CN113684469B - Organic protective coating for electronic device and preparation method thereof - Google Patents
Organic protective coating for electronic device and preparation method thereof Download PDFInfo
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- CN113684469B CN113684469B CN202110904261.6A CN202110904261A CN113684469B CN 113684469 B CN113684469 B CN 113684469B CN 202110904261 A CN202110904261 A CN 202110904261A CN 113684469 B CN113684469 B CN 113684469B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F120/10—Esters
- C08F120/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F120/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G83/00—Macromolecular compounds not provided for in groups C08G2/00 - C08G81/00
Abstract
The invention relates to the technical field of organic coating, in particular to an organic protective coating for an electronic device and a preparation method thereof. The organic protective coating is obtained by polymerization reaction of a monomer composition comprising a monomer A and a monomer B on the surface of an electronic device; the monomer A is one or more of olefin monomers containing ethylene double bond and isocyanate group; the main chain of the monomer B is one of a saturated carbon chain main chain, a saturated hetero chain main chain or a main chain containing benzene rings; the end group of the monomer B is two or more amino groups or two or more hydroxyl groups. The preparation method is green and environment-friendly, the obtained plating layer has smooth surface, can realize conformal coverage with a substrate, has good light transmission performance, and can not shade light sensing components so as to influence the service performance; the water-oxygen barrier property of the plating layer is good, the oxygen permeability is low, the inhibition rate of electrochemical corrosion is high, and the circuit board can be effectively prevented from being corroded under the combined action of water and oxygen or short circuit caused by water contacting the circuit board.
Description
Technical Field
The invention relates to the technical field of organic coating, in particular to an organic protective coating for an electronic device and a preparation method thereof.
Background
In recent years, electronic devices such as smart wearable devices, smart phones, outdoor electronic facilities, and the like have been rapidly developed due to their excellent convenience and practicality. Such devices are often exposed to the external environment for a long period of time and are subject to water immersion and environmental corrosion during use, and if the waterproof performance is poor, these electronic devices are very susceptible to damage. The requirements for the waterproof performance of the equipment, which is partially exposed to the outdoor and is easily affected by the natural environment, are higher.
Therefore, the electronic equipment can be protected from damage caused by rain environment or electrochemical corrosion by high-performance protection, so that the quality of the product is ensured to prolong the service life of the equipment.
With the development of current electronic products, the trend of flexibility and portability is gradually that the conventional barrier films adopted in the current routine have not been suitable. The traditional inorganic barrier film has excellent effects in the aspects of water resistance, water vapor and gas barrier, but the poor flexibility of the inorganic film makes the stressed bending extremely easy to damage, and the damage limits the application to the period of electronic equipment, so that the electronic equipment cannot be effectively protected for a long time.
Therefore, a polymer-based plating layer having high flexibility and high light transmittance becomes a direction for protecting electronic equipment and related devices, and is also a desirable means, especially for use in devices having photosensitive elements, where good light transmittance is required. This requires that the barrier protective coating have excellent water-oxygen barrier properties and, in the case of electrochemical corrosion, good resistance to electrochemical corrosion. However, not all polymer-based coatings can be used for protection of electronic products. Common polymer-based materials are often accompanied by high gas permeability due to high molecular chain flexibility and steric hindrance effect, and are unfavorable for application in the field of electronic device protection.
In response to the problems associated with conventional inorganic barrier films and existing less than ideal polymer-based coatings, improvements are needed to accommodate the actual needs.
Disclosure of Invention
The invention aims to solve the problems, provide an organic protective coating for an electronic device, which has good light transmission performance, good water-oxygen barrier performance and excellent electrochemical corrosion resistance, and also provide a corresponding preparation method.
The preparation method is to construct a compact organic cross-linking network protective layer through in-situ polymerization, and the combination of free radical polymerization and condensation polymerization is beneficial to improving the protective effect on electronic devices by improving the cross-linking degree and compactness of the protective layer.
