CN113793831A - 半导体芯片焊线设备的芯片框架固定支架 - Google Patents

半导体芯片焊线设备的芯片框架固定支架 Download PDF

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CN113793831A
CN113793831A CN202110963875.1A CN202110963875A CN113793831A CN 113793831 A CN113793831 A CN 113793831A CN 202110963875 A CN202110963875 A CN 202110963875A CN 113793831 A CN113793831 A CN 113793831A
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李彬
林广平
杨燮斌
方逸裕
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SHANTOU HUASHAN ELECTRONIC DEVICES CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract

本发明公开一种半导体芯片焊线设备的芯片框架固定支架，包括压板机构，其具有可升降的压板以及安装在压板上的弹性压爪，压板下降时弹性压爪压紧芯片框架；中心轨道模块，其上部有供芯片框架滑行的轨道，轨道的侧部有供可伸缩的插片***的凹部台阶；可伸缩的插片，位于中心轨道的两侧，压板下降时驱动该插片从侧向夹紧芯片框架；若干定位针，压板下降时对压板、芯片框架和中心轨道的进行接合定位；以及连接动力源和压板的驱动机构，可驱动压板升降，可固定芯片框架各个部位，避免焊线过程芯片框架出现震动而导致焊点不良等问题。

Description

半导体芯片焊线设备的芯片框架固定支架
技术领域
本发明涉及半导体芯片封装设备，具体是半导体芯片焊线设备中使用的芯片框架固定支架。
背景技术
焊线工序是半导体封装过程的一个关键生产环节。在焊线过程中，需要用导线将芯片与框架引脚焊接在一起，采用超声波或加热块进行焊线，使用压板将框架压紧固定，然后进行焊线。但焊线过程中框架会发生晃动、偏移，出现焊点虚焊，焊点不良、压不上等问题，使生产过程不良率较高。
CN112108827A公开一种压板装置，包括能将待焊产品压住的压板框，所述压板框上设置有能将待焊产品的焊接区露出的操作窗，还包括设置在所述压板框上能将位于所述操作窗内的待焊区压住的第一辅助压板组件，一定程度上解决了产品报废率高的问题，但因芯片框架整体凹凸不平而非平板，焊线过程仍不能避免芯片框架出现翘曲或震动问题，产品报废率仍然较高。
CN210837658U公开一种焊线辅助压合装置，引线框架上方设置有压板和上模块，下方设置有垫块，垫块上在上模块设置有电磁铁，电磁铁与上模块相互吸合对引线框架进行固定。但仍不能避免焊线过程出现芯片框架翘曲或震动问题，产品报废率仍然较高。
发明内容
本发明的目的在于提供一种可固定芯片框架各个部位，避免焊线过程芯片框架出现震动而导致焊点不良等问题的半导体芯片焊线设备的芯片框架固定支架。
本发明的半导体芯片焊线设备的芯片框架固定支架包括压板机构，其具有可升降的压板以及安装在压板上的弹性压爪，压板下降时弹性压爪压紧芯片框架；中心轨道模块，其上部有供芯片框架滑行的轨道，轨道的侧部有供可伸缩的插片***的凹部台阶；可伸缩的插片，位于中心轨道的两侧，压板下降时驱动该插片从侧向夹紧芯片框架；若干定位针，压板下降时对压板、芯片框架和中心轨道的进行接合定位；以及连接动力源和压板的驱动机构，可驱动压板升降。
优选的是，所述弹性压爪有梳状压头。
所述插片上有与芯片框架侧部台阶对应的用于夹紧芯片框架侧部的若干台阶。
所述插片为插片模块的前端，插片模块后端有插片驱动块连接腔，该连接腔端部有限位台阶，插片驱动块前端有T形凸台，该T形凸台位于所述连接腔中并与所述限位台阶相钳接，插片模块与插片驱动块之间有弹簧，插片驱动块后端有插片驱动滚轮，压板下方有斜波状凸块，插片驱动滚轮抵触压板下方的斜波状凸块。
所述中心轨道位于轨道底板上，中心轨道有容纳所述插片模块和插片驱动块的通孔，插片模块和插片驱动块位于该通孔中并由轨道底板支撑。
所述中心轨道有插片模块的复位弹簧安装孔，复位弹簧穿过该安装孔，两端分别连接中心轨道两侧的插片模块。
本发明可快速从各个方向分台阶固定芯片框架的各个部位，避免焊线过程芯片框架出现震动或翘曲而导致焊点不良等问题，实现芯片快速焊线封装，大大减少产品报废率。
附图说明
图1是芯片框架立体图。
图2是本发明芯片框架固定支架组装图。
图3是芯片框架固定支架零件***图。
图4是中心轨道模块与插片模块结合状态图。
图5是插片模块与插片驱动块结合状态俯视图。
图6是插片模块与插片驱动块结合状态侧视图。
图7是插片模块的夹板与芯片框架底板结合状态图。
图8是芯片框架固定支架剖视图。
附图标记：
芯片框架1，底板101，上部平板102，连接柱103，定位孔104；
压板2，压爪安装槽201，压爪轴孔202，弹簧定位槽203，定位针210，定位针固定孔211，斜波状凸块220；
压爪3，梳状压头301，压爪轴孔302，压爪转轴303，压缩弹簧304；
中心轨道模块4，前轨道模块401，后轨道模块402，轨道403，轨道404，凹部台阶405，通孔406，定位孔410；
插片模块5，插片501，插片驱动块502，夹板503，台阶504，连接腔505，限位台阶506，T形凸台507，压缩弹簧508，插片驱动滚轮510，轮轴511，复位弹簧512；
