CN113691268B - Data transmission and receiving device - Google Patents
Data transmission and receiving device Download PDFInfo
- Publication number
- CN113691268B CN113691268B CN202110937495.0A CN202110937495A CN113691268B CN 113691268 B CN113691268 B CN 113691268B CN 202110937495 A CN202110937495 A CN 202110937495A CN 113691268 B CN113691268 B CN 113691268B
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- layer
- chip circuit
- circuit board
- capillary
- base body
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a data transmission and receiving device, which comprises a first base body, a second base body, a shell and a chip circuit board, wherein the chip circuit board is arranged on the first base body through the second base body, and the shell is coated outside the first base body; the side of the first substrate facing the chip circuit board is provided with a capillary network, the capillary network comprises main capillaries distributed in a matrix form, so that the main capillaries are in a layered structure with an upper layer and a lower layer, wherein the side close to the chip circuit board is an evaporation layer, and the layer far away from the chip circuit board is a cooling layer; two adjacent main capillaries on the same layer are in a communicated state; in the main capillaries of the evaporation layer and the cooling layer, two adjacent main capillaries positioned in the same vertical plane are connected through a second auxiliary capillary, so that the main capillaries of the evaporation layer and the cooling layer are in a communicated state; the main capillary tube has a coolant therein. The invention can improve the cooling efficiency of the chip circuit board, thereby improving the working efficiency of the chip circuit board and prolonging the storage time of the setting data.
Description
Technical Field
The present invention relates to a data transmission and exchange device, and more particularly, to a data transmission and reception device.
Background
In a normal data transmission and reception system, the data storage capacity of the flash memory device (e.g., NANDFLASH) is mostly not affected at a temperature below normal (T <40 ℃), but is greatly reduced once the temperature is higher than the normal (T >40 ℃). For example, below normal temperatures (T <40 ℃), data stored in a flash memory device should be preserved normally for more than five years, with temperatures rising to 60 ℃, data stored in a flash memory device can be preserved for about one year, and with temperatures further rising to above 85 ℃, data stored in a flash memory device can only be preserved for two to three days. It follows that in a data transmission and reception system, in order to maintain a long stable storage setting, it is necessary to maintain its operation at a normal temperature. In the prior art, a fan is usually installed to cool the air, but the effect of the method is not obvious.
Disclosure of Invention
In order to solve the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a data transmission and reception apparatus, which can improve the cooling efficiency of a chip circuit board, thereby improving the working efficiency thereof and prolonging the storage time of setting data.
The technical scheme adopted by the invention for solving the technical problems is as follows: a data transmission and receiving device comprises a first base body, a second base body, a shell and a chip circuit board, wherein the chip circuit board is installed on the first base body through the second base body, and the shell covers the outside of the first base body;
a groove is formed in one side, facing the chip circuit board, of the first substrate, a capillary network is installed in the groove and comprises main capillaries distributed in a matrix form, so that the main capillaries are of a layered structure with an upper layer and a lower layer, an evaporation layer is arranged on one side close to the chip circuit board, and a cooling layer is arranged on one side far away from the chip circuit board;
in the main capillaries in the same layer, a plurality of the main capillaries are parallel to each other and are distributed at equal intervals, and two adjacent main capillaries are connected through a first auxiliary capillary respectively, so that two adjacent main capillaries in the same layer are in a communicated state;
in the main capillaries of the evaporation layer and the cooling layer, two adjacent main capillaries positioned in the same vertical plane are connected through a second auxiliary capillary, so that the main capillaries of the evaporation layer and the cooling layer are in a communicated state;
the primary capillary tube has a coolant therein.
Optionally, any one of the main capillaries in the cooling layer is connected with a fluid infusion tube, the fluid infusion tube penetrates out of the first base body, and a fluid infusion port is arranged on one side of the first base body away from the chip circuit board.
Optionally, a return pipe for communicating the main capillary of the evaporation layer with the main capillary of the cooling layer is further arranged on the side portions of the evaporation layer and the cooling layer;
the top of the return pipe extends from the evaporation layer to the end of the chip circuit board.