The technical scheme adopted for solving the technical problems is as follows:
an organic protective coating for an electronic device, the organic protective coating being obtained by polymerization of a monomer composition comprising a monomer a and a monomer B on the surface of the electronic device; wherein, the liquid crystal display device comprises a liquid crystal display device,
the monomer A is one or more of olefin monomers containing ethylene double bond and isocyanate group;
the main chain of the monomer B is one of a saturated carbon chain main chain, a saturated hetero chain main chain or a main chain containing benzene rings;
the end group of the monomer B is two or more amino groups or two or more hydroxyl groups.
Unlike the usual radical polymerization in the preparation of polymers, in this component system, in addition to the radical polymerization of monomer A itself, the isocyanate groups in monomer A and the amino or hydroxyl groups in monomer B can undergo a polycondensation reaction of high reactivity, which is advantageous for the formation of a higher degree of crosslinking of the polymer. Along with the simultaneous free radical polymerization of the monomer A and the polycondensation reaction of the monomer A and the monomer B on the surface of the circuit board, the coating has excellent rigidity, and prevents water and oxygen from penetrating through the polymer to reach the surface of the substrate and the substrate material to generate oxidation-reduction reaction so as to corrode and damage the substrate.
Further, when the monomer A and the monomer B are polymerized, the molar ratio of the monomer A to the monomer B is 5:1-1:5.
From the viewpoint of improving the crosslinking degree and the monomer utilization ratio, it is further preferable that the molar ratio of the monomer A to the monomer B is 1:1.5 to 1.5:1, more preferably 1.25:1, and the molar ratio of the monomer A to the monomer B is in this range, contributing to the construction of a stable and dense crosslinked network barrier layer.
Further, monomer A is isocyanatoethyl methacrylate, a polyisocyanate methacrylate or p-isocyanatostyrene.
Further, with respect to the monomer B,
when the main chain of the monomer B is a saturated carbon chain main chain, the monomer B is hexamethylenediamine, hexanediol or trihexylamine;
when the main chain of the monomer B is a saturated hetero chain main chain, the monomer B is diethylene glycol di (3-aminopropyl) ether, 2, 3-tetrafluoro-1, 4-butanediol or 2- (butylamino) ethylamine;
when the main chain of the monomer B is the main chain containing benzene rings, the monomer B is p-phenylenediamine, 2,3,5, 6-tetramethyl-1, 4-phenylenediamine, resorcinol or 2, 3-dihydroxybenzoic acid methyl ester.
In view of the water-oxygen barrier property and electrochemical corrosion resistance of the coating, the chemical stability of the polymer coating needs to be improved by higher reactivity and chain segment rigidity, preferably, the monomer B has a main chain of one of a saturated carbon chain main chain or a main chain containing benzene rings, and the terminal group of the monomer B is two or more amino groups.
Considering that the crosslinking between molecular chains is more favorable for improving the water-oxygen barrier property and the electrochemical corrosion resistance of the coating, and the chain segment length influences the crosslinking degree due to the steric hindrance effect in the crosslinking process, the monomer B is more preferably saturated carbon chains, and the carbon chain length of the monomer B is more than 4.
Based on the aspects of environmental protection and improvement of the uniformity of the coating, the invention also provides a technical route for preparing the protective coating of the electronic device in a full-dry mode: the initiating chemical vapor deposition method is a combination and improvement of hot filament chemical vapor deposition and free radical polymerization, and is a novel green vacuum coating method. The polymer film is formed on the substrate by free radical reaction in a gas phase environment, which is a green and heat-preserving polymer film plating technology, so that the copolymerization mode of the monomer composition is preferably an initiating chemical vapor deposition method. In particular, unlike the prior art in which the gases are previously mixed and then introduced into the chamber, the constituent gases are particularly required to be introduced separately and then mixed in the chamber due to the self-crosslinking activity between the monomers.
