CN113664313A - Manual welding equipment for BGA chip - Google Patents

Manual welding equipment for BGA chip Download PDF

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Publication number
CN113664313A
CN113664313A CN202110849003.2A CN202110849003A CN113664313A CN 113664313 A CN113664313 A CN 113664313A CN 202110849003 A CN202110849003 A CN 202110849003A CN 113664313 A CN113664313 A CN 113664313A
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CN
China
Prior art keywords
axis
screw
bga chip
guide rail
axle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202110849003.2A
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Chinese (zh)
Inventor
金明
储苏飞
王磊
车子强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Vocational College Of Information Technology
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Nanjing Vocational College Of Information Technology
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Publication date
Application filed by Nanjing Vocational College Of Information Technology filed Critical Nanjing Vocational College Of Information Technology
Priority to CN202110849003.2A priority Critical patent/CN113664313A/en
Publication of CN113664313A publication Critical patent/CN113664313A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses BGA chip manual welding equipment which comprises a bottom plate, a printed board clamping mechanism, a positioning mechanism and a BGA chip clamp, wherein the printed board clamping mechanism and the positioning mechanism are arranged on the bottom plate, the printed board clamping mechanism is used for fixing a printed board, the BGA chip clamp and the positioning mechanism are connected through a spring, and the positioning mechanism controls the position of the BGA chip clamp.

Description

Manual welding equipment for BGA chip
Technical Field
The invention relates to a manual BGA chip welding device, and belongs to the technical field of electronic assembly.
Background
With the continuous development of integrated circuit manufacturing processes, Ball Grid Array (BGA) packages are mostly adopted for mainstream chips in order to reduce heat loss. Because BGA encapsulation does not have a welding lead, the chip takes a hemispherical welding spot as a welding spot, so that welding becomes a special technology. Although the BGA chip soldering mostly adopts the SMT technology, a plurality of soldering defects still exist, and repair is needed. The manual welding often has the defects of inaccurate positioning, easy dislocation, low efficiency, poor welding and the like.
Disclosure of Invention
The invention aims to provide BGA chip manual welding equipment to solve the problem that a BGA chip cannot be fixed during manual welding in the prior art.
In order to realize the purpose, the invention is realized by adopting the following technical scheme:
the invention provides a BGA chip manual welding device which comprises a bottom plate, a printed board clamping mechanism, a positioning mechanism and a BGA chip clamp, wherein the printed board clamping mechanism and the positioning mechanism are arranged on the bottom plate, the printed board clamping mechanism is used for fixing a printed board, the BGA chip clamp and the positioning mechanism are connected through a spring, and the positioning mechanism controls the position of the BGA chip clamp.
Furthermore, the printed board clamping mechanism comprises a longitudinal clamping plate, a transverse clamping plate, a longitudinal sliding clamping plate, a first guide rail and a longitudinal screw rod; the longitudinal clamping plate, the transverse clamping plate, the first guide rail and the bottom plate are fixedly connected, a nut is arranged in the longitudinal sliding clamping plate, the longitudinal screw rod is arranged in the first guide rail and is in threaded connection with the nut, and the longitudinal screw rod rotates in the nut to realize traction on the longitudinal sliding clamping plate; the longitudinal clamping plate, the transverse clamping plate and the longitudinal sliding clamping plate are all provided with clamping grooves for fixing the printed board.
Furthermore, the positioning mechanism comprises a Z-axis transmission device, an X-axis transmission device, a Y-axis transmission device and a handle; z axle transmission device locates perpendicularly on the bottom plate and links firmly with the bottom plate, and X axle transmission device locates perpendicularly on Z axle transmission device and with Z axle transmission device threaded connection, and Y axle transmission device locates perpendicularly on the X axle transmission device and with X axle transmission device threaded connection, and the handle is located on Y axle transmission device, and Y axle transmission device and BGA chip anchor clamps link to each other.
