CN215725355U - Double-layer 3D temperature-uniforming plate and heat dissipation module - Google Patents
Double-layer 3D temperature-uniforming plate and heat dissipation module Download PDFInfo
- Publication number
- CN215725355U CN215725355U CN202120301097.5U CN202120301097U CN215725355U CN 215725355 U CN215725355 U CN 215725355U CN 202120301097 U CN202120301097 U CN 202120301097U CN 215725355 U CN215725355 U CN 215725355U
- Authority
- CN
- China
- Prior art keywords
- temperature
- heat
- heat dissipation
- layer
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the technical field of heat dissipation temperature-uniforming plates, and particularly relates to a double-layer 3D temperature-uniforming plate and a heat dissipation module, wherein the double-layer 3D temperature-uniforming plate comprises a first temperature-uniforming plate, and a first liquid-phase working medium is arranged in the first temperature-uniforming plate; the steam channel is arranged in the heat conduction connecting pipe, the inner wall of the heat conduction connecting pipe is provided with a liquid guiding capillary structure, the first end of the heat conduction connecting pipe extends into the inner cavity of the first temperature equalizing plate, and the steam channel is communicated with the inner cavity of the first temperature equalizing plate; and a second liquid phase working medium is arranged in the second temperature equalizing plate, the second temperature equalizing plate is connected with the second end of the heat-conducting connecting pipe, and the inner cavity of the second temperature equalizing plate is communicated with the steam channel. The utility model realizes high-efficiency heat dissipation, and similarly, the first temperature-equalizing plate and the second temperature-equalizing plate can be simultaneously connected with electronic products needing heat dissipation, thereby meeting the double heat dissipation requirements and the use requirements of users.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation temperature-uniforming plates, and particularly relates to a double-layer 3D temperature-uniforming plate and a heat dissipation module.
Background
The vapor chamber is also a vacuum chamber vapor chamber, and is similar to a heat pipe in principle based on technology, but has a difference in conduction mode. The heat pipe is one-dimensional linear heat conduction, and the heat in the vapor chamber is conducted on a two-dimensional surface, so that the efficiency is higher, and the application range of the vapor chamber is wider due to higher heat conduction efficiency.
When in use, the temperature equalization plate is generally used for electronic products which need small volume or fast heat dissipation, and is mainly used for products such as servers, high-grade graphic cards and the like at present. The uniform temperature plate has become a strong competitor for the heat dissipation method of the heat pipe by virtue of its high heat dissipation performance.
However, the existing temperature equalizing plate has some disadvantages, the temperature equalizing plate on the market can only realize heat dissipation of a single product, when meeting the double heat source and double heat dissipation requirements, the situation that the heat dissipation requirements cannot be met can occur, and then the temperature equalizing plate on the market cannot meet the use requirements of double heat dissipation, and further cannot meet the use requirements of users. Therefore, it is necessary to design a double-layer 3D temperature-uniforming plate and a heat dissipation module.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a double-layer 3D temperature-uniforming plate and a heat dissipation module, and aims to solve the technical problem that the temperature-uniforming plate in the prior art cannot meet the use requirement of double heat dissipation, so that the use requirement of a user cannot be met.
In order to achieve the above object, an embodiment of the present invention provides a double-layer 3D vapor chamber, including:
the first temperature-uniforming plate is internally provided with a first liquid-phase working medium;
the steam channel is arranged in the heat conduction connecting pipe, the inner wall of the heat conduction connecting pipe is provided with a liquid guiding capillary structure, the first end of the heat conduction connecting pipe extends into the inner cavity of the first temperature equalizing plate, and the steam channel is communicated with the inner cavity of the first temperature equalizing plate;
and a second liquid phase working medium is arranged in the second temperature equalizing plate, the second temperature equalizing plate is connected with the second end of the heat-conducting connecting pipe, and the inner cavity of the second temperature equalizing plate is communicated with the steam channel.
