CN113851601B - Organic light-emitting display panel and electronic equipment - Google Patents
Organic light-emitting display panel and electronic equipment Download PDFInfo
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- CN113851601B CN113851601B CN202111142992.8A CN202111142992A CN113851601B CN 113851601 B CN113851601 B CN 113851601B CN 202111142992 A CN202111142992 A CN 202111142992A CN 113851601 B CN113851601 B CN 113851601B
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- cover plate
- organic light
- display panel
- emitting display
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- 239000010410 layer Substances 0.000 claims abstract description 82
- 239000012790 adhesive layer Substances 0.000 claims abstract description 32
- 238000010521 absorption reaction Methods 0.000 claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000000149 argon plasma sintering Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005245 sintering Methods 0.000 abstract description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the disclosure provides an organic light-emitting display panel and an electronic device, wherein the organic light-emitting display panel at least comprises the following components in sequence: the energy absorption layer, the cover plate, the packaging adhesive layer and the display substrate; the organic light-emitting display panel comprises a display area and a peripheral area, wherein the packaging adhesive layer is arranged in the peripheral area and surrounds the display area; the energy absorption layer is arranged on the cover plate, and the orthographic projection of the energy absorption layer on the cover plate covers the orthographic projection of the packaging adhesive layer on the cover plate and is used for absorbing heat energy in the laser sintering process. According to the embodiment of the disclosure, the structure of the cover plate is improved, the energy absorption layer is arranged on the cover plate, the orthographic projection of the energy absorption layer on the cover plate covers the orthographic projection of the encapsulation adhesive layer on the cover plate, and then when laser sintering is carried out, part of heat energy in the laser sintering process can be taken away, so that the sintering effect is ensured, and the problems of SD signal line and fraction short circuit and the like caused by deviation and widening of the encapsulation adhesive layer are avoided.
Description
Technical Field
The disclosure relates to the field of display, and in particular, to an organic light emitting display panel and an electronic device.
Background
The Frit package (i.e. glass Frit package) is a packaging mode used for AMOLED (i.e. active matrix organic light emitting diode) products, and the packaging is completed by performing a laser (laser sintering) process, so as to adhere TSP (cover plate) and BP (back plate) together, and prevent gas and water vapor in air from entering the screen, and affecting evaporation materials.
However, in the process of sintering after the printing of the crit glue, if the design or process Margin is insufficient, the crit glue is caused to deviate or widen, and then the adjacent SD signal lines (namely, the source signal line and the drain signal line) are caused to melt, so that the SD signal line is in short circuit with the crit sub (namely, the metal layer corresponding to the crit glue packaging area), and abnormal display phenomenon occurs, which affects the performance of the device.
Disclosure of Invention
In view of this, an embodiment of the present disclosure provides an organic light emitting display panel and an electronic device for solving the following problems in the prior art: in the process of sintering after the Frit glue is printed, the Frit glue can shift or widen, so that the nearby SD signal line is caused to be melted, the SD signal line and the Frit sub are short-circuited, and abnormal display occurs.
In one aspect, an embodiment of the present disclosure provides an organic light emitting display panel, including at least: the energy absorption layer, the cover plate, the packaging adhesive layer and the display substrate; the organic light-emitting display panel comprises a display area and a peripheral area, wherein the packaging adhesive layer is arranged in the peripheral area and surrounds the display area; the energy absorption layer is arranged on the cover plate, and the orthographic projection of the energy absorption layer on the cover plate covers the orthographic projection of the packaging adhesive layer on the cover plate and is used for absorbing heat energy in the laser sintering process.
In some embodiments, the material of the energy absorbing layer comprises indium tin oxide.
In some embodiments, the organic light emitting display panel further includes a touch structure that does not overlap with an orthographic projection of the energy absorbing layer on the cover plate.
In some embodiments, the touch structure is disposed on the same layer as the energy absorbing layer.
In some embodiments, the width of the energy absorbing layer is greater than the width of the encapsulation glue layer in a direction perpendicular to the extension of the encapsulation glue layer.