Furthermore, the Y-axis transmission device comprises a Y-axis sliding block, a Y-axis guide rail, a Y-axis fixing screw, a Y-axis nut and a Y-axis screw rod which is coaxial with the Y-axis guide rail; the handle and the BGA chip clamp are connected with each other in a sliding mode through a Y-axis sliding block and a Y-axis transmission device, a Y-axis fixing screw is connected with a Y-axis guide rail and a Y-axis screw rod, the Y-axis screw rod is connected with the Y-axis fixing screw and a Y-axis nut in a threaded mode respectively, and the Y-axis nut is fixedly connected with the Y-axis sliding block.
Furthermore, the X-axis transmission device comprises an X-axis guide rail, an X-axis fixing screw, an X-axis nut, an X-axis sliding block and an X-axis screw rod which is coaxial with the X-axis guide rail; the X-axis fixing screw is connected with the X-axis guide rail and the X-axis screw rod, the X-axis screw rod is respectively in threaded connection with the X-axis fixing screw and the X-axis nut, and the Y-axis transmission device and the X-axis nut are fixedly connected with the X-axis sliding block.
Furthermore, the Z-axis transmission device comprises a Z-axis guide rail, a Z-axis fixing screw, a Z-axis nut, a Z-axis sliding block and a Z-axis screw rod which is coaxial with the Z-axis guide rail; the Z-axis fixing screw is connected with the Z-axis guide rail and the Z-axis screw rod, the Z-axis screw rod is respectively in threaded connection with the Z-axis fixing screw and the Z-axis nut, and the X-axis transmission device and the Z-axis nut are fixedly connected with the Z-axis sliding block.
Further, the BGA chip clamp comprises a clamp connecting support, a first clamping head fixing support, a second clamping head fixing support and an adjusting screw, wherein the first clamping head fixing support and the second clamping head fixing support are fixedly connected with two ends of the clamp connecting support respectively and are provided with clamping heads respectively; and a first thread section in threaded connection with the first clamping head fixing support and a second thread section in threaded connection with the second clamping head fixing support are respectively arranged at two ends of the adjusting screw rod, and the thread directions of the first thread section and the second thread section are opposite.
Further, the clamp connecting bracket is a connecting piece made of elastic materials.
Compared with the prior art, the invention has the following beneficial effects:
according to the manual BGA chip welding equipment, the bottom plate is used as a supporting part of the whole equipment, the printed board clamping mechanism is arranged on the bottom plate, and the printed board to be welded can be conveniently and quickly fixed by the printed board clamping mechanism; the BGA chip clamp is connected with the positioning mechanism through a spring, and the positioning mechanism controls the position of the BGA chip clamp; the positioning mechanism can be moved by applying corresponding force to the positioning mechanism, so that the BGA chip clamp is controlled to move to a specified position, the BGA chip is moved to a position needing welding, and welding of a hot air gun is facilitated;
the manual welding device for the BGA chip provided by the invention can accurately fix the BGA chip at the welding pad, prevent welding failure caused by sliding when the welding pad and the solder ball are heated during welding, and has the advantages of simple structure, low cost and easiness in operation.
Drawings
FIG. 1 is a schematic structural diagram of a BGA chip manual soldering apparatus provided in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a Z-axis transmission provided by an embodiment of the invention;
FIG. 3 is a schematic structural diagram of an X-axis transmission according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a Y-axis transmission provided by an embodiment of the invention;
FIG. 5 is a schematic view of a handle mounting location provided by an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a BGA chip holder according to an embodiment of the present invention.