轨道底板6，通孔601；
气缸驱动架7，压板导向轴701，轴套702。
具体实施方式
图1是芯片框架的构造示意图，是TO-270封装型号的芯片框架1，由面积较小的底板101和面积较大的上部平板102组合构成，上部平板102在底板101处为通孔，由底板101端部的连接柱103与上部平板102向下弯曲形成的连接件连接在一起。其侧部有底板101和上部平板102构成的两个台阶。焊线后半导体芯片固定于底板101上并连接导线。采用超声波焊线时，为避免超声波震荡造成的芯片框架震动翘曲而导致焊点不良，需要对芯片框架1的各个部位分别进行固定。
图2-图8示出本发明的一种实施方式，该芯片框架固定支架包括压板机构，中心轨道模块，芯片框架定位机构，可伸缩的插片，以及驱动机构。
压板机构从芯片框架1上方压紧芯片框架1，具有可升降的压板2以及头部对向的2个压爪3。压板2上有压爪3的安装槽201，压爪安装槽201中有压爪轴孔202，压爪安装槽201端部有弹簧定位槽203，压缩弹簧304位于弹簧定位槽203中。压爪3头部为梳状压头301，压爪3中部有压爪轴孔302。安装时，压缩弹簧304置于弹簧定位槽203中，压爪3置于压爪安装槽201中，压爪转轴303穿过压爪安装槽201中的压爪轴孔202和压爪3中部的压爪轴孔302。压板2下降时，压爪3前端的梳状压头301弹性地压紧芯片框架1的上部平板102，对芯片框架1的压力可通过压缩弹簧304的选择确定。梳状压头301有利于多点均匀压紧芯片框架1的上部平板102。
中心轨道模块4的前后端分别连接前轨道模块401和后轨道模块402，中心轨道模块4、前轨道模块401和后轨道模块402各有供芯片框架1底板101滑行的轨道403和上部平板102滑行的轨道404，轨道403的边缘有供插片501***的凹部台阶405。中心轨道模块4位于轨道底板6上，中心轨道模块4的轨道403的侧部有容纳插片模块5和插片驱动块502的通孔406。轨道底板6安装于芯片焊线设备机台上。
定位机构是固定于压板2上的定位针210。压板2的上部有4个定位针固定孔211，定位针210固定于定位针固定孔211中，定位针210分别与一个芯片框架的4角部的4个定位孔104和中心轨道模块4的4个定位孔410一一对应，当压板2下降时，4个定位针210分别穿过芯片框架1的4个定位孔104***到中心轨道模块4的4个定位孔410中，使芯片框架1得到准确定位。
插片模块5和插片驱动块502位于中心轨道模块4的通孔406中，并由轨道底板6支撑，以限定插片模块5和插片驱动块502作直线往复移动。插片模块5前端为插片501，该插片501可***到中心轨道模块4的凹部台阶405上，插片501前端有夹板503，该夹板503用于夹紧芯片框架1底板101的侧边，插片501上面有台阶504用于夹紧芯片框架1的上部平板102的侧边。插片模块5后端有插片驱动块502的连接腔505，连接腔505端部有限位台阶506。插片驱动块502前端有与连接腔505连接的T形凸台507，T形凸台507插在连接腔505中并与限位台阶506相钳接，由限位台阶506限定在连接腔505中活动。位于连接腔505中，插片模块5与插片驱动块502之间有压缩弹簧508。插片驱动块502后端有插片驱动滚轮510，通过轮轴511连接于插片驱动块502后端。中心轨道模块4的轨道403下方有通孔，复位弹簧512穿过该通孔，两端分别连接两侧的插片模块5，压板2上升时推动插片模块5和插片驱动块502弹出复位。
插片模块5的驱动机构为压板2的下方的斜波状凸块220，斜波状凸块220抵触插片驱动滚轮510，当压板2下降时，压板2下方的斜波状凸块220挤压插片驱动滚轮510，将插片驱动块502和插片模块5推向中心，夹板503夹住芯片框架1底板101的侧边后，压缩弹簧508受到挤压，由压缩弹簧508挤压产生的弹力夹紧芯片框架1底板101的侧边。
压板2的驱动机构包括气缸驱动架7和4个压板导向轴701。气缸驱动架7由气缸驱动其上下移动。压板导向轴701上端连接压板2，压板导向轴701中间穿过轨道底板6的4个通孔601，由插在通孔601中的轴套702减少压板导向轴701上下移动的摩擦力，压板导向轴701下端连接气缸驱动架7。
工作过程中，气缸驱动架7上下移动一次为一个工作周期，可将一个芯片与导线、芯片框架焊接在一起。当气缸驱动架7向下移动，带动压板2向下移动，压爪3向下移动，其梳状压头301从芯片框架1的上部压紧芯片框架1的上部平板102，同时，4个定位针210穿过芯片框架1的通孔104***到中心轨道模块4的定位孔410中，压板2的斜波状凸块220向下移动推动插片模块5向中心移动，夹板503抵触芯片框架1的底板101并挤压压缩弹簧508，由压缩弹簧508产生的弹力夹紧芯片框架1的底板101，插片模块5上的台阶504夹紧紧芯片框架1的上部平板102。由此，芯片框架1的各个部位都得到了固定，避免了焊线过程芯片框架1任意部位的震动翘曲。完成焊线后，气缸驱动架7向上移动，带动压板2向上移动，压爪3和4个定位针210向上移动离开芯片框架1，压板2的斜波状凸块220上升，插片驱动块502 的T形凸台507后退并与插片模块5的限位台阶506钳接，插片模块5和插片驱动块502一起在复位弹簧510推动下复位，芯片框架1可移开中心轨道模块4并输入下一芯片框架1，进入下一周期的工作。
以上实施例是针对TO-270封装产品芯片框架固定支架的一种实施方式，依据本发明的技术实质进行简单修改、等同变化后的其它相似封装产品的芯片框架固定支架，均仍属于本发明保护范围。