In some embodiments, the display substrate further comprises: the packaging adhesive layer is arranged between the metal layer and the cover plate, and the metal layer is close to one side surface of the packaging adhesive layer and comprises a plurality of grooves.
In some embodiments, the metal layer includes a first power signal line and/or a second power signal line, the first power signal line and/or the second power signal line including a plurality of hollowed-out areas, the hollowed-out areas overlapping the encapsulation glue layer.
In some embodiments, the metal layer further comprises: and a third signal line, wherein a spacing area is arranged between the third signal line and the first power signal line and/or the second power signal line in the extending direction perpendicular to the packaging adhesive layer, and the energy absorption layer at least covers the spacing area.
In some embodiments, the organic light emitting display panel further includes a thin film transistor disposed on the substrate back plate, the thin film transistor including an active layer, a gate electrode, and a source drain electrode, the metal layer being disposed on the same layer as the source drain electrode.
In some embodiments, the encapsulation glue layer material comprises a glass glue.
In another aspect, an embodiment of the present disclosure provides an electronic device, including at least: the organic light emitting display panel of any of the embodiments of the present disclosure.
According to the embodiment of the disclosure, the structure of the cover plate is improved, the energy absorption layer is arranged on the cover plate, the orthographic projection of the energy absorption layer on the cover plate is covered on the orthographic projection of the packaging adhesive layer on the cover plate, and then when laser sintering is carried out, part of heat energy in the laser sintering process can be taken away, so that the sintering effect is ensured, the problem that SD signal lines are short-circuited with the fraction and the like due to deviation and widening of the packaging adhesive layer is avoided, normal production and normal display of the device are realized, and the product yield is obviously improved.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
Fig. 1 is a schematic diagram of a portion of a cross-section of an organic light emitting display panel according to an embodiment of the disclosure;
fig. 2 is a schematic diagram showing a partial cross section of an organic light emitting display panel according to an embodiment of the disclosure;
fig. 3 is a schematic diagram of a portion of a cross-section of an organic light emitting display panel according to an embodiment of the disclosure;
fig. 4 is a schematic view of an arrangement of energy absorbing layers provided by an embodiment of the present disclosure.
Reference numerals:
1-energy absorption layer, 2-cover plate, 3-packaging adhesive layer, 4-display substrate, 41-metal layer, 42-substrate back plate and 5-source drain electrode.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed description of known functions and known components.
The embodiment of the disclosure provides an organic light emitting display panel, a partial cross-section of which is schematically shown in fig. 1, at least comprising:
the energy absorption layer 1, the cover plate 2, the packaging adhesive layer 3 and the display substrate 4; the organic light-emitting display panel comprises a display area and a peripheral area, wherein the packaging adhesive layer is arranged in the peripheral area and surrounds the display area; the energy absorption layer is arranged on the cover plate, and the orthographic projection of the energy absorption layer on the cover plate covers the orthographic projection of the packaging adhesive layer on the cover plate and is used for absorbing heat energy in the laser sintering process.
Fig. 1 is a schematic cross-sectional view of the vicinity of a peripheral region modified in accordance with an embodiment of the present invention, and is not an overall structure of the entire organic light emitting display panel.
According to the embodiment of the disclosure, the structure of the cover plate is improved, the energy absorption layer is arranged on the cover plate, the orthographic projection of the energy absorption layer on the cover plate is covered on the orthographic projection of the packaging adhesive layer on the cover plate, and then when laser sintering is carried out, part of heat energy in the laser sintering process can be taken away, so that the sintering effect is ensured, the problem that SD signal lines are short-circuited with the fraction and the like due to deviation and widening of the packaging adhesive layer is avoided, normal production and normal display of the device are realized, and the product yield is obviously improved.
In particular, in order to ensure the performance of the cover plate, the material of the energy absorbing layer is preferably ITO (i.e., indium tin oxide), however, other materials that have no influence on the display of the cover plate and can absorb heat energy may be selected, and details thereof will not be repeated here.
