CN1137512C - Method for making smart cards and resulting cards - Google Patents
Method for making smart cards and resulting cards Download PDFInfo
- Publication number
- CN1137512C CN1137512C CNB961804459A CN96180445A CN1137512C CN 1137512 C CN1137512 C CN 1137512C CN B961804459 A CNB961804459 A CN B961804459A CN 96180445 A CN96180445 A CN 96180445A CN 1137512 C CN1137512 C CN 1137512C
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- glue
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- cavity
- electronic module
- viscose glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The present invention relates to a preparation method of an electronic module type smart card. A card body (1) with a hollow cavity (3, 4), an electronic module (5) which has the same size with the hollow cavity and an adhesive of cyanoacrylate kind which is placed in the hollow cavity are used. The method also comprises a plurality of processing steps: the adhesive is coated in the hollow cavity, the electronic module is inserted in the centre position of the cavity, and the adhesive between the card and the module is pressed. The method is characterized in that the adhesive is sufficient for covering an adhesive surface which covers 50 to 100% of the hollow cavity surface; after being pressed, the adhesive is at the temperature of 15 to 30 DEG C and in the humidity of 50 to 75%. The present invention also relates to a smart card manufactured by the method.
Description
Technical field
The present invention relates to a kind of smart card preparation method, this smart card is made up of a card body and an electronic module, also relates to the made smart card of this method of employing.
Background technology
In existing certain methods, a kind of so as you know method: card body, an electronic module that it mainly is to have a band cavity are to contact plate in principle, also have the semiconductor chip of a band integrated circuit, the method also is to utilize the mode of bonding to be fixed in the above-mentioned cavity such as the glue ground electronic module with a cyanoacrylate adhesive class.The bonding operating procedure all comprises usually: put into colloidal binder earlier; Again electronic module is inserted in the cavity and by preset time and pushes.
But, adopt this method that is commonly referred to plug-in mounting all be in the automatic industrial range of application, use this need on various station, carry out different separately speed operations but also need make the card that will prepare from a station to the allegro conveying of another station, be approximately per hour several thousand cards, this influences end product quality with regard to variety of issue occurring easily.
Especially be proved according to the made card of aforesaid operations process using mull technique and usually had some tangible weak points.
In the middle of these shortcomings, mainly be the centralized positioning calibration error of electronic module in cavity.In fact, though module is properly inserted in the cavity center position, and electronic module off-center after bonding that is to say initial relatively some displacement of insertion position.This class position of being verified is moved and be may be interpreted as or the slight rotation in the chamber or translation or two kinds of situations have simultaneously, one side or overlapping on the card surface at cavity outside contact plate under the extreme case.
Have been found that: off-center is especially because cause the card active force that body produced when a station moves on to another station at the card body, and particularly violent acceleration effort that body produces when extrusion position stops and decelerating effect power caused by beginning to insert and block respectively.
Off-center also may be because the residual stress in the electronic module that will be bent upwards causes.In this case, electronic module has the danger that breaks away from cavity when each acceleration as mentioned above or deceleration.People also find to adhere to bad some relevant shortcomings with module on the card body.Under this class situation, card just can not satisfy the requirement of bending strength/torsional strength standard or can not satisfy the desired drawing regulation of current standard (ISO AFNOR).
Thereby must under the situation that does not reduce productive rate, address these problems.
Summary of the invention
The objective of the invention is to propose a kind of in the card body method of bonding electronic module, it can have the productive rate that adapts to industrial automation production and higher tempo simultaneously, does not cause the center shortcoming of calibration or adhesion etc. of electronic module again.
For this reason, of the present invention to the effect that about a kind of preparation method of electronic module smart card, this method provides the viscose glue of a kind of card body with cavity, a kind of size and the corresponding electronic module of described cavity and a kind of cyanoacrylate adhesive type, this method also comprises following several steps, described viscose glue is put into described cavity, described electronic module is inserted the center that is embedded into this cavity, the more described viscose glue of extruding between card body and module; This viscose glue drips shape with glue and is placed on central point and at least four the side points; The method is characterized in that:
The amount that described viscose glue is placed is at least 50% surface that only allows bonding described cavity surface after extruding;
The placement of viscose glue is to be under the condition that ambient temperature is 50-75% 15-30 ℃ and relative humidity to finish; And drip greatly at the glue that the glue of central point drips than side point place.