Optionally, the both ends of heat conduction connecting pipe are overlapped respectively and are equipped with the positioning sealing ring, the up end of first temperature equalizing plate with the lower terminal surface of second temperature equalizing plate all is equipped with the location lug, the location lug with the positioning sealing ring phase-match sets up, so that two positioning sealing ring and two the back is connected respectively to the location lug, two the positioning sealing ring respectively with the up end of first temperature equalizing plate with the lower terminal surface butt of second temperature equalizing plate.
Optionally, the inside of location sealing ring is equipped with annular joint groove, annular joint groove and location lug phase-match set up so that the location sealing ring with the location lug joint.
Optionally, the heat-conducting connecting pipe includes an external heat pipe and an internal capillary bearing member, the internal capillary bearing member covers the inner wall of the external heat pipe, and the liquid-guiding capillary structure is disposed in the internal capillary bearing member.
Optionally, the number of the heat-conducting connecting pipes is multiple, and each heat-conducting connecting pipe is arranged at equal intervals.
One or more technical solutions in the double-layer 3D temperature-uniforming plate provided in the embodiment of the present invention have at least one of the following technical effects:
when the double-layer 3D temperature equalizing plate is used, the first temperature equalizing plate can be connected with an electronic product needing heat dissipation, the heat of the electronic product is dissipated to the first temperature equalizing plate, the first liquid-phase working medium is evaporated to convert the first liquid-phase working medium from the liquid-phase working medium into the gas-phase working medium, the gas-phase working medium is diffused and circulated to the second temperature equalizing plate through the steam channel, the gas-phase working medium is converted into the liquid-phase working medium when meeting cold in the process of passing through the steam channel and in the process of contacting with the second liquid-phase working medium in the second temperature equalizing plate, the reconverted liquid-phase working medium flows back to the inner cavity of the first temperature equalizing plate from the liquid guide capillary structure, and efficient heat dissipation is realized through the state conversion of the liquid-phase working medium and the cooperative use of the steam channel and the liquid guide capillary structure in the heat conduction connecting pipe, and the first temperature equalizing plate and the second temperature equalizing plate can be simultaneously connected with the electronic product needing heat dissipation, and then satisfy two heat dissipation demands, satisfy user's user demand.
In order to achieve the above object, an embodiment of the present invention provides a double-layer 3D temperature-uniforming plate heat dissipation module, including the double-layer 3D temperature-uniforming plate.
Optionally, double-deck 3D temperature-uniforming plate heat dissipation module still includes two backup pads, two the both ends of backup pad respectively with the up end of first temperature-uniforming plate with the lower terminal surface of second temperature-uniforming plate is connected, two the backup pad is laminated mutually and is surrounded the heat conduction connecting pipe sets up.
Optionally, the first side surfaces of the two support plates are provided with an embedding groove, and the embedding groove is matched with the heat-conducting connecting pipe, so that the heat-conducting connecting pipe is embedded in the embedding groove.
Optionally, the double-layer 3D temperature-uniforming plate heat dissipation module further includes a plurality of heat dissipation fins, two ends of each heat dissipation fin are respectively connected to the upper end surface of the first temperature-uniforming plate and the lower end surface of the second temperature-uniforming plate, and at least one of the heat dissipation fins is respectively connected to the second side surfaces of the two support plates.
One or more technical solutions in the double-layer 3D temperature-uniforming plate heat dissipation module provided in the embodiments of the present invention at least have one of the following technical effects:
the double-layer 3D temperature-uniforming plate heat dissipation module comprises the double-layer 3D temperature-uniforming plate, so that the double-layer 3D temperature-uniforming plate heat dissipation module realizes high-efficiency heat dissipation through the state conversion of a liquid-phase working medium and the cooperative use of a steam channel and a liquid guide capillary structure in the heat conduction connecting pipe.