In particular, the material of the encapsulation adhesive layer is preferably glass adhesive.
The organic light-emitting display panel can further comprise a touch structure, the touch structure and the orthographic projection of the energy absorption layer on the cover plate are not overlapped, namely, the touch structure is arranged in a display area of the organic light-emitting display panel, and the touch structure and the energy absorption layer are arranged on the same layer.
Based on the above structure, the material setting of the energy absorption layer of the disclosed embodiment is ITO, and other beneficial effects can also exist, namely under the condition that ITO is adopted, the touch function can also be realized in the region corresponding to the energy absorption layer, and then under the condition that the peripheral region also needs touch, the structure of the touch material adjusting cover plate is not required to be additionally increased. In particular, in order to ensure the touch demand, the energy absorbing layer may be configured to include a plurality of discontinuous areas, and each discontinuous area corresponds to one touch point, so that the increased energy absorbing layer not only can absorb heat energy, but also can be used as a part of the screen, and the edge area of the screen is ensured to be also capable of being touched.
In order to ensure the best thermal energy absorption effect, the width of the energy absorption layer is preferably greater than or equal to the width of the encapsulation glue layer in the extending direction perpendicular to the encapsulation glue layer.
As shown in fig. 2, the display substrate may further include a metal layer 41 and a substrate back plate 42, where the encapsulation adhesive layer is disposed between the metal layer and the cover plate, and the metal layer is close to a side surface of the encapsulation adhesive layer and includes a plurality of grooves.
The metal layer comprises a first power signal line and/or a second power signal line (namely VDD/VSS), wherein the first power signal line and/or the second power signal line comprises a plurality of hollowed-out areas, and the hollowed-out areas are overlapped with the packaging adhesive layer. The metal layer further includes a third signal line (i.e., an ESTV, a gate start signal, EMGOA Start Vertical), and a space region is formed between the third signal line and the first power signal line and/or the second power signal line in a direction perpendicular to the extension direction of the encapsulation layer, and the energy absorbing layer covers at least the space region.
The organic light emitting display panel further comprises a thin film transistor arranged on the substrate backboard, the thin film transistor comprises an active layer, a grid electrode and a source drain electrode, the metal layer 41 and the source drain electrode 5 are arranged on the same layer, and the position of the metal layer 41 and the position of the source drain electrode 5, which are arranged on the same layer, are schematically shown in fig. 3. The source/drain electrode material at least comprises aluminum component, and the melting point of aluminum is low, so that the problem of melting aluminum is solved by the design.
In all products using CELL ET mode at present, signal lines at two ends are led in from pad (signal line area is led in when equipment and screen contact) through SD, and are connected with lower gate line (grid line) through punching mode, and the punching position of SD line at the outermost side of two ends is T-shaped design, two ends of T-shaped are respectively 22um long, the distance between punching position and the limit is 8-9um, and the limit and source drain are in the same layer. As shown in fig. 4, a part of layers is simplified, and only the relation between the discretely arranged energy absorbing layer and the wait sub (i.e. the metal layer) is shown, and by changing the structural design of the TSP, the embodiment of the disclosure is equivalent to adding an energy absorbing layer with shielding effect above the wait sub, so as to block part of thermal energy, and make the temperature transferred to the source and drain not to melt Al, thereby improving such defects.
The embodiment of the disclosure further provides an electronic device, which at least includes the above-mentioned organic light emitting display panel, and the structure of the organic light emitting display panel is not described herein.
Furthermore, although exemplary embodiments have been described herein, the scope thereof includes any and all embodiments having equivalent elements, modifications, omissions, combinations (e.g., of the various embodiments across schemes), adaptations or alterations based on the present disclosure. Elements in the claims are to be construed broadly based on the language employed in the claims and are not limited to examples described in the present specification or during the practice of the present application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as exemplary only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.
