for reducing the temperature of the bottom surface of the PCB, increasing the hardness of the bottom, properly adjusting the temperature between the upper side and the lower side of the PCB, and reducing the probability of local warping of the chip while not affecting the melting of the chip on the upper surface of the PCB;
the driving mechanism is used for driving the anti-curling rolling mechanism to move in the metal cover frame; the transverse area of the magnetic carrier and the metal cover frame is larger than that of the PCB; a plurality of magnet columns with cylindrical structures are uniformly arranged on the magnetic carrier; fixing seats are symmetrically arranged on two sides of the top of the metal cover frame; the rolling mechanism comprises a plurality of rolling rollers which are connected to the inner side of the metal cover frame in a rolling way, the axes of the rolling rollers jointly penetrate through a rotating rod, two ends of the rotating rod are connected to the inside of fixing seats on two sides in a rotating way through bearings, the driving mechanism is arranged in the fixing seats on one side of the fixing seats, and the driving mechanism is connected with one end of the rotating rod in a rotating way; a locating pin is fixedly arranged on a rotating rod positioned at the position of the roller, and a locating groove clamped with the locating pin is formed in the roller; the driving mechanism comprises a ball screw which is rotationally connected inside the fixing seat, a servo motor is rotationally connected to the outer part of one end of the ball screw, a nut is movably connected to the ball screw, a connecting column is fixedly arranged on one side of the nut, facing the roller, of the nut, a connecting rotary groove is formed in the connecting column, a connecting rotary rod is rotationally connected to the inner part of the connecting rotary groove, and the outer end of the connecting rotary rod is fixedly connected with one end of the rotary rod; the cooling mechanism comprises a heat-conducting plate arranged on the top wall of the magnetic carrier, a cold air bin is arranged in the magnetic carrier at the bottom of the heat-conducting plate, and a refrigerator fixed at the outer bottom of the magnetic carrier is communicated with the bottom of the cold air bin.
2. The PCB anti-curling magnetic carrier of claim 1, wherein a circumferential outer surface of the roller is provided with a buffer layer; locking bolts are arranged on the rotating rods on two sides of each set of locating pins; the diameter of the roller is larger than the thickness of the metal cover frame.
3. The PCB anti-curling magnetic carrier of claim 2, wherein an adjusting support rod with a rectangular structure is arranged on the metal cover frame between the adjacent rolling rollers, sliding ports with the same circulating movement direction as the driving mechanism driving positioning pins are formed in the adjusting support rod, sliding ports are formed in the side walls of the two ends opposite to the fixed seats, sliding blocks are fixedly arranged at the bottoms of the two ends of the adjusting support rod, and the sliding blocks are in sliding connection with sliding grooves on the two top walls of the metal cover frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053907.0A CN113853062B (en) | 2021-09-09 | 2021-09-09 | PCB warp magnetic carrier that prevents |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053907.0A CN113853062B (en) | 2021-09-09 | 2021-09-09 | PCB warp magnetic carrier that prevents |
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| Publication Number | Publication Date |
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| CN113853062A CN113853062A (en) | 2021-12-28 |
| CN113853062B true CN113853062B (en) | 2023-06-27 |
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| CN202111053907.0A Active CN113853062B (en) | 2021-09-09 | 2021-09-09 | PCB warp magnetic carrier that prevents |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209390471U (en) * | 2018-11-16 | 2019-09-13 | 江门市唯是半导体科技有限公司 | A kind of chip and the automatic bonding equipment of glass substrate |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10217424A (en) * | 1997-02-06 | 1998-08-18 | Itsukou:Kk | Mechanism for correcting warp of board to be printed in screen printer |
| JP2002172760A (en) * | 2000-12-08 | 2002-06-18 | Canon Inc | Offset printing apparatus |
| US6857559B2 (en) * | 2003-04-10 | 2005-02-22 | Visteon Global Technologies, Inc. | System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process |
| JP2015149452A (en) * | 2014-02-07 | 2015-08-20 | 株式会社タムラ製作所 | Warp suppressing device and reflow device |
| CN207338327U (en) * | 2017-11-02 | 2018-05-08 | 上海美维科技有限公司 | A kind of ultra-thin packed substrate levelling warpage device |
| CN208142163U (en) * | 2018-04-19 | 2018-11-23 | 苏州固锝电子股份有限公司 | Even-heating carrier for IC chip |
| CN109530483A (en) * | 2018-12-13 | 2019-03-29 | 信丰文峰电子科技有限公司 | A kind of flattening mechanism of metal bending plate |
| CN112804815A (en) * | 2021-01-28 | 2021-05-14 | 江苏运鸿辉电子科技有限公司 | LED lamp pressfitting apron |
| CN113194624A (en) * | 2021-04-25 | 2021-07-30 | 深圳名仕堂贸易有限公司 | Warping processing device and process for PCB |
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2021
- 2021-09-09 CN CN202111053907.0A patent/CN113853062B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209390471U (en) * | 2018-11-16 | 2019-09-13 | 江门市唯是半导体科技有限公司 | A kind of chip and the automatic bonding equipment of glass substrate |
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| CN113853062A (en) | 2021-12-28 |
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Effective date of registration: 20230605 Address after: Building 18, Shapuwei Maozhou Industrial Zone, Songgang Street, Bao'an District, Shenzhen City, Guangdong Province, 518127 Applicant after: Henghai Electronics (Shenzhen) Co.,Ltd. Address before: 223010 No. 17, Jixian Road, Huai'an Economic and Technological Development Zone, Huai'an City, Jiangsu Province Applicant before: ASEP TECHNOLOGY HUAI'AN Co.,Ltd. |
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