CN113808892B - Composite thermal subassembly and method of making the same - Google Patents
Composite thermal subassembly and method of making the same Download PDFInfo
- Publication number
- CN113808892B CN113808892B CN202111110116.7A CN202111110116A CN113808892B CN 113808892 B CN113808892 B CN 113808892B CN 202111110116 A CN202111110116 A CN 202111110116A CN 113808892 B CN113808892 B CN 113808892B
- Authority
- CN
- China
- Prior art keywords
- composite
- powder
- solder
- cathode tube
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 107
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000011812 mixed powder Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000005245 sintering Methods 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 9
- 238000003466 welding Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 33
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 239000011733 molybdenum Substances 0.000 claims description 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 238000000462 isostatic pressing Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 3
- JPNWDVUTVSTKMV-UHFFFAOYSA-N cobalt tungsten Chemical compound [Co].[W] JPNWDVUTVSTKMV-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 claims description 3
- OUFGXIPMNQFUES-UHFFFAOYSA-N molybdenum ruthenium Chemical compound [Mo].[Ru] OUFGXIPMNQFUES-UHFFFAOYSA-N 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910000531 Co alloy Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910000929 Ru alloy Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 description 11
- 239000002245 particle Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/08—Manufacture of heaters for indirectly-heated cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/13—Solid thermionic cathodes
- H01J1/20—Cathodes heated indirectly by an electric current; Cathodes heated by electron or ion bombardment
- H01J1/22—Heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
- H01J23/02—Electrodes; Magnetic control means; Screens
- H01J23/04—Cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/18—Assembling together the component parts of electrode systems
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Solid Thermionic Cathode (AREA)
Abstract
The present disclosure provides a composite thermal subassembly and method of making the same, the method comprising: mixing the insulating powder and the metal powder to obtain mixed powder, and synchronously expanding and contracting the insulating powder and the metal powder; compacting the mixed powder to obtain a bar; sintering the bar material to obtain a blank; turning the blank to obtain a composite heater (5); and bonding the cathode tube (2) and the electrode (7) at two ends of the composite heater (5) respectively by using welding materials (6) to obtain the composite heater assembly. The preparation method disclosed by the invention is simple in process, and the cathode composite thermal sub-assembly which is high in reliability, small in volume, high in efficiency, uniform in heating and free of magnetic field can be prepared.
Description
Technical Field
The present disclosure relates to the field of microwave vacuum electronic devices, and more particularly, to a composite thermal subassembly and a method for manufacturing the same.
Background
The microwave vacuum electronic device is widely applied to the aspects of radars, satellite communication, electronic accelerators, global positioning, controllable thermonuclear fusion, future military advanced high-power microwave weapons and the like, and has unique functions and excellent performances, and particularly can not be replaced by other devices under the conditions of high power and high frequency band. The part of the microwave vacuum device that heats the cathode is called a heater or a thermal subassembly.
The rapid start-up and long life requirements of microwave devices in recent years present a higher technical challenge for the performance of the thermionic device, requiring a great deal of intensive research effort in how to shorten the preheating time and reduce the heating power. The main methods adopted at present are as follows: improving the heating structure and shielding, increasing the radiation capacity of the thermal sub-insulation layer, and making a so-called cathode thermal sub-assembly. The conventional preparation method of the heat comprises the following steps: winding: the tungsten or tungsten alloy wire is wound into a heat with a required structure and resistance by using a wire winding machine and a special heat die. Shaping: putting the heat fixed on the shaping mould in a molybdenum boat, putting the molybdenum boat into a hydrogen furnace, heating to a certain temperature, maintaining for a certain time, powering off, cooling to room temperature, and taking out. However, the conventional preparation method of the heat has some disadvantages: the preheating time of the cathode is prolonged; the heating efficiency is low; the working temperature of the heat is high; the vibration and impact resistance is poor.
The conventional thermal subassembly is a combination body formed by filling insulating filler in a gap between an indirect cathode and a heater and sintering, and the mode of heating the cathode by the heater changes heat radiation into heat conduction to heat, and the structure is shown in figure 1. However, such conventional thermal subassemblies still have many drawbacks such as short circuit of hot wires, large volume, insufficient thermal efficiency, magnetic field generation at the cathode surface, and influence of electron emission performance.
Disclosure of Invention
First, the technical problem to be solved
Aiming at the prior art problems, the present disclosure provides a composite thermal subassembly and a preparation method thereof, which are used for at least partially solving the above technical problems.