The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. In addition, in the above detailed description, various features may be grouped together to streamline the disclosure. This is not to be interpreted as an intention that the disclosed features not being claimed are essential to any claim. Rather, the disclosed subject matter may include less than all of the features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with one another in various combinations or permutations. The scope of the disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
While various embodiments of the present disclosure have been described in detail, the present disclosure is not limited to these specific embodiments, and various modifications and embodiments can be made by those skilled in the art on the basis of the concepts of the present disclosure, and these modifications and modifications should be within the scope of the present disclosure as claimed.
Claims (6)
1. An organic light emitting display panel, comprising, in order:
the energy absorption layer, the cover plate, the packaging adhesive layer and the display substrate; wherein,,
the organic light-emitting display panel comprises a display area and a peripheral area, wherein the packaging adhesive layer is arranged in the peripheral area and surrounds the display area;
the energy absorption layer is arranged on the cover plate, and orthographic projection of the energy absorption layer on the cover plate covers orthographic projection of the packaging adhesive layer on the cover plate and is used for absorbing heat energy in a laser sintering process;
the material of the energy absorption layer comprises indium tin oxide, the organic light-emitting display panel further comprises a touch structure, and the touch structure is not overlapped with orthographic projection of the energy absorption layer on the cover plate;
the energy absorption layer comprises a plurality of discontinuous areas, each discontinuous area corresponds to one touch point, and the touch points are distributed along the periphery area so as to realize a multi-point touch function;
the display substrate further includes: the packaging adhesive layer is arranged between the metal layer and the cover plate, and the metal layer is close to one side surface of the packaging adhesive layer and comprises a plurality of grooves;
the metal layer comprises a first power supply signal wire and/or a second power supply signal wire, the first power supply signal wire and/or the second power supply signal wire comprise a plurality of hollowed-out areas, and the hollowed-out areas are overlapped with the packaging adhesive layer;
the metal layer further includes: and a third signal line, wherein a spacing area is arranged between the third signal line and the first power signal line and/or the second power signal line in the extending direction perpendicular to the packaging adhesive layer, and the energy absorption layer at least covers the spacing area.
2. The organic light emitting display panel of claim 1, wherein the touch structure is disposed on the same layer as the energy absorbing layer.
3. The organic light-emitting display panel according to claim 1, wherein a width of the energy absorbing layer is greater than a width of the encapsulation adhesive layer in an extending direction perpendicular to the encapsulation adhesive layer.
4. The organic light-emitting display panel according to claim 1, further comprising a thin film transistor disposed on the substrate back plate, the thin film transistor comprising an active layer, a gate electrode, and a source drain electrode, the metal layer being disposed in the same layer as the source drain electrode.
5. The organic light-emitting display panel of claim 1, wherein the encapsulation glue layer material comprises a glass glue.
6. An electronic device, comprising at least: the organic light emitting display panel of any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111142992.8A CN113851601B (en) | 2021-09-28 | 2021-09-28 | Organic light-emitting display panel and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111142992.8A CN113851601B (en) | 2021-09-28 | 2021-09-28 | Organic light-emitting display panel and electronic equipment |
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| Publication Number | Publication Date |
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| CN113851601A CN113851601A (en) | 2021-12-28 |
| CN113851601B true CN113851601B (en) | 2023-08-01 |
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| TWI811946B (en) * | 2022-01-06 | 2023-08-11 | 友達光電股份有限公司 | Stretchable display panel |
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| CN107342371B (en) * | 2017-08-25 | 2019-03-22 | 上海天马有机发光显示技术有限公司 | Organic light emitting display panel and preparation method thereof, organic light-emitting display device |
| CN109950427B (en) * | 2019-04-17 | 2021-11-05 | 京东方科技集团股份有限公司 | Vacuum sintering device and organic layer sintering process |
| CN110289289B (en) * | 2019-06-24 | 2021-04-20 | 昆山国显光电有限公司 | Display panel and display device |
| CN113327946A (en) * | 2021-06-04 | 2021-08-31 | 京东方科技集团股份有限公司 | Display panel and display device |
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