CN210172883U

CN210172883U - Multi-chip one-time pressurizing welding tool

Info

Publication number: CN210172883U
Application number: CN201920517024.2U
Authority: CN
Inventors: 吴昕雷; 赵文忠; 陈帅; 赵志平; 张飞
Original assignee: CETC 20 Research Institute
Current assignee: CETC 20 Research Institute
Priority date: 2019-04-17
Filing date: 2019-04-17
Publication date: 2020-03-24
Anticipated expiration: 2029-04-17

Abstract

The utility model provides a multi-chip one-time pressure welding tool, wherein a beam is fixedly connected above a bottom plate through a stand column; the substrate is arranged on the bottom plate, and a chip carrier groove for placing a chip carrier is arranged on the substrate; the positioning plate is arranged on the substrate and is provided with a positioning frame which is communicated up and down, and the shape of the positioning frame is the same as the shape of the spliced chips which need to be welded simultaneously; the soldering lug and the chip are sequentially arranged in the positioning frame; the upper part of the positioning plate is sealed by a positioning cover, and the positioning cover is provided with needle pressing guide holes corresponding to the number and the positions of the chips; the pressure head is installed on the crossbeam, and the pressure head height can be adjusted, and the same tucker one end of chip quantity passes tucker guiding hole extrusion chip, and the other end links firmly through extrusion spring and pressure head. The utility model can weld a plurality of chips and chip carriers at one time, avoid the chips to be heated for many times and reduce the risk of the chips being damaged; the positioning device can position a plurality of chips at the same time, has adjustable pressure, reduces the voidage and ensures the welding quality.

Description

Multi-chip one-time pressurizing welding tool

Technical Field

The invention relates to the field of eutectic soldering of micro-assembly chips.

Background

With the development of microwave hybrid integrated circuits toward high performance, miniaturization, light weight, high reliability and low cost, it has become a common practice to use bare chips to replace packaged devices and to implement assembly by using microwave multi-chip module technology. The microwave multi-chip module is realized by chips with different functions, and various single-chip microwave integrated circuit chips integrate circuits with relatively complete functions on a single substrate, play an important role in a microwave communication system and are the core of microwave multi-chip module assembly. When the chips are used, the chips are required to be assembled on a heat-matching heat dissipation carrier, and the method for realizing the chips comprises conductive adhesive bonding and eutectic welding. Compared with the conductive adhesive bonding, the eutectic welding has the advantages of low contact resistance, high heat transfer efficiency, uniform heat dissipation, high welding strength, good process consistency and the like, and is suitable for assembling high-frequency and high-power devices. Therefore, the assembly of high power chips usually uses eutectic soldering.

In the traditional eutectic method, a mode of manually eutectic by holding tweezers on a hot table is mainly adopted, mechanical vibration is generated by the tweezers in an inert gas atmosphere to generate friction between a chip and a carrier, and oxides in solder and bubbles in a welding area are eliminated, so that eutectic welding with low voidage is realized. However, this method is no longer suitable for new product formats and capacity requirements. Firstly, when the multi-chip eutectic is carried out, the chips welded in front can be heated for a long time in a sequential friction mode, so that the risk of damaging a device is caused, and the first chip is easily influenced during the welding operation of the second chip; second, in the monolithic microwave integrated circuit chip, the substrate is mostly GaAs, the material is very brittle, and tweezers easily damage the chip when force is applied. Therefore, a new process is needed to solve the above problems.

The vacuum controlled atmosphere eutectic furnace can realize various eutectic processes of devices. During eutectic, no soldering flux is needed, the eutectic has the function of vacuumizing or filling inert gas, and cavities can be effectively reduced in vacuum. During the eutectic process, the jig is required to be positioned to prevent the movement of the chip due to the change in the air flow. The multi-chip one-time eutectic welding can be realized by applying a special clamp. During multi-chip eutectic soldering, as the size of the chips is smaller and the number of the chips is larger and larger, the chips are required to be finished by adopting a special fixture tool. The fixture not only has the function of fixing the position of the chip and the solder, but also has the function of applying certain pressure to the chip, and has the characteristics of easy operation, high temperature resistance and no deformation.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides a pressure welding tool which can assemble and weld a plurality of chips and a carrier at one time, avoid the damage to the chips and reduce the welding holes between the chips and the carrier.

