CN211238291U

CN211238291U - Light emitting diode with adjustable light emitting surface

Info

Publication number: CN211238291U
Application number: CN201922500911.1U
Authority: CN
Inventors: 邝健; 区伟能; 邵晓娟; 鄢冬; 肖国伟; 侯宇
Original assignee: APT Electronics Co Ltd
Current assignee: APT Electronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-08-11
Anticipated expiration: 2029-12-31

Abstract

The utility model discloses a light emitting diode with adjustable luminous surface, which comprises a LED bracket, a chip positioned on the inner surface of a bowl cup of the LED bracket and packaging glue used for filling the inner space of the bowl cup of the LED bracket; the chip is communicated with the LED bracket through a gold thread; and the upper surface of the packaging adhesive is provided with a light blocking layer with an opening. The size of the opening of the light blocking layer is smaller than that of the light emitting surface of the LED support, and an area defined by the boundary of the opening is required to be contained in the light emitting surface of the LED support. The diameter or the side length of the light blocking layer opening is 1/2-1 times of the diameter of the light emitting surface. The shape of the open pore is a circular or other polygonal hole. Adopt the emitting diode of adjustable light emitting area, when satisfying frivolous, optical density, power and the luminance of its output all than higher.

Description

Light emitting diode with adjustable light emitting surface

Technical Field

The utility model belongs to the technical field of emitting diode, concretely relates to emitting diode of adjustable light emitting area.

Background

The light emitting diode is a common light emitting device, can efficiently convert electric energy into light energy by releasing energy through electron and hole recombination to emit light, and has the characteristics of energy conservation, environmental protection and high reaction speed. Therefore, the LED has wide application in the fields of illumination, flat panel display, medical devices and the like in modern society.

At present, the LED products applied to the direct type display field mainly have a circular light emitting surface, such as Φ 2.1mm, Φ 2.6mm, and the like. Along with the development trend of increasingly light and thin display equipment, the requirement on the circular light emitting surface of the LED is increasingly high, the light emitting surface needs to be reduced, then the light emitting angle of secondary light distribution is further increased by matching with a lens, and the thinning of the display equipment can be realized. Although the requirement of lightness and thinness is met, the following defects exist:

1. the size of the luminous surface is determined by a bracket mold, and the mold opening needs to spend large capital investment and time;

2. along with the reduction of the size of the light emitting surface, the inner space of the cup of the LED support is correspondingly reduced, the number of chips capable of being accommodated and used is also reduced, and the usable power and the brightness of the LED are reduced.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model aims to provide a: the light emitting diode with the adjustable light emitting surface is light, thin and high in output optical density, power and brightness.

In order to achieve the purpose, the utility model discloses realize according to following technical scheme:

the light emitting diode with the adjustable luminous surface comprises an LED bracket, a chip positioned on the inner surface of the LED bracket bowl cup and packaging glue used for filling the inner space of the LED bracket bowl cup; the chip is communicated with the LED bracket through a gold thread; and the upper surface of the packaging adhesive is provided with a light blocking layer with an opening.

Further, the size of the opening of the light blocking layer is smaller than that of the light emitting surface of the LED support, and the area enclosed by the boundary of the opening is required to be contained in the light emitting surface of the LED support.

Further, the diameter or the side length of the light blocking layer opening is 1/2-1 times of the diameter of the light emitting surface.

Further, the shape of the open hole is a circular or other polygonal hole.

Furthermore, the packaging adhesive and the light blocking layer are bonded through silica gel.

Further, the light blocking layer is a heat-resistant material layer with strong light blocking performance.

Further, the heat-resistant material layer is a silica gel layer with reflective filling particles.

Further, the reflective filler particles are TiO₂。

Compared with the prior art, the beneficial effects of the utility model are that:

1. the light emitting diode of adjustable light emitting area, under the prerequisite that does not shorten the LED light emitting area, only need add the one deck layer that is in the light at the top of the light emitting area of LED support to carry out the trompil processing to this layer that is in the light, thereby adjust the size of a dimension of LED's light emitting area through the trompil size on adjustment layer that is in the light. Simultaneously, from another perspective, under the prerequisite that will obtain the same light emitting area, adopt the utility model discloses a project organization, then it can use the support in big bowl cup and big light emitting area, and then just also can hold the large size chip, consequently also all strengthens to the output density, power and the luminance of light.

2. The in-process of preparation, only need to adjust the trompil size on the layer that is in the light, just can simply realize the adjustment to LED's light emitting area size of adjustable light emitting area. The processing technology is simple, and can be used for batch production, particularly repeated die opening is not needed, so that a large amount of capital and time investment is saved.

Drawings

The following detailed description of embodiments of the invention is provided with reference to the accompanying drawings, in which:

fig. 1 is a top view of an led with an adjustable light emitting area according to the present invention;

FIG. 2 is a cross-sectional view along AA of FIG. 1;

fig. 3-8 are process display diagrams of a method for manufacturing a light emitting diode with an adjustable light emitting area according to the present invention.

101: the chip 102: gold wire 103, packaging adhesive 104, LED support 105: adhesive silicone 106: light-blocking layer

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

As shown in fig. 1-2, the light emitting diode with adjustable light emitting area of the present invention does not reduce the light emitting area in order to satisfy the trend of light and thin, so that it is not necessary to open a mold, and a lot of money and time are saved. In addition, the light-emitting surface is not reduced, so that the inner space of the LED support bowl cup is not reduced, more chips can be accommodated, and the requirements for higher power and brightness are met.

Specifically, the light emitting diode with the adjustable light emitting surface comprises an LED support 104, a chip 101 positioned on the inner surface of a bowl of the LED support 104, and packaging glue 103 for filling the inner space of the bowl of the LED support 104; the chip 101 is communicated with the LED bracket 104 through a gold wire 102 to form a conducting loop; the upper surface of the packaging adhesive 103 is provided with an apertured light blocking layer 106. The light-blocking layer 106 has smaller openings than the light-emitting surface of the LED support 104, and the area surrounded by the boundaries of the openings must be included in the light-emitting surface of the LED support. The diameter or edge length of the openings of the light-blocking layer is then between 1/2 and 1 times the diameter of the light-emitting surface. The shape of the opening is a circular or other polygonal hole, and the opening can be finely adjusted according to actual requirements, so that the practical application of different light-emitting surface requirements is met.

Further, in order to make the connection between the light blocking layer 106 and the encapsulation adhesive 103 more stable, the two are bonded by the silicone adhesive. Meanwhile, the light blocking layer 106 is a heat-resistant material layer having strong light blocking property due to its function. Wherein the heat-resistant material layer is preferably a silica gel layer having a reflective filling example which may be TiO₂。

Correspondingly, the manufacturing method of the light emitting diode with the adjustable light emitting surface of the utility model has the advantages that the manufacturing steps are very simple, and the specific process is as follows:

s1: manufacturing a light blocking layer 106;

injecting the silica gel containing the reflective filler particles into a silica gel film, which is a whole silica gel film as shown in fig. 3;

according to actual demand size, it is right silica gel film carries out matrix trompil processing, as shown in fig. 4, gets the layer 106 that is in the light that a plurality of matrixes were arranged, and the matrix distributes, and the follow-up one-to-one after encapsulating with LED support 104 of being convenient for, and simultaneously, its processing efficiency has also been promoted in big batch processing.

S2: the LED support 104 is subjected to a conventional packaging process, as shown in fig. 5;

as can be seen from the figure, the LED brackets 104 with large light-emitting areas are also distributed in a matrix form, and are also manufactured in large quantities, and correspond to the light-blocking layers 106 one by one, specifically, the number of the LED brackets 104 is the same as the number of the light-blocking layers;

s3: coating a light-transmitting adhesive material on the upper surface of the LED support 104 after the encapsulation process, as shown in fig. 6;

s4: covering the light-blocking layer on the light-transmitting adhesive material, so that the center of the light-blocking layer corresponds to the center of the LED support, that is, each LED support 104 is located at the same center as the corresponding light-blocking layer 106, thereby ensuring the uniformity of light blocking, as shown in fig. 7;

s5: the LED support 104 covered with the light blocking layer 106 is cut into a matrix to obtain a finished LED with adjustable light emitting surface, that is, a whole semi-finished LED with a 5 × 5 matrix is cut into 25 finished LEDs with adjustable light emitting surface, however, the distribution of the 5 × 5 matrix may be adjusted to other 6 × 6, 18 × 32, 20 × 32, or other matrices, not limited to the illustrated 5 × 5 matrix. As shown in fig. 8. The 25 light emitting diodes with the light emitting surfaces adjusted can be in the same specification size or different specification sizes, and the specification sizes are mainly determined by the size of the opening of the light blocking layer and the size of the light emitting surface of the LED support. Of course, in the process of mass production, the products are produced together with the same specification and size, so that quality is guaranteed against errors.

In order to further embody the remarkable effects of the light emitting diode with an adjustable light emitting surface and the manufacturing method thereof of the present invention, the following specific embodiments are explained:

example 1:

the light emitting diode with the adjustable luminous surface comprises an LED bracket 104, a chip 101 and packaging glue 103 for filling the inner space of a bowl cup of the LED bracket 104; the chip 101 is communicated with the LED bracket 104 through a gold wire 102; the upper surface of the packaging adhesive 103 is provided with a light blocking layer 106 with an opening, and the size of the opening is phi 2.1 mm. The aperture of the light blocking layer 106 is smaller than the light emitting surface of the LED support 104, wherein the light emitting surface of the LED support 104 is Φ 2.3 mm.

Example 2:

the present embodiment is different from embodiment 1 only in that: the light emitting surface of the LED support 104 is Φ 2.6mm, and the diameter thereof is larger than that of embodiment 1, so that more chips can be accommodated, and the LED support is superior in light emitting density, power and brightness.

Comparative example 1:

the light emitting diode with an adjustable light emitting surface manufactured by the traditional technology is not described in detail in the prior art, and the light emitting surface of the LED support 104 is phi 2.1 mm.

Comparative example 2:

the light emitting diode with an adjustable light emitting surface manufactured by the traditional technology is not described in detail in the prior art, and the light emitting surface of the LED support 104 is phi 2.6 mm.

Comparing the leds of examples 1-2 and comparative examples with respect to their tunable light emitting surfaces, the following table one shows the details:

categories	Size of support bowl	Containing chip	LED luminous surface	Optical density	Cost of opening the mold
						Example 1	Big (a)	Big (a)	Small	Height of	About 100 ten thousand
Example 2	Is larger	Is larger	Small	Is higher than	About 100 ten thousand
						Comparative example 1	Small	Small	Small	Is low in	About 100 ten thousand
Comparative example 2	Big (a)	Big (a)	Big (a)	Is higher than	About 100 ten thousand

According to the first table of the above, adjustable light emitting area's emitting diode, for traditional technique, it just can satisfy frivolous current demand under the prerequisite of the light emitting area of not reducing the LED support to from structural, more reduced the use of lens. Because the bowl cup is larger in size, more chips can be accommodated in the bowl cup, and therefore the optical density and the brightness are improved.

Meanwhile, from the cost of products, the traditional technology is used, as the traditional technology, the LEDs with the diameter of 2.6mm and the LED with the diameter of 2.1mm are needed, two types of bracket molds must be opened, the technology only needs to open the bracket mold with the diameter of 2.6mm, the LED with the diameter of 2.1mm can be obtained through the opening adjustment of the light blocking layer, the expense for opening the bracket mold with the diameter of 2.6mm is saved, namely, the expense of at least 100W is saved, and the time cost is not taken into account. Can not be a very considerable data, and is worth popularizing and using.

Other technologies related to light emitting diodes with adjustable light emitting areas are referred to in the prior art and are not described herein.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made by the technical spirit of the present invention to the above embodiments do not depart from the technical solution of the present invention, and still fall within the scope of the technical solution of the present invention.

Claims

1. A light emitting diode with an adjustable light emitting surface, comprising:

the LED support comprises an LED support, a chip positioned on the inner surface of the LED support bowl cup and packaging glue used for filling the inner space of the LED support bowl cup;

the chip is communicated with the LED bracket through a gold thread;

and the upper surface of the packaging adhesive is provided with a light blocking layer with an opening.

2. The adjustable light emitting face led of claim 1 wherein:

the size of the opening of the light blocking layer is smaller than that of the light emitting surface of the LED support, and an area defined by the boundary of the opening is required to be contained in the light emitting surface of the LED support.

3. The adjustable light emitting face led of claim 2 wherein:

the diameter or the side length of the light blocking layer opening is 1/2-1 times of the diameter of the light emitting surface.

4. The adjustable light emitting face led of claim 2 wherein:

the shape of the open pore is a circular or polygonal hole.

5. The adjustable light emitting face led of claim 1 wherein:

and the packaging adhesive and the light blocking layer are bonded through silica gel.

6. The adjustable light emitting face led of claim 1 wherein:

the light blocking layer is a heat-resistant material layer with strong light blocking performance.

7. The adjustable light emitting face led of claim 6 wherein:

the heat-resistant material layer is a silica gel layer with reflective filling particles.

8. The adjustable light emitting face led of claim 7 wherein:

the reflective filler particles are TiO₂。