In order to achieve the above object, an embodiment of the present invention provides a method for manufacturing a double-layer 3D vapor chamber heat dissipation module, where the method includes the following steps:
step S100: providing a first temperature-equalizing plate, and injecting a first liquid-phase working medium into an inner cavity of the first temperature-equalizing plate;
step S200: providing a heat-conducting connecting pipe, arranging a steam channel in the heat-conducting connecting pipe, and arranging a liquid-guiding capillary structure on the inner wall of the heat-conducting connecting pipe;
step S300: extending the first end of the heat-conducting connecting pipe into the inner cavity of the first temperature-uniforming plate, and communicating the steam channel with the inner cavity of the first temperature-uniforming plate;
step S400: providing a second temperature-uniforming plate, and injecting a second liquid-phase working medium into an inner cavity of the second temperature-uniforming plate;
step S500: and connecting the second temperature-equalizing plate with the second end of the heat-conducting connecting pipe, and communicating the inner cavity of the second temperature-equalizing plate with the steam channel.
One or more technical solutions in the method for manufacturing a double-layer 3D temperature-uniforming plate heat dissipation module provided by the embodiment of the present invention at least have one of the following technical effects:
the manufacturing method of the double-layer 3D temperature-uniforming plate heat dissipation module is used for manufacturing the double-layer 3D temperature-uniforming plate heat dissipation module comprising the double-layer 3D temperature-uniforming plate, so that the manufactured double-layer 3D temperature-uniforming plate heat dissipation module also has the advantages of meeting double heat dissipation requirements and user requirements.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic overall structure diagram of a double-layer 3D vapor chamber according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a double-layered 3D vapor chamber according to an embodiment of the present invention;
fig. 3 is an exploded view of a double-layered 3D vapor chamber according to an embodiment of the present invention;
FIG. 4 is a schematic view of an overall structure of a positioning seal ring according to an embodiment of the present invention;
fig. 5 is a schematic perspective view of a dual-layer 3D temperature-uniforming plate heat dissipation module according to an embodiment of the present invention;
fig. 6 is an exploded view of a dual-layer 3D vapor chamber heat dissipation module according to an embodiment of the present invention;
fig. 7 is a schematic diagram illustrating a disassembled state of the supporting plate and the heat-conducting connecting pipe according to the embodiment of the present invention;
fig. 8 is a schematic flow chart illustrating a method for manufacturing a dual-layer 3D vapor chamber heat dissipation module according to an embodiment of the present invention;
fig. 9 is a schematic flow chart illustrating a method for manufacturing a dual-layer 3D thermal module according to another embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
100. a first vapor chamber; 130. positioning the bump;
200. a heat-conducting connecting pipe; 210. an external heat pipe; 220. an internal capillary support; 221. an annular clamping groove; 230. positioning the sealing ring; 240. a steam channel;
300. a second temperature equalization plate;
400. a support plate; 410. a clamping groove;
500. and heat dissipation fins.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the embodiments of the present invention, and should not be construed as limiting the utility model.
In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
In one embodiment of the present invention, as shown in fig. 1 to 4, a double-layered 3D vapor chamber is provided, which includes a first vapor chamber 100, a thermally conductive connecting tube 200, and a second vapor chamber 300.
Wherein, a first liquid phase working medium is arranged in the first temperature-uniforming plate 100. Specifically, the first liquid-phase working medium is injected into the first temperature equalization plate 100 in advance. The first liquid-phase working medium is evaporated and converted into a gas-phase working medium when being heated, and the gas-phase working medium is condensed and reconverted into the first liquid-phase working medium of a liquid phase when being cooled.
A steam channel 240 is arranged inside the heat-conducting connecting pipe 200, a liquid-guiding capillary structure (not shown) is arranged on the inner wall of the heat-conducting connecting pipe 200, the first end of the heat-conducting connecting pipe 200 extends into the inner cavity of the first temperature-uniforming plate 100, and the steam channel 240 is communicated with the inner cavity of the first temperature-uniforming plate 100. Specifically, the steam channel 240 is used for circulating the gas-phase working medium when the first liquid-phase working medium is heated and evaporated to be converted into the gas-phase working medium. The liquid guide capillary structure is used for generating a capillary phenomenon, namely the first liquid-phase working medium is adsorbed to the liquid guide capillary structure through a capillary action.