Because these designs are arranged, this method only just demonstrates its characteristics in the environmental condition of high rhythm speed commercial Application.Particularly can avoid adhesive glue to paste bad shortcoming and avoid staiing special equipment and generation static that the back will be explained.
The amount of adhesive glue will satisfy the requirement of required enough stickup faces and keep electronic module can offset the requirement that makes its off-centered active force after its transmission or viscose glue are extruded so that meet mechanical strength standard noted earlier and reach.
When above-mentioned adhesive surface can obtain optimum during for 60-80%.Temperature is 18-24 ℃ and humidity is 50-75%.
When above-mentioned stickup face is about 70%, temperature is about 20 ℃ and humidity is about at 55% o'clock can improve sticking Quality and guaranteed also that simultaneously electronic module reaches gratifying level.The glue opening time of being clung under these conditions, is about 60 seconds.
According to another feature, this method comprises a replenish step, in advance the lower surface of this module is soaked with alcohol before electronic module being inserted in the above-mentioned cavity according to this replenish step.
The purpose of this feature is exactly the very important person for ground forms sticking a little of some cyanoacrylate adhesive glues and electronic module, and this just can make viscose glue allow module keep the center being sent to another station process from a station with two-forty better.
According to another feature, inserting electronic module is to carry out according to the time interval of 300-600 millisecond (m.s.).
This time period can make viscose glue form again below electronic module and more stick a little, and this can keep the center to module better in transport process.When operating by this way, the inventive method can allow viscose glue to place with the very high speed that can control fully.
According to another preferred feature, place the adhesive glue by 5 viscose glue points at least, the point in center is that a weight is the glue of 0.002-0.004 gram, and 4 every of points of side be weight are the glue that 0.0005-0.0015 restrains.
These glue amounts can guarantee that electronic module keeps good state in transport process.And clearly put glue in such a way more hurry up, the placement glue of the line line of isodose glue of all being unwilling for example to use with other the sort of mode.In order to make module keep optimum state, the glue amount of central point above-mentioned and measuring point is respectively about 0.003 gram and 0.001 gram.
Putting glue at central point places the glue of 4 points of side later on again and can reach the best bond quality.
According to another feature, this method is carried out described last extruding by the pressure apparatus of just the contact plate periphery being exerted pressure.
Because this design arrangement, can be added to obtain specifying the necessary pressure of viscose glue thickness and can form high-quality electronic module and paste and also can not produce the compression that semiconductor chip is caused damage simultaneously.
It is about according to the made electronic module type smart card of said method that the present invention also has a content.
Description of drawings
Some other feature and advantage of the present invention can clearly illustrate out when having read the explanation of back two kinds of main execution modes that provide as an example more.Also to consult several accompanying drawings, have among the figure:
What Fig. 1 represented is card body used in a inventive method;
Fig. 2 is the profile of used electronic module in the inventive method;
Fig. 3 is the vertical view of electronic module carrier sheet;
Fig. 4 is that the expression electronic module blocks the schematic diagram of body assembling relatively;
Fig. 5 is the cavity vertical view that has viscose glue set-point profile;
What Fig. 6 represented is the adhesive surface of extruding back bonder on cavity;
What Fig. 7 to 11 represented is various different steps or each different fitting operation station of this method;
Figure 12 is a pressurizing unit;
What Figure 13 represented is the embodiment vertical view that adopts this method to install with very high speed;
Figure 14 has expressed the alcohol soaking device.
Embodiment
The essential preparation of the preparation method of smart card a kind of card body and a size and the corresponding electronic module of described cavity with cavity.
Fig. 1 has described the embodiment of the used card body 1 of this method.It comprises a cavity 2, and this cavity can be made with die pressing simultaneously or make with processing method with the card body.
This class card body all is by standard ISO or AFNOR and the standard component of processing, thereby its size all is predetermined.