The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a chip pressurization welding frock, includes bottom plate, stand, crossbeam, base plate, locating plate, location lid, tucking and pressure head, its characterized in that: the cross beam is fixedly connected above the bottom plate through the upright post; the substrate is arranged on the bottom plate, and a chip carrier groove for placing a chip carrier is arranged on the substrate; the positioning plate is arranged on the base plate, a positioning frame which is communicated up and down is arranged on the positioning plate, and the shape of the positioning frame is the same as that of the spliced chips which need to be welded simultaneously; the soldering lug and the chip with the same size as the chip are sequentially arranged in the positioning frame; the upper part of the positioning plate is sealed by a positioning cover, and the positioning cover is provided with needle pressing guide holes corresponding to the number and the positions of the chips; the pressure head install on the crossbeam, and the pressure head height can be adjusted, the same tucking one end with chip quantity passes tucking guiding hole extrusion chip, the other end links firmly through extrusion spring and pressure head.

The upper end of the pressure head is fixedly connected with the lower end of a screw rod through an extrusion spring, the screw rod is arranged in a solenoid, and the upper end of the screw rod is fixedly connected with the upper end of the solenoid through a nut; the solenoid is a hollow cylinder provided with external threads, and the outer wall of the solenoid is in threaded connection with the through hole in the cross beam.

One end of the cross beam is provided with a through hole which is communicated up and down, and the other end of the cross beam is provided with a long groove which is communicated up and down and is opened laterally; after the pin screw penetrates through the through hole, one end of the cross beam is installed at the upper end of one upright post, and the cross beam can rotate around the axis of the upright post; the upper end of the other upright column on the bottom plate is a stud, and when the cross beam rotates to the position that the stud is arranged in the long groove, a locking nut is arranged on the stud to fix the cross beam.

The bottom plate on be provided with the location counter bore of laying the base plate, base plate lower surface arch have the location round platform, with the location counter bore matching of bottom plate.

The base plate, the positioning plate and the positioning cover are fixedly connected through the positioning pin.

And a C-shaped elastic reed is adopted as a spring between the pressure head and the pressure pin.

The invention has the beneficial effects that: a plurality of chips and the chip carrier can be welded at one time, so that the chips are prevented from being heated for many times, and the risk of damaging the chips is reduced; the method can simultaneously position and apply tiny pressure (pressure is adjustable) to a plurality of chips, reduce the voidage and ensure the welding quality.

Drawings

Fig. 1 is a schematic view of an assembled cross-sectional structure of the present invention, in which fig. 1(a) is a cross-sectional view of an assembled cross-section, fig. 1(b) is a partially enlarged view of an assembled position, and fig. 1(c) is a partially enlarged view of an assembled chip and pad position.

Fig. 2 is an exploded view of the assembly of the present invention.

Fig. 3 is a schematic structural diagram of the substrate of the present invention.

Fig. 4 is a schematic structural view of the positioning plate of the present invention.

Fig. 5 is a schematic structural view of the positioning cover of the present invention.

Fig. 6 is a schematic view of the structure of the C-shaped spring reed of the present invention.

Fig. 7 is a schematic view of the structure of the pressing pin of the present invention.

Fig. 8 is a schematic diagram of the structure of the pressure head of the invention.

Fig. 9 is a schematic view of the coil structure of the present invention.

FIG. 10 is a schematic view of the screw structure of the present invention.

Fig. 11 is a schematic view of a beam structure according to the present invention.

Fig. 12 is a schematic view of the bottom plate structure of the present invention.

In the figure, 1-bottom plate, 2-left column, 3-cross beam, 4-pin screw, 5-nut, 6-fastening nut, 7-screw, 8-cylindrical spring, 9-solenoid, 10-locking nut, 11-right column, 12-internal hexagonal screw, 13-spring washer, 14-conical rivet, 15-pressure head, 16-C-shaped elastic reed, 17-press pin, 18-positioning pin, 19-positioning cover, 20-positioning plate, 21-substrate, 22-chip, 23-welding piece, 24-chip carrier, 25-substrate chip carrier groove, 30-substrate positioning circular table, 35-substrate positioning pin hole, 45-chip positioning frame, 50-positioning plate positioning pin hole, 55-positioning cover press pin guide hole, 60-locating cap locating pin hole, 70-C shape spring reed rivet hole, 75-C shape spring reed rivet hole, 80-tucker rivet hole, 85-tucker guide cylinder, 90-tucker bottom surface, 95-tucker cylindrical surface, 100-tucker rivet hole, 110-tucker guide cylinder, 115-tucker spring contact surface, 120-solenoid inner hole, 125-solenoid outer thread, 130-solenoid inner hole, 135-solenoid outer thread, 140-solenoid cylindrical surface, 145-cross beam threaded hole, 146-cross beam pin screw hole, 147-cross beam slotted hole, 150-bottom plate locating counter bore, 155-bottom plate locating pin hole.

Detailed Description

The present invention will be further described with reference to the following drawings and examples, which include, but are not limited to, the following examples.

The chip pressure welding tool provided by the invention comprises: the device comprises a bottom plate, a left upright post, a right upright post, a cross beam, a locking nut, a pin screw, a base plate, a positioning plate, a cylindrical pin, a positioning cover, a pressing pin, a pressing head, a C-shaped elastic reed, a conical rivet, a cylindrical spring, a screw rod, a spiral tube and a nut. The bottom plate and the cross beam are connected through the left stand column and the right stand column through the pin screws and the locking nuts, the cross beam can rotate around the pin screws arranged on the left stand column, and the cross beam can be locked through the locking nuts when the cross beam rotates to the position of the right stand column. The bottom plate is provided with a positioning counter bore for placing the base plate, the base plate is provided with a chip carrier groove and a positioning pin for placing a chip carrier, the shape and the size of the chip carrier groove are related to the number and the shape of chips needing to be welded simultaneously, the chip carrier is placed into the chip carrier groove of the base plate, the positioning plate is installed on the base plate through the positioning pin on the base plate, a soldering lug with the same size as the chip is cut into a positioning frame on the positioning plate, a positioning cover is placed into the positioning frame through the positioning pin on the base plate after the chip is placed into the positioning frame, and the positioning cover is provided with a needle pressing guide hole corresponding to the number and the position. A C-shaped elastic reed is riveted between a pressing pin and a pressing head through a conical rivet and then is arranged in a solenoid, a cylindrical spring, a screw rod and a nut are respectively and sequentially arranged in the solenoid, an assembly is arranged in a threaded hole corresponding to a cross beam, the pressing pin is aligned to a corresponding guide hole on a positioning cover, the height of the solenoid is adjusted, the screw rod is adjusted to control the pressure of the cylindrical spring, and the pressure of the pressing pin on a chip is enabled to be within an allowable range. The pressing pins can not contact the chip at the same time due to the small difference between the length of the pressing pins and the thickness of the chip, so that the bottom surfaces of the pressing pins can not contact the upper surface of the chip, the defects can be overcome by the action of the C-shaped elastic reed, the bottom surfaces of the pressing pins can contact the upper surface of the chip, and acting force can be applied to the chip. And after the assembly is finished, the aluminum alloy plate can be placed on a welding table in an eutectic furnace for welding.

The chip carrier groove on the substrate is matched with the shape, the number and the size of the chips to be welded.

The chip positioning frame on the positioning plate is matched with the shape, the number and the size of the chips to be welded.

The number and the position of the guide holes on the positioning cover are matched with the position and the number of the chips to be welded.

The positioning pin on the base plate is matched with the positioning plate and the positioning pin hole on the positioning cover in position and size.

The number and the positions of the pressing pins and the C-shaped elastic reeds are matched with the number and the position sizes of chips to be welded.

The size of the indenter is related to the number and size of the chips.

The inner diameter of the spiral pipe is matched with the shapes and the sizes of the pressure head, the cylindrical spring and the screw rod.

The outer diameter of the solenoid is matched with the size of a threaded hole in the cross beam.

The bottom plate, the left upright post, the right upright post and the cross beam are connected through pin screws, locking nuts and inner hexagonal screws.

As shown in fig. 1 to 12, an embodiment of the present invention discloses a chip pressure welding tool, which includes a substrate 1, a left column 2, a beam 3, a pin screw 4, a nut 5, a fastening nut 6, a screw 7, a cylindrical spring 8, a screw tube 9, a locking nut 10, a right column 11, an internal hexagonal screw 12, a spring washer 13, a conical rivet 14, a pressing head 15, a C-shaped elastic reed 16, a pressing pin 17, a positioning pin 18, a positioning cover 19, a positioning plate 20, a substrate 21, a chip 22, a soldering lug 23, and a chip carrier 24. As shown in fig. 1(a), 1(b) and 1(c), the left upright 2 and the right upright 11 are mounted on the base plate 1 and fastened and connected by a screw 12 and a spring washer 13 through a counter bore 155, and the cross beam 3 is mounted on the left upright 2 and the right upright 11 and connected by a pin screw 4 and a lock nut 10. The base plate 21 is arranged on the bottom plate 1 and is positioned with the positioning counter bore 150 on the bottom plate 1 through the positioning round platform 30 on the base plate 21, the pin hole 35 on the base plate 21 is provided with the positioning pin 18, the chip carrier 24 is arranged in the chip carrier groove 25 of the base plate, the positioning plate 20 is arranged on the base plate 21 through the positioning pin 18, the soldering lug 23 and the chip 24 are arranged in the two chip positioning frames 45 on the positioning plate, and then the positioning cover 19 is arranged on the positioning plate 20 through the positioning pin 18. C-shaped elastic reeds 16 are riveted between the pressing pins 17 and the pressing head 15 through conical rivets 14 and then are arranged into the spiral tube 9, cylindrical springs 8, screw rods 7 and nuts 5 are respectively and sequentially arranged in the spiral tube 9, the assembly is arranged in the threaded holes 145 corresponding to the cross beam 3, the pressing pins 17 are aligned to the corresponding guide holes 55 on the positioning cover 19, the height of the spiral tube is adjusted, and the pressure of the cylindrical springs 8 is controlled by the adjusting screws 7 so that the pressure of the pressing pins to the chip is within an allowable range.

As shown in fig. 3, the substrate 21 in this embodiment is centrally provided with a chip carrier recess 25 matching the shape and size of the chip carrier to be soldered and a pin hole 35 for mounting the positioning pin 18.

As shown in fig. 4, the positioning plate 20 of the present embodiment is centrally provided with a chip positioning frame 45 matching the number and size of chips to be soldered, and positioning pin holes 50.

As shown in fig. 5, the positioning cover 19 of the present embodiment is provided with positioning pin holes 60 matching with the positioning pin holes 35, 50 of the base plate 21 and the positioning plate 20, and pin guiding holes 55 matching with the number and the position size of the chips to be soldered.

As shown in fig. 6, in the present embodiment, the C-shaped spring plate 16 is provided at the upper portion with a rivet hole 70 matching with the rivet hole 100 of the indenter 15, and at the lower portion with a rivet hole 75 matching with the rivet hole 80 of the indenter 17.

As shown in fig. 7, the upper portion of the pressing pin 17 in this embodiment is provided with a rivet hole 80 matching with the conical rivet 14, and a cylindrical surface 85 of the pressing pin 17 matches with the pressing pin guide hole 55 of the positioning cover 19.

As shown in fig. 8, the lower part of the ram 15 in this embodiment is provided with a rivet hole 100 matching with the conical rivet 14, and the

cylindrical surfaces

95, 110 match with

holes

120, 130 on the screw tube 9.

As shown in fig. 9, the outer circle of the screw tube 9 in this embodiment is provided with an external thread 125 matching with a threaded hole 145 on the beam 3, and the center is provided with stepped

holes

120, 130 matching with the

cylindrical surfaces

95, 110 on the pressure head 15 and the

cylindrical surfaces

135, 140 on the screw 7.

As shown in fig. 10, the screw 7 of the present embodiment is provided with an external thread 135 on the outer circumference thereof for matching with the threaded hole of the nut 5, and a shoulder 140 on the lower end thereof for matching with the cylindrical surface 120 of the screw tube 9.

As shown in fig. 11, the cross beam 3 in this embodiment is provided with a threaded hole 145 matching with the external thread 125 of the screw tube 9, a pin hole 146 matching with the pin screw 4 is provided at the left end, and an open long groove 147 corresponding to the right upright post 11 is provided at the right end.

As shown in fig. 12, the bottom plate 1 in this embodiment is provided with a counter bore 150 corresponding to the positioning circular truncated cone 30 on the base plate 21, and is provided with counter bores 155 at the bottom surfaces of both ends to be connected with the left column 2 and the right column 11 by

fasteners

12, 13.

The tool designed by the embodiment can be designed according to the number of chips to be welded and the shape and the size of the chips, and the design principle is unchanged.

According to the structural description, the components are assembled in a butt joint mode according to the functions as shown in figure 1, the cross beam 3 and the bottom plate 1 are connected through the left upright post 2 and the right upright post 11 by the pin screws 4 and the

fasteners

12 and 13, the cross beam 3 can rotate around the pin screws 4, and when the cross beam is rotated to the right upright post 11, the cross beam is locked through the locking nuts 10. The cylindrical pins 18 are placed in the positioning pin holes 35 of the base plate 21 and then placed in the counter bores 150 of the base plate 1, the chip carriers 24 are placed in the grooves 25 of the base plate 21, and then the positioning plate 20 is placed on the base plate 21 through the positioning pin holes 50. After the bonding pads 23 and the chips 22 are sequentially mounted in the chip positioning frames 45 on the positioning plate 20, the positioning cover 19 is mounted on the substrate 21 through the positioning pins 18. The C-shaped elastic spring piece 16 is respectively riveted with the hole 100 on the pressure head 15 and the hole 80 on the pressure pin 17 through the