A second liquid phase working medium is arranged in the second temperature equalizing plate 300, the second temperature equalizing plate 300 is connected with the second end of the heat conducting connecting pipe 200, and the inner cavity of the second temperature equalizing plate 300 is communicated with the steam channel 240. The second liquid-phase working medium can also be adsorbed to the liquid guiding capillary structure under the action of the liquid guiding capillary structure, and then the heat-conducting connecting pipe 200 is respectively communicated to the inner cavities of the first uniform temperature plate 100 and the second uniform temperature plate 300, so that the inner cavities of the first uniform temperature plate 100 and the second uniform temperature plate 300 are communicated, that is, the first liquid-phase working medium and the second liquid-phase working medium are communicated through the liquid guiding capillary structure, and no matter the first uniform temperature plate 100 and the second uniform temperature plate 300 need heat dissipation, the quick and efficient heat dissipation can be realized through the quick interaction circulation of the liquid-phase working medium, and the heat dissipation requirement of a dual heat source is met.
Specifically, when the double-layer 3D temperature-uniforming plate of the present invention is used, the first temperature-uniforming plate 100 may be connected to an electronic product to be cooled, heat of the electronic product is dissipated to the first temperature-uniforming plate 100, and the first liquid-phase working medium is evaporated, so that the first liquid-phase working medium is converted from a liquid-phase working medium to a gas-phase working medium, the gas-phase working medium is diffused and circulated to the second temperature-uniforming plate 300 through the steam channel 240, and is converted into a liquid-phase working medium when cooled during passing through the steam channel 240 and contacting with the second liquid-phase working medium in the second temperature-uniforming plate 300, the reconverted liquid-phase working medium flows back to the inner cavity of the first temperature-uniforming plate 100 from the liquid-guiding capillary structure, and further high-efficiency heat dissipation is achieved by state conversion of the liquid-phase working medium and cooperative use of the steam channel 240 and the liquid-guiding capillary structure in the heat-conducting connecting pipe 200, and the same principle, the first temperature equalizing plate 100 and the second temperature equalizing plate 300 can be simultaneously connected with electronic products needing heat dissipation, so that double heat dissipation requirements are met, and the use requirements of users are met.
In another embodiment of the present invention, as shown in fig. 1 to 4, two ends of the heat conducting connecting pipe 200 are respectively sleeved with a positioning sealing ring 230, the upper end surface of the first temperature uniforming plate 100 and the lower end surface of the second temperature uniforming plate 300 are respectively provided with a positioning protrusion 130, the positioning protrusion 130 is matched with the positioning sealing ring 230, so that after the two positioning sealing rings 230 are respectively connected with the two positioning protrusions 130, the two positioning sealing rings 230 are respectively abutted against the upper end surface of the first temperature uniforming plate 100 and the lower end surface of the second temperature uniforming plate 300. Specifically, when the positioning sealing ring 230 is used in cooperation with the positioning protrusion 130, the heat conductive connecting pipe 200 is convenient to mount. During installation, the positioning sealing ring 230 is firstly sleeved on the heat-conducting connecting pipe 200, then the heat-conducting connecting pipe 200 is inserted into the first temperature equalizing plate 100 and the second temperature equalizing plate 300, and then the positioning sealing ring 230 is connected with the positioning lug 130, so that connection can be completed, convenience and rapidness are realized, labor cost is saved, the overall production cost is reduced, and the production efficiency is improved.
