CN113798691A - Micro-damage cutting system and method for photovoltaic crystalline silicon solar cell - Google Patents
Micro-damage cutting system and method for photovoltaic crystalline silicon solar cell Download PDFInfo
- Publication number
- CN113798691A CN113798691A CN202010557911.XA CN202010557911A CN113798691A CN 113798691 A CN113798691 A CN 113798691A CN 202010557911 A CN202010557911 A CN 202010557911A CN 113798691 A CN113798691 A CN 113798691A
- Authority
- CN
- China
- Prior art keywords
- processing
- processing subsystem
- laser
- crystalline silicon
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 81
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 230000009471 action Effects 0.000 claims abstract description 12
- 230000008646 thermal stress Effects 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 230000033001 locomotion Effects 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 6
- 239000002826 coolant Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The embodiment of the application belongs to the technical field of cutting of photovoltaic crystalline silicon solar cells, and relates to a system and a method for cutting micro-damage of a photovoltaic crystalline silicon solar cell. The photovoltaic crystalline silicon solar cell micro-damage cutting system comprises a first processing subsystem, a second processing subsystem and a transmission device; the first processing subsystem is used for grooving two ends of a battery piece cutting channel through pulse laser, and the second processing subsystem is used for scanning and heating the battery piece through continuous laser along the groove opening direction under the cooperation of a cooling system, so that the battery piece is automatically separated under the action of thermal stress. The cutting method can reduce heat affected zones and section microcracks in the solar cell slice cutting process, improve product strength and avoid hidden crack risks, simultaneously greatly reduce dust generated in the cutting process, and can be widely applied to the field of photovoltaic crystalline silicon solar cell cutting.
Description
Technical Field
The application relates to a photovoltaic crystalline silicon solar cell cutting technology, in particular to a photovoltaic crystalline silicon solar cell micro-damage cutting system and method.
Background
With the development of science and technology, people's environmental awareness is continuously strengthened, and solar energy is widely concerned as a clean and renewable energy source. The crystalline silicon solar cell manufactured based on the semiconductor technology is a core component of photovoltaic power generation, the larger the size of the cell is and the higher the cell efficiency is, the larger the short-circuit current of a device is, the larger the packaging loss from the cell to a component is, and the hot spot risk of the component outdoors is increased, so that the cutting of the cell cannot be avoided, and the cell is packaged after being divided into small pieces, so that remarkable power gain can be obtained.
At present, the solar cell slice is mainly cut by adopting pulse laser ablation and matching with mechanical splitting, namely, materials near a cutting channel are removed by a certain depth by using pulse laser, and then the materials are separated by mechanically breaking the slice. The processing mode has the following disadvantages: 1. a large amount of dust is formed in the material laser removing process, which is harmful to human health, and easily causes equipment to catch fire, thus seriously reducing the production safety; 2. when materials are removed by laser, a large number of micro cracks are generated in a cutting area, on one hand, the strength of a cut battery piece is influenced, the service life of the packaged photovoltaic module is shortened, on the other hand, defects are formed in crystalline silicon, and the conversion efficiency of the battery is reduced; 3. the high peak power pulse laser and the material act to enable the temperature to rise rapidly and diffuse to the surrounding area, a heat affected area in a certain range is formed at the cutting edge, the surface structure of the battery piece is damaged, and the conversion efficiency is reduced; 4. after the pulse laser removes the material, the cell is broken by mechanical breaking, which easily causes the breakage and hidden breakage of the cell.
Disclosure of Invention
The invention aims to provide a micro-damage cutting system and method for a photovoltaic crystalline silicon solar cell, which can reduce heat affected zone and section microcracks in the solar cell slice cutting process, improve product strength, avoid hidden crack risks, greatly reduce dust generated in the cutting process, and can be widely applied to the field of photovoltaic crystalline silicon solar cell cutting.
In order to solve the above-mentioned problems, embodiments of the present invention provide the following technical solutions:
a micro-damage cutting system for a photovoltaic crystalline silicon solar cell comprises a first processing subsystem, a second processing subsystem and a transmission device;
the first processing subsystem is used for grooving the two ends of the battery piece cutting channel through pulse laser, the second processing subsystem is used for scanning and heating the battery piece along the opening direction of the groove through continuous laser under the cooperation of a cooling system, so that the battery piece is automatically separated under the action of thermal stress, the transmission device is used for conveying the battery piece with the loading position to the processing position of the first processing subsystem, or conveying the battery piece with the two ends grooved to the processing position of the first processing subsystem to the processing position of the second processing subsystem, or conveying the separated battery piece to the unloading position from the processing position of the second processing subsystem.
Further, the first processing subsystem comprises a first laser, a first beam expanding and collimating unit, a first reflecting unit, a first focusing unit, a first object stage and a first motion module;
the first processing subsystem is used for emitting a first processing light beam and processing a cell plate on the first objective table to form a first processing subsystem processing path, and the first laser, the first beam expanding and collimating unit, the first reflecting unit and the first focusing unit are sequentially arranged;
the first laser is used for emitting an initial Gaussian beam to the first beam expanding and collimating unit, the first beam expanding and collimating unit expands and collimates the beam, the first reflection unit reflects the beam to the first focusing unit, the first focusing unit converges the beam to form a first processing beam, the first processing beam acts on a battery plate on the first objective table, the first motion module is arranged on the first reflection unit and/or the first objective table, and the first motion module drives the first reflection unit and/or the first objective table to move so as to change the relative position of the first processing beam and the first objective table.
Further, the second processing subsystem comprises a second laser, a second beam expanding and collimating unit, a second reflecting unit, a second focusing unit, a second object stage and a second motion module;
the second processing subsystem is used for emitting a second processing light beam and processing the battery piece on the second objective table, the second laser, the second beam expanding and collimating unit, the second reflecting unit and the second focusing unit are sequentially arranged, and the cooling system is used for cooling the tail part of a light spot of the second processing light beam, which is close to the battery piece on the second objective table;
the second laser is used for emitting an initial Gaussian beam to the second beam expanding and collimating unit, the second beam expanding and collimating unit expands and collimates the beam, the second reflecting unit reflects the beam to the second focusing unit, the second focusing unit converges the beam to form a second processing beam, the second processing beam acts on a battery plate on the second objective table, the second moving module is arranged on the second reflecting unit and/or the second objective table, and the second moving module drives the second reflecting unit and/or the second objective table to move so as to change the relative position of the second processing beam and the second objective table.
The photovoltaic crystalline silicon solar cell micro-damage cutting system further comprises a positioning device, the positioning device is used for positioning the cell slice with grooves at two ends in the process that the transmission device conveys the cell slice from the first object stage to the second object stage, the initial position of the second processing light beam is located at the starting point of the initial position of the processing path of the first processing subsystem, and the second movement module is used for driving the second reflection unit and/or the second object stage to move, so that the second processing light beam moves along the processing path of the first processing subsystem.
Further, the first laser is a pulse laser with a wavelength of 200-.
Furthermore, the first processing subsystem has the slotting depth of 10-180 μm and the slotting length of 0.5-20 mm at two ends of the battery piece.
Further, the second laser is one of a continuous laser and a quasi-continuous laser, the wavelength of the Gaussian beam generated by the second laser is 900nm-1100nm, and the laser power is 100W-1000W.
Furthermore, the second focusing unit comprises a cylindrical mirror or a diffractive optical element, a laser spot of a light beam focused by the second focusing unit is an elliptical spot or a long-strip-shaped spot, and the long axis direction of the laser spot is consistent with the cutting direction.
Furthermore, the cooling medium of the cooling system is gas, liquid or a gas-liquid mixture, the gas is one of air, CO2 and nitrogen, the gas pressure is 0.1-0.8MPa, the liquid can be water or a volatile organic solvent, and the liquid flow is 0.1-10 Ml/min.
In order to solve the technical problem provided above, an embodiment of the present invention further provides a photovoltaic crystalline silicon solar cell micro-damage cutting system method, which adopts the following technical scheme:
a micro-damage cutting system method for a photovoltaic crystalline silicon solar cell comprises the following steps:
the transmission device conveys the battery pieces in the feeding area to a processing position of the first processing subsystem;
the first processing subsystem performs slotting on two ends of a battery piece cutting channel by using pulse laser;
the transmission device conveys the battery piece with grooves at two ends from the processing position of the first processing subsystem to the processing position of the second processing subsystem;
the second processing subsystem scans and heats the battery piece along the opening direction of the groove by using continuous laser under the coordination of a cooling system, so that the battery piece is automatically separated under the action of thermal stress;
the transmission device conveys the separated battery pieces to a discharging position from the processing position of the second processing subsystem.
Compared with the prior art, the embodiment of the invention mainly has the following beneficial effects:
a micro-damage cutting system and method for a photovoltaic crystalline silicon solar cell are provided, wherein a transmission device operates a cell at a feeding position, a processing position of a first processing subsystem, a processing position and a discharging position of a second processing subsystem in a processing process, grooves with certain depth and length are formed in two ends of a cell cutting channel by a first processing subsystem through pulse laser, and a cell is scanned and heated by a second processing subsystem along the forming direction of the grooves through continuous laser, so that the cell is automatically separated under the action of thermal stress, the cell is cut, a heat affected area and section microcracks in the solar cell cutting process can be reduced, the product strength is improved, the hidden crack risk is avoided, meanwhile, dust generated in the cutting process is greatly reduced, the micro-damage cutting system and method can be widely applied to the field of photovoltaic crystalline silicon solar cell cutting, and are particularly suitable for HJT, TOPCON and other high performance batteries.
Drawings
In order to illustrate the solution of the invention more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without inventive effort.
FIG. 1 is a schematic diagram of a first processing subsystem in an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a second processing subsystem in accordance with an embodiment of the present invention;
FIG. 3 is a flow chart of a micro-damage cutting method for a photovoltaic crystalline silicon solar cell in an embodiment of the invention;
FIG. 4 is a diagram of a micro-damage cut object of a single-sided aluminum back-field battery in an embodiment of the invention;
FIG. 5 is a diagram of a P-type double-sided battery micro-damage cutting object in an embodiment of the invention;
FIG. 6 is a diagram of an N-type double-sided battery micro-damage cutting object in an embodiment of the invention;
FIG. 7 is a graph of a micro-damage cut object of an HJT battery in an embodiment of the present invention;
FIG. 8 is a diagram of a micro-damage cutting object of a double-sided laminated cell according to an embodiment of the present invention;
FIG. 9 is a comparison graph of cross-sectional effects of conventional laser cutting and micro-damage cutting in an embodiment of the present invention;
FIG. 10 is a comparison of the thermal effect of the conventional laser cutting and micro-damage cutting edges in the embodiment of the present invention.
Description of reference numerals:
110. a first laser; 111. a first beam expanding and collimating unit; 112. a first reflection unit; 113. a first focusing unit; 114. a first stage; 210. a second laser; 211. a second beam expanding and collimating unit; 212. a second reflection unit; 213. a second focusing unit; 214. a second stage; 215. a cooling system.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The terms "comprising" and "having," and any variations thereof, in the description and claims of the present invention and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the relevant drawings.
Examples
A micro-damage cutting system for a photovoltaic crystalline silicon solar cell is shown in figures 1 to 10 and comprises a first processing subsystem, a second processing subsystem and a transmission device; the first processing subsystem is used for grooving the two ends of the battery piece cutting channel through pulse laser, the second processing subsystem is used for scanning and heating the battery piece along the opening direction of the groove through continuous laser under the cooperation of a cooling system 215, so that the battery piece is automatically separated under the action of thermal stress, the transmission device is used for conveying the battery piece with the feeding position to the processing position of the first processing subsystem, or conveying the battery piece with the grooves at the two ends to the processing position of the second processing subsystem from the processing position of the first processing subsystem, or conveying the separated battery piece to the discharging position from the processing position of the second processing subsystem.
The invention provides a micro-damage cutting system for a photovoltaic crystalline silicon solar cell, which is characterized in that a transmission device operates a cell slice between a feeding position, a processing position of a first processing subsystem, a processing position and a discharging position of a second processing subsystem in a processing process, grooves with certain depth and length are formed at two ends of a cell slice cutting channel by a pulse laser in the first processing subsystem, and the cell slice is scanned and heated by a second processing subsystem along the forming direction of the grooves by continuous laser, so that the cell slice is automatically separated under the action of thermal stress, the cell slice cutting is realized, a heat affected area and section microcracks in the solar cell slice cutting process can be reduced, the product strength is improved, the hidden crack risk is avoided, meanwhile, a large amount of dust generated in the cutting process is reduced, the micro-damage cutting system can be widely applied to the field of the photovoltaic crystalline silicon solar cell cutting, and is particularly suitable for the existing HJT, TOPCON and other high performance batteries.
As shown in fig. 1 and 2, the first processing subsystem includes a first laser 110, a first beam expanding and collimating unit 111, a first reflecting unit 112, a first focusing unit 113, a first stage 114, and a first motion module.
The first processing subsystem is configured to emit a first processing light beam, process a cell on the first stage 114, and form a processing path of the first processing subsystem, where the first laser 110, the first beam expanding and collimating unit 111, the first reflecting unit 112, and the first focusing unit 113 are sequentially disposed.
The first laser 110 is configured to emit an initial gaussian light beam to the first beam expanding and collimating unit 111, the first beam expanding and collimating unit 111 expands and collimates the light beam, the first reflecting unit 112 reflects the light beam to the first focusing unit 113, the first focusing unit 113 converges the light beam to form a first processing light beam, and acts the first processing light beam on a battery plate on the first object stage 114, the first motion module is disposed on the first reflecting unit 112 and/or the first object stage 114, the first motion module is connected to a control system and controlled by the control system, and the first motion module drives the first reflecting unit 112 and/or the first object stage 114 to move, so as to change a relative position between the first processing light beam and the first object stage 114.
The control system controls the first motion module disposed on the first reflection unit 112 and/or the first stage 114 to move, and changes the relative position of the first processing beam and the first stage 114, so that grooves with a certain depth and length are formed at two ends of the cell slice cutting path.
The first laser 110 is a pulse laser with a wavelength of 200-.
The first processing subsystem has the slotting depth of 10-180 mu m and the slotting length of 0.5-20 mm at two ends of the battery piece.
The second processing subsystem includes a second laser 210, a second beam expanding and collimating unit 211, a second reflecting unit 212, a second focusing unit 213, a second stage 214, and a second motion module.
In this embodiment, the second processing subsystem processes along a processing path of the first processing subsystem, the second laser 210, the second beam expanding and collimating unit 211, the second reflecting unit 212, and the second focusing unit 213 are sequentially disposed, and the cooling system 215 is configured to cool a tail portion of a light spot of the second processing beam, which is close to the battery plate on the second stage 214.
The second laser 210 is configured to emit an initial gaussian light beam to the second beam expanding and collimating unit 211, the second beam expanding and collimating unit 211 expands and collimates the light beam, the second reflecting unit 212 reflects the light beam to the second focusing unit 213, the second focusing unit 213 converges the light beam to form a second processing light beam, and acts the second processing light beam on a battery plate on the second stage 214, the second motion module is disposed on the second reflecting unit 212 and/or the second stage 214, the second motion module is connected to and controlled by a control system, and the second motion module drives the second reflecting unit 212 and/or the second stage 214 to move, so as to change a relative position between the second processing light beam and the second stage 214.
In this embodiment, the first motion module and the second motion module may be servo motor driving mechanisms, and may precisely control the positions of the battery pieces to be processed.
In this embodiment, the transmission device may be a robot clamping jaw device, the positioning device may be a positioning device such as a positioning groove, a positioning plate, or a positioning pin, the positioning device positions the cell piece whose two ends are grooved in the process of being conveyed from the first object stage 114 to the second object stage 214 by the transmission device, so that the initial position of the second processing beam is located at the starting point of the initial position of the processing path of the first processing subsystem, and the second movement module drives the second reflection unit 212 and/or the second object stage 214 to move, so that the second processing beam moves along the processing path of the first processing subsystem.