In the figure: 1. a base plate; 2. a longitudinal clamping plate; 3. a transverse clamping plate; 4. a longitudinal sliding clamping plate; 5. a first guide rail; 6. a longitudinal screw rod; 7. a nut; 8. a Z-axis transmission device; 9. an X-axis transmission device; 10. a Y-axis transmission device; 11. a handle; 12. BGA chip clamp; 81. a Z-axis guide rail; 82. a Z-axis fixing screw; 83. a Z-axis lead screw; 84. a Z-axis nut; 85. a Z-axis slide block; 91. an X-axis guide rail; 92. an X-axis fixing screw; 93. an X-axis lead screw; 94. an X-axis nut; 95. an X-axis slider; 101. a Y-axis guide rail; 102. a Y-axis set screw; 103. a Y-axis lead screw; 104. a Y-axis nut; 105. a Y-axis slider; 121. the clamp is connected with the bracket; 122. the first clamping head fixing bracket; 123. the second clamping head is fixed on the bracket; 124. a clamping head; 125. adjusting the screw rod; 126. a spring.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus are not to be construed as limiting the invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Example one
With reference to fig. 1 to 6, the present invention provides a BGA chip manual soldering apparatus, which includes a base plate 1, a printed board clamping mechanism, a positioning mechanism, and a BGA chip clamp 12.
The invention provides BGA chip manual welding equipment.A printed board clamping mechanism comprises a longitudinal clamping plate 2, a transverse clamping plate 3, a longitudinal sliding clamping plate 4, a first guide rail 5, a longitudinal screw rod 6 and a screw cap 7; the longitudinal sliding clamping plate 4 is connected with the bottom plate 1 in a sliding mode through a nut 7, a longitudinal screw rod 6, a first guide rail 5, clamping grooves matched with the sizes of the printed boards are formed in the longitudinal clamping plate 2, the transverse clamping plate 3 and the longitudinal sliding clamping plate 4, and the printed boards can be fixed by adjusting the longitudinal sliding clamping plate 4.
The printed board clamping mechanism comprises a bottom plate 1, wherein a longitudinal clamping plate 2 is installed on the right side of the bottom plate, a transverse clamping plate 3 is installed on the rear side of the bottom plate, a longitudinal sliding clamping plate 4 is installed on the left side of the bottom plate, a nut 7 is installed in the longitudinal sliding clamping plate 4 on the left side, a longitudinal screw rod 6 rotates in the nut 7 relatively, the longitudinal sliding clamping plate 4 is pulled to move on a first guide rail 5, and the printed board is clamped.
The invention provides a BGA chip manual welding device, wherein a positioning mechanism comprises a Z-axis transmission device 8, an X-axis transmission device 9, a Y-axis transmission device 10 and a handle 11; applying forces in different directions to the handle 11, the BGA chip holder 12 can be moved to the desired soldering position of the BGA chip by the Z-axis actuator 8, the X-axis actuator 9 and the Y-axis actuator 10.
As shown in fig. 2, the positioning mechanism is mounted on the base plate 1, the Z-axis transmission device 8 includes a Z-axis guide rail 81, a Z-axis fixing screw 82, a Z-axis nut 84, a Z-axis slider 85, and a Z-axis lead screw 83 coaxial with the Z-axis guide rail 81, the Z-axis fixing screw 82 is disposed on the Z-axis guide rail 81, one end of the Z-axis lead screw 83 is connected to the Z-axis fixing screw 82, the other end is also connected to the Z-axis nut 84 by a screw, the Z-axis slider 85 is fixedly connected to the Z-axis nut 84, the X-axis transmission device 9 is fixedly connected to the Z-axis slider 85, a vertical force is applied to the handle 11, the vertical force is fixedly connected to the Z-axis slider 85 by the X-axis transmission device 9, and power is output to the Z-axis transmission device 8 to move the BGA chip holder 12 up and down.
As shown in fig. 3, the X-axis transmission device 9 includes an X-axis guide rail 91, an X-axis fixing screw 92, an X-axis nut 94, an X-axis slider 95, and an X-axis screw 93 coaxial with the X-axis guide rail 91, the X-axis fixing screw 92 is disposed on the X-axis guide rail 91, one end of the X-axis screw 93 is in threaded connection with the X-axis fixing screw 92, the other end is in threaded connection with the X-axis nut 94, the X-axis slider 95 is fixedly connected with the X-axis nut 94, the Y-axis transmission device 10 is fixedly connected with the X-axis slider 95, a force in the left-right direction is applied to the handle 11, the BGA power is output to the X-axis transmission device 9 to move the BGA chip holder 12 left and right.