The preparation method of the organic protective coating comprises the following steps: firstly, heating and gasifying a monomer A, a monomer B and an initiator respectively, respectively introducing the monomers A, the monomer B and the initiator into a cavity in a vacuum state through different pipelines, and uniformly mixing the monomers A, the monomer B and the initiator after entering the cavity.
And introducing the gasified monomer A, the gasified monomer B and the gasified initiator from different air inlets respectively, uniformly mixing in the cavity, and adjusting the vacuum degree in the reaction cavity to 200-800mtorr.
Further, introducing a monomer, then introducing an initiator gasified at room temperature, heating the nichrome wire in the cavity to 180-250 ℃ in the cavity, and growing a film on a substrate with the temperature of 10-50 ℃ to obtain the organic protective coating. The temperature of the matrix is controlled to be 10-50 ℃ and the film with the thickness of 500-1000nm is grown.
Further, the matrix is a metal, a polymer material or an inorganic material.
Further, at 25 ℃, the saturated vapor pressure of the monomer A and the monomer B is 0.01mmHg to 4mmHg.
The base material of the barrier layer is not particularly limited, and may be a metal, a polymer material, an electronic device, or the like, since the production environment is mild and no solvent is introduced.
Aiming at the method, the monomer is conveniently gasified and then is input into the cavity, and the following steps are selected: at 25 ℃, the saturated vapor pressure of the monomer A and the monomer B is 0.01 mmHg-4 mmHg.
The beneficial effects of the invention are as follows:
(1) The preparation method is green and environment-friendly, the surface of the plating layer is smooth, conformal coverage can be realized with the substrate, and the light transmittance is good, so that the light sensing components are not shielded, and the service performance is not influenced;
(2) Good water-oxygen barrier property and oxygen permeability as low as 5.8X10 -13 cm 3 cm/cm 2 The inhibition rate of s cm Hg to electrochemical corrosion reaches 99.3 percent. The circuit board can be effectively prevented from being corroded under the combined action of water and oxygen or short circuit caused by water contacting the circuit board.
Drawings
FIG. 1 is an infrared spectrum of the protective coating obtained in example 2.
Fig. 2 is a light transmittance test chart of the protective coating obtained in example 2.
FIG. 3 is a graph showing the electrochemical corrosion resistance of the protective coating obtained in example 2.
Fig. 4 is a water resistance test chart of the protective coating obtained in example 2.
Detailed Description
Representative embodiments based on the drawings will now be further refined. The following description is not intended to limit the embodiment to one preferred embodiment, but is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the embodiments as defined by the appended claims.
The invention provides an organic protective coating for electronic devices, which is obtained by polymerizing an organic composition comprising a monomer A and a monomer B on the surface of a substrate.
Example 1:
monomer A is ethyl methacrylate (hereinafter referred to as IEM), monomer B is 1, 6-hexamethylenediamine (hereinafter referred to as HEA), di-tert-butyl peroxide is used as an initiator, and polished copper sheets and integrated circuit boards are used as substrates.
In the film plating process, an integrated circuit board and a copper sheet are taken as base materials to be placed on a sample table in a cavity, and the temperature of the sample table is controlled to be 10-50 ℃. And (3) starting a vacuum pump to vacuumize the cavity, respectively heating the heating monomers IEM and HEA to 65 ℃ and 50 ℃ for vaporization, regulating the flow through a needle valve, and then introducing the heated monomers IEM and HEA into the cavity. Wherein the IEM flow is controlled to be 0.4sccm; HEA flow rate of 0.8sccm; and gasifying the di-tert-butyl peroxide under the condition of room temperature, introducing the di-tert-butyl peroxide into the cavity, controlling the flow to be 0.7sccm, keeping the vacuum degree of the reaction cavity to be 300-500 mtorr, controlling the temperature of the heating wire in the reaction cavity to be 180-250 ℃, controlling the substrate temperature to be 42 ℃, and depositing for about 40min, wherein the thickness of the coating is about 800nm.