In addition, the positioning sealing ring 230 also has a sealing function. The positioning sealing ring 230 is connected with the positioning bump 130, so that the positioning sealing ring 230 seals the joint of the heat-conducting connecting pipe 200 and the first uniform temperature plate 100 and the second uniform temperature plate 300, seamless connection is realized, working media in the heat dissipation process of the uniform temperature plates do not leak, the safety performance is improved, the heat dissipation efficiency is improved, and the use requirements of users are met.
In another embodiment of the present invention, after the positioning sealing ring 230 is connected to the positioning protrusion 130, the positioning sealing ring 230 after welding may be a welded sealing ring (not shown), it can be understood that the welded sealing ring is a welding ring, and the heat conducting connecting pipe 200 is connected to the first temperature equalizing plate 100 and the second temperature equalizing plate 300 more stably and better in sealing performance by welding, so as to solve a liquid leakage phenomenon frequently occurring when the temperature equalizing plates are connected to a heat pipe in the market, and have a very high practicability.
In another embodiment of the present invention, as shown in fig. 2 to 4, an annular clamping groove 221 is formed inside the positioning sealing ring 230, and the annular clamping groove 221 is matched with the positioning protrusion 130 to clamp the positioning sealing ring 230 to the positioning protrusion 130. Specifically, through setting up annular joint groove 221, make the convenience the location sealing ring 230 with the connection of location lug 130, convenient operation promotes production efficiency.
In another embodiment of the present invention, as shown in fig. 2 to 3, the heat conductive connection tube 200 includes an external heat pipe 210 and an internal capillary bearing 220, the internal capillary bearing 220 covers an inner wall of the external heat pipe 210, and the liquid guiding capillary structure is disposed in the internal capillary bearing 220. Specifically, by providing the heat conductive connection pipe 200 as the external heat pipe 210 and the internal capillary bearing 220, the heat conductive connection pipe 200 has both a protective function and a high-efficiency heat dissipation function. Specifically, the external heat pipe 210 has a protection function, i.e. protects the internal capillary bearing 220, i.e. protects the liquid guiding capillary structure on the internal bearing, and in addition, the external heat pipe 210 can also absorb heat, i.e. has a heat dissipation function. The internal capillary bearing member 220 has a high-efficiency heat dissipation function, and the flow of the working medium is accelerated through the liquid guiding capillary structure borne by the internal capillary bearing member, so that high-efficiency and quick heat dissipation is realized.
Further, the space inside the external heat pipe 210 excluding the capillary bearing is the vapor channel 240. The channel volume of the vapor channel 240 is much larger than the volume of the inner capillary bearing 220. Therefore, after the liquid-phase working medium is heated and converted into the gas-phase working medium, the liquid-phase working medium can be diffused along the steam channel 240 more quickly, so that more efficient diffusion is realized, and the heat dissipation efficiency is improved.
In another embodiment of the present invention, the number of the heat-conductive connection pipes 200 is multiple, and each of the heat-conductive connection pipes 200 is disposed at equal intervals. Specifically, by providing a plurality of heat-conducting connecting pipes 200, each heat-conducting connecting pipe 200 can dissipate heat at the same time, thereby improving the heat dissipation efficiency.
In another embodiment of the present invention, as shown in fig. 1 to 7, an embodiment of the present invention further provides a double-layer 3D temperature-uniforming plate heat dissipation module, including the double-layer 3D temperature-uniforming plate.
In another embodiment of the present invention, as shown in fig. 5 to 7, the double-layer 3D temperature-uniforming plate heat dissipation module further includes two support plates 400, two ends of the two support plates 400 are respectively connected to the upper end surface of the first temperature-uniforming plate 100 and the lower end surface of the second temperature-uniforming plate 300, and the two support plates 400 are attached to each other and surround the heat-conducting connecting pipe 200. Specifically, the supporting plate 400 plays a role of supporting the first temperature equalizing plate 100 and the second temperature equalizing plate 300 on the one hand, so that the stability of the overall structure is realized, and the service life of the product is prolonged.
