CN113654015A - Illumination module and display device - Google Patents
Illumination module and display device Download PDFInfo
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- CN113654015A CN113654015A CN202010361270.0A CN202010361270A CN113654015A CN 113654015 A CN113654015 A CN 113654015A CN 202010361270 A CN202010361270 A CN 202010361270A CN 113654015 A CN113654015 A CN 113654015A
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- Prior art keywords
- light emitting
- circuit board
- layer
- guide plate
- emitting diode
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses an illumination module and a display device. The circuit board is provided with an insulating layer, a metal layer and a circuit layer, wherein the insulating layer is arranged between the metal layer and the circuit layer, and the metal layer is provided with an opening exposing a part of the insulating layer. The light emitting diode has a light emitting surface and a non-light emitting surface, and the non-light emitting surface faces the metal layer. The light guide plate is parallel or approximately parallel to the circuit board and is adjacent to the light emitting surface of the light emitting diode, and the optical axis of the light emitting diode is coincident or approximately coincident with the symmetry axis of the light guide plate. The portion of the insulating layer is attached to the light guide plate by a waterproof adhesive. A display device comprising the illumination module is also provided. Because the metal layer of the circuit board is provided with a part of the opening which is exposed out of the insulating layer, thicker waterproof glue can be arranged between the part of the insulating layer and the light guide plate, thereby effectively preventing the light-emitting diode from being damaged by moisture.
Description
Technical Field
The invention relates to an illumination module and a display device comprising the same.
Background
Most of the existing lighting modules are free of waterproof structures, and are easily affected by water vapor, so that the circuit is short-circuited or rusted. Therefore, it is an urgent subject to be improved in the art how to improve the illumination module and the display device using the illumination module to have good waterproof performance.
Disclosure of Invention
The invention aims to provide an illuminating module and a display device with good waterproofness. Because the metal layer of the circuit board is provided with a part of the opening which is exposed out of the insulating layer, thicker waterproof glue can be arranged between the part of the insulating layer and the light guide plate, thereby effectively preventing the light-emitting diode from being damaged by moisture.
The invention provides an illumination module which comprises a circuit board, a light emitting diode, a light guide plate and waterproof glue. The circuit board is provided with an insulating layer, a metal layer and a circuit layer, wherein the insulating layer is arranged between the metal layer and the circuit layer, and the metal layer is provided with an opening exposing a part of the insulating layer. The light emitting diode has a light emitting surface and a non-light emitting surface, and the non-light emitting surface faces the metal layer. The light guide plate is parallel or approximately parallel to the circuit board and is adjacent to the light emitting surface of the light emitting diode, and the optical axis of the light emitting diode is coincident or approximately coincident with the symmetry axis of the light guide plate. The portion of the insulating layer is attached to the light guide plate by a waterproof adhesive.
According to some embodiments of the present invention, the circuit board further includes solder paste (solder paste) disposed between the non-light-emitting surface of the led and the metal layer.
According to some embodiments of the invention, the circuit board further includes a plating layer disposed between the solder paste and the metal layer.
According to some embodiments of the invention, the lighting module further comprises: and the first protective layer covers the metal layer and is laterally adjacent to the solder paste.
According to some embodiments of the invention, the lighting module further comprises: and the second protective layer covers the circuit layer.
According to some embodiments of the invention, the lighting module further comprises: the base material is parallel or approximately parallel to the circuit board, and the light guide plate is arranged between the circuit board and the base material.
According to some embodiments of the invention, the waterproof glue is further disposed between the light guide plate and the substrate.
According to some embodiments of the invention, the waterproof glue is further disposed between the circuit board and the substrate.
According to some embodiments of the present invention, the insulating layer has a via hole disposed therein, and the light emitting diode is electrically connected to the circuit layer through the metal layer and the via hole.
The present invention further provides a display device, comprising: the lighting module and the display panel fixed on one surface of the light guide plate.