Optionally, the main capillary, the first auxiliary capillary, the second auxiliary capillary and the return pipe are all metal pipes.
Optionally, the housing is provided with a heat dissipation hole for forming convection, and the inner wall of the housing near the side of the chip circuit board far away from the capillary network is fixedly connected with a fan assembly.
Optionally, the chip circuit board is fixed to the second substrate in a pasting manner;
the number of the second base bodies is four, and the four second base bodies are respectively positioned at four corners of the chip circuit board.
Optionally, the first base body is provided with a mounting groove for mounting the second base body, an elastic limiting rod is arranged on the side portion of the mounting groove, and a limiting groove matched with the elastic limiting rod is arranged at the bottom of the side portion of the second base body.
Optionally, the inner wall of the mounting groove is provided with an accommodating hole for accommodating the elastic limiting rod, the elastic limiting rod is inserted into the accommodating hole, and the outer end of the elastic limiting rod is exposed out of the accommodating hole and extends into the mounting groove.
Optionally, a force-bearing inclined plane is arranged at the outer end of the elastic limiting rod, and a force-applying inclined plane matched with the force-bearing inclined plane is arranged at the bottom of the second base body;
the bottom of mounting groove be equipped with the first inclined plane of application of force inclined plane adaptation, the spacing inslot be equipped with the second inclined plane of atress inclined plane adaptation.
Optionally, a convex portion is arranged at the bottom of the second base body, and a shallow groove matched with the convex portion is arranged at the bottom of the mounting groove.
By adopting the technical scheme, compared with the prior art, the capillary network is arranged on one side, close to the chip circuit board, of the first base body, so that the back surface of the chip circuit board can be cooled, other consumption and other heat release sources are avoided in the cooling process, the cooling efficiency of the chip circuit board is greatly improved, the working efficiency of the chip circuit board is improved, and the storage time of the set data is prolonged.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of the structure of a capillary network of the present invention;
FIG. 3 is a schematic top view of a capillary network according to the present invention;
FIG. 4 is a side view schematic of a capillary network of the present invention;
FIG. 5 is a schematic structural view of a second substrate according to the present invention;
fig. 6 is a schematic structural view of the first substrate of the present invention.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1, the present invention discloses a data transmission and reception device, which includes a first substrate 1, a second substrate 2, a housing 3 and a chip circuit board 4, wherein the chip circuit board 4 is mounted on the first substrate 1 through the second substrate 2, and the housing 3 covers the first substrate 1. Specifically, when the housing 3 is installed on the first base body 1, a gap is left between the periphery of the first base body 1 and the housing 3, therefore, the first base body 1 can be fixedly connected with the inner wall of the housing 3 through a connecting rod and a bolt-nut assembly, in addition, heat dissipation holes 5 capable of forming convection are further formed in two sides of the housing 3, a fan assembly 6 is fixedly connected with the inner wall of the housing 3, the fan assembly 6 is matched with the heat dissipation holes 5, the external air and the air inside the housing 3 form convection, the heat of one side surface of the chip circuit board 4 is taken away, and the heat of the other side surface of the chip circuit board 4 is absorbed through a capillary tube network 7. On the outer side of the housing 3, an external connector 12 is further provided, and the external connector 12 is used for connecting the data transmission and reception device with a host, so that the external connector 12 is also electrically connected with the chip circuit board 4 through a wire to realize the connection of the chip circuit board 4 with the host.
In the present invention, as shown in fig. 1, the first substrate 1 is provided with a groove 8 on the side facing the chip circuit board 4, and the capillary network 7 is installed in the groove 8. In particular, the capillary network 7 is snapped into the groove 8 by means of a snap seat 9 at its bottom. The capillary network 7 is mounted by means of snap seats 9, which facilitate the disassembly of the capillary network 7, so as to allow a quick replacement of the capillary network 7.
Specifically, as shown in fig. 2 to 4, the capillary network 7 includes main capillaries 701 arranged in a matrix, and a first auxiliary capillary 702 and a second auxiliary capillary 703 connected between two adjacent main capillaries 701.