On the other hand backup pad 400 still has the parcel and lives heat conduction connecting pipe 200's effect, through two backup pad 400 parcel heat conduction connecting pipe 200 makes heat conduction connecting pipe 200 lateral surface all with heat conduction connecting pipe 200 contacts, makes heat conduction connecting pipe 200's heat transmits extremely high-efficiently backup pad 400, and then realizes thermal high-efficient diffusion, promotes the radiating efficiency.
In another embodiment of the present invention, as shown in fig. 7, the first side surfaces of the two support plates 400 are respectively provided with a clamping groove 410, and the clamping groove 410 is matched with the heat-conducting connecting pipe 200, so that the heat-conducting connecting pipe 200 is clamped in the clamping groove 410. Specifically, through the setting of the caulking groove 410, it is convenient that the supporting plate 400 is provided with the heat conduction connecting pipe 200 in a wrapping manner, and the heat dissipation efficiency is improved.
In another embodiment of the present invention, as shown in fig. 6, the dual-layer 3D temperature-uniforming plate heat dissipation module further includes a plurality of heat dissipation fins 500, two ends of each heat dissipation fin 500 are respectively connected to the upper end surface of the first temperature-uniforming plate 100 and the lower end surface of the second temperature-uniforming plate 300, and at least one heat dissipation fin 500 of each heat dissipation fin 500 is respectively connected to the second side surfaces of the two support plates 400. Specifically, by providing a plurality of heat dissipation fins 500 and connecting at least one of the heat dissipation fins 500 to the second side surfaces of the two support plates 400, the two support plates 400 seamlessly transfer the heat of the heat conduction connecting tube 200 to the heat dissipation fins 500, thereby achieving efficient heat dissipation.
On the other hand, the connection surfaces of the two support plates 400 and the heat dissipation fins 500 are flat and smooth. At this time, the support plate 400 wraps the heat-conducting connection pipe 200 through the caulking groove 410 on one side surface, and the support plate 400 is further connected with the heat-radiating fins 500 through a smooth surface, so that efficient heat radiation is realized. Compared with the design without the supporting plate 400, the supporting plate 400 fills up the gaps between the heat dissipation fins 500 and the heat conduction connecting pipe 200, thereby improving the heat dissipation efficiency.
Further, compared with the prior art that the production cost is increased by modifying the heat-radiating fins 500 in order to realize the seamless connection between the heat-radiating fins 500 and the heat-conducting connecting pipe 200, and the modified heat-radiating fins 500 have poor stability in use due to structural modification, the heat-conducting connecting pipe 200 and the heat-radiating fins 500 are seamless and efficient in heat conduction and heat radiation by arranging the supporting plate 400, the stability of the product structure is further improved, and the service life of a heat-radiating product is greatly prolonged.
The double-layer 3D temperature-uniforming plate heat dissipation module comprises the double-layer 3D temperature-uniforming plate, so that the double-layer 3D temperature-uniforming plate heat dissipation module realizes high-efficiency heat dissipation through the state conversion of the liquid-phase working medium and the cooperative use of the steam channel 240 and the liquid guide capillary structure in the heat conduction connecting pipe 200.
In another embodiment of the present invention, as shown in fig. 8 to 9, an embodiment of the present invention further provides a method for manufacturing a dual-layer 3D vapor chamber heat dissipation module, where the method includes the following steps:
step S100: providing a first temperature-uniforming plate 100, and injecting a first liquid-phase working medium into an inner cavity of the first temperature-uniforming plate 100;
step S200: providing a heat conduction connecting pipe 200, arranging a steam channel 240 in the heat conduction connecting pipe 200, and arranging a liquid guide capillary structure on the inner wall of the heat conduction connecting pipe 200;
specifically, the steam channel 240 provided in this step is circular, so as to increase the circulation rate of the gas-phase working medium, and increase the heat dissipation efficiency and effect.
