CN111995427A - 一种抗热震异形大块硅砖及其制备方法 - Google Patents

一种抗热震异形大块硅砖及其制备方法 Download PDF

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CN111995427A
CN111995427A CN202010842849.9A CN202010842849A CN111995427A CN 111995427 A CN111995427 A CN 111995427A CN 202010842849 A CN202010842849 A CN 202010842849A CN 111995427 A CN111995427 A CN 111995427A
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董红芹
樊效乐
李建涛
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Zhengzhou Dongyu New Material Technology Co ltd
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Abstract

本发明涉及一种抗热震异形大块硅砖及其制备方法，通过在结晶石英原料中添加部分熔融石英，利用熔融石英本身纯度高、高温状态下成玻璃态结构、热膨胀系数非常小、不发生各相的转化的优点，降低了烧结后硅砖内鳞石英和方石英的含量，总体上降低了结晶石英相转化过程中产生的体积效应，进一步降低了硅砖冷却过程中产生的裂纹。由于仅替代部分结晶石英原料，因此比用纯熔融石英做的产品性价比要高很多；同时产品可以和大宗小型产品同步烧成，大幅提高生产效率。

Description

一种抗热震异形大块硅砖及其制备方法
技术领域
本发明涉及硅砖制备技术领域，尤其涉及一种抗热震异形大块硅砖及其制备方法。
背景技术
目前现有的硅砖生产工艺为采用天然的结晶石英为原料，添加矿化剂，在烧结过程中，促使全部结晶石英转化成60％左右的鳞石英，30％左右的方石英，9％左右的玻璃相及1％的残余石英。结晶石英向鳞石英和方石英的转化过程中体积会分别增加14.4％和16.7％，产生体积膨胀，这种体积膨胀会在硅砖内产生较大应力。且在硅砖冷却降温过程中，鳞石英、方石英及残余石英分别在600℃、220℃、120℃左右会产生体积突变，会大幅降低硅砖的抗热震性能。
基于上述问题，在制备砖型复杂、体积较大的异形大块硅砖的过程中，合格率普遍很低，因为这些产品数量少，不能单独烧成，只好随着大批大量小型硅砖烧成，即便延长保温时间，由于烧成和冷却都是由表及里的过程，就造成硅砖内外温度变化不一致，导致内外的膨胀和冷缩不一致而产生裂纹，造成废品，不得不一次次的重复生产，降低了生产效率和供货效率。即使用梭式窑超长时间的保温能够保障生产的成功，但也受制于生产装备的限制，导致生产能耗高、效率低。
发明内容
为解决现有技术的不足，本发明提出一种抗热震异形大块硅砖及其制备方法，通过在硅砖中添加部分熔融石英的方式，利用熔融石英本身纯度高、高温状态下成玻璃态结构、热膨胀系数非常小、不发生各相的转化的优点，总体上降低石英转化的体积效应，进而减少硅砖裂纹的产生。
为实现以上目的，本发明所采用的技术方案包括：
一种抗热震异形大块硅砖，其特征在于，可选自包括以质量分数计的如下组分：20％～50％的熔融石英、25％～65％的硅砂、10％～20％的废砖砂、10％～15％的熔融石英细粉、18％～25％的硅砂细粉、10％～15％的废砖砂细粉、+0.4％～1.4％的萤石细粉、+0.2％～0.8％的铁鳞细粉、+0.4％～1.4％的粘土粉、+0.7％～2％的钙粉、+1.5％～2.5％的结合剂。
进一步地，所述熔融石英粒度优选为小于等于3mm，且二氧化硅含量优选为不低于99％。
进一步地，所述熔融石英细粉粒度小于等于0.088mm，且二氧化硅含量不低于99％。
进一步地，所述硅砂粒度优选为小于等于2.2mm，所述废砖砂粒度优选为小于等于2.5mm，所述硅砂细粉粒度优选为小于等于0.088mm，所述废砖砂粒度小于等于0.088mm，所述萤石细粉粒度优选为小于等于0.088mm，所述铁鳞细粉粒度优选为小于等于0.088mm，所述粘土粉粒度优选为小于等于0.044mm，所述钙粉粒度优选为小于等于0.038mm。
进一步地，所述硅砂细粉优选为新密硅石粉。
进一步地，所述结合剂优选为木质素溶液、酸性硅溶胶，所述木质素溶液的比重区间优选为1.15～1.17g/cm3。
进一步地，一种抗热震异形大块硅砖的制备方法，包括以下步骤：
S1、原料混合：将所述原料称重、混合后加入适量水，放入搅拌机中混合均匀形成泥料；
S2、压制成型：将所述混合后的泥料放入模具中，进行机压或震动成型，制成砖坯；
S3、干燥：将所述成型后的砖坯放入干燥器中干燥，得到干燥砖坯；
S4、烧结：将所述干燥砖坯放入煅烧炉中升温煅烧，然后放入隧道窑或梭式窑中保温煅烧至砖坯烧结；
S5、降温冷却：将所述烧结后的砖坯进行降温冷却，得到抗热震异形大块硅砖。
进一步地，所述步骤S3中干燥温度区间优选为80～110℃，所述干燥砖坯的水分质量含量优选为小于0.5％。
进一步地，所述步骤S4中升温煅烧的升温速率优选为20～80℃/h，升温终点1420℃，所述保温煅烧的温度区间优选为1050～1450℃，保温时间优选为6～20小时。
进一步地，所述步骤S5中降温终点温度为100℃。
本发明的有益效果为：
采用本发明所述抗热震异形大块硅砖及其制备方法，通过在结晶石英原料中添加部分熔融石英，降低了烧结后硅砖内鳞石英和方石英的含量，总体上降低了结晶石英相转化过程中产生的体积效应，进一步降低了硅砖冷却过程中产生的裂纹。由于仅替代部分结晶石英原料，因此比用纯熔融石英做的产品性价比要高很多；同时产品可以和大宗小型产品同步烧成，大幅提高生产效率。
具体实施方式
实施例1
一种抗热震异形大块硅砖，选自以质量分数计的如下组分：20％的熔融石英、35％的硅砂、15％的废砖砂、10％的熔融石英细粉、20％的新密硅石粉、+0.8％(均为占起始料总重量的百分比)的萤石细粉、+0.3％的铁鳞细粉、+0.3％的粘土粉、+1.6％的钙粉、+1.8％的木质素溶液。进一步地，所述熔融石英粒度优选为小于等于3mm，所述硅砂粒度优选为小于等于2.2mm，所述废砖砂粒度优选为小于等于2.5mm，所述熔融石英细粉粒度优选为小于等于0.088mm，所述新密硅石粉粒度优选为小于等于0.088mm，所述萤石细粉粒度优选为小于等于0.088mm，所述铁鳞细粉粒度优选为小于等于0.088mm，所述粘土粉粒度优选为小于等于0.044mm，所述钙粉粒度优选为小于等于0.038mm。
优选的，上述抗热震异形大块硅砖通过如下方法制备，包括以下步骤：
S1、将熔融石英、硅砂、废砖砂、熔融石英细粉、新密硅石粉、萤石细粉、铁鳞细粉、粘土粉、钙粉、木质素溶液等原料称重、混合后加入+6％的水，放入搅拌机中搅拌20～30min，混合均匀形成泥料；
S2、压制成型：将所述混合后的泥料放入模具中，进行机压或震动成型，制成砖坯；
S3、干燥：将所述成型后的砖坯放入干燥器中干燥，干燥温度区间为80～110℃，得到水分质量含量小于0.5％干燥砖坯；
S4、烧结：将所述干燥砖坯放入煅烧炉中以20～25℃/h的速率升温煅烧，升温终点1420℃，然后放入1430℃的隧道窑或梭式窑中保温煅烧20h；
S5、降温冷却：将所述烧结后的砖坯进行降温冷却，先以40～50℃/h的降温速率降温至700℃，然后以20～25℃/h的降温速率降温至100℃，得到低膨胀抗热震异形大块硅砖。
实施例2
一种抗热震异形大块硅砖，选自以质量分数计的如下组分：35％的熔融石英、20％的硅砂、15％的废砖砂、10％的熔融石英细粉、20％的新密硅石粉、+0.6％的萤石细粉、+0.3％的铁鳞细粉、+0.3％的粘土粉、+1.4％的钙粉、+1.8％的木质素溶液。进一步地，所述熔融石英粒度优选为小于等于3mm，所述硅砂粒度优选为小于等于2.2mm，所述废砖砂粒度优选为小于等于2.5mm，所述熔融石英细粉粒度优选为小于等于0.088mm，所述新密硅石粉粒度优选为小于等于0.088mm，所述萤石细粉粒度优选为小于等于0.088mm，所述铁鳞细粉粒度优选为小于等于0.088mm，所述粘土粉粒度优选为小于等于0.044mm，所述钙粉粒度优选为小于等于0.038mm。
优选的，上述抗热震异形大块硅砖通过如下方法制备，包括以下步骤：
S1、将熔融石英、硅砂、废砖砂、熔融石英细粉、新密硅石粉、萤石细粉、铁鳞细粉、粘土粉、钙粉、木质素溶液等原料称重、混合后加入+6％的水，放入搅拌机中搅拌20～30min，混合均匀形成泥料；
S2、压制成型：将所述混合后的泥料放入模具中，进行机压或震动成型，制成砖坯；
S3、干燥：将所述成型后的砖坯放入干燥器中干燥，干燥温度区间为80～110℃，得到水分质量含量小于0.5％干燥砖坯；
S4、烧结：将所述干燥砖坯放入煅烧炉中以20～25℃/h的速率升温煅烧，升温终点1420℃，然后放入1440℃的隧道窑或梭式窑中保温煅烧15h；
S5、降温冷却：将所述烧结后的砖坯进行降温冷却，先以40～50℃/h的降温速率降温至700℃，然后以20～25℃/h的降温速率降温至100℃，得到低膨胀抗热震异形大块硅砖。
实施例3
一种抗热震异形大块硅砖，选自以质量分数计的如下组分：50％的熔融石英、20％的废砖砂、15％的熔融石英细粉、15％的废砖砂细粉、+1％的钙粉、+1.8％的酸性硅溶胶。进一步地，所述熔融石英粒度优选为小于等于3mm，所述废砖砂粒度优选为小于等于2.5mm，所述熔融石英细粉粒度优选为小于等于0.088mm，所述废砖砂细粉粒度优选为小于等于0.088mm，所述钙粉粒度优选为小于等于0.038mm。
优选的，上述抗热震异形大块硅砖通过如下方法制备，包括以下步骤：
S1、熔融石英、废砖砂、熔融石英细粉、废砖砂细粉、钙粉、酸性硅溶胶等原料称重、混合后加入+6％的溶胶，放入搅拌机中搅拌20～30min，混合均匀形成泥料；
S2、压制成型：将所述混合后的泥料放入模具中，进行机压或震动成型，制成砖坯；
S3、干燥：将所述成型后的砖坯放入干燥器中干燥，干燥温度区间为80～110℃，得到水分质量含量小于0.5％干燥砖坯；
S4、烧结：将所述干燥砖坯放入煅烧炉中以50～80℃/h的速率升温煅烧，升温终点1420℃，然后放入1050℃的隧道窑或梭式窑中保温煅烧6h；
S5、降温冷却：将所述烧结后的砖坯进行降温冷却，以80～100℃/h的降温速率降温至100℃，得到低膨胀抗热震异形大块硅砖。
表1抗热震异形大块硅砖的性能指标
项目 单位 实施例1 实施例2 实施例3 普通硅砖
SiO2 ％ 94.5 95 96.5 94
显气孔率 ％ 21 20.5 19 22
耐压 MPa 35 38 40 30
荷重温度 ℃ 1655 1655 1660 1650
以上所述仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换等都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求书的保护范围为准。

