CN113716945B - 一种低导热轻量化硅砖及其制备方法 - Google Patents

一种低导热轻量化硅砖及其制备方法 Download PDF

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CN113716945B
CN113716945B CN202110940865.6A CN202110940865A CN113716945B CN 113716945 B CN113716945 B CN 113716945B CN 202110940865 A CN202110940865 A CN 202110940865A CN 113716945 B CN113716945 B CN 113716945B
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董红芹
樊效乐
李建涛
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Zhengzhou Dongyu New Material Technology Co ltd
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Abstract

本发明涉及一种低导热轻量化硅砖及其制备方法，所述硅砖可选自包括以质量分数计的如下组分：60％～65％的结晶硅砂、15％～20％的熟硅砂、15％～25％的结晶硅石粉、外加1.5％～3.5％的微米碳酸钙粉、外加1％～2％的矿化剂、外加1％～2.5％的粘结剂。通过上述材料的混合调配及烧结过程的温度控制，制备出气孔率适中、导热率低、轻量化的硅砖制品，有助于降低炉体的钢壳温度，进而提高钢壳的寿命，且对环境友好。

Description

一种低导热轻量化硅砖及其制备方法
技术领域
本发明涉及硅砖制备技术领域，尤其涉及一种低导热轻量化硅砖硅砖及其制备方法。
背景技术
目前顶燃式热风炉的蓄热室上部和锥段的炉衬普遍采用和蓄热室用硅质格子砖性能一样的硅砖，从使用性能的角度考虑，蓄热室内部的硅质格子砖，作为蓄热的载体，其体密越大、导热率越高、换热能力越强，性能越好；研究表明硅砖的导热率可达到2.35～2.45w/mk，导热率整体提高20％以上，如果工作层的硅质炉衬也沿用这样的设计思路，那么同样的炉衬厚度势必会引起炉体钢壳温度的提高，尤其拱顶温度提高，高温势必造成钢壳的晶间应力腐蚀，引起开焊等不良后果降低其寿命。基于上述分析过程，不难得出作为炉衬材料的硅砖要具备低导热性的结论，其完全不同于作为蓄热体的硅砖要具备高导热性的设计思路。因此本申请提供一种低导热性、气孔率适中、轻量化的硅砖制品，有助于降低钢壳温度，满足现有炉衬材料的需求。
发明内容
为解决现有技术的不足，本发明提出一种低导热轻量化硅砖及其制备方法。
为实现以上目的，本发明所采用的技术方案包括：
根据本发明的第一个方面，公开了一种低导热轻量化硅砖，可选自包括以质量分数计的如下组分：60％～65％的结晶硅砂、15％～20％的熟硅砂、15％～25％的结晶硅石粉、外加1.5％～3.5％的微米碳酸钙粉、外加1％～2％的矿化剂、外加1％～2.5％的粘结剂。
进一步地，所述微米碳酸钙粉优选为粒度小于等于5微米且质量含量不低于95％。
进一步地，所述结晶硅砂优选为粒度小于等于2.2mm且SiO2质量含量不低于98.5％。
进一步地，所述熟硅砂优选为粒度小于等于2.5mm且SiO2质量含量不低于94.5％。
进一步地，所述结晶硅石粉优选为粒度小于等于0.074mm。
进一步地，所述1％～2％的矿化剂优选为包括0.4％～0.6％的铁鳞粉和1％～1.5％的萤石粉，所述铁鳞粉优选为粒度小于等于0.088mm且Fe2O3质量含量不低于90％，所述萤石粉优选为粒度小于等于0.088mm且CaF2质量含量不低于80％。
进一步地，所述1％～2.5％的粘结剂优选为包括0.5％～0.7％的膨润土和1％～2％的黄糊精，所述膨润土优选为粒度小于等于0.045mm。
进一步地，所述硅砖优选为应用于热风炉、焦炉或煅烧炉的炉墙。
根据本公开的第二个方面，公开了一种如上所述的低导热轻量化硅砖的制备方法，包括原料混合、压制成型、干燥、烧结、降温冷却的工艺过程，所述干燥工艺温度区间优选为80～120℃，所述烧结工艺优选为在1460～1480℃的温度区间内保温20～25h。
本发明的有益效果为：
采用本发明所述的一种低导热轻量化硅砖，包括结晶硅砂、熟硅砂、结晶硅石粉、微米碳酸钙粉、矿化剂、粘结剂等材料。其中微米碳酸钙粉的加入，在硅砖烧制过程中分解为氧化钙和二氧化碳，二氧化碳的挥发会留下亚微米级的空隙，同时氧化钙可促进石英的转化过程，通过各个组分的混合调配及烧结过程温度的控制，制备出气孔率适中、导热率低、轻量化的硅砖制品，有助于降低炉体的钢壳温度，进而提高钢壳的寿命，且对环境友好。
具体实施方式
研究表明影响硅砖材料导热性能最重要的因素为显气孔率和磷石英含量。其中气孔率越低、鳞石英含量越高，硅砖的导热率越高。对于作为炉衬材料的硅砖而言，作用于高温部位，不可能通过大幅增加显气孔率的手段来降低硅砖的导热率。本发明基于原位反应原理，在不降低硅含量和高温性能的前提下，通过引入微气孔、提高方石英含量的手段来降低硅砖的导热率。
碳酸钙在约825℃时分解为氧化钙和二氧化碳，微米级的碳酸钙会因为二氧化碳的挥发，留下一定的亚微米级的空隙，同时分解产生的氧化钙参与到硅砖的石英的转化过程中；硅砖烧成过程中石英最终转化成鳞石英和方石英，方石英熔点为1713℃，鳞石英熔点为1670℃，为了降低导热率需要提高方石英的含量，为了促进方石英更大量的生成，烧成温度略高于普通硅砖。
为了更清楚的理解本发明的内容，将结合实施例详细说明。
实施例1
一种低导热轻量化硅砖，选自包括以质量分数计的如下组分：包括以质量分数计的如下组分：65％的结晶硅砂、15％的废砖熟硅砂、20％的结晶硅石粉、外加2.2％的微米碳酸钙粉、外加0.6％的铁鳞粉、外加0.5％的膨润土、外加1.2％的萤石粉。其中所述结晶硅砂粒度小于等于2.2mm且SiO2含量不低于98.5％，所述废砖熟硅砂粒度小于等于2.5mm且SiO2含量不低于94.5％，所述结晶硅石粉粒度小于等于0.074mm，所述微米碳酸钙粉粒度小于等于5微米且质量含量不低于95％，所述铁鳞粉粒度小于等于0.088mm且Fe2O3质量含量不低于90％，所述萤石粉的粒度小于等于0.088mm且CaF2质量含量不低于80％，所述膨润土粒度小于等于0.045mm。
优选的，上述低导热轻量化硅砖的制备方法包括原料混合、压制成型、干燥、烧结、降温冷却的工艺过程，所述干燥工艺温度区间为80～120℃，所述烧结工艺为在1460～1480℃的温度区间内保温20～25h。
实施例2
一种低导热轻量化硅砖，选自包括以质量分数计的如下组分：包括以质量分数计的如下组分：65％的结晶硅砂、18％的废砖熟硅砂、17％的结晶硅石粉、外加2.6％的微米碳酸钙粉、外加0.6％的铁鳞粉、外加0.5％的膨润土、外加1.2％的萤石粉。其中所述结晶硅砂粒度小于等于2.2mm且SiO2含量不低于98.5％，所述废砖熟硅砂粒度小于等于2.5mm且SiO2含量不低于94.5％，所述结晶硅石粉粒度小于等于0.074mm，所述微米碳酸钙粉粒度小于等于5微米且质量含量不低于95％，所述铁鳞粉粒度小于等于0.088mm且Fe2O3质量含量不低于90％，所述萤石粉的粒度小于等于0.088mm且CaF2质量含量不低于80％，所述膨润土粒度小于等于0.045mm。
优选的，上述低导热轻量化硅砖的制备方法包括原料混合、压制成型、干燥、烧结、降温冷却的工艺过程，所述干燥工艺温度区间为80～120℃，所述烧结工艺为在1460～1480℃的温度区间内保温20～25h。
实施例3
一种低导热轻量化硅砖，选自包括以质量分数计的如下组分：包括以质量分数计的如下组分：65％的结晶硅砂、20％的废砖熟硅砂、15％的结晶硅石粉、外加3％的微米碳酸钙粉、外加0.6％的铁鳞粉、外加0.5％的膨润土、外加1.2％的萤石粉。其中所述结晶硅砂粒度小于等于2.2mm且SiO2含量不低于98.5％，所述废砖熟硅砂粒度小于等于2.5mm且SiO2含量不低于94.5％，所述结晶硅石粉粒度小于等于0.074mm，所述微米碳酸钙粉粒度小于等于5微米且质量含量不低于95％，所述铁鳞粉粒度小于等于0.088mm且Fe2O3质量含量不低于90％，所述萤石粉的粒度小于等于0.088mm且CaF2质量含量不低于80％，所述膨润土粒度小于等于0.045mm。
优选的，上述低导热轻量化硅砖的制备方法包括原料混合、压制成型、干燥、烧结、降温冷却的工艺过程，所述干燥工艺温度区间为80～120℃，所述烧结工艺为在1460～1480℃的温度区间内保温20～25h。
上述实施例1至3得到的硅砖产品，产品质地均匀、质量良好，而且与现有的硅砖相比，显著降低了硅砖的导热率且保证了适中的气孔率，使硅砖性能远远优于市面上的硅砖制品，有助于降低钢壳温度，满足现有炉衬材料的需求。且所述硅砖产品的理化检测结果如表1所示。
表1一种低导热轻量化硅砖的性能指标
Figure BDA0003214814240000041
以上所述仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换等都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求书的保护范围为准。