Claims (6)

1.半导体芯片焊线设备的芯片框架固定支架，其特征在于，包括压板机构，其具有可升降的压板以及安装在压板上的弹性压爪，压板下降时弹性压爪压紧芯片框架；中心轨道模块，其上部有供芯片框架滑行的轨道，轨道的侧部有供可伸缩的插片***的凹部台阶；可伸缩的插片，位于中心轨道的两侧，压板下降时驱动该插片从侧向夹紧芯片框架；若干定位针，压板下降时对压板、芯片框架和中心轨道的进行接合定位；以及连接动力源和压板的驱动机构，可驱动压板升降。
2.根据权利要求1所述芯片框架固定支架，其特征在于，所述弹性压爪有梳状压头。
3.根据权利要求1或2所述芯片框架固定支架，其特征在于，所述插片上有与芯片框架侧部台阶对应的用于夹紧芯片框架侧部的若干台阶。
4.根据权利要求1或2所述芯片框架固定支架，其特征在于，所述插片为插片模块的前端，插片模块后端有插片驱动块连接腔，该连接腔端部有限位台阶，插片驱动块前端有T形凸台，该T形凸台位于所述连接腔中并与所述限位台阶相钳接，插片模块与插片驱动块之间有弹簧，插片驱动块后端有插片驱动滚轮，压板下方有斜波状凸块，插片驱动滚轮抵触压板下方的斜波状凸块。
5.根据权利要求4所述芯片框架固定支架，其特征在于，所述中心轨道位于轨道底板上，中心轨道有容纳所述插片模块和插片驱动块的通孔，插片模块和插片驱动块位于该通孔中并由轨道底板支撑。
6.根据权利要求5所述芯片框架固定支架，其特征在于，所述中心轨道有插片模块的复位弹簧安装孔，复位弹簧穿过该安装孔，两端分别连接中心轨道两侧的插片模块。
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Publication number Priority date Publication date Assignee Title
CN105171308A (zh) * 2015-08-30 2015-12-23 深圳英飞自动化设备有限公司 半导体芯片自动焊接固定装置
CN210516700U (zh) * 2019-09-27 2020-05-12 无锡美偌科微电子有限公司 一种半导体芯片封装结构
CN112108827A (zh) * 2020-09-23 2020-12-22 珠海格力新元电子有限公司 一种压板装置
CN213945409U (zh) * 2020-09-23 2021-08-13 珠海格力新元电子有限公司 一种压板装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105171308A (zh) * 2015-08-30 2015-12-23 深圳英飞自动化设备有限公司 半导体芯片自动焊接固定装置
CN210516700U (zh) * 2019-09-27 2020-05-12 无锡美偌科微电子有限公司 一种半导体芯片封装结构
CN112108827A (zh) * 2020-09-23 2020-12-22 珠海格力新元电子有限公司 一种压板装置
CN213945409U (zh) * 2020-09-23 2021-08-13 珠海格力新元电子有限公司 一种压板装置

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