(II) technical scheme
The present disclosure provides a method of making a composite thermal subassembly, comprising: mixing the insulating powder and the metal powder to obtain mixed powder, and synchronously expanding and contracting the insulating powder and the metal powder; compacting the mixed powder to obtain a bar; sintering the bar material to obtain a blank; turning the blank to obtain a composite heater 5; the cathode tube 2 and the electrode 7 are bonded to both ends of the composite heat 5 using the solder 6, respectively, to obtain a composite heat sub-assembly.
Optionally, the metal powder comprises 10% -50% by volume.
Optionally, compacting the mixed powder to obtain a rod comprises: and (3) tamping the mixed powder to a close-packed structure, and pressing the mixed powder by isostatic pressing or a die to obtain the bar, wherein the isostatic pressing pressure is 50-500 Mpa.
Optionally, the mixed powder is milled prior to compacting the mixed powder.
Optionally, sintering the bar to obtain a green body comprises: sintering the bar material for 1-3 h at 1500-2000 ℃ to obtain a blank.
Alternatively, bonding the cathode tube 2 and the electrode 7 to both ends of the composite heat 5, respectively, using the solder 6, to obtain a composite heat sub-assembly includes: preparing solder 6 by using an organic solvent to obtain solder paste; placing solder paste between the composite heat 5 and the cathode tube 2 and between the composite heat 5 and the electrode 7 to obtain a composite heat subassembly blank; heating the composite thermal sub-assembly blank to the molten solder paste, and cooling to obtain a composite thermal sub-assembly; wherein the composite heater 5 is not contacted with the side wall of the cathode tube 2, the temperature for heating the green body of the composite heater assembly is 1500-2000 ℃, and the heating time is 1-3 min.
Optionally, the material of the insulating powder includes aluminum oxide, boron nitride, aluminum nitride or beryllium oxide.
Optionally, the metal powder comprises tungsten or molybdenum.
Optionally, the material of the solder 6 includes platinum, molybdenum-nickel alloy, molybdenum-ruthenium alloy or tungsten-cobalt alloy.
Another aspect of the present disclosure provides a composite thermal subassembly comprising: cathode tube 2, composite heat 5, solder 6 and electrode 7; wherein, the composite heat element 5 is adhered in the cathode tube 2 through the solder 6, the electrode 7 is adhered at the other end of the composite heat element 5 through the solder 6, the composite heat element 5 is not contacted with the side wall of the cathode tube 2, and the composite heat element 5 is formed by compounding metal and an insulator.
(III) beneficial effects
The composite heat component is prepared by mixing insulating powder and metal powder according to a certain proportion and sintering, and can replace heating wires in the traditional heat component. The insulating powder increases the resistivity of the composite heat and ensures the normal operation of the composite heat. The composite heat is not contacted with the cylinder wall of the cathode cylinder, most of generated heat is directly transmitted to the cathode matrix through the cylinder bottom heat conduction of the cathode cylinder, and the heat radiated by the other part of heat is reflected back into the cylinder through the cylinder wall and is also transmitted to the cathode matrix along with the composite heat, so that the heat efficiency is improved.
Because the composite heater does not contain a heating coil and generates heat integrally, the volume of the composite heater is much smaller than that of a traditional heating wire under the same heating efficiency, and therefore, the composite heater subassembly prepared by the method has the advantages of no hot wire short circuit problem, high reliability, small volume, high efficiency, no magnetic field and the like.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent from the following description of embodiments thereof with reference to the accompanying drawings in which:
FIG. 1 schematically illustrates a block diagram of a conventional thermal subassembly according to an embodiment of the present disclosure;
FIG. 2 schematically illustrates a block diagram of a composite thermal subassembly according to an embodiment of the present disclosure;
FIG. 3 schematically illustrates a flow chart of a method of manufacturing a composite thermal subassembly according to an embodiment of the present disclosure;
fig. 4 schematically illustrates a flow chart of a method of manufacturing a composite thermal subassembly according to another embodiment of the present disclosure.
[ reference numerals description ]
1-cathode matrix
2-cathode tube
3-insulating layer
4-heat
5-composite heat
6-solder
7-electrode
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
In the drawings or description, like or identical parts are provided with the same reference numerals. Features of the embodiments illustrated in the description may be combined freely to form new solutions without conflict, in addition, each claim may be used alone as one embodiment or features of the claims may be combined as a new embodiment, and in the drawings, the shape or thickness of the embodiments may be enlarged and labeled in a simplified or convenient manner. Furthermore, elements or implementations not shown or described in the drawings are of a form known to those of ordinary skill in the art. Additionally, although examples of parameters including particular values may be provided herein, it should be appreciated that the parameters need not be exactly equal to the corresponding values, but may be approximated to the corresponding values within acceptable error margins or design constraints.