Tests show that the organic protective coating of the electronic device obtained in the example 1 has an electrochemical corrosion inhibition rate of 78% on metals in a 3.5% NaCl solution. The surface of the alloy has a certain metal anti-corrosion effect, and the surface is found to have larger particles by an electron scanning microscope, so that the surface is too rough caused by too fast self-crosslinking reaction of HEA and IEM due to excessive HEA is judged, and therefore partial void channels are generated.
Example 2:
the monomer A is IEM, the monomer B is HEA, the di-tert-butyl peroxide is used as an initiator, and the polished copper sheet and the integrated circuit board are used as base materials.
Controlling IEM flow to be 0.4sccm; HEA flow rate of 0.3sccm; other preparation processes are the same as above.
As shown in FIG. 1, the high crosslinking degree polymer coating prepared in example 2 was characterized by infrared spectroscopic analysis, and p (IEM-co-HEA) was found to be 275cm -1 The characteristic peak at the position belongs to an asymmetric stretching vibration peak of an isocyanate group (-N=C=O) special for IEM, and the peak area of the isocyanate group (-N=C=O) in pIEM prepared by the same initiating chemical vapor deposition method is greatly reduced after normalization treatment. At the same time p (IEM-co-HEA) at 1550cm -1 And 1667cm-1 exhibit bending vibration absorption peaks for-NH and-CO-indicating the formation of ureido functionality (-NHCO-). And the peak area is large, which means that the urea group content is large and the crosslinking density is large.
Tests show that the organic protective coating of the electronic device obtained in the example 2 has an electrochemical corrosion inhibition rate of 99.3% on metals in a 3.5% NaCl solution. The permeability to oxygen is as low as 5.8X10 -13 cm 3 cm/cm 2 s cmHg, the sample has oxygen barrier effect. The light response integrated circuit board after being coated as shown in fig. 4 is placed into water after being electrified, and can still keep working normally after being in water environment for 72 hours.
Calculated, the theoretical degree of crosslinking in example 2 was 89%.
The SEM shows that the surface of the sample is smooth and even, and the sample is tightly combined with the substrate material. And the sample deposited on the transparent substrate showed excellent light transmittance, as shown in fig. 2, after the protective coating is coated on the transparent substrate, the icon behind the substrate can still be clearly seen through the coating. The sample plated on the copper sheet was electrochemically characterized as shown in FIG. 3, and the corrosion current was changed from the original I 0 ＝1.619*10 -4 A/cm 2 Reduced to i=1.17×10 -6 A/cm 2 The formula is:
inhibition% 0 -I)/I0*100％，
The calculation shows that the protective coating prepared by the scheme has the protective effect of 99.3 percent.
Example 3: the monomer A in the monomer composition in example 1 is unchanged, the monomer B is propylene diamine, and the monomer flow used in film coating is IEM 0.4sccm, propylene diamine 0.3sccm and di-tert-butyl peroxide 0.7sccm respectively; the hot wire of the reaction cavity is heated to 210 ℃, the cavity pressure is 300mtorr, the substrate temperature is 43 ℃, the deposition time is 40min, and the thickness of the coating is about 800nm. Other deposition conditions were as above, with a coating thickness of about 800nm. Through testing, the prepared film has the characteristics of good light transmittance and tight combination with a substrate material. The transmittance to oxygen is as low as 7.5×10 -12 cm 3 cm/cm 2 s cm Hg. Electrochemical characterization of the Corrosion Current from the original I on the sample plated on the copper sheet 0 ＝1.619*10 -4 A/cm 2 Reduced to i=1.3×10 -5 A/cm 2 At this time, the corrosion inhibition rate reached 92%.