Cavity should be able to be put into electronic module.Thereby its shape can change according to selected electronic module.It has two cut-out in this example, and first cut-out 3 is the ordinary rectangular that communicate with the card body front surface, and second cut-out 4 is that it is in the center of rectangle and leads to the bottom of first cut-out than first darker typical circular.The diameter d of second cut-out be 8.2mm and the height h be 0.6mm (Fig. 4).
Used material, normally plastics are decided according to purposes.For example, the telephony intelligence card all makes with ABS (propylene cyanogen butadiene styrene), and it also can make with PVC (polyvinyl chloride) material, perhaps make have Merlon (PC) the synusia shape such as the synusia shape that is PC/ABS or PC/PVC material.
In example, it is ABS that people have used a kind of cavity and card body material according to the ISO standard.
Electronic module 5 (Fig. 2 and 3) generally comprises: the carrier sheet 6a of an insulation synthetic material; The contact plate 7 of electric conducting material; The silicon 8 that contains integrated circuit; The line 9 of some chips and contact plate and the coating resin 10 of topped chip and line.
The coating of the thermocoagulation epoxy resin thickening layer that to have formed a kind of especially thickness may be random size normally.Under the best circumstances, this thickening layer can be flat according to a more accurate side milling, makes the paste operation of electronic module in the card body more convenient.Preferably the present invention makes every effort to reach and need not to mill earlier the flat coating of just directly utilizing.
Module (Fig. 2 and 3) can be a several types, for example can be what is called " LFCC " the type electronic module (the Lead Frame of anti-stick subsides) of band polyimide carrier sheet, or band epoxy resins carrier mode module.
In the present embodiment, electronic module is the LFCC type, thereby its lower surface is a polyimides.It is (Fig. 3) that is made by the monoblock thin slice that is on the inductor.
Card body cavity is to specify the module that is used for holding as shown in Figure 4.For this reason, groove 4 is corresponding with positioning convex part 10, and groove 3 is corresponding with contact plate 5, and assembling necessary tolerance gap (J) is arranged.This gap is such, and promptly module can folk prescription be to rotating or unilaterally moving in same plane in the card plane, and naked eyes see that drawing this space has therefore also caused the centrally aligned deviation.
According to the present invention, this method also will provide a kind of cyanoacrylate adhesive glue.Especially according to glue with this glue of amount of accelerator can have various character.Preferably, good in order to guarantee to paste, glue also should be pure as far as possible and also as far as possible slowly polymerization.On the contrary, find: if wish to cling electronic module and make it keep the center, glue should polymerization not get too slow under available operating condition yet.
Verified: as the danger of overflowing much just to be arranged as the pectin amount.Viscose glue does not have fully module to be remained on to carry out continuous productive process on certain position in addition.
Therefore, not only the type of cyanoacrylate adhesive also has the environmental condition of used amount and operation all will pre-determine so that can remain on module on certain position in the industrial production of two-forty.
Adopt a kind ofly so gluingly just can keep that module is in that bonding force and resistance to plucking on the certain position goes out, reach a kind of good coordination between bending resistance/torsional strength, the opening time of this glue under environmental condition, be about 30-60 second and its amount can corresponding example in the wideest value range.Say that qualitatively a kind of opening time of glue is exactly that time that can also adhere at this time inner chamber.The optimal compromise of all these values is to adopt to have an opening time and be about 30 seconds glue.The opening time of this alpha-cyanoacrylate ester gum is about 30 seconds.This alpha-cyanoacrylate ester gum is with " Henkel " trade mark and is marked with under numbering 8400 the situation and uses.
This method comprises that several steps according to these steps is according to the present invention, puts into the cyanoacrylate viscose glue in cavity, and electronic module is inserted in the cavity similar center and applies certain pressure, makes described electronic module push glue near above-mentioned card body.These steps are done more detailed description in the Application Example shown in Fig. 7 to 11 in the back.
According to method of the present invention, the amount that the alpha-cyanoacrylate ester gum is placed is wanted stickup face that can the above-mentioned cavity plane surface in topped 50-100% extruding back and is under 15-30 ℃ of temperature, and temperature is 50-75%.
Best in the result who utilizes 60-80% adhesive surface, temperature to obtain during for 50-75% for 18-24 ℃, humidity.