The various embodiments of the disclosure described above may be freely combined to form additional embodiments, unless otherwise technical hurdles or contradictions exist, which are all within the scope of the disclosure.
Although the present disclosure has been described with reference to the accompanying drawings, the examples disclosed in the drawings are intended to illustrate preferred embodiments of the present disclosure and are not to be construed as limiting the present disclosure. The dimensional proportions in the drawings are illustrative only and should not be construed as limiting the present disclosure.
Although a few embodiments of the present general inventive concept have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.
Fig. 2 schematically illustrates a block diagram of a composite thermal subassembly according to an embodiment of the present disclosure.
According to an embodiment of the present disclosure, as shown in fig. 2, a composite thermal subassembly includes, for example: cathode base 1, cathode tube 2, composite heat 5, solder 6 and electrode 7. Wherein, the composite heat element 5 is adhered in the cathode tube 2 through the solder 6, the electrode 7 is adhered at the other end of the composite heat element 5 through the solder 6, the composite heat element 5 is not contacted with the side wall of the cathode tube 2, and the composite heat element 5 is formed by compounding metal and an insulator. During operation, the composite heat 5 generates heat wholly, most of generated heat is thermally conducted to the cathode matrix 1 through the bottom of the cathode tube 2 (such as a metal molybdenum tube), other heat radiated heat is reflected back to the cathode tube 2 by the side wall of the cathode tube 2, and along with the heat conduction of the composite heat 5 to the cathode matrix 1, the temperature of the cathode tube 2 is greatly reduced compared with that of the traditional structure, and the heat efficiency of the composite heat sub-assembly is improved. In fig. 1, the conventional heat sub-assembly heats through the heat element 4, i.e. the heating wire, and the composite heat sub-assembly in the present disclosure heats through the composite heat element 5, so that when the same heating value is generated, the volume of the composite heat element 5 is much smaller than that of the heat element 4, and the volume of the prepared composite heat sub-assembly is also much smaller.
Fig. 3 schematically illustrates a flow chart of a method of manufacturing a composite thermal subassembly according to an embodiment of the present disclosure.
According to an embodiment of the present disclosure, as shown in fig. 3, a method of manufacturing a composite thermal subassembly includes, for example:
and S310, mixing the insulating powder and the metal powder to obtain mixed powder, wherein the insulating powder and the metal powder expand and contract synchronously.
According to the embodiment of the present disclosure, the material of the insulating powder has a similar expansion coefficient to the material of the metal powder, so that the composite heat 5 has a stable structure during the preparation and use of the composite heat sub-assembly, and no defect is generated in the material due to thermal expansion and cooling shrinkage. The insulating material may be, for example, alumina, beryllium oxide, boron nitride, aluminum nitride, or the like, and the metal material may be, for example, a metal powder of tungsten, rhenium, molybdenum, or the like, or any mixed metal powder thereof. Or mixing water-soluble compounds of the insulating material and the metal material. The insulating material has good insulating property and small evaporation rate at the working temperature or the high temperature required in the treatment process.
And S320, compacting the mixed powder to obtain a bar.
According to an embodiment of the present disclosure, for example, the mixture is put into an agate mortar to be ground, the ground mixture is poured into a rubber sleeve, the mixture powder particles are formed into a close-packed structure by beating, kneading and tamping, and then isostatic pressing or die press forming is performed under a pressure of 50-500 Mpa.
S330, sintering the bar material to obtain a blank.
According to the embodiment of the present disclosure, after sintering, the insulating powder particles and the metal powder particles, the insulating powder particles and the insulating powder particles, and the mutual adhesion between the metal powder particles and the metal powder particles are mixed together, and the composite heat 5 can conduct electricity while the resistivity is much greater than that of a pure metal rod, thereby ensuring the normal operation of the composite heat 5. The composite heater 5 does not contain heating wires, so that the problem of short circuit of the heating wires caused by the breakage of an insulating layer is avoided, the reliability is high, and a magnetic field is not generated due to the existence of a coil. The sintering conditions are, for example, high-temperature sintering at a temperature of 1500℃to 2000℃for 1 to 3 hours.