Claims (3)

1.一种低导热轻量化硅砖，其特征在于，包括以质量分数计的如下组分：60%~65%的结晶硅砂、15%~18%的熟硅砂、17%~20%的结晶硅石粉、外加2.2%~2.6%的微米碳酸钙粉、外加1%~2%的矿化剂、外加1%~2.5%的粘结剂；
所述1%~2%的矿化剂包括0.4%~0.6%的铁鳞粉和1%~1.5%的萤石粉，所述铁鳞粉的粒度小于等于0.088mm且Fe2O3质量含量不低于90%，所述萤石粉的粒度小于等于0.088mm且CaF2质量含量不低于80%；
所述微米碳酸钙粉的粒度小于等于5 微米且质量含量不低于95%；
所述结晶硅砂的粒度小于等于2.2mm且SiO2质量含量不低于98.5%；
所述熟硅砂的粒度小于等于2.5mm且SiO2质量含量不低于94.5%；
所述结晶硅石粉的粒度小于等于0.074mm；
所述1%~2.5%的粘结剂包括0.5%~0.7%的膨润土和1%~2 %的黄糊精，所述膨润土的粒度小于等于0.045mm。
2.如权利要求1所述的硅砖，其特征在于，所述硅砖应用于热风炉、焦炉或煅烧炉的炉墙。
3.一种如权利要求1至2任一项所述的低导热轻量化硅砖的制备方法，其特征在于，包括原料混合、压制成型、干燥、烧结、降温冷却的工艺过程，所述干燥工艺温度区间为80~120℃，所述烧结工艺为在1460~1480℃的温度区间内保温20~25h。
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