Can see the cavity that has the viscose glue impression on Fig. 6.After spreading out, viscose glue to make the left vestige of each side glue point can determine the semicircular surface of a 12c to 14c, and be shaped as common U-shaped, the few radial of this shape difference extends from prolonging near the edge of second groove 4 near the rectangle interior angle by first groove, faces this angle at the bottom of the U-shaped.The central point vestige itself has become a circular face 11c.
Therefore, utilize the determined adhesive surface of these vestige shapes and adopt above-mentioned ratio, the abundant adhesion that just can obtain electronic module is so that the anti-desired stress of various aforesaid standards.
In example, used the various numerical value that are enough to keep electronic module state and best sticking Quality: the viscose glue amount of putting into want 70% surface of topped cavity that is to say to be Fig. 6 rectangular surfaces 70%, temperature is 20 ℃ and humidity is 55%.Push and make the thickness of viscose glue reach the thinnest degree.It is better that extruding back thickness reaches 0.01-0.03mm (millimeter) result, for example 0.02mm.At these determined values, the open-interval higher limit scope of viscose glue is at 30-60 between second, and is best about 60 seconds.
Otherwise, choosing cyanoacrylate type adhesive glue and also can obtain the preferable hold mode of module and enough sticking Quality, the open-interval lower limit scope of this glue is at 30-60 between second, is exactly 30 seconds when keeping above-mentioned other parameter value for example.
About determining of above-mentioned environmental condition, verified: the very low meeting of temperature and humidity causes the viscose glue polymerization too slow thereby module can occur and have and come unstuck and off-centered danger (also having because of the contaminated danger of viscose glue polymeric surface: " blooming ").On the contrary, also prove: temperature and humidity is very high then to cause the viscose glue polymerization too fast, and this also can cause the danger that amine occurs taking off on the one hand, stains and stop up the defective that the viscose glue branch is put used needle tubing in the device on the other hand in addition.In addition, also prove: humidity is too low the danger that causes static.The harm of static is to hold the alpha-cyanoacrylate ester gum to drip and blindly place and cause shortcoming.
According to a kind of preferred feature of the present invention, viscose glue is placed according at least 5 glue points, and to drip weight be 0.002-0.004 gram and at least four side points to the glue of central point at least, and it is that 0.0005-0.0015 restrains that the glue of each side point drips weight.These values can allow module to keep good state up to the extrusion process step.
In example, only just can keep optimum state and used glue amount almost to be central point be 0.003 gram and each side point is 0.001 gram with 5 amine points.
Laying the mode that preferably becomes a line relatively with the form of point places so that help and uses in the industrial scale of two-forty.The number of point is 5 and the special good adhesion that can guarantee module to the more favourable impression of glue point etc.5 sticky point numbers are considered, and will to divide the total amount of putting glue also be eaily and can use fast.
Fig. 5 has described a kind of best impression example.It comprises that a what is called is in center sticky point 11a and 4 other side point 12a-15a in the chip groove, and they all are in the contact board slot and in four angles of rectangle of figuring cavity.Some other chamber point vestige also is possible.
Each processing step of this method is described now with reference to the Application Example shown in Fig. 7-11.
Fig. 7 to 11 both can represent that each processing step of this method also represented the consecutive operational sequence of a kind of equipment that the back will be described in the example.
In first operation (Fig. 7) and according to first step a), put device 16 by branch and at first put a glue 11b in cavity center, continuous productive process is delivered to next operation (Fig. 8) to the card body then.
At this station and according to second processing step b) so-called side alpha-cyanoacrylate ester gum 12b to 14b is put in 4 angles of upper grooves 4 to utilize other branch to put device 17 and 18, and the card body is sent to the so-called station (Fig. 9) that inserts.
Inserting the operation place, according to another processing step c of this method), by inserter 19, apply slight what is called simultaneously and insert pressure electronic module 5 insertions.The insertion time is 300ms (millisecond) in this example.
Adopt the upper limit insertion time that for example equals 500ms to obtain best hold mode.Then, the card body is sent to extrusion position (Figure 10) by continuous productive process or (according to a kind of preferred replacement scheme: Figure 11).