As shown in fig. 4 and 5, the Y-axis transmission device 10 includes a Y-axis guide rail 101, a Y-axis fixing screw 102, a Y-axis nut 104, a Y-axis slider 105, and a Y-axis screw 103 coaxial with the Y-axis guide rail 101, the Y-axis fixing screw 102 is disposed on the Y-axis guide rail 101, one end of the Y-axis screw 103 is connected to the Y-axis fixing screw 102 by screw, the other end is connected to the Y-axis nut 104 by screw, the Y-axis slider 105 is connected to the Y-axis nut 104 by screw, the BGA chip holder 12 is connected to the lower end of the Y-axis slider 105, the handle 11 is connected to the upper end of the Y-axis slider 105 by screw, a force in the forward and backward directions is applied to the handle 11, and the BGA chip holder 12 can be moved forward and backward by the Y-axis transmission device 10.
According to the manual BGA chip welding equipment provided by the invention, a BGA chip clamp 12 comprises a clamp connecting support 121, a first clamping head fixing support 122, a second clamping head fixing support 123, a clamping head 124 and an adjusting screw 125; the adjusting screw 125 adjusts the distance between the first clamping head fixing support 122 and the second clamping head fixing support 123, so that the BGA chip can be clamped and placed at a designated position, and welding of the hot air gun is facilitated.
As shown in fig. 6, two ends of the clamp connection bracket 121 are respectively and fixedly connected to a first clamping head fixing bracket 122 and a second clamping head fixing bracket 123, one ends of the first clamping head fixing bracket 122 and the second clamping head fixing bracket 123, which are far away from the clamp connection bracket 121, are both provided with clamping heads 124, an adjusting screw 125 is arranged between the first clamping head fixing bracket 122 and the second clamping head fixing bracket 123, two ends of the adjusting screw 125 are respectively provided with a first thread section and a second thread section, the first thread section is in threaded connection with the first clamping head fixing bracket 122, the second thread section is in threaded connection with the second clamping head fixing bracket 123, and the thread directions of the first thread section and the second thread section are opposite.
The jig connection bracket 121 is a connection member made of an elastic material; when the adjusting screw rod 125 is screwed, the first clamping head fixing support 122 and the second clamping head fixing support 123 move inwards or outwards simultaneously, the clamp connecting support 121 contracts or extends, and the adjusting screw rod 125 adjusts the distance between the clamping heads 124 by adjusting the distance between the first clamping head fixing support 122 and the second clamping head fixing support 123, so that the BGA chip is clamped.
Be equipped with spring 126 between BGA chip anchor clamps 12 and the Y axle slider 105, spring 126's one end and Y axle slider 105 fixed connection, the other end and anchor clamps linking bridge 121 fixed connection, connect through spring 126, can realize the bonding between BGA chip and the printed board pad better.
The manual welding device for the BGA chip provided by the invention can accurately fix the BGA chip at the welding pad, prevent welding failure caused by sliding when the welding pad and the solder ball are heated during welding, and has the advantages of simple structure, low cost and easiness in operation.
Example two
With reference to fig. 1 to 6, the present invention provides a BGA chip manual soldering apparatus, which includes a base plate 1, a printed board clamping mechanism, a positioning mechanism, and a BGA chip clamp 12.
The invention provides BGA chip manual welding equipment.A printed board clamping mechanism comprises a longitudinal clamping plate 2, a transverse clamping plate 3, a longitudinal sliding clamping plate 4, a first guide rail 5, a longitudinal screw rod 6 and a screw cap 7; the longitudinal sliding clamping plate 4 is connected with the bottom plate 1 in a sliding mode through a nut 7, a longitudinal screw rod 6, a first guide rail 5, clamping grooves matched with the sizes of the printed boards are formed in the longitudinal clamping plate 2, the transverse clamping plate 3 and the longitudinal sliding clamping plate 4, and the printed boards can be fixed by adjusting the longitudinal sliding clamping plate 4.
The printed board clamping mechanism comprises a bottom plate 1, wherein a longitudinal clamping plate 2 is installed on the right side of the bottom plate, a transverse clamping plate 3 is installed on the rear side of the bottom plate, a longitudinal sliding clamping plate 4 is installed on the left side of the bottom plate, a nut 7 is installed in the longitudinal sliding clamping plate 4 on the left side, a longitudinal screw rod 6 rotates in the nut 7 relatively, the longitudinal sliding clamping plate 4 is pulled to move on a first guide rail 5, and the printed board is clamped.
The invention provides a BGA chip manual welding device, wherein a positioning mechanism comprises a Z-axis transmission device 8, an X-axis transmission device 9, a Y-axis transmission device 10 and a handle 11; applying forces in different directions to the handle 11, the BGA chip holder 12 can be moved to the desired soldering position of the BGA chip by the Z-axis actuator 8, the X-axis actuator 9 and the Y-axis actuator 10.
As shown in fig. 2, the positioning mechanism is mounted on the base plate 1, the Z-axis transmission device 8 includes a Z-axis guide rail 81, a Z-axis fixing screw 82, a Z-axis nut 84, a Z-axis slider 85, and a Z-axis lead screw 83 coaxial with the Z-axis guide rail 81, the Z-axis fixing screw 82 is disposed on the Z-axis guide rail 81, one end of the Z-axis lead screw 83 is connected to the Z-axis fixing screw 82, the other end is also connected to the Z-axis nut 84 by a screw, the Z-axis slider 85 is fixedly connected to the Z-axis nut 84, the X-axis transmission device 9 is fixedly connected to the Z-axis slider 85, a vertical force is applied to the handle 11, the vertical force is fixedly connected to the Z-axis slider 85 by the X-axis transmission device 9, and power is output to the Z-axis transmission device 8 to move the BGA chip holder 12 up and down.
As shown in fig. 3, the X-axis transmission device 9 includes an X-axis guide rail 91, an X-axis fixing screw 92, an X-axis nut 94, an X-axis slider 95, and an X-axis screw 93 coaxial with the X-axis guide rail 91, the X-axis fixing screw 92 is disposed on the X-axis guide rail 91, one end of the X-axis screw 93 is in threaded connection with the X-axis fixing screw 92, the other end is in threaded connection with the X-axis nut 94, the X-axis slider 95 is fixedly connected with the X-axis nut 94, the Y-axis transmission device 10 is fixedly connected with the X-axis slider 95, a force in the left-right direction is applied to the handle 11, the BGA power is output to the X-axis transmission device 9 to move the BGA chip holder 12 left and right.
As shown in fig. 4 and 5, the Y-axis transmission device 10 includes a Y-axis guide rail 101, a Y-axis fixing screw 102, a Y-axis nut 104, a Y-axis slider 105, and a Y-axis screw 103 coaxial with the Y-axis guide rail 101, the Y-axis fixing screw 102 is disposed on the Y-axis guide rail 101, one end of the Y-axis screw 103 is connected to the Y-axis fixing screw 102 by screw, the other end is connected to the Y-axis nut 104 by screw, the Y-axis slider 105 is connected to the Y-axis nut 104 by screw, the BGA chip holder 12 is connected to the lower end of the Y-axis slider 105, the handle 11 is connected to the upper end of the Y-axis slider 105 by screw, a force in the forward and backward directions is applied to the handle 11, and the BGA chip holder 12 can be moved forward and backward by the Y-axis transmission device 10.
According to the manual BGA chip welding equipment provided by the invention, a BGA chip clamp 12 comprises a clamp connecting support 121, a first clamping head fixing support 122, a second clamping head fixing support 123, a clamping head 124 and an adjusting screw 125; the adjusting screw 125 adjusts the distance between the first clamping head fixing support 122 and the second clamping head fixing support 123, so that the BGA chip can be clamped and placed at a designated position, and welding of the hot air gun is facilitated.
As shown in fig. 6, two ends of the clamp connection bracket 121 are respectively and fixedly connected to a first clamping head fixing bracket 122 and a second clamping head fixing bracket 123, one ends of the first clamping head fixing bracket 122 and the second clamping head fixing bracket 123, which are far away from the clamp connection bracket 121, are both provided with clamping heads 124, an adjusting screw 125 is arranged between the first clamping head fixing bracket 122 and the second clamping head fixing bracket 123, two ends of the adjusting screw 125 are respectively provided with a first thread section and a second thread section, the first thread section is in threaded connection with the first clamping head fixing bracket 122, the second thread section is in threaded connection with the second clamping head fixing bracket 123, and the thread directions of the first thread section and the second thread section are opposite.
The jig connection bracket 121 is a connection member made of an elastic material; when the adjusting screw rod 125 is screwed, the first clamping head fixing support 122 and the second clamping head fixing support 123 move inwards or outwards simultaneously, the clamp connecting support 121 contracts or extends, and the adjusting screw rod 125 adjusts the distance between the clamping heads 124 by adjusting the distance between the first clamping head fixing support 122 and the second clamping head fixing support 123, so that the BGA chip is clamped.
When the manual BGA chip welding equipment provided by the invention is used for manually welding the BGA chip, the BGA chip is clamped by the clamping head 124 of the BGA chip clamp 12, the adjusting screw rod 125 is screwed, the distance between the first clamping head fixing support 122 and the second clamping head fixing support 123 is adjusted, the clamping head 124 is tightened, the BGA chip is fixed, the welding position is determined, the BGA chip can be heated by a hot air gun, and the welding of the BGA chip is completed at one time.
When the manual BGA chip welding equipment provided by the invention is used for welding and disassembling the BGA chip, the BGA chip is clamped by the clamping head 124 of the BGA chip clamp 12, the adjusting screw rod 125 is screwed, the distance between the first clamping head fixing support 122 and the second clamping head fixing support 123 is adjusted, the clamping head 124 is tightened, the BGA chip is fixed, the welding position is determined, the BGA chip can be heated by a hot air gun, and the welding and disassembling of the BGA chip can be completed at one time.
The manual BGA chip welding equipment provided by the invention avoids the BGA chip from sliding when the hot air gun heats the BGA chip, and ensures the quality of welding or unsoldering work.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims (8)

1. The utility model provides a manual welding equipment of BGA chip, its characterized in that, includes bottom plate (1), printing board fixture, positioning mechanism and BGA chip anchor clamps (12), on printing board fixture and positioning mechanism located bottom plate (1), printing board fixture was used for fixed printing board, BGA chip anchor clamps (12) and positioning mechanism pass through spring (126) and connect, and positioning mechanism controls the position of BGA chip anchor clamps (12).
2. The BGA chip manual welding device of claim 1, wherein the printed board clamping mechanism comprises a longitudinal clamping board (2), a transverse clamping board (3), a longitudinal sliding clamping board (4), a first guide rail (5) and a longitudinal screw rod (6); the longitudinal clamping plate (2), the transverse clamping plate (3), the first guide rail (5) and the bottom plate are fixedly connected, a nut (7) is arranged in the longitudinal sliding clamping plate (4), the longitudinal screw rod (6) is arranged in the first guide rail (5) and is in threaded connection with the nut (7), and the longitudinal screw rod (6) rotates in the nut (7) to realize traction on the longitudinal sliding clamping plate (4); the longitudinal clamping plate (2), the transverse clamping plate (3) and the longitudinal sliding clamping plate (4) are all provided with clamping grooves for fixing the printed board.
