CN113727526A - Windowing method for protective layer of circuit board - Google Patents
Windowing method for protective layer of circuit board Download PDFInfo
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- CN113727526A CN113727526A CN202111011590.4A CN202111011590A CN113727526A CN 113727526 A CN113727526 A CN 113727526A CN 202111011590 A CN202111011590 A CN 202111011590A CN 113727526 A CN113727526 A CN 113727526A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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Abstract
The invention relates to the technical field of circuit board processing, and discloses a circuit board protective layer windowing method, which comprises the steps of arranging a first processing area and a second processing area on a protective film according to the position of a windowing on a circuit board, enabling the second processing area to be arranged along the periphery of the first processing area, respectively arranging a first processing parameter and a second processing parameter of a laser processing device according to the first processing area and the second processing area, processing the first processing area line by the laser processing device according to the first processing parameter, and processing the second processing area circle by circle according to the second processing parameter, thereby realizing the windowing processing of the circuit board, compared with the existing processing method that the protective film is processed firstly and then the protective film is arranged on a substrate of the circuit board, the windowing method of the circuit board protective layer can reduce the windowing precision error of the protective film from hundreds of micrometers to dozens of micrometers, and can greatly improve the line width and line width of the circuit board, and high-precision production and processing of the circuit board are realized.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a windowing method for a protective layer of a circuit board.
Background
At present, aiming at the windowing of the circuit board, the adopted process sequence is to firstly carry out the opening of the protective film and then attach the protective film with the opening to the circuit layer, in the practical application scene, the alignment precision error of the windowing mode is about 300um, and meanwhile, the alignment precision in the production process of the soft board is determined by multiple factors, so that the control difficulty is large, and the design of the soft board circuit is restricted to be more precise and refined.
Therefore, there is a need to provide a new circuit board protection layer windowing scheme to solve the above problems.
Disclosure of Invention
In view of the above, the object of the present invention is: a high-precision method for windowing a protective layer of a circuit board is provided.
In order to achieve one or a part of or all of the above or other objects, the present invention provides a method for opening a protective layer of a circuit board, comprising the steps of: arranging a protective film on the circuit layer of the circuit board and pressing; arranging a first processing area and a second processing area on the protective film according to the windowing position on the circuit board, wherein the second processing area is arranged along the periphery of the first processing area; setting a first processing parameter of the laser processing device according to the first processing area, and setting a second processing parameter of the laser processing device according to the second processing area; the laser processing device processes the first processing area line by line according to the first processing parameter; the laser processing device processes the second processing region along the periphery of the first processing region according to the second processing parameter.
Optionally, when the first processing area and the second processing area are processed, a buffer area is arranged between the first processing area and the second processing area, and the buffer area is used for accelerating the laser processing device, so that the laser processing device reaches the set processing parameters when moving to the processing position.
Optionally, the processing the first processing area by the laser processing device comprises: the first processing area comprises a first starting side and a first ending side, the first processing area is processed by the laser processing device line by line on the first starting side, after the Nth line is processed, the laser processing device returns to the first starting side from the first ending side, and moves to the (N + 1) th line from the first starting end to process until the first processing area is processed.
Optionally, the processing the second processing area by the laser processing device comprises: the laser processing device processes the second processing area along the periphery of the first processing area.
Optionally, the laser processing device finishes processing the second processing area through a plurality of processes around the periphery of the first processing area.
Optionally, the laser processing device finishes processing the second processing area around the periphery of the first processing area, and includes:
the laser processing device processes the second processing area along the periphery of the first processing area according to an annular processing path.
Optionally, the processing parameters include: cutting length L, cutting width H, repetition number C, facula diameter D, filling interval Y, cutting speed V, processing time T, facula overlap ratio beta, the above-mentioned parameter satisfies following relational expression:
optionally, the processing parameters further include an optical frequency f, and when the processing area is S, the time T required for processing the area S is:
optionally, the processing parameter further includes a spot pitch X, the spot overlap ratio is β, and the spot overlap ratio β and the spot pitch X satisfy the following relationship:
optionally, the processing parameters further include a focal length offset Z, a focal length of the focusing lens is F, a diameter of an incident beam is L, a wavelength of the laser beam is λ, a divergence angle of a focused light spot is θ, a theoretical light spot diameter is K, and the parameters satisfy the following relation:
D＝Z×tanθ；
D<K。
the implementation of the invention has the following beneficial effects:
compared with the prior processing method of firstly processing the protective film and then mounting the protective film on the substrate of the circuit board, the windowing method of the protective film protective layer of the circuit board can reduce the windowing precision error of the protective film from hundreds of microns to tens of microns and greatly improve the line width line spacing of the circuit board, and high-precision production and processing of the circuit board are realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of an embodiment of a method for windowing a protective layer of a circuit board according to the present invention;
FIG. 2 is a schematic diagram of a processing route of a method for windowing a protective layer of a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic view of another processing path of the method for windowing a protective layer of a circuit board according to an embodiment of the present invention;
FIG. 4 is a marked diagram of a processing area of the windowing method for the protective layer of the circuit board according to the embodiment of the invention;
FIG. 5 is a schematic diagram of an actual processing effect of the windowing method for the protection layer of the circuit board according to the embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as according to the upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship, movement, etc. of the components in a specific posture (according to the figure), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
According to the embodiment of the invention, through different material electrification, the laser spot overlapping rate is controlled by utilizing the laser accurate control energy and the numerical control system, the laser spot is completely paved in the whole windowing range, and the windowing laser processing procedure of the protective film is finally realized. The details will be illustrated by the following examples.
Fig. 1 is a flowchart of an implementation manner of a circuit board protection layer windowing method according to an embodiment of the present invention, and referring to fig. 1, the circuit board protection layer windowing method includes the following steps:
s10: and arranging the protective film on the circuit layer of the circuit board and pressing the protective film to enable the protective film and the circuit layer to be combined into an integrated structure to form the circuit board.
S20: a first processing region and a second processing region are provided on the protective film according to a position of the window on the wiring board, the second processing region being provided along a periphery of the first processing region such that the second processing region surrounds the first processing region.
S30: and setting a first processing parameter of the laser processing device according to the first processing area, and setting a second processing parameter of the laser processing device according to the second processing area, so that the laser processing device can accurately perform processing operation according to design requirements.
S40: the laser processing device processes the first processing area line by line according to the set first processing parameter, taking the embodiment in fig. 2 as an example, specifically, after the laser processing device processes one line from the initial end 11 to the end 12 of the first processing area S1, the laser processing device rapidly returns to the initial end 11 from the end 12 in a non-processing state, and then the laser processing device operates to reach the set processing parameter to process the next line in the first processing area, and the above steps are repeated until the first processing area is processed.
It should be noted that the initial end and the final end described in the above embodiments are only for illustration and are not limited in nature.
S50: the laser processing apparatus performs the processing operation on the second processing area S2 along the periphery of the first processing area S1 one by one according to the set second processing parameters until the second processing area S2 is finished. The peripheral edge here means a peripheral edge around, i.e., an edge around the first processing area.
Compared with the existing windowing method of firstly processing a windowing on a protective film and then laminating the protective film and a circuit layer, the processing method of the protective layer of the circuit board of the invention presses the protective film on the circuit layer, sets the processing parameters of the laser processing device according to the difference of the melting points of the materials on the circuit board, so that the laser processing apparatus removes only a specific material such as a protective film according to preset processing parameters, the windowing operation of the protective film can be realized under the condition of not damaging other components of the circuit board, compared with the former that windowing is carried out first and then pressing is carried out, the embodiment of the invention carries out pressing and then windowing, progressive processing areas and circle-by-circle processing areas are also divided in the windowing process, therefore, the windowing precision of the protective film is improved from hundreds of micrometers to dozens of micrometers, the line width and the line distance of the circuit board are greatly improved, and the high-precision circuit board processing is realized.
In practical application scenes, in the prior art, a process of firstly processing and windowing a protective film and then laminating the protective film is adopted, the error of alignment precision is about 300um, meanwhile, the alignment precision in the production of a flexible circuit board is determined by multiple factors, and the control difficulty is high.
Fig. 2 is a schematic diagram of a processing route of a method for windowing a protection layer of a circuit board according to an embodiment of the present invention, and referring to fig. 2, when a first processing area S1 and a second processing area S2 are processed, a buffer area 10 is disposed between the first processing area S1 and the second processing area S2, and the buffer area 10 is used for accelerating a laser processing device so that the laser processing device reaches a set processing parameter when moving to a processing position. Specifically, the buffer 10 is configured to accelerate a laser head of the laser processing apparatus from a speed of 0 to a set speed, and increase laser processing energy from 0 to the set energy value, so that the laser processing apparatus can reach set processing parameters when reaching a processing area through accelerated preparation of the buffer 10, thereby ensuring a processing effect of windowing the protective layer.
The laser processing device processes the first processing area S1, wherein the first processing area S1 comprises a first starting side 11 and a first ending side 12, the laser processing device processes the first processing area on the first starting side line by line, after the Nth line is processed, the laser processing device returns to the first starting side 11 from the first ending side 12, moves to the (N + 1) th line from the first starting side for processing until the first processing area is processed, and N is a positive integer larger than or equal to 1. The laser processing apparatus accumulates speed and energy on the first start side 11, and the processing apparatus decelerates and attenuates energy on the first end side 12. The laser processing device can reliably reach the set processing parameters when entering the set position by setting the buffer area, so that the windowing consistency of the protective film is guaranteed.
Further, the processing of the second processing area S2 by the laser processing device includes processing the second processing area S2 along the periphery of the first processing area S1, and more particularly, processing the periphery of the first processing area S1 a plurality of times by surrounding the periphery of the first processing area S1, so that the periphery of the first processing area S1 is smoother, and the windowing quality of the circuit board protection layer is improved.
The laser machining apparatus completes the machining of the second machining region S2 around the periphery of the first machining region S1, including the laser machining apparatus machining the second machining region S2 along the periphery of the first machining region S1 in accordance with an annular machining path, which may alternatively be an equally spaced annular machining path to machine the second machining region S2.
In some embodiments, the processing parameters of the laser processing apparatus include a cutting length L, a cutting width H, a repetition number C, a spot diameter D, a filling pitch Y, a cutting speed V, and a processing time T, and the processing parameters satisfy the following relationship:
the processing time required to process a single row is:
the time for processing the fixed area is as follows:
in the above embodiment, according to the length L, the cutting width H, the repetition number C, and the spot diameter D of the protective film to be cut, the required processing time is accurately calculated by setting the processing parameters of the cutting speed V and the spot overlapping rate β, so that the processing time of the laser processing device can be conveniently adjusted, and the processing parameters can be conveniently adjusted according to different use scenes to adapt to more processing scenes, thereby improving the applicability and flexibility of practical application.
In some embodiments, the laser processing apparatus has an output frequency f, a processing area S, and a time T required for processing the area S:
in the embodiment, the adjustment of the processing time T of the processing area S is completed by adjusting the light emitting frequency f, the processing speed V, the spot diameter D and the repetition times C, the time required for completing the processing area S is shown by the relational expression, the larger the value of D is, the smaller the processing time T is, and the size of the spot diameter D is adjusted by the focal length offset Z because the laser is Gaussian light, the spot size of the Gaussian light is symmetrical along the focal point, and meanwhile, the removal depth of the single-point spot is determined by the offset of the laser power and the focal length offset Z, so that the opening effect of the protective film is further determined.
In some embodiments, the spot spacing X, the spot overlap ratio β; further, the filling pitch Y in the above implementation can be understood as: the distance between the corresponding adjacent laser spots on the adjacent paths in the path is traveled by the laser processing device in the processing process, as shown in fig. 3, and further, the parameters satisfy the following relationship:
wherein X is more than or equal to 0 and less than or equal to D, if X is more than D, beta is zero, and beta is more reasonable value range more than or equal to 50% and less than or equal to 90% simultaneously to make the processing diameter of laser facula more than or equal to the interval between the adjacent processing route, ensure that the facula can be completely excised after many processing routes are processed, remain free, thereby avoid the interval of adjacent processing route to be greater than the processing diameter of facula, and can not effectively excise the part that needs processing, and then ensure the reliability of processingquality.
In some embodiments, the processing parameters further include a focal length offset Z, a focal length F of the focusing lens, an incident beam diameter L, a laser wavelength λ, a divergence angle θ of the focused spot, and a theoretical spot diameter size K, and the above parameters satisfy the following relationship:
D＝Z×tanθ；
D<K。
in the embodiment, the windowing method for the circuit board protective layer can reliably process the circuit board protective layer, and guarantees the windowing effect of the circuit board protective layer.
Fig. 3 is a schematic diagram of another processing path of the windowing method for a circuit board protection layer according to an embodiment of the present invention, fig. 4 is a labeled diagram of a processing area of the windowing method for a circuit board protection layer of fig. 3, and referring to fig. 3 and 4, compared with a circular structure presented by the first processing area S1 and the second processing area S2 of fig. 2, fig. 3 and 4 show another schematic diagram of a structure in which the first processing area S1 is rectangular and the second processing area S2 is also rectangular, the laser processing device accelerates and increases the energy of the laser to the set processing parameters in the first starting end, i.e., the buffer 111, decelerates the first ending side 112 after the first row is processed, decreases the laser power and then runs at a high speed from the first ending side 112 to the second starting side 121, after the second starting side 121 is reached, the laser processing device accelerates and increases the energy of the laser to the set processing parameters, and after the second row is processed, the speed is reduced on the second end side 122 to reduce the laser power, which is a processing cycle for processing two adjacent rows line by line, so that the processing effects of the first row and the second row in the whole row are consistent when the second row is processed, and the processing cycle is repeated until the first processing area S1 is processed, so that the processing effects of the whole first processing area are consistent when the rest areas to be processed, namely the third row and the fourth row are waiting for processing.
After the first processing area S1 is processed, the processing is performed from the inner side of the second processing area S2 to the outside along the periphery of the first processing area S1, specifically, the innermost ring 21 is processed along the annular processing path of the periphery of the second processing area S2 closest to the first processing area S1, and the secondary inner ring 22 is processed after the processing of the innermost ring 21 is completed until the processing of the remaining areas to be processed of the second processing area is also completed one by one, thereby realizing the stable and reliable processing of the protective layer of the circuit board.
Fig. 5 is a schematic view of an actual processing effect of the windowing method for a protective layer of a circuit board according to the embodiment of the invention, and referring to fig. 5, the actual processing effect of the protective layer of the circuit board has a complete windowing form and smooth peripheral areas.
The technical features of the embodiments described above can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The windowing method for the protective layer of the circuit board is characterized by comprising the following steps:
arranging a protective film on the circuit layer of the circuit board and pressing;
arranging a first processing area and a second processing area on the protective film according to the windowing position on the circuit board, wherein the second processing area is arranged along the periphery of the first processing area;
setting a first processing parameter of the laser processing device according to the first processing area, and setting a second processing parameter of the laser processing device according to the second processing area;
the laser processing device processes the first processing area line by line according to the first processing parameter;
the laser processing device processes the second processing area along the periphery of the first processing area according to the second processing parameter.
2. The method of claim 1, wherein during the processing of the first processing zone and the second processing zone, the method further comprises:
and arranging a buffer area between the first processing area and the second processing area, wherein the buffer area is used for accelerating the laser processing device, so that the laser processing device reaches set processing parameters when moving to a processing position.
3. The method for windowing the protective layer of the circuit board according to claim 2, wherein the laser processing device processes the first processing area by:
the first processing area comprises a first starting side and a first finishing side, and the laser processing device processes the first processing area line by line on the first starting side;
after the nth row is processed, the laser processing device returns to the first starting side from the first ending side, and moves to the (N + 1) th row from the first starting end to process until the first processing area is processed.
4. The method for windowing the protective layer of the circuit board according to claim 3, wherein the laser processing device processes the second processing area by:
the laser processing device processes the second processing area along the periphery of the first processing area.
5. The circuit board protective layer windowing method according to claim 4, wherein the laser processing device is processed a plurality of times around the periphery of the first processing area to finish the second processing area.
6. The method for windowing a protective layer of a circuit board according to claim 5, wherein the laser processing device surrounds the periphery of the first processing area to finish the second processing area, comprising:
the laser processing device processes the second processing area along the periphery of the first processing area according to an annular processing path.
7. The circuit board protective layer windowing method according to claim 1, wherein the processing parameters comprise: cutting length L, cutting width H, repetition number C, facula diameter D, filling interval Y, cutting speed V, process time T, the following relation is satisfied to above-mentioned parameter:
8. the method of claim 7, wherein the processing parameters further include an optical frequency f, and when the processing area is S, the time T required for processing the area S is:
9. the method for windowing the protective layer of the circuit board according to claim 8, wherein the processing parameters further include a spot pitch X and a spot overlap ratio β, and the spot overlap ratio β and the spot pitch X satisfy the following relationship:
10. the method of claim 9, wherein the processing parameters further include a focal length offset Z, a focal length F of the focusing lens, an incident beam diameter L, a laser wavelength λ, a divergence angle θ of a focused spot, and a theoretical spot diameter K, and the parameters satisfy the following relation:
D＝Z×tanθ；
D<K。
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