The second laser 210 is one of a continuous laser and a quasi-continuous laser, the wavelength of the gaussian beam generated by the second laser 210 is 900nm-1100nm, and the laser power is 100W-1000W.
The second focusing unit comprises a cylindrical mirror or a diffractive optical element, laser spots of light beams focused by the second focusing unit are oval spots or strip-shaped spots, and the long axis direction of the laser spots is consistent with the cutting direction.
In this embodiment, the laser spot of the light beam focused by the second focusing unit is an elliptical spot.
The cooling medium of the cooling system 215 is gas, liquid or a gas-liquid mixture, the gas is one of air, CO2 and nitrogen, the gas pressure is 0.1-0.8MPa, the liquid can be water or a volatile organic solvent, and the liquid flow is 0.1-10 Ml/min.
In this embodiment, the cooling system 215 moves relative to the second stage 214 at the same speed as the light spot, the cooling system 215 uses a gas-liquid mixture as a cooling medium to cool the tail position of the elliptical light spot, the material at the heating position of the light spot is instantaneously cooled from the highest temperature point, a huge temperature difference stress is formed, and the battery piece is automatically separated under the action of the stress.
The working principle is as follows: the battery piece is conveyed to a first objective table 114 from a loading position by a transmission device, a first laser 110 emits an initial Gaussian beam to a first beam expanding and collimating unit 111, the first beam expanding and collimating unit 111 expands and collimates the beam, a first reflection unit 112 reflects the beam to a first focusing unit 113, the first focusing unit 113 converges the beam to form a first processing beam, the first processing beam acts on the battery piece on the first objective table 114, and grooves with certain depth and length are formed at two ends of a battery piece cutting channel; the transmission device conveys the battery piece with grooves at two ends to the second objective table 214 from the first objective table 114, the second laser 210 is used for emitting an initial Gaussian beam to the second beam expanding and collimating unit 211, the second beam expanding and collimating unit 211 expands and collimates the beam, the second reflecting unit 212 reflects the beam to the second focusing unit 213, the second focusing unit 213 converges the beam to form a second processing beam, the battery piece is scanned and heated along the opening direction of the groove, the battery piece is automatically separated under the action of thermal stress, the battery piece is cut, heat affected areas and section microcracks in the cutting process of the solar battery piece can be reduced, the product strength is improved, the hidden crack risk is avoided, meanwhile, dust generated in the cutting process is greatly reduced, and the solar battery piece cutting device can be widely applied to the field of cutting of photovoltaic crystalline silicon solar batteries.
In order to solve the technical problem provided above, an embodiment of the present invention further provides a photovoltaic crystalline silicon solar cell micro-damage cutting system method, which adopts the following technical scheme:
a micro damage cutting system method for a photovoltaic crystalline silicon solar cell, as shown in fig. 3, the micro damage cutting system method for a photovoltaic crystalline silicon solar cell includes:
the transmission device conveys the battery pieces in the feeding area to a processing position of the first processing subsystem;
the first processing subsystem performs slotting on two ends of a battery piece cutting channel by using pulse laser;
the transmission device conveys the battery piece with grooves at two ends from the processing position of the first processing subsystem to the processing position of the second processing subsystem;
the second processing subsystem scans and heats the battery piece along the opening direction of the groove by using continuous laser under the coordination of a cooling system, so that the battery piece is automatically separated under the action of thermal stress;
the transmission device conveys the separated battery pieces to a discharging position from the processing position of the second processing subsystem.
The invention provides a micro-damage cutting method for a photovoltaic crystalline silicon solar cell, which is characterized in that a transmission device operates a cell slice between a feeding position, a processing position of a first processing subsystem, a processing position and a discharging position of a second processing subsystem in a processing process, grooves with certain depth and length are formed at two ends of a cell slice cutting channel by a first processing subsystem through pulse laser, and the cell slice is scanned and heated by a second processing subsystem along the forming direction of the grooves by continuous laser, so that the cell slice is automatically separated under the action of thermal stress, the cell slice cutting is realized, a heat affected area and section microcracks in the solar cell slice cutting process can be reduced, the product strength is improved, the hidden crack risk is avoided, meanwhile, a large amount of dust generated in the cutting process is reduced, the micro-damage cutting method can be widely applied to the field of the photovoltaic crystalline silicon solar cell cutting, and is particularly suitable for the existing HJT, TOPCON and other high performance batteries.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention without limiting its scope. This invention may be embodied in many different forms and, on the contrary, these embodiments are provided so that this disclosure will be thorough and complete. Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and modifications can be made, and equivalents may be substituted for elements thereof. All equivalent structures made by using the contents of the specification and the attached drawings of the invention can be directly or indirectly applied to other related technical fields, and are also within the protection scope of the patent of the invention.
Claims (10)
1. A micro-damage cutting system of a photovoltaic crystalline silicon solar cell is characterized in that,
the photovoltaic crystalline silicon solar cell micro-damage cutting system comprises a first processing subsystem, a second processing subsystem and a transmission device;
the first processing subsystem is used for grooving the two ends of the battery piece cutting channel through pulse laser, the second processing subsystem is used for scanning and heating the battery piece along the opening direction of the groove through continuous laser under the cooperation of a cooling system, so that the battery piece is automatically separated under the action of thermal stress, the transmission device is used for conveying the battery piece with the loading position to the processing position of the first processing subsystem, or conveying the battery piece with the two ends grooved to the processing position of the first processing subsystem to the processing position of the second processing subsystem, or conveying the separated battery piece to the unloading position from the processing position of the second processing subsystem.
2. The micro-damage cutting system of a photovoltaic crystalline silicon solar cell according to claim 1,
the first processing subsystem comprises a first laser, a first beam expanding and collimating unit, a first reflecting unit, a first focusing unit, a first objective table and a first motion module;
the first processing subsystem is used for emitting a first processing light beam and processing a cell plate on the first objective table to form a first processing subsystem processing path, and the first laser, the first beam expanding and collimating unit, the first reflecting unit and the first focusing unit are sequentially arranged;
the first laser is used for emitting an initial Gaussian beam to the first beam expanding and collimating unit, the first beam expanding and collimating unit expands and collimates the beam, the first reflection unit reflects the beam to the first focusing unit, the first focusing unit converges the beam to form a first processing beam, the first processing beam acts on a battery plate on the first objective table, the first motion module is arranged on the first reflection unit and/or the first objective table, and the first motion module drives the first reflection unit and/or the first objective table to move so as to change the relative position of the first processing beam and the first objective table.
3. The micro-damage cutting system of a photovoltaic crystalline silicon solar cell according to claim 2,
the second processing subsystem comprises a second laser, a second beam expanding and collimating unit, a second reflecting unit, a second focusing unit, a second objective table and a second motion module;
the second processing subsystem is used for emitting a second processing light beam and processing the battery piece on the second objective table, the second laser, the second beam expanding and collimating unit, the second reflecting unit and the second focusing unit are sequentially arranged, and the cooling system is used for cooling the tail part of a light spot of the second processing light beam, which is close to the battery piece on the second objective table;
the second laser is used for emitting an initial Gaussian beam to the second beam expanding and collimating unit, the second beam expanding and collimating unit expands and collimates the beam, the second reflecting unit reflects the beam to the second focusing unit, the second focusing unit converges the beam to form a second processing beam, the second processing beam acts on a battery plate on the second objective table, the second moving module is arranged on the second reflecting unit and/or the second objective table, and the second moving module drives the second reflecting unit and/or the second objective table to move so as to change the relative position of the second processing beam and the second objective table.
4. The micro-damage cutting system of a photovoltaic crystalline silicon solar cell according to claim 3,
the photovoltaic crystalline silicon solar cell micro-damage cutting system further comprises a positioning device, the positioning device is used for positioning the cell slice with grooves at two ends in the process that the transmission device conveys the cell slice to the second objective table from the first objective table, the initial position of the second processing light beam is located at the starting point of the initial position of the processing path of the first processing subsystem, and the second movement module is used for driving the second reflection unit and/or the second objective table to move, so that the second processing light beam moves along the processing path of the first processing subsystem.