The present invention also provides a lighting module comprising: circuit board, emitting diode, light guide plate and waterproof glue. The circuit board has a thin portion. The light emitting diode is adjacent to the thin portion of the circuit board. The light emitting diode has a light emitting surface and a non-light emitting surface, and the non-light emitting surface faces the circuit board. The light guide plate is parallel or approximately parallel to the circuit board and is adjacent to the light emitting surface of the light emitting diode. The thin part of the circuit board is adhered to the light guide plate through waterproof glue.
Compared with the prior art, the thickness of the thin part of the lighting module and the display device is thinner than that of other parts of the circuit board, so thicker waterproof glue can be arranged between the thin part and the light guide plate, and the light emitting diode is effectively prevented from being damaged by moisture.
Drawings
In order to make the aforementioned and other objects, features, and advantages of the present invention comprehensible, embodiments thereof, reference is made to the following detailed description taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic cross-sectional view illustrating an illumination module according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view illustrating an illumination module according to another embodiment of the invention.
Fig. 3 is a schematic cross-sectional view illustrating an illumination module according to another embodiment of the invention.
Fig. 4 is a schematic cross-sectional view illustrating a display device according to an embodiment of the invention.
Description of the main reference numerals:
100-lighting module, 110-circuit board, 110 p-plating, 110 s-tin paste, 110 t-thin part, 112-insulating layer, 112 v-via hole, 114-metal layer, 1142, 1144-opening, 116-circuit layer, 120-light emitting diode, 120 e-light emitting surface, 1202n, 1204n, 1206 n-non-light emitting surface, 130-light guide plate, 140, 1402, 1404, 1406-waterproof glue, 150-substrate, 1602-first protective layer, 1604-second protective layer, 1702-first adhesive layer, 1704-second adhesive layer, 200-display panel, 210-driving substrate, 220-front panel, 230-front protective layer, 240-waterproof glue and 300-glue layer.
Detailed Description
The following provides many different embodiments or examples of the invention to achieve different technical features of the provided subject matter. The elements and design of the following specific examples serve to simplify the present invention. These are, of course, merely examples and are not intended to be limiting. For example, the description discloses forming a first feature over a second feature, including embodiments in which the first feature and the second feature are formed in direct contact, and also including embodiments in which additional features are formed between the first feature and the second feature, i.e., the first feature and the second feature are not in direct contact. Moreover, repeated reference symbols and/or verbs may be used in various examples. These repeated symbols or words are provided for simplicity and clarity and are not intended to limit the relationship between the various embodiments and/or the described structures.
Furthermore, spatially relative terms, such as "lower," "upper," and the like, are used for convenience in describing the relative relationship of one element or feature to another element or feature in the figures. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The invention provides an illumination module, which can be applied to a backlight module or a front light module of a display panel. In some embodiments, the illumination module includes a light guide plate disposed on the back surface or the display surface of the display panel. Various embodiments of the lighting module will be detailed below.
Fig. 1 is a schematic cross-sectional view illustrating an illumination module according to an embodiment of the invention. The lighting module includes a circuit board 110, a light emitting diode 120, a light guide plate 130 and a waterproof adhesive 140.
The circuit board 110 has an insulating layer 112, a metal layer 114 and a circuit layer 116, wherein the insulating layer 112 is disposed between the metal layer 114 and the circuit layer 116. The metal layer 114 has an opening 1142 exposing a portion of the insulating layer 112.
In some embodiments, the circuit board is a dual layer board (e.g., circuit layer 116/insulating layer 112/metal layer 114 shown in fig. 1). In other embodiments, the circuit board is a three-layer board (e.g., second circuit layer/second insulating layer/first circuit layer/first insulating layer/metal layer, not shown) or a circuit board (not shown) having more than three layers of metal layers and circuit layers.