Step S300: extending a first end of the heat-conducting connecting pipe 200 into the inner cavity of the first temperature-uniforming plate 100, and communicating the steam channel 240 with the inner cavity of the first temperature-uniforming plate 100;
step S400: providing a second temperature-uniforming plate 300, and injecting a second liquid-phase working medium into an inner cavity of the second temperature-uniforming plate 300;
step S500: the second temperature equalization plate 300 is connected to the second end of the heat conductive connection pipe 200, and the inner cavity of the second temperature equalization plate 300 is communicated with the steam channel 240.
Specifically, the method for manufacturing the double-layer 3D temperature-uniforming plate heat dissipation module is used for manufacturing the double-layer 3D temperature-uniforming plate heat dissipation module comprising the double-layer 3D temperature-uniforming plate, so that the manufactured double-layer 3D temperature-uniforming plate heat dissipation module also has the advantages of meeting double heat dissipation requirements and user requirements.
In another embodiment of the present invention, as shown in fig. 9, the manufacturing method further includes the steps of:
step S610: providing two supporting plates 400, connecting two ends of the two supporting plates 400 with the upper end surface of the first temperature equalizing plate 100 and the lower end surface of the second temperature equalizing plate 300 respectively, and simultaneously attaching the two supporting plates 400 to and surrounding the heat conducting connecting pipe 200.
Specifically, by providing two support plates 400, the heat of the heat conductive connection pipe 200 can be efficiently transmitted while supporting.
Step S620: providing a plurality of heat dissipation fins 500, connecting two ends of each heat dissipation fin 500 with the upper end surface of the first temperature equalizing plate 100 and the lower end surface of the second temperature equalizing plate 300, and connecting at least one heat dissipation fin 500 of each heat dissipation fin 500 with the second side surfaces of the two support plates 400.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A double-layer 3D vapor chamber, comprising:
the first temperature-uniforming plate is internally provided with a first liquid-phase working medium;
the steam channel is arranged in the heat conduction connecting pipe, the inner wall of the heat conduction connecting pipe is provided with a liquid guiding capillary structure, the first end of the heat conduction connecting pipe extends into the inner cavity of the first temperature equalizing plate, and the steam channel is communicated with the inner cavity of the first temperature equalizing plate;
and a second liquid phase working medium is arranged in the second temperature equalizing plate, the second temperature equalizing plate is connected with the second end of the heat-conducting connecting pipe, and the inner cavity of the second temperature equalizing plate is communicated with the steam channel.
2. The double-layer 3D temperature-uniforming plate according to claim 1, wherein two ends of the heat-conducting connecting pipe are respectively sleeved with a positioning sealing ring, the upper end surface of the first temperature-uniforming plate and the lower end surface of the second temperature-uniforming plate are respectively provided with a positioning bump, and the positioning bumps are matched with the positioning sealing rings, so that after the two positioning sealing rings are respectively connected with the two positioning bumps, the two positioning sealing rings are respectively abutted against the upper end surface of the first temperature-uniforming plate and the lower end surface of the second temperature-uniforming plate.
3. The double-layer 3D temperature-uniforming plate according to claim 2, wherein an annular clamping groove is formed in the positioning sealing ring, and the annular clamping groove and the positioning bump are matched so that the positioning sealing ring and the positioning bump are clamped.
4. The dual-layer 3D vapor chamber according to claim 1, wherein the thermally conductive connection tube comprises an external heat pipe and an internal capillary bearing, the internal capillary bearing is disposed on an inner wall of the external heat pipe, and the liquid-guiding capillary structure is disposed in the internal capillary bearing.
5. The double-layer 3D temperature-uniforming plate according to any one of claims 1 to 4, wherein the number of the heat-conducting connecting pipes is multiple, and the heat-conducting connecting pipes are arranged at equal intervals.
6. A double-layer 3D vapor chamber heat dissipation module, comprising the double-layer 3D vapor chamber of any one of claims 1-5.