Claims (10)

1.一种抗热震异形大块硅砖，其特征在于，可选自包括以质量分数计的如下组分：20％～50％的熔融石英、25％～65％的硅砂、10％～20％的废砖砂、10％～15％的熔融石英细粉、18％～25％的硅砂细粉、10％～15％的废砖砂细粉、外加0.4％～1.4％的萤石细粉、0.2％～0.8％的铁鳞细粉、0.4％～1.4％的粘土粉、0.7％～2％的钙粉、1.5％～2.5％的结合剂。
2.如权利要求1所述的硅砖，其特征在于，所述熔融石英粒度小于等于3mm，且二氧化硅含量不低于99％。
3.如权利要求1所述的硅砖，其特征在于，所述熔融石英细粉粒度小于等于0.088mm，且二氧化硅含量不低于99％。
4.如权利要求1至3任一项所述的硅砖，其特征在于，所述硅砂粒度小于等于2.2mm，所述废砖砂粒度小于等于2.5mm，所述硅砂细粉粒度小于等于0.088mm，所述废砖砂粒度小于等于0.088mm，所述萤石细粉粒度小于等于0.088mm，所述铁鳞细粉粒度小于等于0.088mm，所述粘土粉粒度小于等于0.044mm，所述钙粉粒度小于等于0.038mm。
5.如权利要求4所述的硅砖，其特征在于，所述硅砂细粉为新密硅石粉。
6.如权利要求4所述的硅砖，其特征在于，所述结合剂为木质素溶液和/或酸性硅溶胶；所述木质素溶液的比重区间为1.15～1.17g/cm3。
7.一种抗热震异形大块硅砖的制备方法，其特征在于，包括以下步骤：
S1、原料混合：将所述原料称重、混合后加入5％～10％的水，放入搅拌机中混合均匀形成泥料；
S2、压制成型：将所述混合后的泥料放入模具中，进行机压或震动成型，制成砖坯；
S3、干燥：将所述成型后的砖坯放入干燥器中干燥，得到干燥砖坯；
S4、烧结：将所述干燥砖坯放入煅烧炉中升温煅烧，然后放入隧道窑或梭式窑中保温煅烧直至砖坯烧结；
S5、降温冷却：将所述烧结后的砖坯进行降温冷却，得到抗热震异形大块硅砖。
8.如权利要求7所述的制备方法，其特征在于，所述步骤S3中干燥温度区间为80～110℃，所述干燥砖坯的水分质量含量小于0.5％。
9.如权利要求7所述的制备方法，其特征在于，所述步骤S4中升温煅烧的升温速率为20～80℃/h，升温终点1420℃，所述保温煅烧的温度区间为1050～1450℃，保温时间为6～20小时。
10.如权利要求7至9任一项所述的制备方法，其特征在于，所述步骤S5中降温终点温度为100℃。
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