Example 4: the monomer A in the monomer composition in the example 3 is unchanged, the monomer B is p-phenylenediamine, and the monomer flow used in film coating is IEM 0.4sccm, p-phenylenediamine 0.3sccm and di-tert-butyl peroxide 0.7sccm respectively; the preparation conditions were the same as in example 3. Through the test, the prepared film has the characteristics of good light transmittance and tight combination with a substrate material as in the example 3 due to the excellent property of the initiating chemical vapor deposition technology. The transmittance to oxygen is as low as 1.2×10 -12 cm 3 cm/cm 2 s cm Hg. Electrochemical characterization of the Corrosion Current from the original I on the sample plated on the copper sheet 0 ＝1.619*10 - 4 A/cm 2 Reduced to i=3.2×10 -6 A/cm 2 The corrosion inhibition rate reaches 98% at this time, and the benzene ring structure in the adopted monomer B increases the rigidity of the molecular chain and reduces the movement of the molecular chain.
Comparative example 1:
the monomer A in example 2 was replaced with Ethylene Glycol Diacrylate (EGDA), the monomer B was still HEA, and the flow rates of the monomer A, the monomer B and the initiator used for the deposition were 0.4sccm, 0.3sccm and 0.7sccm, respectively; process forAnd introducing the gasified monomer into the cavity which is vacuumized, heating the hot wire to 210 ℃, adjusting the pressure of the cavity to 300mtorr, and preparing the coating with the thickness of 800nm at the substrate temperature of 38 ℃. Compared with the film prepared in example 2, the electrochemical corrosion inhibition rate of the metal in 3.5% NaCl solution is 65%, and the oxygen permeability is as low as 7.1X10 -10 cm 3 cm/cm 2 s cm Hg. This comparative example shows the necessity of the reaction of the isocyanate groups in ethyl acrylate with the amino groups in 1, 6-hexamethylenediamine for the compactness of the polymer film and for improving the protective effect.
Comparative example 2:
if only monomer A in example 1 is used, the flow rates of monomer A and initiator used for the deposition are 0.4sccm and 0.4sccm, respectively; and (3) introducing the gasified monomer into the cavity which is vacuumized, heating the hot wire to 210 ℃, regulating the pressure of the cavity to 150mtorr, and preparing the coating with the thickness of 800nm at the substrate temperature of 42 ℃. Then, the prepared coating is subjected to vacuum moisture annealing treatment, the annealing environment temperature is 80 ℃, the vacuum degree is less than 0.1MPa, the annealing time is 24 hours, and other preparation conditions are the same as those of comparative example 1. The electrochemical corrosion inhibition rate of the metal having a crosslinking degree of 70% in a 3.5% NaCl solution was 75% compared to the film prepared in example 1. The permeability to oxygen is as low as 5.8X10 -10 cm 3 cm/cm 2 s cmHg。
Comparative example 3:
the monomer A in example 2 was IEM, the monomer B was still 4-aminostyrene, and the flow rates of the monomer A, the monomer B and the initiator used for the deposition were 0.4sccm, 0.3sccm and 0.7sccm, respectively; and in the same process, introducing the gasified monomer into the cavity which is vacuumized, heating the hot wire to 210 ℃, regulating the pressure of the cavity to 300mtorr, and preparing the coating with the thickness of 800nm at the substrate temperature of 38 ℃. The electrochemical corrosion inhibition rate of the metal in 3.5% NaCl solution is 85%, and the permeability to oxygen is as low as 2.1 multiplied by 10 -10 cm 3 cm/cm 2 s cmHg。
In comparative example 1, the replacement of monomer A with ethylene glycol diacrylate represents the monomer A of the present invention, further demonstrating the necessity of containing isocyanate groups.
In comparative example 2, only the isocyanate group-containing monomer IEM was used, and the degree of crosslinking was significantly lower than in example 1.
By comparison, it can be derived that: the monomer A contains an ethylenic double bond and an isocyanate group, and the diamino para-form urea group in the monomer B, so that the necessity of improving the degree of crosslinking of the polymer is increased.
The testing method comprises the following steps:
oxygen transmission test, oxygen transmission test using differential pressure gas permeation instrument (VAC-V2): samples plated on PS films were placed tightly between the upper and lower test chambers. Firstly, vacuumizing a low-pressure cavity (a lower cavity), closing the test lower cavity when the pressure is pumped to 10mTorr, and filling oxygen with a certain pressure into a high-pressure cavity (an upper cavity) to ensure that a constant pressure difference is formed at two sides of a sample; under the action of pressure difference gradient, the gas permeates from the high pressure side to the low pressure side, and parameters such as the permeation quantity and the permeation coefficient of the gas are obtained through monitoring and processing of the pressure in the low pressure side.
Since a dense polymer and coating composite is used, the diffusion gas transport across the structure depends on the coating and the substrate.
Wherein, the liquid crystal display device comprises a liquid crystal display device,
p is the overall apparent permeability of the structure,
l is the total thickness ls + lc,
p s is the permeability in the substrate(s),
pc is the permeability in coating (c).
Electrochemical testing:
electrochemical corrosion testing was performed using a three-stage (CHI 660E) electrochemical workstation consisting of a working electrode (brass, length-width = 1cm x 2 cm), a Saturated Calomel Electrode (SCE) reference electrode, and a Pt plate counter electrode. Potentiodynamic polarization curve (Tafel) samples were measured at a scan rate of 0.5mV/s starting from an open circuit potential, -250mV to +250 mV.
For ease of explanation, specific nomenclature is used in the above description to provide a thorough understanding of the embodiments. It will be apparent to those skilled in the art that certain modifications, combinations and variations are possible in light of the above teachings.
Claims (8)
1. An organic protective coating for an electronic device, characterized by: the organic protective coating is obtained by polymerization reaction of a monomer composition comprising a monomer A and a monomer B on the surface of an electronic device; wherein, the liquid crystal display device comprises a liquid crystal display device,
the monomer A is one or more of olefin monomers containing ethylene double bond and isocyanate group;
the main chain of the monomer B is one of a saturated carbon chain main chain, a saturated hetero chain main chain or a main chain containing benzene rings;
the end group of the monomer B is two or more amino groups or two or more hydroxyl groups;
the molar ratio of the monomer A to the monomer B is 5:1-1:5.
2. An organic protective coating for electronic devices according to claim 1, characterized in that: the molar ratio of the monomer A to the monomer B is 1:1.5-1.5:1.
3. An organic protective coating for electronic devices according to claim 1, characterized in that: monomer A is isocyanoethyl methacrylate, polyisocyanate methacrylate or p-isocyanatostyrene.
4. An organic protective coating for electronic devices according to claim 1, characterized in that: with respect to the monomer B,
when the main chain of the monomer B is a saturated carbon chain main chain, the monomer B is hexamethylenediamine, hexanediol or trihexylamine;
when the main chain of the monomer B is a saturated hetero chain main chain, the monomer B is diethylene glycol di (3-aminopropyl) ether, 2, 3-tetrafluoro-1, 4-butanediol or 2- (butylamino) ethylamine;
when the main chain of the monomer B is the main chain containing benzene rings, the monomer B is p-phenylenediamine, 2,3,5, 6-tetramethyl-1, 4-phenylenediamine, resorcinol or 2, 3-dihydroxybenzoic acid methyl ester.
5. A method of producing an organic protective coating for an electronic device according to any one of the preceding claims, characterized in that: the method comprises the following steps: firstly, heating and gasifying a monomer A, a monomer B and an initiator respectively, respectively introducing the monomers A, the monomer B and the initiator into a cavity in a vacuum state through different pipelines, and uniformly mixing the monomers A, the monomer B and the initiator after entering the cavity.
6. The method of manufacturing according to claim 5, wherein: and (3) introducing a monomer, then introducing an initiator gasified at room temperature, heating the nichrome wire in the cavity to 180-250 ℃, and growing a film on a substrate with the temperature of 10-50 ℃ to obtain the organic protective coating.
7. The method of manufacturing according to claim 6, wherein: the matrix is metal, polymer material or inorganic material.
8. The method of manufacturing according to claim 6, wherein: at 25 ℃, the saturated vapor pressure of the monomer A and the monomer B is 0.01 mmHg-4 mmHg.
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