At extrusion position (Figure 10), according to another processing step d of the present invention), in 22 seconds time, apply the active force extruding gummer that is about 34daN by the squeezer that is worked in whole module surface.
According to preferred scheme (Figure 11) and another feature of the present invention, only on the periphery of contact plate, to push, its advantage is exactly the danger of suitably pushing viscose glue and not causing mechanical stress, and this class stress may have infringement to semiconductor chip or line.Used squeezer is described among Figure 12 in the back.
As the front illustrated, in fact the projection of protective finish thickening position 10 may have slight variation by thickness.Therefore yet under opposite extreme situations, bossing may withstand the end of cavity and form a module centers point higher slightly than contact plate, these contact plates with block that the surface is equal aligns.The configuration design that this class is often run in manufacturing industry is forbidden applying high-quality and is pasted necessary pressure.
In example, the active force of 34daN only is dispersed on the peripheral position of contact plate, and this peripheral position leans against on first groove.
At next processing step, card is withdrawn from, and this just is through with and inserts operation.
According to this method another feature, this method comprises that such processing step is that the electronic module surface is handled so that can promote the polymerization of glue when viscose glue contacts with module in this step.
Also can use some other to be the known processing method of present technique field professional.
Adopting way easily, also is directly to stick preferably on electronic module in view of viscose glue, soaks into the module lower surface with alcohol before being embedded in the described cavity in that it is inserted.95% enol can obtain activation effect preferably.
This operating procedure can directly and be to activate the polymerization that viscose glue contacts with the policapram that passes alcohol partly, and can form some artificially and stick a little, they also can remain on electronic module on the tram in the continuous productive process transport process.
For enough affixed points being arranged really and correctly keeping the state of electronic module, preferably also to as the front is illustrated, grasp the slotting embedding time of electronic module.The insertion time all be ready to be limited to 600ms (millisecond) as maximum so that can keep the industry of two-forty compatible.
Soak into alcohol also can be artificially between ABS Material card surface and polyimides module film adhesive the different surface moisture of formation also can cause different stickups.In fact, the hydrophily of ABS material is different with polyimides.The ABS material can be at surface area water molecule and polyimides can be at inner product water molecule.Water is a kind of parameter that influences the viscose glue activity function, preferably film surface is carried out the polymerization activation so that all can have gluing preferably level simultaneously on the module and on the card body.
Below a kind of apparatus embodiments of the inventive method two-forty commercial Application is just described with reference to Figure 13.
This equipment comprises: card body feeding device 21 can provide a plurality of card bodies; Electronic module feeding device 22,23 can provide a plurality of electronic modules; First glue drips branch to be put its branch that band needle-valve 16 is housed of device 24 and puts device 24b; Second branch that 4 glue drips put device 25, and it is equipped with the branch of two needle-valves 17 and 18 and puts device 25b; The slotting setting-in of the module of inserting embedding device 26b is housed puts 26; The pressurizing unit 27 of band squeezer they all be installed in circular orbit 28 around, the card body can stop the time of one section extruding therein; Blanking and module are sent to inserts the equipment 29 that setting-in is put, and need soak into the device 30 of alcohol if necessary, is arrangement for evacuation 31 then.This equipment also comprises the atmosphere case (not shown) that can carry out temperature and humidity control.
The feeder apparatus of electronic module is made of two reels, and it is tied with the thin slice 6b of band module and second reel 23 volume have the thin slice with module first reel 22, and another reel is decontroled when a reel spooling.Thin slice is device 30 and the module cutter sweep 29 by the infiltration alcohol described later continuously.
From this thin slice, cut out module and module is delivered to cutter sweep and insert setting-in and put, module is inserted in cavity of each card body in this mode of sentencing centring by conveyer.
In this embodiment, the device 30 with alcohol infiltration module lower surface is that the sponge in the vinyl alcohol maceration extract constitutes in the container by immersing.This sponge is always keeping and the contacting of module feed thin slice.
The needle-valve that the viscose glue branch is put device can vertically or laterally move.
Each pressurizing unit 27 all is equipped with squeezer 27a, and its end 20a (Figure 12) contacts with module.In order to adopt the extruding that is fit to the inventive method, this end be equipped with centre bore impression lining 20b it can only exert pressure to the module periphery.This impression lining is that but the material by dispersive pressure makes and do not damage contact plate, and this material is such as being elastomer, and it is the corresponding with modular shape of rectangle that this impression serves as a contrast.