In some embodiments, the insulating layer 114 is a plastic substrate, such as Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), polytetrafluoroethylene (Teflon), Liquid Crystal Polymer (Liquid Crystal Polymer, LCP), Polyethylene (PE), Polypropylene (PP), Polystyrene (Polystyrene, PS), Polyvinyl Chloride (PVC), Nylon (Nylon or Polyamides), polymethyl methacrylate (PMMA), acryl (Acrylic), ABS plastic (Acrylic-Polyurethane-Styrene), phenol resin (Phenolic Resins), Epoxy resin (Epoxy), Polyester (Polyester), Silicone (Silicone), Polyurethane (Polyurethane), Polyurethane (PU), polyamide (paim), or any other suitable material.
In some embodiments, the metal layer 114 is a copper foil or other suitable metal foil. In some embodiments, the circuit layer 116 is formed by a metal material layer (e.g., copper foil or other suitable metal foil) through a patterning process, such as a photolithography process.
The light emitting diode 120 has a light emitting surface 120e and a non-light emitting surface. In some embodiments, referring to fig. 1, which shows a cross section of the lighting module, the led 120 has an emitting surface 120e and a plurality of non-emitting surfaces 1202n, 1204n and 1206n, wherein one of the non-emitting surfaces 1202n faces the metal layer 114. In some embodiments, the insulating layer 112 has a via 112v disposed in the insulating layer 112, and the light emitting diode 120 is electrically connected to the circuit layer 116 through the metal layer 114 and the via 112 v.
In some embodiments, the lighting module 100 includes a plurality of light emitting diodes (fig. 1 shows a cross section of only one light emitting diode 120 of the light emitting diodes), and the circuit board 110 and the light emitting diodes form a light bar.
The light guide plate 130 is parallel or substantially parallel to the circuit board 110 and abuts the light emitting surface 120e of the light emitting diode 120. As shown by the dotted line in fig. 1, the optical axis of the light emitting diode 120 coincides or substantially coincides with the symmetry axis of the light guide plate 130 to avoid light leakage.
In some embodiments, the height (or thickness) of the light emitting diode 120 is greater than or equal to the thickness of the light guide plate 130. In some embodiments, the height of the light emitting diode 120 and the thickness of the light guide plate 130 are between 2.5: 1 and 1.5: 1.
In some embodiments, the circuit board 110 further includes a solder paste (solder paste)110s disposed between the non-light-emitting surface 1202n of the light emitting diode 120 and the metal layer 114. In some embodiments, the circuit board 110 further includes a plating layer 110p disposed between the solder paste 110s and the metal layer 114. The aforementioned solder paste 110s and/or the plating layer 110p can be used to appropriately pad the light emitting diode 120 such that the optical axis of the light emitting diode 120 coincides with or substantially coincides with the symmetry axis of the light guide plate 130, as shown by the dotted line in fig. 1.
In some embodiments, waterproof glue 140 includes waterproof glues 1402, 1404, and 1406. The exposed portion of the insulating layer 112 is adhered to the light guide plate 130 through the waterproof adhesive 1402. In order to increase the waterproof effect, the thicker the waterproof adhesive is, the better the waterproof effect is, therefore, the invention provides the circuit board 110 with the step difference, the metal layer 114 of which has the opening 1142 to expose the portion of the insulating layer 112, and the thickness of the metal layer 114 is reduced, so that the thicker waterproof adhesive 1402 can be disposed between the portion of the insulating layer 112 and the light guide plate 130, thereby effectively preventing the light emitting diode 120 from being damaged by moisture. In an embodiment, the waterproof glue 140 may be, for example, a waterproof double-sided tape.
In some embodiments, lighting module 100 further comprises a first protective layer (cover layer)1602 covering metal layer 114 to protect metal layer 114 from moisture. In some embodiments, as shown in fig. 1, the first protective layer 1602 is laterally adjacent to the solder paste 110 s. In some embodiments, the lighting module 100 further includes a first attaching layer 1702, and the first protection layer 1602 is attached to the circuit board 110 through the first attaching layer 1702.