5. The micro-damage cutting system of a photovoltaic crystalline silicon solar cell according to claim 2,
the first laser is a pulse laser with the wavelength of 200-1100nm, and the pulse laser is one of a nanosecond laser, a picosecond laser and a femtosecond laser.
6. The micro-damage cutting system of a photovoltaic crystalline silicon solar cell according to claim 2,
the first processing subsystem has the slotting depth of 10-180 mu m and the slotting length of 0.5-20 mm at two ends of the battery piece.
7. The micro-damage cutting system of a photovoltaic crystalline silicon solar cell according to claim 3,
the second laser is one of continuous and quasi-continuous lasers, the wavelength of a Gaussian beam generated by the second laser is 900nm-1100nm, and the laser power is 100W-1000W.
8. The micro-damage cutting system of a photovoltaic crystalline silicon solar cell according to claim 3,
the second focusing unit comprises a cylindrical mirror or a diffractive optical element, laser spots of light beams focused by the second focusing unit are oval spots or strip-shaped spots, and the long axis direction of the laser spots is consistent with the cutting direction.
9. The micro damage cutting system of photovoltaic crystalline silicon solar cells according to claim 1 or 3,
the cooling medium of the cooling system is gas, liquid or a gas-liquid mixture, the gas is one of air, CO2 and nitrogen, the gas pressure is 0.1-0.8MPa, the liquid can be water or a volatile organic solvent, and the liquid flow is 0.1-10 Ml/min.
10. A micro-damage cutting method for a photovoltaic crystalline silicon solar cell is characterized by comprising the following steps:
the transmission device conveys the battery pieces in the feeding area to a processing position of the first processing subsystem;
the first processing subsystem performs slotting on two ends of a battery piece cutting channel by using pulse laser;
the transmission device conveys the battery piece with grooves at two ends from the processing position of the first processing subsystem to the processing position of the second processing subsystem;
the second processing subsystem scans and heats the battery piece along the opening direction of the groove by using continuous laser under the coordination of a cooling system, so that the battery piece is automatically separated under the action of thermal stress;
the transmission device conveys the separated battery pieces to a discharging position from the processing position of the second processing subsystem.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010557911.XA CN113798691A (en) | 2020-06-17 | 2020-06-17 | Micro-damage cutting system and method for photovoltaic crystalline silicon solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010557911.XA CN113798691A (en) | 2020-06-17 | 2020-06-17 | Micro-damage cutting system and method for photovoltaic crystalline silicon solar cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113798691A true CN113798691A (en) | 2021-12-17 |
Family
ID=78943278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010557911.XA Pending CN113798691A (en) | 2020-06-17 | 2020-06-17 | Micro-damage cutting system and method for photovoltaic crystalline silicon solar cell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113798691A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020047479A (en) * | 2000-12-13 | 2002-06-22 | 김경섭 | Laser cutting method for non-metallic materials |
| CN1435291A (en) * | 2002-02-02 | 2003-08-13 | 三星电子株式会社 | Method and device for cutting non-metal substrate |
| CN101444875A (en) * | 2008-12-08 | 2009-06-03 | 浙江工业大学 | Cutting method of fragile material substrate |
| US20100243628A1 (en) * | 2009-03-25 | 2010-09-30 | Samsung Mobile Display Co., Ltd. | Substrate cutting apparatus and method of cutting substrate using the same |
| JP2011011972A (en) * | 2009-06-05 | 2011-01-20 | Lemi Ltd | Apparatus for cutting brittle material and method of cutting brittle material |
| CN110853515A (en) * | 2019-11-20 | 2020-02-28 | 京东方科技集团股份有限公司 | Display panel, cutting method thereof and display device |
| CN110977186A (en) * | 2019-12-13 | 2020-04-10 | 无锡奥特维科技股份有限公司 | Single crystal battery piece splitting equipment and single crystal battery piece splitting method |
| CN111151896A (en) * | 2020-02-07 | 2020-05-15 | 宁夏小牛自动化设备有限公司 | Cutting method and cutting equipment for solar cell |
| CN111151885A (en) * | 2020-02-19 | 2020-05-15 | 无锡奥特维科技股份有限公司 | Battery piece splitting equipment |
-
2020
- 2020-06-17 CN CN202010557911.XA patent/CN113798691A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020047479A (en) * | 2000-12-13 | 2002-06-22 | 김경섭 | Laser cutting method for non-metallic materials |
| CN1435291A (en) * | 2002-02-02 | 2003-08-13 | 三星电子株式会社 | Method and device for cutting non-metal substrate |
| CN101444875A (en) * | 2008-12-08 | 2009-06-03 | 浙江工业大学 | Cutting method of fragile material substrate |
| US20100243628A1 (en) * | 2009-03-25 | 2010-09-30 | Samsung Mobile Display Co., Ltd. | Substrate cutting apparatus and method of cutting substrate using the same |
| JP2011011972A (en) * | 2009-06-05 | 2011-01-20 | Lemi Ltd | Apparatus for cutting brittle material and method of cutting brittle material |
| CN110853515A (en) * | 2019-11-20 | 2020-02-28 | 京东方科技集团股份有限公司 | Display panel, cutting method thereof and display device |
| CN110977186A (en) * | 2019-12-13 | 2020-04-10 | 无锡奥特维科技股份有限公司 | Single crystal battery piece splitting equipment and single crystal battery piece splitting method |
| CN111151896A (en) * | 2020-02-07 | 2020-05-15 | 宁夏小牛自动化设备有限公司 | Cutting method and cutting equipment for solar cell |
| CN111151885A (en) * | 2020-02-19 | 2020-05-15 | 无锡奥特维科技股份有限公司 | Battery piece splitting equipment |
Non-Patent Citations (1)
| Title |
|---|
| 王中林，王绍理: "激光加工设备与工艺", 华中科技大学出版社, pages: 75 - 76 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212470228U (en) | Double-laser heat cracking cutting device for solar cell | |
| CN111730217B (en) | Double-laser thermal cracking cutting device and thermal cracking cutting method for solar cell | |
| CN111571006A (en) | Battery piece dividing method | |
| CN113333965B (en) | Quartz glass invisible cutting method based on Bessel light beam | |
| WO2014134470A1 (en) | Laser system and method for processing sapphire | |
| WO2004075174A3 (en) | System and method for cutting using a variable astigmatic focal beam spot | |
| CN114161000A (en) | Splitting method and splitting device for laser cutting of glass | |
| CN113042903B (en) | Nondestructive cutting method and nondestructive cutting apparatus | |
| Bovatsek et al. | Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355nm q-switched laser source using line-focus fluence optimization technique | |
| CN106475680A (en) | A kind of method that OCA optical cement in interlayer is disassembled using laser | |
| CN110788483B (en) | Low-temperature cutting method and device suitable for HIT battery | |
| CN111151896A (en) | Cutting method and cutting equipment for solar cell | |
| JP2011011972A (en) | Apparatus for cutting brittle material and method of cutting brittle material | |
| CN111151895A (en) | Process and system for cutting transparent material by utilizing filamentation effect | |
| CN113284981A (en) | Nondestructive cutting equipment and process for silicon and silicon-based semiconductor wafer | |
| CN102689092A (en) | Solar wafer precision machining method and device using double laser beams | |
| CN113649701B (en) | Laser edge cleaning method and device for solar cell | |
| CN109817761A (en) | A kind of method and system of multiwavelength laser timesharing ablation solar battery deielectric-coating | |
| CN113798691A (en) | Micro-damage cutting system and method for photovoltaic crystalline silicon solar cell | |
| CN113664365A (en) | Water-free nondestructive cutting process and device for solar cell | |
| CN113387553A (en) | Femtosecond laser double-pulse glass welding strength enhancing system device | |
| CN112846538A (en) | Solar cell low-loss cutting device and method | |
| CN114643426B (en) | Device and method for improving quality and efficiency of laser cutting splitting of borosilicate glass | |
| CN115555726A (en) | Nondestructive cutting method for crystalline silicon solar cell | |
| CN216706328U (en) | Solar cell cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211217 |