When the card body arrives each branch and puts the position of device, needle-valve be in corresponding institute estimate impression viscose glue point top (Fig. 5) and drop near cavity surface, and the control system (not shown) is controlled the glue of emitting scheduled volume; Needle-valve recurs to so that pull apart the residue collodion silk that may hang on the needle-valve and be in the position that next card body will be waited for again then.Needle-valve all will be regulated so that can descend in 1.5 seconds, divide and put and promote.
Subsequently, the card body is sent to slotting embedding device station by continuous productive process and is in the electronic module of packing into there, and the insertion time has been used 500ms.
At last, card is sent to pressurizing unit station place, is squeezed near the card body in the there module, and that applied is 34daN.The card body stopped 22 seconds on the circle transmission device, was discharged to next station afterwards.
In the outlet of circulating conveyor, the card body may be through detecting and being removed to withdrawing from device 31.
The mobile device of card body from a station to another station is that mechanization is carried out so that can make speed reach per hour 1500 cards.
Claims (10)
1. the preparation method of an electronic module smart card, this method provides the viscose glue of a kind of card body with cavity, a kind of size and the corresponding electronic module of described cavity and a kind of cyanoacrylate adhesive type, this method also comprises following several steps, described viscose glue is put into described cavity, described electronic module is inserted the center that is embedded into this cavity, the more described viscose glue of extruding between card body and module; This viscose glue drips shape with glue and is placed on central point and at least four the side points; The method is characterized in that:
The amount that described viscose glue is placed is at least 50% surface that only allows bonding described cavity surface after extruding;
The placement of viscose glue is to be under the condition that ambient temperature is 50-75% 15-30 ℃ and relative humidity to finish; And
The glue that drips than side point place at the glue of central point drips greatly.
2. method according to claim 1 is characterized in that: described adhesive surface is 60-80%, and temperature is 18-24 ℃.
3. method according to claim 2 is characterized in that: described adhesive surface is about 70%, and temperature is about 20 ℃, and relative humidity is about 55%.
4. method according to claim 1, it is characterized in that: this method comprises a step, this step is soaked into for the module lower surface is carried out alcohol, this soak be before module is inserted into described cavity, to carry out or module with carry out before viscose glue contacts.
5. method according to claim 1 is characterized in that: the placement form of described viscose glue is: weight be the center dispense of 0.002-0.004 gram drip with weight be that each side point glue of 0.0005-0.0015 gram drips.
6. method according to claim 5 is characterized in that: center dispense drips weight and each side point glue and drips weight and be respectively 0.003 gram and 0.001 and restrain.
7. method according to claim 1 is characterized in that: the placement that 4 side point glue drips all center dispense drip place after and before electronic module inserts and carry out.
8. according to the described method of arbitrary claim in the claim 1 to 7, it is characterized in that: push by an impression liner that has centre bore that is placed between electronic module and the squeezer.
9. method according to claim 1 is characterized in that: module is inserted cavity and is carried out in the 300-600ms time slot.
10. according to the described method of arbitrary claim in the claim 1 to 6, it is characterized in that: the opening time of cyanoacrylate adhesive glue is 30-60 second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB961804459A CN1137512C (en) | 1996-08-05 | 1996-08-05 | Method for making smart cards and resulting cards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB961804459A CN1137512C (en) | 1996-08-05 | 1996-08-05 | Method for making smart cards and resulting cards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1229496A CN1229496A (en) | 1999-09-22 |
| CN1137512C true CN1137512C (en) | 2004-02-04 |
Family
ID=5127886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB961804459A Expired - Fee Related CN1137512C (en) | 1996-08-05 | 1996-08-05 | Method for making smart cards and resulting cards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1137512C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205563658U (en) * | 2016-04-13 | 2016-09-07 | 深圳市高福科技有限公司 | Metal smart card of safe encapsulation |
-
1996
- 1996-08-05 CN CNB961804459A patent/CN1137512C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1229496A (en) | 1999-09-22 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040204 |