In some embodiments, the lighting module 100 further includes a second protective layer 1604 covering the circuit layer 116 to protect the circuit layer 116 from moisture. In some embodiments, the illumination module 100 further includes a second adhesion layer 1704 through which the second protection layer 1604 is adhered to the circuit board 110.
In some embodiments, the lighting module 100 further includes a substrate 150 parallel or substantially parallel to the circuit board 110, and the light guide plate 130 is interposed between the circuit board 110 and the substrate 150. In some embodiments, the substrate 150 includes a plastic substrate, such as, but not limited to, synthetic Mylar (Mylar), biaxially oriented polypropylene (BOPP), polyimide, polyethylene terephthalate, polyethylene naphthalate, polytetrafluoroethylene, liquid crystal polymer, polyethylene, polypropylene, polystyrene, polyvinyl chloride, nylon, polymethyl methacrylate, ABS plastic, phenol resin, epoxy resin, polyester, silicone, polyurethane, polyamide-imide, other suitable materials, or combinations thereof.
In some embodiments, the waterproof glue 1404 is disposed between the light guide plate 130 and the substrate 150 to effectively prevent the light emitting diodes 120 from being damaged by moisture.
In some embodiments, the waterproof adhesive 1406 is disposed between the circuit board 110 and the substrate 150 to effectively prevent the led 120 from being damaged by moisture. In some embodiments, the waterproof glue 1406 is attached between the first protection layer 1602 and the substrate 150.
Fig. 2 is a schematic cross-sectional view illustrating an illumination module according to another embodiment of the invention. The difference between fig. 2 and fig. 1 is that the metal layer 114 of fig. 2 has another opening 1144 exposing another portion of the insulating layer 112, and the lighting module of fig. 2 does not include the first protection layer 1602 and the first adhesion layer 1702 shown in fig. 1, so the waterproof glue 1406 of fig. 2 is adhered between the another portion of the insulating layer 112 and the substrate 150.
Fig. 3 is a schematic cross-sectional view illustrating an illumination module according to another embodiment of the invention. The difference between fig. 3 and fig. 1 is that the plating layer 110p shown in fig. 1 is not disposed above the metal layer 114 in fig. 3, so the solder paste 110s in fig. 3 is directly formed on the metal layer 114 and directly contacts the metal layer 114. The thickness of the solder paste 110s is adjusted according to the specific thickness of the light guide plate 130 and the thickness of the waterproof adhesive 1402 (e.g., waterproof double-sided tape) for achieving excellent waterproof performance, so that the optical axis of the led 120 coincides or substantially coincides with the symmetry axis of the light guide plate 130.
In other embodiments (not shown), the metal layer is provided with a thick enough plating layer, but is not provided with solder paste. The thickness of the coating is adjusted according to the specific thickness of the light guide plate and the thickness of the waterproof adhesive (e.g., waterproof double-sided tape) for achieving excellent waterproof performance, so that the optical axis of the light emitting diode coincides or substantially coincides with the symmetry axis of the light guide plate.
The invention also provides a display device. Fig. 4 is a schematic cross-sectional view illustrating a display device according to an embodiment of the invention. As shown in fig. 4, the display device includes an illumination module 100 and a display panel 200.
The lighting module 100 may be, for example, the lighting module shown in fig. 1 to 3. The lighting module 100 shown in fig. 4 is an example of the lighting module shown in fig. 1.
The display panel 200 is fixed on a surface of the light guide plate 130 of the illumination module 100. In some embodiments, the display panel 200 is a Liquid crystal display panel (Liquid crystal display panel), an Organic light-emitting display panel (Organic light-emitting display panel), or an Electrophoretic display panel (Electrophoretic display panel).
In some embodiments, the display panel 200 is fixed on the light guide plate 130 by the adhesive layer 300. In some embodiments, the glue layer 300 is an Optical Clear Adhesive (OCA).
In some embodiments, the display panel 200 includes a driving substrate 210, a front panel 220, a front protective layer 230, and a waterproof adhesive 240.
In some embodiments, the driving panel 210 is a thin film transistor array substrate. In some embodiments, the driving substrate 210 includes a flexible substrate (not shown) and a driving circuit (not shown) disposed thereon. In some embodiments, the flexible substrate comprises polyimide, polyethylene terephthalate or polyethylene naphthalate, or polymethyl methacrylate.
In some embodiments, the front panel 220 includes an electrophoretic display layer (not shown) and a driving electrode layer (not shown) disposed above the electrophoretic display layer. In another embodiment, the front panel 220 may include an organic electroluminescent display layer.
In some embodiments, the front protection layer 230 is made of polyethylene terephthalate or polyethylene naphthalate. In some embodiments, the front protection layer 230 is directly attached to the front panel 220. In some embodiments, the water resistant glue 240 is a silicon-based or epoxy-based glue.
The invention also provides a lighting module. Fig. 1 is a schematic cross-sectional view illustrating an illumination module according to an embodiment of the invention. As shown in fig. 1, the lighting module includes a circuit board 110, a light emitting diode 120, a light guide plate 130 and a waterproof adhesive 140.
The circuit board 110 has a thin portion 110 t. In some embodiments, the circuit board is a double-layer board, which includes, for example, the circuit layer 116, the insulating layer 112, and the complete metal layer. After removing a portion of the complete metal layer, the metal layer 114 with the opening 1142 is formed. Below the opening 1142 is a thin portion 110t of the circuit board 110. The thin portion 110t has a step difference (or thickness difference) with other portions of the circuit board. In other embodiments, the depth of the opening may be arbitrarily adjusted as long as the thickness of the circuit board (i.e., the thin portion) below the opening is thinner than the other portions of the circuit board.
In other embodiments, the thin portion of the circuit board may be formed using other processes as long as the thickness of the thin portion is thinner than other portions of the circuit board. For example, a material layer may be formed over a portion of the circuit board, and another portion of the circuit board that is not covered by the material layer is a thin portion.
The light emitting diode 120 is adjacent to the thin portion 110t of the circuit board 110. The light emitting diode 120 has a light emitting surface 120e and a non-light emitting surface. In some embodiments, referring to fig. 1, the light emitting diode 120 has a light emitting surface 120e and a plurality of non-light emitting surfaces 1202n, 1204n and 1206n, wherein the non-light emitting surfaces 1202n face other portions (non-thin portions) of the circuit board 110. Further, as shown in fig. 1, the non-light emitting surface 1202n and the light emitting surface 120e of the light emitting diode 120 are adjacent to the thin portion 110t of the circuit board 110.
The light guide plate 130 is parallel or substantially parallel to the circuit board 110 and abuts the light emitting surface 120e of the light emitting diode 120.
The thin portion 110t of the circuit board 110 is adhered to the light guide plate 130 through the waterproof adhesive 1402. Since the thickness of the thin portion 110t is thinner than other portions of the circuit board, a thicker waterproof glue 1402 can be disposed between the thin portion 110t and the light guide plate 130, thereby effectively preventing the light emitting diode 120 from being damaged by moisture.
The foregoing briefly addresses the features of the various embodiments so that those skilled in the art may better understand the aspects of the present invention. Those skilled in the art should appreciate that they may readily use the present invention as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (11)
1. A lighting module, comprising:
the circuit board is provided with an insulating layer, a metal layer and a circuit layer, wherein the insulating layer is arranged between the metal layer and the circuit layer, and the metal layer is provided with an opening which exposes one part of the insulating layer;
a light emitting diode having a light emitting surface and a non-light emitting surface, the non-light emitting surface facing the metal layer;
the light guide plate is parallel or approximately parallel to the circuit board and is adjacent to the light emitting surface of the light emitting diode, and the optical axis of the light emitting diode is coincident or approximately coincident with the symmetry axis of the light guide plate; and
a waterproof glue through which the portion of the insulating layer is adhered to the light guide plate.