3. The BGA chip manual soldering apparatus of claim 1, wherein the positioning mechanism includes a Z-axis transmission device (8), an X-axis transmission device (9), a Y-axis transmission device (10) and a handle (11); z axle transmission (8) are perpendicularly located on bottom plate (1) and are linked firmly with bottom plate (1), X axle transmission (9) are perpendicularly located on Z axle transmission (8) and with Z axle transmission (8) threaded connection, Y axle transmission (10) are perpendicularly located on X axle transmission (9) and with X axle transmission (9) threaded connection, Y axle transmission (10) are located on Y axle transmission (10) handle (11), and Y axle transmission (10) and BGA chip anchor clamps (12) link to each other.
4. The BGA chip manual soldering apparatus of claim 3, wherein the Y-axis transmission device (10) comprises a Y-axis slide block (105), a Y-axis guide rail (101), a Y-axis fixing screw (102), a Y-axis nut (104), and a Y-axis screw rod (103) coaxial with the Y-axis guide rail (101); the handle (11) and the BGA chip clamp (12) are in sliding connection with the Y-axis transmission device (10) through a Y-axis sliding block (105), a Y-axis fixing screw (102) is connected with a Y-axis guide rail (101) and a Y-axis screw rod (103), the Y-axis screw rod (103) is in threaded connection with the Y-axis fixing screw (102) and a Y-axis screw nut (104) respectively, and the Y-axis screw nut (104) is fixedly connected with the Y-axis sliding block (105).
5. The BGA chip manual soldering apparatus according to claim 3, wherein the X-axis transmission device (9) comprises an X-axis guide rail (91), an X-axis fixing screw (92), an X-axis nut (94), an X-axis slider (95), and an X-axis lead screw (93) coaxial with the X-axis guide rail (91); the X-axis fixing screw (92) is connected with the X-axis guide rail (91) and the X-axis screw rod (93), the X-axis screw rod (93) is respectively in threaded connection with the X-axis fixing screw (92) and the X-axis screw nut (94), and the Y-axis transmission device (10) and the X-axis screw nut (94) are fixedly connected with the X-axis sliding block (95).
6. The BGA chip manual soldering apparatus according to claim 3, wherein the Z-axis transmission device (8) comprises a Z-axis guide rail (81), a Z-axis fixing screw (82), a Z-axis nut (84), a Z-axis slider (85), and a Z-axis lead screw (83) coaxial with the Z-axis guide rail (81); z axle set screw (82) are connected Z axle guide rail (81) and Z axle lead screw (83), and Z axle lead screw (83) respectively with Z axle set screw (82), Z axle screw (84) threaded connection, X axle transmission (9), Z axle screw (84) all link firmly with Z axle slider (85).
7. The BGA chip manual soldering apparatus of claim 1, wherein the BGA chip jig (12) includes a jig connecting bracket (121), first and second jig head fixing brackets (122, 123) fixedly connected to both ends of the jig connecting bracket (121) respectively and having jig heads (124) fixed to ends thereof, and an adjusting screw (125); and a first thread section in threaded connection with the first clamping head fixing support (122) and a second thread section in threaded connection with the second clamping head fixing support (123) are respectively arranged at two ends of the adjusting screw rod (125), and the thread directions of the first thread section and the second thread section are opposite.
8. A BGA chip manual soldering apparatus according to claim 7, in which the jig connection brackets (121) are connectors made of an elastic material.
CN202110849003.2A 2021-07-27 2021-07-27 Manual welding equipment for BGA chip Withdrawn CN113664313A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110849003.2A CN113664313A (en) 2021-07-27 2021-07-27 Manual welding equipment for BGA chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110849003.2A CN113664313A (en) 2021-07-27 2021-07-27 Manual welding equipment for BGA chip

Publications (1)

Publication Number Publication Date
CN113664313A true CN113664313A (en) 2021-11-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110849003.2A Withdrawn CN113664313A (en) 2021-07-27 2021-07-27 Manual welding equipment for BGA chip

Country Status (1)

Country Link
CN (1) CN113664313A (en)

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Application publication date: 20211119