holes

70 and 75 by the conical rivet 14, the C-shaped elastic spring piece is arranged into the

inner holes

120 and 130 of the screw tube 9, and the cylindrical spring 8 and the screw 7 are arranged in the screw tube 9 and then the nut 5 is arranged. After the screw tube 9 assembly is assembled, the screw tube 9 assembly is arranged in the threaded hole 145 of the cross beam 3, the press pin 17 is aligned with the press pin guide hole 55 on the positioning cover 19, the bottom surface 90 of the press pin 17 is slowly contacted with the chip 22 through the guide hole 55, and the screw 7 is adjusted to apply proper pressure on the chip 22 through the cylindrical spring 8 and the C-shaped elastic spring 16. After the adjustment is completed, the screw 7 is locked by the nut 6. The tool is assembled by this time.

The pressurizing tool for chip welding is introduced to apply pressure to the chip simultaneously, the force is applied to the spring through the screw, the C-shaped elastic reeds are respectively connected with the pressing pins, and the pressing pins are respectively contacted with the chip through elastic deformation, so that the defect that the pressing pins cannot be contacted with the chip simultaneously due to errors caused by manufacturing of the pressing pins is overcome, and the chip is easily damaged by applying pressure through tweezers during manual welding.

In summary, the chip welding and pressurizing tool has the following advantages:

firstly, a plurality of chips can be welded simultaneously, and the risk of damage to the chips caused by multiple times of heating is reduced.

And secondly, the cylindrical spring and the C-shaped elastic reed are used for applying pressure to the chip through the pressure respectively, so that the damage to the chip caused by the application of the pressure by using tweezers in manual welding is avoided.

While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.

Claims

1. The utility model provides a pressurization welding frock is once carried out to multicore piece, includes bottom plate, stand, crossbeam, base plate, locating plate, location lid, tucking and pressure head, its characterized in that: the cross beam is fixedly connected above the bottom plate through the upright post; the substrate is arranged on the bottom plate, and a chip carrier groove for placing a chip carrier is arranged on the substrate; the positioning plate is arranged on the base plate, a positioning frame which is communicated up and down is arranged on the positioning plate, and the shape of the positioning frame is the same as that of the spliced chips which need to be welded simultaneously; the soldering lug and the chip with the same size as the chip are sequentially arranged in the positioning frame; the upper part of the positioning plate is sealed by a positioning cover, and the positioning cover is provided with needle pressing guide holes corresponding to the number and the positions of the chips; the pressure head install on the crossbeam, and the pressure head height can be adjusted, the same tucking one end with chip quantity passes tucking guiding hole extrusion chip, the other end links firmly through extrusion spring and pressure head.

2. The multi-chip one-time pressure welding tool according to claim 1, characterized in that: the upper end of the pressure head is fixedly connected with the lower end of a screw rod through an extrusion spring, the screw rod is arranged in a solenoid, and the upper end of the screw rod is fixedly connected with the upper end of the solenoid through a nut; the solenoid is a hollow cylinder provided with external threads, and the outer wall of the solenoid is in threaded connection with the through hole in the cross beam.

3. The multi-chip one-time pressure welding tool according to claim 1, characterized in that: one end of the cross beam is provided with a through hole which is communicated up and down, and the other end of the cross beam is provided with a long groove which is communicated up and down and is opened laterally; after the pin screw penetrates through the through hole, one end of the cross beam is installed at the upper end of one upright post, and the cross beam can rotate around the axis of the upright post; and the upper end of the other upright post on the bottom plate is a stud, and when the cross beam rotates to the position that the stud is arranged in the long groove, a locking nut is arranged on the stud to fix the cross beam.

4. The multi-chip one-time pressure welding tool according to claim 1, characterized in that: the bottom plate on be provided with the location counter bore of laying the base plate, base plate lower surface arch have the location round platform, with the location counter bore matching of bottom plate.

5. The multi-chip one-time pressure welding tool according to claim 1, characterized in that: the base plate, the positioning plate and the positioning cover are fixedly connected through the positioning pin.

6. The multi-chip one-time pressure welding tool according to claim 1, characterized in that: and a C-shaped elastic reed is adopted as a spring between the pressure head and the pressure pin.