S340, turning the blank body to obtain the composite heat 5.
According to embodiments of the present disclosure, the sinter-formed bar is turned into a composite heat of a desired size, for example.
And S350, bonding the cathode tube 2 and the electrode 7 at two ends of the composite heat 5 by using the welding materials 6 respectively to obtain the composite heat sub-assembly.
According to the embodiments of the present disclosure, the working temperature of the heat is generally about 1100 ℃ to 1400 ℃, the melting point of the solder 6 needs to be higher than the working temperature of the composite heat, otherwise, the heat causes evaporation of the solder during the working process, and the melting point of the solder 6 cannot be too high, so that the composite heat 5 is deformed and the resistance value of the composite heat is changed due to too high welding temperature. Therefore, the solder 6 can be made of metal or alloy material (such as platinum, molybdenum-nickel, molybdenum-ruthenium, tungsten-cobalt, etc.) with melting point between 1500 ℃ and 2000 ℃ which is infiltrated with both the cathode molybdenum cylinder and the composite heat. The welding process is, for example, to put the composite heat 5 into a cathode tube coated with high temperature solder paste and put into a high temperature furnace, heated to the melting point of the solder, and maintained for 1-3 minutes. The solder 6 is soaked with the cathode molybdenum tube, the composite heat and the electrode 7, so that firm welding is ensured, and the cathode molybdenum tube has good electric conductivity and heat conductivity. The insulating powder does not chemically react with the metal powder and the cathode can 2.
The method of making the composite thermal subassembly of the present disclosure is further illustrated by the following specific examples.
Fig. 4 schematically illustrates a flow chart of a method of manufacturing a composite thermal subassembly according to another embodiment of the present disclosure.
According to an embodiment of the present disclosure, as shown in fig. 4, a method of manufacturing a composite thermal subassembly includes, for example:
s410, physically mixing the alumina powder with about 5 microns and the metal tungsten powder with about 5 microns according to the proportion of 10% -50% of tungsten metal volume ratio, and then putting the mixture into an agate mortar for grinding.
S420, pouring the ground mixture into a rubber sleeve, tamping and kneading the rubber sleeve to form a close-packed structure of mixture powder particles, and then carrying out isostatic pressing forming under the pressure of 100-200 Mpa.
S430, sintering the pressed bar at a high temperature of 1500-2000 ℃ for 1-3 hours.
S440, turning the sintered bar material into a composite heat 5 with a required size.
S450, both end surfaces of the composite heat 5 are coated with a solder paste (e.g., 70% tungsten+30% cobalt) prepared with an organic solvent (e.g., nitro-cotton, glycerin, etc.), placed in the cathode tube 2 with the cathode base 1, and an electrode 7 is placed on the other end surface of the composite heat 5.
S460, putting the cathode tube 2, the composite heater 5 and the electrode 7 obtained by the treatment in the step S450 into a high-temperature furnace, heating the mixture to a melting point of solder (1550 ℃ for example), maintaining the mixture for 1-3 minutes, powering off the mixture, cooling the mixture to room temperature, and taking the mixture out.
And S470, measuring the cold resistance of the composite heat 5 by using a resistance tester, and judging whether the cold resistance meets the requirements, and discarding if the cold resistance meets the requirements.
In summary, the embodiments of the present disclosure provide a composite thermal subassembly and a method for manufacturing the same. The composite heat is obtained by mixing insulating powder and metal powder and sintering, and the composite heat and the cathode cylinder are welded by high-temperature solder, so that the cathode composite heat component which is easy to manufacture, high in reliability, small in volume, high in efficiency, uniform in heating and free of magnetic field can be obtained.
The product embodiment is similar to the method embodiment in that details are not fully omitted, please refer to the method embodiment, and the details are not repeated here.
It should be understood that the specific order or hierarchy of steps in the processes disclosed are examples of exemplary approaches. Based on design preferences, it is understood that the specific order or hierarchy of steps in the processes may be rearranged without departing from the scope of the present disclosure. The accompanying method claims present elements of the various steps in a sample order, and are not meant to be limited to the specific order or hierarchy.
It should be further noted that the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only with reference to the directions of the drawings, and are not intended to limit the scope of the present disclosure. Like elements are denoted by like or similar reference numerals throughout the drawings. Conventional structures or constructions will be omitted when they may obscure the understanding of this disclosure. And the shape, size and position relation of each component in the figure do not reflect the actual size, proportion and actual position relation.