7. The dual-layer 3D vapor chamber heat dissipation module according to claim 6, further comprising two supporting plates, wherein two ends of the two supporting plates are respectively connected to the upper end surface of the first vapor chamber and the lower end surface of the second vapor chamber, and the two supporting plates are attached to and surround the heat conductive connecting pipe.
8. The dual-layer 3D vapor chamber heat dissipation module according to claim 7, wherein the first side surfaces of the two support plates are respectively provided with an insertion groove, and the insertion grooves are matched with the heat conductive connection pipes, so that the heat conductive connection pipes are inserted into the insertion grooves.
9. The dual-layer 3D vapor chamber heat dissipation module of claim 7, further comprising a plurality of heat dissipation fins, wherein two ends of each heat dissipation fin are respectively connected to the upper end surface of the first vapor chamber and the lower end surface of the second vapor chamber, and at least one of the heat dissipation fins is respectively connected to the second side surfaces of the two support plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120301097.5U CN215725355U (en) | 2021-02-02 | 2021-02-02 | Double-layer 3D temperature-uniforming plate and heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120301097.5U CN215725355U (en) | 2021-02-02 | 2021-02-02 | Double-layer 3D temperature-uniforming plate and heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215725355U true CN215725355U (en) | 2022-02-01 |
Family
ID=80012024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120301097.5U Active CN215725355U (en) | 2021-02-02 | 2021-02-02 | Double-layer 3D temperature-uniforming plate and heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215725355U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI843657B (en) | 2023-01-10 | 2024-05-21 | 雙鴻科技股份有限公司 | Heat dissipation device |
-
2021
- 2021-02-02 CN CN202120301097.5U patent/CN215725355U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI843657B (en) | 2023-01-10 | 2024-05-21 | 雙鴻科技股份有限公司 | Heat dissipation device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2019166241A1 (en) | Watercold plate for battery module | |
| KR20150076173A (en) | Battery cell assembly and method for manufacturing cooling fin for battery cell assembly | |
| CN108028324A (en) | Cooling fins for battery cooling circuit | |
| CN209930821U (en) | Liquid-cooled heat conduction block and water-cooled radiator | |
| WO2023010836A1 (en) | Heat dissipation module and electronic device | |
| CN112781420A (en) | Double-layer 3D temperature-uniforming plate, heat dissipation module and manufacturing method of heat dissipation module | |
| CN110943058B (en) | Heat radiator | |
| CN111755775A (en) | Battery cold plate, battery box and battery pack | |
| CN215725355U (en) | Double-layer 3D temperature-uniforming plate and heat dissipation module | |
| CN109219305A (en) | A kind of Liquid cooling chasis and its plug-in unit | |
| CN111312940A (en) | Device based on battery package thermal design | |
| CN210014478U (en) | Radiator, air condensing units and air conditioner | |
| CN216960588U (en) | Heat dissipation device and electronic equipment | |
| CN110149784A (en) | Radiating subassembly and electronic equipment | |
| CN113675494B (en) | Heat pipe fin type cooling structure applied to power battery module | |
| CN213073423U (en) | Radiator, air conditioner frequency converter with radiator and electronic equipment | |
| CN111613422B (en) | Wireless charging seat | |
| CN212625778U (en) | Battery cold plate, battery box and battery pack | |
| CN110864574A (en) | Novel loop heat pipe without compensation cavity and using method thereof | |
| CN102802377A (en) | Radiator equipped with parallel heat tubes and manufacturing method of radiator | |
| CN111615310A (en) | Heat pipe and self-radiating connector | |
| CN211451990U (en) | Novel loop heat pipe without compensation cavity | |
| CN112911028A (en) | Temperature equalization plate, terminal equipment and manufacturing method of temperature equalization plate | |
| CN214155169U (en) | Radiator, air conditioner frequency converter with same and electronic equipment | |
| CN219741077U (en) | Heat radiation module and immersed liquid-cooled electronic equipment with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |