CN108323152B - Point tin cream chip mounter - Google Patents
Point tin cream chip mounter Download PDFInfo
- Publication number
- CN108323152B CN108323152B CN201810099894.2A CN201810099894A CN108323152B CN 108323152 B CN108323152 B CN 108323152B CN 201810099894 A CN201810099894 A CN 201810099894A CN 108323152 B CN108323152 B CN 108323152B
- Authority
- CN
- China
- Prior art keywords
- base
- moving mechanism
- fixedly connected
- gluing
- gluing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 6
- 239000006071 cream Substances 0.000 title claims description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 150
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 57
- 238000003860 storage Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 19
- 229910052802 copper Inorganic materials 0.000 abstract description 19
- 239000010949 copper Substances 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000010923 batch production Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a spot solder paste chip mounter, which comprises a base, wherein the bottom of the base is fixedly connected with a plurality of supporting mechanisms, a plurality of storage mechanisms are arranged on the base, two conveyor belts are arranged on the upper side of the base, mounting grooves corresponding to the conveyor belts are arranged on the top of the base, a working plate is movably connected on the conveyor belts, a first gluing device, a second gluing device and a pasting device which are arranged on the base are sequentially arranged above the conveyor belts, and a feeding mechanism is arranged on one side of the base. According to the invention, the working plate is driven to move by the conveyor belt, accurate limiting is performed by the limiting plate and the limiting mechanism in the moving process, the gluing treatment of the copper sheet is finished by the first gluing device and the second gluing device, and then the diode is pasted on the copper sheet by the pasting device, so that the pasting treatment is performed in such a way, not only is the labor force saved, but also the production speed is increased, and the large-scale production of manufacturers is facilitated.
Description
Technical Field
The invention relates to the technical field of surface mounting devices, in particular to a spot tin paste surface mounting machine.
Background
The surface mount machine is a device which is arranged behind a dispensing machine or a screen printer in a production line and is used for accurately placing surface mount components on a PCB bonding pad by moving a mounting head.
At present, when the chip mounter is used, the PCB welded plate which is processed is independently placed in the chip mounter, so that the chip mounter is independently processed, the production speed is slow, a large amount of manpower is required for operation, and the chip mounter is not suitable for large-scale batch production of manufacturers.
Therefore, we design a spot solder paste chip mounter.
Disclosure of Invention
The invention aims to solve the problems that the existing chip mounter is slow in production speed and needs a large amount of personnel to operate, so that the chip mounter is not suitable for mass production.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a point tin cream chip mounter, includes the base, the bottom fixedly connected with of base is a plurality of supporting mechanism, be equipped with a plurality of storage mechanism on the base, the upside of base is equipped with two conveyer belts, the top of base is equipped with the mounting groove that corresponds with the conveyer belt, swing joint has the working plate on the conveyer belt, the top of conveyer belt is equipped with first rubberizing device, second rubberizing device and the device of pasting of installing on the base in proper order, one side of base is equipped with feed mechanism, feed mechanism is located between second rubberizing device and the device of pasting, the top fixedly connected with connecting rod of base, the one end fixedly connected with control panel of base is kept away from to the connecting rod.
Preferably, the storage mechanism comprises a plurality of storage cavities arranged on the base, a box door is connected at the notch of each storage cavity in a hinge mode, and a handle is arranged on the box door.
Preferably, limiting plates are fixedly connected to opposite inner side walls of the mounting groove, and the working plate is located between the two limiting plates.
Preferably, three limiting mechanisms are fixedly connected to the inner bottoms of the mounting grooves, limiting grooves corresponding to the limiting mechanisms are formed in two ends of the working plate, and the three limiting mechanisms are respectively located under the first gluing device, the second gluing device and the pasting device.
Preferably, the first rubberizing device and the second rubberizing device all include the first lateral shifting mechanism and the connecting plate of fixing on the base, fixedly connected with driven mechanism on the connecting plate, first lateral shifting mechanism and driven mechanism pass through first longitudinal shifting mechanism and connect, the both ends of first longitudinal shifting mechanism respectively with first lateral shifting mechanism and driven mechanism all sliding connection, sliding connection has first vertical mechanism on the first longitudinal shifting mechanism, fixedly connected with rubberizing mechanism on the first vertical mechanism.
Preferably, the pasting device comprises a second transverse moving mechanism and a sliding rail which are fixed on the base, the second transverse moving mechanism is connected with the sliding rail through a second longitudinal moving mechanism, two ends of the second longitudinal moving mechanism are respectively connected with a third transverse mechanism and the sliding rail in a sliding manner, a second vertical mechanism is connected to the second longitudinal moving mechanism in a sliding manner, and a suction mechanism is fixedly connected to the bottom of the second vertical mechanism.
Preferably, the feeding mechanism comprises a bottom box fixed on the side wall of the base, the top of the bottom box is fixedly connected with a storage rack, a fixing frame and a rail which is obliquely arranged, a third transverse moving mechanism is fixedly connected to the fixing frame, a third vertical mechanism is connected to the third transverse moving mechanism in a sliding mode, and a manipulator is fixedly connected to the third vertical mechanism.
Preferably, the control panel is electrically connected with the first gluing device, the second gluing device, the pasting device and the feeding device.
According to the invention, the working plate is driven to move by the conveyor belt, accurate limiting is performed by the limiting plate and the limiting mechanism in the moving process, the gluing treatment of the copper sheet is finished by the first gluing device and the second gluing device, and then the diode is pasted on the copper sheet by the pasting device, so that the pasting treatment is performed in such a way, not only is the labor force saved, but also the production speed is increased, and the large-scale production of manufacturers is facilitated.
Drawings
Fig. 1 is a schematic structural diagram of a spot solder paste placement machine according to the present invention;
fig. 2 is a schematic diagram of a connection structure between a first gluing device, a second gluing device and a pasting device and a base in the spot solder paste chip mounter according to the present invention;
fig. 3 is a schematic structural diagram of a first gluing device in the spot solder paste chip mounter according to the present invention;
fig. 4 is a schematic side structural view of a first gluing device in the spot solder paste chip mounter according to the present invention;
fig. 5 is a schematic structural diagram of a pasting device in the spot solder paste chip mounter according to the present invention;
fig. 6 is a schematic structural diagram of a feeding mechanism in the spot solder paste chip mounter according to the present invention.
In the figure: 1 base, 2 conveyer belt, 3 working plate, 4 first rubberizing device, 5 second rubberizing device, 6 paste the device, 61 second lateral shifting mechanism, 62 slide rail, 63 second vertical mechanism, 64 second vertical mechanism, 65 suction mechanism, 7 feed mechanism, 71 base box, 72 storage rack, 73 mount, 74 track, 75 third lateral shifting mechanism, 76 third vertical mechanism, 77 manipulator, 8 connecting rod, 9 control panel, 10 supporting mechanism, 11 storage mechanism, 111 chamber door, 112 handle, 12 limiting plate, 13 limiting mechanism, 14 first lateral shifting mechanism, 15 connecting plate, 16 driven mechanism, 17 first vertical mechanism, 18 first vertical mechanism, 19 rubberizing mechanism.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1-6, the spot tin cream chip mounter comprises a base 1, a plurality of supporting mechanisms 10 are fixedly connected to the bottom of the base 1, the movement of the base 1 and the base 1 is conveniently supported through the action of the supporting mechanisms 10, a plurality of storage mechanisms 11 are arranged on the base 1, each storage mechanism 11 comprises a plurality of storage cavities arranged on the base 1, a box door 111 is connected to a notch of each storage cavity in a hinge mode, a handle 112 is arranged on each box door 111, and therefore people can store needed devices and tools needed to be used in overhaul conveniently, and people can use conveniently.
The upper side of base 1 is equipped with two conveyer belts 2, swing joint has work board 3 on the conveyer belt 2, the top of base 1 is equipped with the mounting groove that corresponds with conveyer belt 2, equal fixedly connected with limiting plate 12 on the relative inside wall of mounting groove, work board 3 is located between two limiting plates 12, the effect through conveyer belt 2 drives the motion of work board 3 like this, thereby drive the removal of PCB welded plate through work board 3, then carry out spacingly with the both sides of work board through the effect of two limiting plates 12, thereby guarantee rubberizing accuracy and stability, and then make things convenient for people's use, the interior bottom fixedly connected with three stop gear 13 of mounting groove, the both ends of work board 3 all are equipped with the spacing groove that corresponds with stop gear 13, three stop gear 13 are located first rubberizing device 4 respectively, second rubberizing device 5 and paste device 6 under, so make it be connected with the spacing groove at work board 2 both ends through the effect of stop gear 13, thereby carry out spacingly with work board 2, and then guarantee that first rubberizing device 4, second rubberizing device 5 and paste device 6 carry out spacingly with the both sides of work board, thereby the work board 2 is stable on the work board 2, and stable production process is accomplished on the work board is stable.
The upper side of the conveyor belt 2 is sequentially provided with a first gluing device 4, a second gluing device 5 and a pasting device 6 which are arranged on the base 1, the first gluing device 4 and the second gluing device 5 respectively comprise a first transverse moving mechanism 14 and a connecting plate 15 which are fixed on the base 1, a driven mechanism 16 is fixedly connected to the connecting plate 15, the first transverse moving mechanism 14 and the driven mechanism 16 are connected through a first longitudinal moving mechanism 17, two ends of the first longitudinal moving mechanism 17 are respectively connected with the first transverse moving mechanism 14 and the driven mechanism 16 in a sliding manner, a first vertical mechanism 18 is connected to the first longitudinal moving mechanism 17 in a sliding manner, and a gluing mechanism 19 is fixedly connected to the first vertical mechanism 18, so that gluing is needed on a copper sheet through the action of the first gluing device 4 and the second gluing device 5, stable gluing of a diode is facilitated, the problem of glue leakage on the glue leakage and few glue leakage can be avoided through the arrangement of the two gluing devices, and the stability of glue connection is ensured.
When the copper sheet rubberizing is accomplished just needs to put the diode on the copper sheet, then need use paste device 6, paste device 6 is including fixing second lateral shifting mechanism 61 and slide rail 62 on base 1, second lateral shifting mechanism 61 is connected with slide rail 62 through second longitudinal shifting mechanism 63, the both ends of second longitudinal shifting mechanism 63 respectively with third lateral mechanism 61 and slide rail 62 sliding connection, sliding connection has the vertical mechanism 64 of second on the second longitudinal shifting mechanism 63, the bottom fixedly connected with suction mechanism 65 of the vertical mechanism 64 of second, so through paste device 6's effect with the accurate copper sheet of placing the rubberizing of diode on, and then make things convenient for people's welding.
One side of the base 1 is provided with a feeding mechanism 7, the feeding mechanism 7 is located between the second gluing device 5 and the pasting device 6, the feeding mechanism 7 comprises a bottom box 71 fixed on the side wall of the base 1, the top of the bottom box 71 is fixedly connected with a storage rack 72, a fixing rack 73 and a rail 74 obliquely arranged, the fixing rack 73 is fixedly connected with a third transverse moving mechanism 75, the third transverse moving mechanism 75 is slidingly connected with a third vertical mechanism 76, the third vertical mechanism 76 is fixedly connected with a manipulator 77, the diode is conveniently placed through the action of the feeding device 7, and further the process production is facilitated, namely people only need to place the diode on the storage rack 72, the manipulator is conveniently placed on the rail 74, further the pasting device 6 absorbs the diode, further the process is facilitated, the top of the base 1 is fixedly connected with a connecting rod 8, one end of the connecting rod 8, which is far away from the base 1, of the control panel 9 is fixedly connected with the first gluing device 4, the second gluing device 5, the pasting device 6 and the feeding device 7 are electrically connected with the whole device 7, and the whole device can be conveniently used by controlling the whole device 9.
In the invention, when the diode chip mounting treatment is needed, firstly, the copper sheets are orderly placed on the working plate 3, and then are placed on the conveyor belt 2, and at the moment, the operation of the conveyor belt 2, the first gluing device 4, the second gluing device 5, the gluing device 6 and the feeding mechanism 7 is controlled through the control panel 9, because the first transverse moving mechanism 14, the first longitudinal moving mechanism 17, the first vertical mechanism 18, the second transverse moving mechanism 61, the second longitudinal moving mechanism 63, the second vertical mechanism 64, the third transverse moving mechanism 75 and the third vertical mechanism 76 in the device are all completed by push rod motors and push rods, and the control panel 9 is electrically connected with the push rod motors. The movement of the conveyor belt 2 drives the working plate 3, thereby facilitating the flow production of the copper sheets by the action of the conveyor belt, facilitating the mass production, limiting the working plate 3 by the limiting plates 12 on two sides when the working plate 3 is placed on the conveyor belt 2 for movement, so that the stability and the accuracy of the working plate 3 during processing are improved,
when the working plate moves forwards, the working plate is limited by the cooperation of the limiting mechanism 13 and the limiting groove, namely, the position of the working plate is positioned by the action of the limiting plate 12 and the limiting mechanism 13, so that deviation in the gluing process is avoided, then, the gluing treatment of one copper sheet on the working plate 3 is finished by the cooperation of the first vertical mechanism 18 and the first gluing mechanism 19, then, the longitudinal movement of the first vertical mechanism 18 is finished by the action of the first longitudinal movement mechanism 17, further, the gluing of one copper sheet on the working plate 3 is finished, then, the transverse movement of the first longitudinal movement mechanism 17 is finished by the cooperation of the first transverse movement mechanism 14 and the first driven mechanism 16, so that the gluing process is orderly finished by the gluing mechanism 19, wherein the control panel 9 is electrically connected with a control valve at the discharge end of the gluing mechanism 19, namely, when the gluing of one copper sheet on the working plate 3 is finished, the longitudinal movement of the copper sheet is finished, the gluing of the other copper sheet is finished, and then, the gluing of the first longitudinal movement mechanism 3 is finished, the first longitudinal movement is finished, the gluing is finished, and the gluing is finished by the second longitudinal movement of the first longitudinal movement mechanism 4 is not finished, and the gluing is finished again, the problem is solved, and the gluing is solved by the first gluing treatment is not finished,
when the gluing is finished, the diode needs to be adhered to the glued copper sheet, namely, the glued copper sheet moves to the position right below the gluing device 6 through the action of the conveying belt 2, the work plate 3 is stable through the cooperation of the limiting mechanism 13 and the limiting groove, the diode is conveniently and accurately placed on the copper sheet, namely, the diode placed on the track 74 is sucked down through the action of the suction mechanism 65, the suction mechanism 65 is electrically connected with the control panel 9, the diode is placed through the action of the second vertical mechanism 64, the diode is sequentially adhered to each copper sheet on the work plate 3 through the action of the second vertical moving mechanism 63 and the second transverse moving mechanism 61, the production is further facilitated, the work plate 3 of the patch is further moved forwards through the action of the conveying belt 2, the collection of people is further facilitated, the production speed is further accelerated through the completion of the patch in the conveying process, and the mass production of manufacturers is facilitated.
In addition, the diode is conveniently placed on the track 74 through the action of the feeding mechanism 7, namely, people can place the diode to be processed on the storage rack 72, and the manipulator 77 is matched with the third transverse moving mechanism 75 and the third vertical mechanism 76 to finish taking the diode on the storage rack and placing the diode on the track 74, so that the whole production of the patch in a flow process is facilitated.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (1)
1. The spot tin cream chip mounter, including base (1), its characterized in that, the bottom fixedly connected with of base (1) a plurality of supporting mechanism (10), be equipped with a plurality of storage mechanism (11) on base (1), the upside of base (1) is equipped with two conveyer belts (2), the top of base (1) is equipped with the mounting groove that corresponds with conveyer belt (2), swing joint has working plate (3) on conveyer belt (2), the top of conveyer belt (2) is equipped with first rubberizing device (4), second rubberizing device (5) and paste device (6) of installing on base (1) in proper order, one side of base (1) is equipped with feed mechanism (7), feed mechanism (7) are located between second rubberizing device (5) and paste device (6), the top fixedly connected with connecting rod (8) of base (1), the one end fixedly connected with control panel (9) that base (1) were kept away from to connecting rod (8), storage mechanism (11) are equipped with including base (1) on a plurality of chambeies, be equipped with the equal slot (111) are equipped with on the relative chamber door (111) of door, the equal door (111) is equipped with hinge on the side wall (111), the working plate (3) is positioned between the two limiting plates (12), three limiting mechanisms (13) are fixedly connected to the inner bottoms of the mounting grooves, limiting grooves corresponding to the limiting mechanisms (13) are formed in the two ends of the working plate (3), the three limiting mechanisms (13) are respectively positioned under the first gluing device (4), the second gluing device (5) and the pasting device (6), the first gluing device (4) and the second gluing device (5) respectively comprise a first transverse moving mechanism (14) and a connecting plate (15) which are fixed on the base (1), a driven mechanism (16) is fixedly connected to the connecting plate (15), the first transverse moving mechanism (14) and the driven mechanism (16) are connected through a first longitudinal moving mechanism (17), the two ends of the first longitudinal moving mechanism (17) are respectively connected with the first transverse moving mechanism (14) and the driven mechanism (16) in a sliding mode, a first vertical moving mechanism (18) is connected to the first longitudinal moving mechanism (17) in a sliding mode, the first transverse moving mechanism (18) is fixedly connected to the first transverse moving mechanism (6) and the first transverse moving mechanism (62) on the base (1), the second transverse moving mechanism (61) is connected with the sliding rail (62) through the second longitudinal moving mechanism (63), two ends of the second longitudinal moving mechanism (63) are respectively connected with the third transverse moving mechanism (61) and the sliding rail (62) in a sliding mode, a second vertical mechanism (64) is connected to the second longitudinal moving mechanism (63) in a sliding mode, a suction mechanism (65) is fixedly connected to the bottom of the second vertical mechanism (64), the feeding mechanism (7) comprises a bottom box (71) fixed to the side wall of the base (1), a material storage rack (72), a fixing rack (73) and a rail (74) which are obliquely arranged are fixedly connected to the top of the bottom box (71), a third transverse moving mechanism (75) is fixedly connected to the fixing rack (73), a manipulator (77) is fixedly connected to the third vertical mechanism (76) in a sliding mode, and the control panel (9) is connected with a first gluing device (4), a second gluing device (5), a gluing device (6) and a gluing device (7) electrically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099894.2A CN108323152B (en) | 2018-01-24 | 2018-01-24 | Point tin cream chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099894.2A CN108323152B (en) | 2018-01-24 | 2018-01-24 | Point tin cream chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108323152A CN108323152A (en) | 2018-07-24 |
| CN108323152B true CN108323152B (en) | 2024-01-23 |
Family
ID=62890484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810099894.2A Active CN108323152B (en) | 2018-01-24 | 2018-01-24 | Point tin cream chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108323152B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437554A (en) * | 2020-12-01 | 2021-03-02 | 付家豪 | Glue dispensing and chip mounting device for electronic product production for spacecraft |
| CN112770528B (en) * | 2020-12-09 | 2023-10-20 | 苏州斯尔特微电子有限公司 | Chip mounter paster mechanism |
| CN114916153B (en) * | 2022-04-25 | 2023-01-31 | 贝隆精密科技股份有限公司 | Curved surface point tin paster all-in-one |
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