2. The lighting module of claim 1, wherein the circuit board further comprises solder paste disposed between the non-light emitting face of the light emitting diode and the metal layer.
3. The lighting module of claim 2, wherein the circuit board further comprises a plating layer disposed between the solder paste and the metal layer.
4. The lighting module of claim 2, further comprising:
a first protective layer covering the metal layer and laterally adjacent to the solder paste.
5. The lighting module of claim 1, further comprising:
and the second protective layer covers the circuit layer.
6. The lighting module of claim 1, further comprising:
the base material is parallel to the circuit board, and the light guide plate is arranged between the circuit board and the base material.
7. The lighting module of claim 6, wherein the waterproof glue is further disposed between the light guide plate and the substrate.
8. The lighting module of claim 6, wherein the waterproof glue is further disposed between the circuit board and the substrate.
9. The lighting module of claim 1, wherein the insulating layer has a via disposed therein, and the light emitting diode is electrically connected to the circuit layer through the metal layer and the via.
10. A display device, comprising:
the lighting module of claim 1; and
and the display panel is fixed on the surface of the light guide plate.
11. A lighting module, comprising:
a circuit board having a thin portion;
a light emitting diode adjacent the thin portion of the circuit board, the light emitting diode having an emitting face and a non-emitting face, the non-emitting face facing the circuit board;
a light guide plate parallel or substantially parallel to the circuit board and abutting the light emitting surface of the light emitting diode; and
a waterproof adhesive through which the thin portion of the circuit board is attached to the light guide plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010361270.0A CN113654015B (en) | 2020-04-30 | 2020-04-30 | Lighting module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010361270.0A CN113654015B (en) | 2020-04-30 | 2020-04-30 | Lighting module and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113654015A true CN113654015A (en) | 2021-11-16 |
| CN113654015B CN113654015B (en) | 2023-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010361270.0A Active CN113654015B (en) | 2020-04-30 | 2020-04-30 | Lighting module and display device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972380A (en) * | 2014-05-28 | 2014-08-06 | 阿博建材（昆山）有限公司 | LED (light-emitting diode) circuit board |
| CN208011416U (en) * | 2018-01-31 | 2018-10-26 | 育笙科技（深圳）有限公司 | A kind of panel light waterproof construction |
| CN109404774A (en) * | 2017-08-15 | 2019-03-01 | 元太科技工业股份有限公司 | Water-proof illuminant module and display device |
| KR20190060912A (en) * | 2017-11-24 | 2019-06-04 | 삼성디스플레이 주식회사 | Backlight assembly and display device including the same and method of menufacturing the same |
| CN109917598A (en) * | 2017-12-13 | 2019-06-21 | 元太科技工业股份有限公司 | Flexible display device and its manufacturing method |
-
2020
- 2020-04-30 CN CN202010361270.0A patent/CN113654015B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972380A (en) * | 2014-05-28 | 2014-08-06 | 阿博建材（昆山）有限公司 | LED (light-emitting diode) circuit board |
| CN109404774A (en) * | 2017-08-15 | 2019-03-01 | 元太科技工业股份有限公司 | Water-proof illuminant module and display device |
| KR20190060912A (en) * | 2017-11-24 | 2019-06-04 | 삼성디스플레이 주식회사 | Backlight assembly and display device including the same and method of menufacturing the same |
| CN109917598A (en) * | 2017-12-13 | 2019-06-21 | 元太科技工业股份有限公司 | Flexible display device and its manufacturing method |
| CN208011416U (en) * | 2018-01-31 | 2018-10-26 | 育笙科技（深圳）有限公司 | A kind of panel light waterproof construction |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113654015B (en) | 2023-06-09 |
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