As shown in fig. 2 and 4, the main capillary 701 has a layered structure of upper and lower layers, wherein the side close to the chip circuit board 4 is an evaporation layer 10, and the layer far from the chip circuit board 4 is a cooling layer 11. The evaporation layer 10 is closer to the side of the chip circuit board 4, so that the evaporation layer 10 can absorb and carry away the heat emitted from the chip circuit board 4, and the cooling layer 11 is used for recycling the cooled cooling liquid.
In the primary capillaries 701, the primary capillaries 701 are arranged in a matrix form, the primary capillaries 701 are parallel to each other, and the primary capillaries 701 are arranged at equal intervals. In the evaporation layer 10, two adjacent main capillaries 701 are connected to each other by the first auxiliary capillary 702, so that the two adjacent main capillaries 701 are in a communication state. Similarly, in the cooling layer 11, two adjacent main capillaries 701 are connected to each other by the first auxiliary capillary 702, so that the two adjacent main capillaries 701 are in a communication state. When the evaporation layer 10 and the cooling layer 11 are connected to each other, the two adjacent main capillaries 701 located on the same vertical plane are connected to each other by the second auxiliary capillary 703, so that the evaporation layer 10 and the main capillaries 701 of the cooling layer 11 are also in a communicating state. Further, the cooling liquid is present in the main capillary 701 of the cooling layer 11 and the evaporation layer 10.
The volume of the coolant in the main capillary 701 in the cooling layer 11 and the evaporation layer 10 may be 15 to 20% of the total volume of the main capillary 701. In the present invention, the cooling liquid may be methanol, which has a boiling point of only 64.8 ℃ and is in a liquid state under normal conditions, but of course, the cooling liquid may also be other low-boiling point and easily condensable substances, such as ethanol, acetone, etc. In the present invention, the capillary network 7 needs to have a certain vacuum degree to facilitate the coolant to flow circularly, and also to facilitate the liquefaction of the coolant, for example, the vacuum degree in the capillary network 7 can be set to 5 to 6KPa.
In the present invention, a return pipe 704 for communicating the main capillary 701 of the evaporation layer 10 and the main capillary 701 of the cooling layer 11 is further provided on the side of the evaporation layer 10 and the cooling layer 11, and the top of the return pipe 704 extends from the evaporation layer 10 to the end of the chip circuit board 4.
When absorbing heat, the main capillary 701 in the evaporation layer 10 is heated, the coolant in the evaporation layer is heated and boiled to be gasified, after the coolant is gasified, the volume of the coolant expands to the position outside the main capillary 701 in the low-temperature region, when the gasified coolant reaches the low-temperature region of the main capillary 701, the coolant is condensed and liquefied again and flows back to the main capillary 701 in the cooling layer 11 through the return pipe 701, and the main capillary 701 in the evaporation layer, because the volume of the coolant in the high-temperature region is reduced and the vacuum degree is kept unchanged, the coolant in the cooling layer 11 is absorbed into the evaporation layer 10 to fill the gasified coolant, and the circulation is repeated in this way to cool the chip circuit board 4.
In the present invention, the main capillary 701, the first auxiliary capillary 702, the second auxiliary capillary 703, and the return pipe 704 are metal pipes to prevent the capillary network 7 from being deformed.
In the present invention, a replenishment pipe 705 may be connected to any one of the main capillaries 701 of the cooling layer 11, and the replenishment pipe 705 replenishes the cooling liquid to the capillary network 7. However, in a normal state, since the whole capillary network 7 is sealed, the total amount of the cooling liquid in the capillary network 7 does not change, and therefore, if the cooling effect is not good due to the change of the total amount of the cooling liquid in the capillary network 7, the phenomenon that the capillary network 7 has liquid leakage is indicated, at this moment, a new capillary network 7 should be replaced in time, and the supplement of the cooling liquid is only a temporary measure. Specifically, the fluid infusion tube 705 penetrates through the first substrate 1 during connection, and a fluid infusion port is disposed on a side of the first substrate 1 away from the chip circuit board 4, and a sealing device needs to be disposed in the fluid infusion port to ensure the sealing performance.
In the present invention, the chip circuit board 4 may be fixed to the second substrate 2 by means of adhesion. Specifically, the number of the second base bodies 2 is four, and the four second base bodies 2 are located at four corners of the chip circuit board 4. As shown in fig. 5 and 6, a mounting groove 13 for mounting the second base body 2 is provided on the first base body 1, an elastic limiting rod 14 is provided on a side portion of the mounting groove 13, and a limiting groove 15 adapted to the elastic limiting rod 14 is provided at a bottom position of the side portion of the second base body 2. Elasticity gag lever post 14 can adopt the rubber pole, it is when second base member 2 downstream, can produce deformation, inside in order to guarantee that second base member 2 can be smooth inserts mounting groove 13, the inner wall of mounting groove 13 still is equipped with the hole 16 that holds that is used for holding elasticity gag lever post 14, the diameter and the elasticity gag lever post 14 looks adaptation that should hold hole 16, elasticity gag lever post 14 is pegged graft in the inside that holds hole 16, and the outer tip of elasticity gag lever post 14 exposes and holds hole 16, and extend to mounting groove 13 in. The outer end of the elastic limiting rod 14 is provided with a stress inclined plane 17, the bottom of the second base body 2 is provided with a force application inclined plane 18 matched with the stress inclined plane 17, meanwhile, the bottom of the mounting groove 13 is provided with a first inclined plane 19 matched with the force application inclined plane 18, and a second inclined plane 20 matched with the stress inclined plane 17 is arranged in the limiting groove 15.
When installation chip circuit board 4, with 2 case mounting grooves 13 of second base member inside presses, elasticity gag lever post 14 atress is to holding the shrinkage in the hole 16, and elasticity gag lever post 14 takes place to deform, and when second base member 2 removed to elasticity gag lever post 14 and spacing groove 15 and aligns, elasticity gag lever post 14 stretched out, forms the cooperation with spacing groove 15 to realize the fixed of second base member 2, make the bottom surface of second base member 2 tightly support the bottom surface of mounting groove 13. Due to the limiting effect of the elastic limiting rod 14, the second base body 2 cannot be separated from the first base body 1, and the second base body 2 and the first base body 1 are connected firmly.
In addition, in the present invention, the bottom of the second base body 2 may be further provided with a convex portion 21, and the bottom of the mounting groove 13 is provided with a shallow groove 22 adapted to the convex portion 21, so as to further improve the stability of the connection of the second base body 2.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Other technical features than those described in the specification are known to those skilled in the art, and are not described herein in detail in order to highlight the innovative features of the present invention.
Claims (8)
1. A data transmission and receiving device is characterized by comprising a first base body, a second base body, a shell and chip circuit boards, wherein the chip circuit boards are installed on the first base body through the second base body and are fixed with the second base body in a pasting mode, the number of the second base bodies is four, the four second base bodies are respectively positioned at the four corners of the chip circuit boards, and the shell covers the outer portion of the first base body;
the first substrate is provided with a groove on one side facing the chip circuit board, a capillary network is arranged in the groove through a clamping seat, the chip circuit board is arranged on the capillary network on the clamping seat in an overhead mode, the capillary network comprises main capillaries distributed in a matrix mode, so that the main capillaries are of a layered structure with an upper layer and a lower layer, wherein one side close to the chip circuit board is an evaporation layer, and the other side far away from the chip circuit board is a cooling layer;
in the main capillaries in the same layer, a plurality of the main capillaries are parallel to each other and are distributed at equal intervals, and two adjacent main capillaries are connected through a first auxiliary capillary respectively, so that two adjacent main capillaries in the same layer are in a communicated state;
in the main capillaries of the evaporation layer and the cooling layer, two adjacent main capillaries positioned in the same vertical plane are connected through a second auxiliary capillary, so that the main capillaries of the evaporation layer and the cooling layer are in a communicated state;
the main capillary tube is provided with cooling liquid;
the shell is provided with heat dissipation holes for forming convection, and the inner wall of the shell, which is close to one side of the chip circuit board, far away from the capillary network, is fixedly connected with a fan assembly.
2. The data transmission and reception device according to claim 1, wherein a fluid infusion tube is connected to any one of the main capillaries of the cooling layer, the fluid infusion tube extends out of the first substrate, and a fluid infusion port is formed in a side of the first substrate away from the chip circuit board.
3. The data transmitting and receiving device according to claim 2, wherein a return pipe communicating the primary capillary of the evaporation layer and the primary capillary of the cooling layer is further provided at a side portion of the evaporation layer and the cooling layer;
the top of the return pipe extends from the evaporation layer to the end of the chip circuit board.
4. The data transmitting and receiving device according to claim 3, wherein the main capillary, the first auxiliary capillary, the second auxiliary capillary, and the return pipe are metal pipes.
5. The data transmission and reception device according to claim 4, wherein the first base has a mounting groove for mounting the second base, and an elastic stopper is disposed on a side of the mounting groove, and a stopper groove adapted to the elastic stopper is disposed at a bottom of the side of the second base.
6. The data transmission and reception device according to claim 5, wherein the mounting groove has an accommodating hole for accommodating the elastic limiting rod, the elastic limiting rod is inserted into the accommodating hole, and an outer end of the elastic limiting rod is exposed from the accommodating hole and extends into the mounting groove.
7. The data transmission and reception device according to claim 6, wherein the outer end of the elastic limiting rod is provided with a force-bearing inclined surface, and the bottom of the second base body is provided with a force-bearing inclined surface matched with the force-bearing inclined surface;
the bottom of mounting groove be equipped with the first inclined plane of application of force inclined plane adaptation, the spacing inslot be equipped with the second inclined plane of atress inclined plane adaptation.
8. The data transmission and reception device according to claim 7, wherein a bottom of the second base body is provided with a convex portion, and a bottom of the mounting groove is provided with a shallow groove adapted to the convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110937495.0A CN113691268B (en) | 2021-08-16 | 2021-08-16 | Data transmission and receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110937495.0A CN113691268B (en) | 2021-08-16 | 2021-08-16 | Data transmission and receiving device |
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| CN113691268A CN113691268A (en) | 2021-11-23 |
| CN113691268B true CN113691268B (en) | 2023-03-10 |
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| CN202110937495.0A Active CN113691268B (en) | 2021-08-16 | 2021-08-16 | Data transmission and receiving device |
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| US20070262441A1 (en) * | 2006-05-09 | 2007-11-15 | Chi-Ming Chen | Heat sink structure for embedded chips and method for fabricating the same |
| DK3147621T3 (en) * | 2015-09-24 | 2019-10-21 | Abb Schweiz Ag | Cooling device and method for cooling at least two electronic power devices |
| CN108646891A (en) * | 2018-06-11 | 2018-10-12 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic device |
| CN211823012U (en) * | 2019-06-04 | 2020-10-30 | 佛山市中格威电子有限公司 | Heat dissipation type variable frequency air conditioner control panel |
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|---|---|---|---|---|
| CN101252822A (en) * | 2008-04-11 | 2008-08-27 | 北京工业大学 | EHD intensification minitype heat radiating device |
| WO2016079880A1 (en) * | 2014-11-21 | 2016-05-26 | 三菱電機株式会社 | Refrigerator and coolant flow rate control method |
| CN109084605A (en) * | 2018-08-01 | 2018-12-25 | 中国科学技术大学 | A kind of pulsating heat pipe of the non-elbow structure of bringing-up section |
| CN109830776A (en) * | 2019-01-22 | 2019-05-31 | 重庆交通大学 | Thermal management device of battery |
| CN112582147A (en) * | 2019-09-27 | 2021-03-30 | 中车株洲电力机车研究所有限公司 | Cooling device of transformer |
| CN111987055A (en) * | 2020-07-16 | 2020-11-24 | 大同新成新材料股份有限公司 | Semiconductor refrigeration graphene chip |
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| CN113691268A (en) | 2021-11-23 |
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