In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, the present disclosure is directed to less than all of the features of a single disclosed embodiment. Thus, the following claims are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate preferred embodiment of this disclosure.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise. As used in the specification or claims, the term "comprising" is intended to be inclusive in a manner similar to the term "comprising" as "comprising," as "comprising" is interpreted when employed as a transitional word in a claim. Any use of the term "or" in the specification of the claims is intended to mean "non-exclusive or".
While the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and that any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (10)
1. A method of making a composite thermal subassembly comprising:
mixing insulating powder and metal powder to obtain mixed powder, wherein the insulating powder and the metal powder expand and contract synchronously;
compacting the mixed powder to obtain a bar;
sintering the bar material to obtain a blank;
turning the blank to obtain a composite heater (5);
and bonding the cathode tube (2) and the electrode (7) at two ends of the composite heat (5) respectively by using welding materials (6) to obtain the composite heat sub-assembly.
2. The method of claim 1, wherein the metal powder comprises 10% -50% by volume.
3. The method of preparing a composite thermal subassembly of claim 1, wherein compacting the mixed powder to obtain a rod comprises:
and tamping the mixed powder to a close-packed structure, and pressing the mixed powder by isostatic pressing or a die to obtain the bar, wherein the isostatic pressing pressure is 50-500 Mpa.
4. A method of manufacturing a composite thermal subassembly according to claim 3, wherein the mixed powder is milled prior to tamping the mixed powder.
5. The method of manufacturing a composite thermal subassembly according to claim 1, wherein the sintering the rod to obtain a green body comprises:
sintering the bar material for 1-3 h at 1500-2000 ℃ to obtain the blank.
6. The method of manufacturing a composite thermal subassembly according to claim 1, wherein the bonding of the cathode tube (2) and the electrode (7) to both ends of the composite thermal subassembly (5) using solder (6), respectively, comprises:
preparing the solder (6) by using an organic solvent to obtain solder paste;
placing the solder paste between the composite heat (5) and the cathode tube (2) and between the composite heat (5) and the electrode (7) to obtain a composite heat sub-assembly blank;
heating the composite thermal sub-assembly blank to melt the solder paste, and cooling to obtain the composite thermal sub-assembly;
wherein the composite heater (5) is not contacted with the side wall of the cathode tube (2), the temperature for heating the composite heater component blank is 1500-2000 ℃, and the heating time is 1-3 min.
7. The method of claim 1, wherein the insulating powder comprises aluminum oxide, boron nitride, aluminum nitride, or beryllium oxide.
8. The method of claim 1, wherein the metal powder comprises tungsten or molybdenum.
9. The method of manufacturing a composite thermal subassembly according to claim 1, wherein the solder (6) comprises platinum, a molybdenum-nickel alloy, a molybdenum-ruthenium alloy or a tungsten-cobalt alloy.
10. A composite thermal subassembly, comprising:
a cathode tube (2), a composite heater (5), solder (6) and an electrode (7);
the composite heater (5) is adhered to the cathode tube (2) through the solder (6), the electrode (7) is adhered to the other end of the composite heater (5) through the solder (6), the composite heater (5) is not contacted with the side wall of the cathode tube (2), the composite heater (5) is made of a composite material obtained by mixing insulating powder and metal powder, and the insulating powder and the metal powder expand and contract synchronously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111110116.7A CN113808892B (en) | 2021-09-22 | 2021-09-22 | Composite thermal subassembly and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111110116.7A CN113808892B (en) | 2021-09-22 | 2021-09-22 | Composite thermal subassembly and method of making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113808892A CN113808892A (en) | 2021-12-17 |
| CN113808892B true CN113808892B (en) | 2023-10-20 |
Family
ID=78896229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111110116.7A Active CN113808892B (en) | 2021-09-22 | 2021-09-22 | Composite thermal subassembly and method of making the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113808892B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3581144A (en) * | 1969-03-27 | 1971-05-25 | Gen Electric | Metal-clad insulated electrical heater |
| KR19980013748A (en) * | 1996-08-02 | 1998-05-15 | 구자홍 | Composition of heater coating material of cathode ray tube electron gun |
| EP1063668A2 (en) * | 1999-06-22 | 2000-12-27 | Nec Corporation | Cathode subassembly and color crt equipped therewith |
| KR20020006109A (en) * | 2000-07-11 | 2002-01-19 | 구자홍 | heater for CRT |
| CN1700387A (en) * | 2004-05-20 | 2005-11-23 | 中国科学院电子学研究所 | Film-coated cathode-thermistor assembly |
| CN101335166A (en) * | 2007-06-27 | 2008-12-31 | 中国科学院电子学研究所 | Cathode three-element alloy film and method for preparing film covered dipping diffusion cathode |
| CN205838569U (en) * | 2016-06-14 | 2016-12-28 | 合肥芯福传感器技术有限公司 | Heater structure for heat activation microminiature self-heating getter |
| CN113161215A (en) * | 2021-04-13 | 2021-07-23 | 南京华东电子真空材料有限公司 | High-reliability getter heater structure and preparation method thereof |
-
2021
- 2021-09-22 CN CN202111110116.7A patent/CN113808892B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3581144A (en) * | 1969-03-27 | 1971-05-25 | Gen Electric | Metal-clad insulated electrical heater |
| KR19980013748A (en) * | 1996-08-02 | 1998-05-15 | 구자홍 | Composition of heater coating material of cathode ray tube electron gun |
| EP1063668A2 (en) * | 1999-06-22 | 2000-12-27 | Nec Corporation | Cathode subassembly and color crt equipped therewith |
| KR20020006109A (en) * | 2000-07-11 | 2002-01-19 | 구자홍 | heater for CRT |
| CN1700387A (en) * | 2004-05-20 | 2005-11-23 | 中国科学院电子学研究所 | Film-coated cathode-thermistor assembly |
| CN101335166A (en) * | 2007-06-27 | 2008-12-31 | 中国科学院电子学研究所 | Cathode three-element alloy film and method for preparing film covered dipping diffusion cathode |
| CN205838569U (en) * | 2016-06-14 | 2016-12-28 | 合肥芯福传感器技术有限公司 | Heater structure for heat activation microminiature self-heating getter |
| CN113161215A (en) * | 2021-04-13 | 2021-07-23 | 南京华东电子真空材料有限公司 | High-reliability getter heater structure and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 一种用于热阴极的高可靠热子;刘燕文;真空科学与技术学报;第第35卷卷(第第1期期);79-83 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113808892A (en) | 2021-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000505939A (en) | Sintered electrode | |
| CN110181050A (en) | A kind of SPS sintering connection method of WRe/TZM/ graphite | |
| CN109590476A (en) | The method that one-step method prepares high-compactness WRe/TZM gradient composites | |
| CN106376107A (en) | Large-power silicon nitride ceramic heating plate and inner-soft outer-hard manufacturing method thereof | |
| CN103341675B (en) | Method for braze welding of Cf/SiC composite material and metal Nb by using Ti-Co-Nb brazing filler metal | |
| CN111243917B (en) | Cathode heater assembly and preparation method thereof | |
| CN113808892B (en) | Composite thermal subassembly and method of making the same | |
| CN109979791A (en) | A kind of Heater-Cathode assembly and preparation method thereof | |
| CN102468092B (en) | Method for preparing heat element for heated cathode | |
| CN101834106B (en) | Tungsten-based impregnated cathode and preparation method thereof | |
| CN105810536B (en) | Using the magnetron of combined type cold cathode head and the production method of cold cathode body | |
| CN107068517B (en) | A kind of magnetron matches the production method for applying cold cathode and cold cathode head | |
| CN113161215A (en) | High-reliability getter heater structure and preparation method thereof | |
| CN1956124B (en) | High efficient cathode assembly | |
| CN102324355B (en) | Travelling wave tube spiral line clamping device and assembly process thereof | |
| CN205016489U (en) | Cathode heater assembly | |
| CN103531419B (en) | A kind of microwave heating magnetron tube core | |
| CN207338428U (en) | A kind of encapsulating structure of ceramic substrate | |
| CN202695372U (en) | Composite conduction structure of high thermal conduction material | |
| CN106007409B (en) | A kind of device to be packaged melts the method and its application of envelope with glass insulation terminal low temperature | |
| CN111673086B (en) | Porous fiber liquid absorption core with surface in-situ grown carbon nano tube and preparation method | |
| CN101513991B (en) | Method for manufacturing macromolecule ozonizer electrode tube | |
| CN107275169B (en) | Cathode heater assembly for high-power klystron electron gun and welding method | |
| KR100747115B1 (en) | Electrode for a cold cathode fluorescent lamp and a manufacturing method thereof | |
| CN209859907U (en) | Strip-shaped electron beam cathode assembly structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |