CN113795090B - Automatic dispensing and welding integrated equipment for chip production - Google Patents
Automatic dispensing and welding integrated equipment for chip production Download PDFInfo
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- CN113795090B CN113795090B CN202110884224.3A CN202110884224A CN113795090B CN 113795090 B CN113795090 B CN 113795090B CN 202110884224 A CN202110884224 A CN 202110884224A CN 113795090 B CN113795090 B CN 113795090B
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- 238000003466 welding Methods 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000428 dust Substances 0.000 claims abstract description 56
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims description 18
- 230000002457 bidirectional effect Effects 0.000 claims description 11
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 6
- 238000005485 electric heating Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 20
- 239000003292 glue Substances 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/0413—Heating with air
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of chip production, in particular to automatic glue dispensing and welding integrated equipment for chip production, aiming at the problems of the background technology, the invention provides the scheme which comprises a case internally provided with a clamping mechanism and a connecting plate provided with a glue dispensing and welding integrated mechanism, wherein the side wall of the case is welded with a dust removing box provided with a dust collecting mechanism, the outer wall of the top of the case is welded with an L-shaped plate provided with a high-precision moving mechanism, and the side wall of the L-shaped plate is welded with an air supply cover provided with an air supply mechanism. According to the invention, through the cooperation of the high-precision moving mechanism and the spot gluing and welding integrated mechanism, the high-precision moving mechanism is utilized to drive the spot gluing and welding integrated mechanism to move with high precision, so that the chip is accurately spot glued and welded on the PCB substrate, the accuracy of the whole equipment is improved, and meanwhile, the spot gluing and welding integrated mechanism is utilized to finish two operations of spot gluing and welding on one equipment, so that the spot gluing is more uniform, and the efficiency and the quality of chip production are improved.
Description
Technical Field
The invention relates to the technical field of chip production, in particular to automatic dispensing and welding integrated equipment for chip production.
Background
In the production process of chips, dispensing and attaching work is usually required, that is, after the substrate is glued, the corresponding chips are picked up, placed and attached to the glued substrate, and then the chips are welded.
But in the prior art, the chip is separately operated on two devices when dispensing and welding are carried out, so that the working efficiency is low, the processing quality of the whole chip is easily affected in the transferring process, the problem of uneven dispensing is usually caused in the conventional dispensing technology, and the PCB substrate is easily rocked and position offset in the welding process due to inconvenient fixing of the PCB substrate during welding, so that the production quality of the chip is affected.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides automatic dispensing and welding integrated equipment for chip production.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides an automatic spot gluing welding integral type equipment for chip production, includes the quick-witted case that inside was equipped with fixture and is provided with the integrative mechanism of spot gluing welding's connecting plate, the lateral wall of machine case welds the dust removal case that possesses dust absorption mechanism, and the top outer wall welding of machine case has the L template that possesses high accuracy mobile mechanism, the lateral wall welding of L template has the air supply cover that possesses air supply mechanism, and the PCB base plate has been placed at the top of machine case, the chip case has been placed to the bottom inner wall of machine case, and the lateral wall of machine case is fixed with the PLC controller;
the clamping mechanism comprises a first servo motor, a bidirectional screw, two T-shaped sliding blocks, two clamping strips, two rubber pads and a slideway;
the dust collection mechanism comprises a mounting plate, an air pump, a mounting frame, a filter screen and a dust collection block;
the high-precision moving mechanism comprises a second servo motor, a gear, a rack, a sliding rail, a CCD high-definition camera, an infrared sensor and a supporting rod;
the spot gluing and welding integrated mechanism comprises a first push rod motor, a transmission case, a stepping motor, spot gluing devices distributed equidistantly, a plurality of chain wheels, chains, a second push rod motor, a lifting plate and electric welding devices distributed equidistantly;
the air supply mechanism comprises a fan, electric heating wires distributed at equal intervals and ventilation holes distributed at equal intervals.
Preferably, the first servo motor is fixed on the side wall of the case, the bidirectional screw is coaxially connected with the output shaft of the first servo motor through a coupler, the bidirectional screw is respectively connected with the inner walls of the two sides of the case through two bearings, and the two T-shaped sliding blocks are respectively connected with two opposite threaded ends of the bidirectional screw in a threaded mode.
Preferably, two the clamping strips are welded on the outer wall of one side of the two T-shaped sliding blocks, which are close to each other, respectively, and the two rubber pads are bonded on the outer wall of one side of the two clamping strips, which are close to each other, respectively, the slide way is arranged on the inner wall of the top of the case, and the outer walls of the two T-shaped sliding blocks are both in sliding connection with the inner wall of the slide way.
Preferably, the mounting plate is welded on the side wall of the dust removal box, the air pump is fixed on the top outer wall of the mounting plate, the mounting frame is inserted on the middle inner wall of the dust removal box, and the filter screen is fixed on the periphery inner wall of the mounting frame.
Preferably, the dust absorption block is welded on the top outer wall of the case, and is of a hollow structure, dust absorption holes distributed at equal distance are formed in the front inner wall of the dust absorption block, and the dust absorption block is connected with the top inner wall of the dust collection case through the exhaust pipe.
Preferably, the second servo motor is fixed on the top outer wall of the L-shaped plate, the gear is coaxially sleeved on the output shaft of the second servo motor, the rack is meshed with the gear, and the sliding rail is arranged on the top inner wall of the L-shaped plate.
Preferably, the CCD high definition camera and the infrared sensor are both fixed on the outer wall of the bottom of the L-shaped plate, the stay bar is welded on the outer wall of the center of the bottom of the rack, the outer wall of the stay bar is in sliding connection with the inner wall of the sliding rail, and the connecting plate is welded on the outer wall of the bottom end of the stay bar.
Preferably, the first push rod motor and the second push rod motor are both fixed on the outer wall of the bottom of the connecting plate, the transmission case is welded on the outer wall of the output end of the first push rod motor, the stepping motor is fixed on the inner wall of the top of the transmission case, and the glue dispensing devices distributed at equal intervals are connected with the inner wall of the bottom of the transmission case through bearings.
Preferably, a plurality of sprockets are respectively sleeved on the glue dispensing apparatuses distributed at equal intervals, the chains are meshed on the plurality of sprockets, an output shaft of the stepping motor is coaxially connected with one of the glue dispensing apparatuses through a coupler, the lifting plate is welded on the outer wall of the output end of the second push rod motor, and electric welding apparatuses distributed at equal intervals are fixed on the outer wall of the bottom of the lifting plate.
Preferably, the fan is fixedly communicated with the side wall of the air supply cover, the electric heating wires distributed at equal intervals are welded on the inner wall of the air supply cover, and the plurality of ventilation holes are formed in the inner wall of one side of the L-shaped plate.
The beneficial effects of the invention are as follows:
1. the invention is provided with the clamping mechanism, and can clamp and fix the PCB substrates of different types before dispensing and welding, so that the PCB substrates are not easy to shake and shift in the subsequent processing process, and the quality and the precision of the dispensing and welding of the chip can be improved;
2. the dust collection mechanism is arranged, so that dust on the surface of the PCB substrate can be removed before spot-gluing and welding, the surface of the PCB substrate can be guaranteed to be tidy in the subsequent processing process, the adverse effect of the dust on the spot-gluing and welding work of the chip can be reduced, and the processing quality and effect are further improved;
3. according to the invention, through the mutual cooperation of the high-precision moving mechanism and the spot gluing and welding integrated mechanism, the high-precision moving mechanism is utilized to drive the spot gluing and welding integrated mechanism to move with high precision so as to realize the accurate spot gluing and welding of the chip on the PCB substrate, so that the accuracy of the whole equipment can be improved, and simultaneously, the spot gluing and welding integrated mechanism can realize the two operations of spot gluing and welding on one equipment, and the spot gluing is more uniform, so that the production efficiency and quality of the chip are improved;
4. be provided with air supply mechanism, at the in-process air supply mechanism that glues of point can be continuous carry hot-blast messenger's chip subsides that can be quick cover on the PCB base plate to improved the efficiency that the point glued, at welded in-process air supply mechanism can be continuous carry cold wind, and then can accelerate the cooling rate of welded part, thereby improved welded efficiency.
Drawings
Fig. 1 is a schematic diagram of an overall three-dimensional structure of an automatic dispensing and welding integrated device for chip production according to the present invention;
fig. 2 is a schematic perspective view of a clamping mechanism and a dust removing mechanism in an integrated automatic dispensing and welding device for chip production according to the present invention;
fig. 3 is a schematic perspective view of a clamping mechanism in an integrated device for automatic dispensing and welding for chip production according to the present invention;
fig. 4 is a schematic perspective view of a dust collection mechanism in an integrated automatic dispensing and welding device for chip production according to the present invention;
fig. 5 is a schematic diagram of a three-dimensional structure of a high-precision moving mechanism in an automatic dispensing and welding integrated device for chip production according to the present invention;
fig. 6 is a schematic perspective view of an integrated spot-gluing and welding mechanism of an integrated automatic spot-gluing and welding device for chip production according to the present invention;
fig. 7 is a schematic diagram of an internal three-dimensional structure of a transmission case in an automatic dispensing and welding integrated device for chip production according to the present invention;
fig. 8 is a schematic perspective view of a transmission connection between multiple sprockets and a chain in an automatic dispensing and welding integrated device for chip production according to the present invention;
fig. 9 is a schematic perspective view of an air supply mechanism in an automatic dispensing and welding integrated device for chip production according to the present invention;
fig. 10 is a schematic perspective view of two parts of an air pump and a fan in an integrated device for automatic dispensing and welding for chip production according to the present invention.
In the figure: 1 machine case, 2 dust removal case, 3L template, 4 connecting plates, 5 air supply cover, 6PCB base plate, 7 chip case, 8PLC controllers, 101 first servo motor, 102 bi-directional screw, 103T type slider, 104 clamping strip, 105 rubber pad, 106 slide, 201 mounting plate, 202 aspiration pump, 203 mounting frame, 204 filter screen, 205 dust absorption block, 301 second servo motor, 302 gear, 303 rack, 304 slide rail, 305CCD high definition camera, 306 infrared sensor, 307 stay bar, 401 first push rod motor, 402 transmission case, 403 stepper motor, 404 point gum appearance, 405 sprocket, 406 chain, 407 second push rod motor, 408 lifter plate, 409 electric welding ware, 501 fan, 502 heating wire, 503 ventilation hole.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-2, an automatic dispensing and welding integrated device for chip production comprises a case 1 with a clamping mechanism inside and a connecting plate 4 with a dispensing and welding integrated mechanism, wherein a dust removal case 2 with a dust collection mechanism is welded on the side wall of the case 1, an L-shaped plate 3 with a high-precision moving mechanism is welded on the top outer wall of the case 1, an air supply cover 5 with an air supply mechanism is welded on the side wall of the L-shaped plate 3, a PCB substrate 6 is placed on the top of the case 1, a chip storage box 7 is placed on the bottom inner wall of the case 1, a PLC 8 is fixed on the side wall of the case 1, a double-open type case door is hinged on the front side of the case 1, and a sealing case door is hinged on the front side of the dust removal case 2;
in the embodiment 1, the preparation work is performed before glue dispensing welding, referring to fig. 2-4, the clamping mechanism is composed of a first servo motor 101 fixed on the side wall of the case 1, a bidirectional screw rod 102 coaxially connected with the output shaft of the first servo motor 101 through a coupler, two T-shaped sliding blocks 103 sequentially screwed on two opposite threaded ends of the bidirectional screw rod 102, two clamping strips 104 sequentially welded on the outer wall of one side of the two T-shaped sliding blocks 103 close to each other, two rubber pads 105 sequentially adhered on the outer wall of one side of the two clamping strips 104 close to each other, and a slideway 106 arranged on the inner wall of the top of the case 1, the bidirectional screw rod 102 is respectively connected with the inner walls of two sides of the case 1 through two bearings, the outer walls of the two T-shaped sliding blocks 103 are both in sliding connection with the inner walls of the slideway 106, the first servo motor 101 is connected with a reversing switch through a wire, and the reversing switch is connected with a power line;
the dust collection mechanism consists of a mounting plate 201 welded on the side wall of the dust collection box 2, an air pump 202 fixed on the outer wall of the top of the mounting plate 201, a mounting frame 203 inserted in the inner wall of the middle of the dust collection box 2, a filter screen 204 fixed on the inner wall around the mounting frame 203 and a hollow dust collection block 205 welded on the outer wall of the top of the machine box 1, dust collection holes distributed at equal intervals are formed in the inner wall of the front surface of the dust collection block 205, and the dust collection block 205 is connected with the inner wall of the top of the dust collection box 2 through an air pump;
according to the device, before dispensing and welding, the two-way screw 102 is required to be driven to rotate by the first servo motor 101, under the limit of the slideway 106, two T-shaped sliding blocks 103 which are in threaded connection with two opposite threaded ends of the two-way screw 102 can drive two clamping strips 104 to be mutually close to clamp and fix the PCB substrate 6, so that the PCB substrate 6 is not easy to shake and shift in position in the subsequent processing process, the quality and precision of chip dispensing and welding can be improved, the dust on the PCB substrate 6 is required to be sucked into the dust collection box 2 by generating stronger suction force at a dust collection hole on the dust collection block 205 by utilizing the air negative pressure principle through the air suction pump 202, and the sucked dust can be intercepted by the filter screen 204 and collected in the dust collection box 2, so that the surface cleanliness of the PCB substrate 6 in the subsequent processing process can be guaranteed, the adverse effect of the dust on the chip dispensing and welding work can be reduced, and the quality and effect of processing are further improved;
the spot gluing and welding integrated mechanism is composed of a first push rod motor 401 and a second push rod motor 407 which are sequentially fixed on the outer wall of the bottom of a connecting plate 4, a transmission case 402 welded on the outer wall of the output end of the first push rod motor 401, a stepping motor 403 fixed on the inner wall of the top of the transmission case 402, equally distributed spot gluing devices 404 connected with the inner wall of the bottom of the transmission case 402 through bearings, a plurality of chain wheels 405 respectively sleeved on the equally distributed spot gluing devices 404, the same chain 406 meshed with the plurality of chain wheels 405, a lifting plate 408 welded on the outer wall of the output end of the second push rod motor 407 and equally distributed electric welders 409 fixed on the outer wall of the bottom of the lifting plate 408, wherein the output shaft of the stepping motor 403 is coaxially connected with one of the spot gluing devices 404 through a coupling;
the air supply mechanism consists of a fan 501 fixedly communicated with the side wall of the air supply cover 5, heating wires 502 welded on the inner wall of the air supply cover 5 and distributed at equal intervals, and ventilation holes 503 formed on the inner wall of one side of the L-shaped plate 3;
in combination with a high-precision moving mechanism, a dispensing and welding integrated mechanism and an air supply mechanism, when in electric glue welding, a gear 302 is driven to rotate by a second servo motor 301, the gear 302 rotates to drive a rack 303 to move, the rack 303 moves to drive a supporting rod 307 to slide in a sliding rail 304, and the dispensing and welding integrated mechanism on a connecting plate 4 is enabled to precisely move by utilizing a CCD high-definition camera 305 and an infrared sensor 306, a plurality of dispensing machines 404 installed on a transmission case 402 are driven to move downwards by a first push rod motor 401 during dispensing, meanwhile, the step motor 403 is started to cooperate with the transmission of a plurality of sprockets 405 and a chain 406, finally, the plurality of dispensing machines 404 can rotate to dispense glue, after the dispensing is finished, a plurality of electric welders 409 fixed at the bottom of a lifting plate 408 are driven to move downwards by utilizing a second push rod motor 407, so that the dispensing and welding integrated mechanism can realize two operations of dispensing and welding on one device, and the dispensing is more uniform, the efficiency and the quality of chip production are improved, and the air supply mechanism can be continuously supplied with a plurality of cooling machines, so that the cooling efficiency of the chip can be increased, and the cooling efficiency of the cooling mechanism can be quickly and the cooling efficiency of the chip can be increased, and the cooling efficiency of the welding mechanism can be further improved.
The working flow of the invention is as follows: the first step, a bi-directional screw 102 is driven to rotate by a first servo motor 101, and under the limit of a slideway 106, two T-shaped sliding blocks 103 which are in threaded connection with two opposite threaded ends of the bi-directional screw 102 drive two clamping strips 104 to be mutually close to clamp and fix a PCB substrate 6; secondly, the suction pump 202 utilizes the air negative pressure principle to enable the dust suction holes on the dust suction block 205 to generate stronger suction force to suck the dust on the PCB substrate 6 into the dust collection box 2, and the sucked dust can be intercepted by the filter screen 204 and collected in the dust collection box 2; thirdly, driving a gear 302 to rotate through a second servo motor 301, wherein the gear 302 rotates to drive a rack 303 to move, the rack 303 moves to drive a supporting rod 307 to slide in a sliding rail 304, and a connecting plate 4 is precisely moved by a CCD high-definition camera 305 and an infrared sensor 306; fourthly, a plurality of glue dispensing meters 404 arranged on a transmission case 402 are driven to move downwards by a first push rod motor 401, meanwhile, the starting of a stepping motor 403 is matched with the transmission of a plurality of chain wheels 405 and a chain 406, and finally, the plurality of glue dispensing meters 404 move downwards to move horizontally and conveniently and rotate, so that uniform glue dispensing is realized, chips in a chip storage box 7 are sequentially placed on a PCB substrate 6 to finish pasting work after glue dispensing is finished, and meanwhile, a fan 501 is matched with the starting of an electric heating wire 502 to enable an air supply cover 5 to continuously convey hot air to the PCB substrate 6; fourth, the second push rod motor 407 is utilized to drive the plurality of electric welders 409 fixed at the bottom of the lifting plate 408 to move downwards for welding, and meanwhile, the fan 501 is started to enable the air supply cover 5 to continuously convey cold air onto the PCB substrate 6.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. The utility model provides an automatic spot gluing welding integral type equipment for chip production, includes quick-witted case (1) that inside was equipped with fixture and is provided with spot gluing welding integrative mechanism's connecting plate (4), its characterized in that, the lateral wall of machine case (1) welds has dust removal case (2) that possess dust absorption mechanism, and the top outer wall welding of machine case (1) has L template (3) that possess high accuracy mobile mechanism, the lateral wall welding of L template (3) has air supply cover (5) that possess air supply mechanism, and PCB base plate (6) have been placed at the top of machine case (1), chip case (7) have been placed to the bottom inner wall of machine case (1), and the lateral wall of machine case (1) is fixed with PLC controller (8);
the clamping mechanism comprises a first servo motor (101), a bidirectional screw (102), two T-shaped sliding blocks (103), two clamping strips (104), two rubber pads (105) and a slideway (106);
the dust collection mechanism comprises a mounting plate (201), an air pump (202), a mounting frame (203), a filter screen (204) and a dust collection block (205);
the high-precision moving mechanism comprises a second servo motor (301), a gear (302), a rack (303), a sliding rail (304), a CCD high-definition camera (305), an infrared sensor (306) and a supporting rod (307);
the dispensing and welding integrated mechanism comprises a first push rod motor (401), a transmission case (402), a stepping motor (403), a dispensing instrument (404) which is equidistantly distributed, a plurality of chain wheels (405), a chain (406), a second push rod motor (407), a lifting plate (408) and electric welders (409) which are equidistantly distributed;
the air supply mechanism comprises a fan (501), heating wires (502) which are distributed equidistantly and ventilation holes (503) which are distributed equidistantly.
2. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein the first servo motor (101) is fixed on the side wall of the case (1), the bidirectional screw (102) is coaxially connected with an output shaft of the first servo motor (101) through a coupler, the bidirectional screw (102) is respectively connected with two side inner walls of the case (1) through two bearings, and two T-shaped sliding blocks (103) are respectively connected with two opposite threaded ends of the bidirectional screw (102) in a threaded mode.
3. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein two clamping strips (104) are welded on the outer wall of one side of the two T-shaped sliding blocks (103) close to each other respectively, two rubber pads (105) are bonded on the outer wall of one side of the two clamping strips (104) close to each other respectively, the sliding way (106) is formed in the inner wall of the top of the machine case (1), and the outer walls of the two T-shaped sliding blocks (103) are connected with the inner wall of the sliding way (106) in a sliding mode.
4. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein the mounting plate (201) is welded on the side wall of the dust removing box (2), the air pump (202) is fixed on the top outer wall of the mounting plate (201), the mounting frame (203) is inserted into the middle inner wall of the dust removing box (2), and the filter screen (204) is fixed on the peripheral inner wall of the mounting frame (203).
5. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein the dust collection block (205) is welded on the top outer wall of the chassis (1), the dust collection block (205) is of a hollow structure, dust collection holes distributed at equal distances are formed in the front inner wall of the dust collection block (205), and the dust collection block (205) is connected with the top inner wall of the dust collection box (2) through an exhaust pipe.
6. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein the second servo motor (301) is fixed on the top outer wall of the L-shaped plate (3), the gear (302) is coaxially sleeved on the output shaft of the second servo motor (301), the rack (303) is meshed with the gear (302), and the sliding rail (304) is arranged on the top inner wall of the L-shaped plate (3).
7. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein the CCD high-definition camera (305) and the infrared sensor (306) are both fixed on the outer wall of the bottom of the L-shaped plate (3), the stay bar (307) is welded on the central outer wall of the bottom of the rack (303), the outer wall of the stay bar (307) is in sliding connection with the inner wall of the sliding rail (304), and the connecting plate (4) is welded on the outer wall of the bottom end of the stay bar (307).
8. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein the first push rod motor (401) and the second push rod motor (407) are both fixed on the outer wall of the bottom of the connecting plate (4), the transmission case (402) is welded on the outer wall of the output end of the first push rod motor (401), the stepping motor (403) is fixed on the inner wall of the top of the transmission case (402), and dispensing instruments (404) distributed at equal distance are both connected with the inner wall of the bottom of the transmission case (402) through bearings.
9. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein a plurality of chain wheels (405) are respectively sleeved on dispensing machines (404) distributed at equal intervals, chains (406) are meshed on the plurality of chain wheels (405), an output shaft of the stepping motor (403) is coaxially connected with one of the dispensing machines (404) through a coupler, a lifting plate (408) is welded on the outer wall of the output end of the second push rod motor (407), and electric welding machines (409) distributed at equal intervals are all fixed on the outer wall of the bottom of the lifting plate (408).
10. The automatic dispensing and welding integrated device for chip production according to claim 1, wherein the fan (501) is fixedly communicated with the side wall of the air supply cover (5), the electric heating wires (502) distributed equidistantly are all welded on the inner wall of the air supply cover (5), and the plurality of ventilation holes (503) are all formed in the inner wall of one side of the L-shaped plate (3).
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| CN202110884224.3A CN113795090B (en) | 2021-08-03 | 2021-08-03 | Automatic dispensing and welding integrated equipment for chip production |
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| CN202110884224.3A CN113795090B (en) | 2021-08-03 | 2021-08-03 | Automatic dispensing and welding integrated equipment for chip production |
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| CN113795090B true CN113795090B (en) | 2023-05-23 |
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| JP2008023471A (en) * | 2006-07-24 | 2008-02-07 | Hitachi Plant Technologies Ltd | Paste applicator and paste application method |
| CN109526151A (en) * | 2018-11-22 | 2019-03-26 | 滁州市云米工业设计有限公司 | A kind of quick dispensing integration apparatus of pcb board |
| CN110446424A (en) * | 2019-08-30 | 2019-11-12 | 恩纳基智能科技无锡有限公司 | Multi-functional double-station flexibility Welding head mechanism |
| CN110694856A (en) * | 2019-10-22 | 2020-01-17 | 江苏卓信达电子科技有限公司 | Dispensing equipment for PP plastic bracelet |
| CN210359915U (en) * | 2019-05-29 | 2020-04-21 | 东莞市三信精密机械有限公司 | Automatic upset welding point all-in-one |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE421389T1 (en) * | 2004-09-08 | 2009-02-15 | Leister Process Tech | HAND EXTRUDER WELDING MACHINE |
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2021
- 2021-08-03 CN CN202110884224.3A patent/CN113795090B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008023471A (en) * | 2006-07-24 | 2008-02-07 | Hitachi Plant Technologies Ltd | Paste applicator and paste application method |
| CN109526151A (en) * | 2018-11-22 | 2019-03-26 | 滁州市云米工业设计有限公司 | A kind of quick dispensing integration apparatus of pcb board |
| CN210359915U (en) * | 2019-05-29 | 2020-04-21 | 东莞市三信精密机械有限公司 | Automatic upset welding point all-in-one |
| CN110446424A (en) * | 2019-08-30 | 2019-11-12 | 恩纳基智能科技无锡有限公司 | Multi-functional double-station flexibility Welding head mechanism |
| CN110694856A (en) * | 2019-10-22 | 2020-01-17 | 江苏卓信达电子科技有限公司 | Dispensing equipment for PP plastic bracelet |
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| CN113795090A (en) | 2021-12-14 |
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