TWI631297B - Waterproof light emitting module and display device - Google Patents
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Abstract
提供一種防水發光模組，包含：電路板；發光二極體，位於電路板上方，發光二極體具有發光面、第一不發光面及第二不發光面；導光板，鄰接發光二極體的發光面；以及防水層，包覆發光二極體的第一不發光面及第二不發光面，防水層包含黏著膠材、基材、導光板的凹陷部分、電路板的一部分或其組合。在此亦提供一種包含此防水發光模組的顯示裝置。 A waterproof light-emitting module includes: a circuit board; a light-emitting diode disposed above the circuit board; the light-emitting diode has a light-emitting surface, a first non-light-emitting surface, and a second non-light-emitting surface; and the light guide plate is adjacent to the light-emitting diode And a waterproof layer covering the first non-light emitting surface and the second non-light emitting surface of the light emitting diode, the waterproof layer comprising an adhesive material, a substrate, a concave portion of the light guide plate, a part of the circuit board, or a combination thereof . A display device including the waterproof lighting module is also provided herein.
Description
本發明係有關於一種防水發光模組及一種防水顯示裝置。 The invention relates to a waterproof lighting module and a waterproof display device.
現有的發光模組大多無防水結構，容易遭受水氣影響，導致電路短路或鏽蝕。因此如何改良發光模組以及應用此發光模組的顯示裝置，使其具有良好的防水性，是本技術領域中亟欲改善的課題。 Most of the existing light-emitting modules have no waterproof structure and are easily affected by moisture and water, resulting in short circuit or rust of the circuit. Therefore, how to improve the light-emitting module and the display device to which the light-emitting module is applied to have good waterproofness is an object of improvement in the technical field.
本發明的目的在於提供一種防水性良好的發光二極體裝置、發光模組及顯示裝置。透過設置防水層包覆發光二極體，可有效防止發光二極體受水氣損害。 An object of the present invention is to provide a light-emitting diode device, a light-emitting module, and a display device which are excellent in water repellency. By providing a waterproof layer to cover the light-emitting diode, the light-emitting diode can be effectively prevented from being damaged by moisture.
本發明提供一種防水發光二極體裝置，包含：電路板；發光二極體，位於電路板上方，發光二極體具有接點；以及防水層，包覆發光二極體的接點，其中防水層包含黏著膠材、單面膠帶、雙面膠帶、塑膠基材或其組合。 The invention provides a waterproof light-emitting diode device, comprising: a circuit board; a light-emitting diode, located above the circuit board, the light-emitting diode has a contact; and a waterproof layer covering the contact of the light-emitting diode, wherein the waterproof The layer comprises an adhesive, a single-sided tape, a double-sided tape, a plastic substrate, or a combination thereof.
根據本發明一實施例，發光二極體具有發光 面，防水層未接觸發光面。 According to an embodiment of the invention, the light emitting diode has a light emitting The waterproof layer does not touch the light-emitting surface.
本發明提供一種防水發光模組，包含：電路板；發光二極體，位於電路板上方，發光二極體具有發光面、第一不發光面及第二不發光面；導光板，鄰接發光二極體的發光面；以及防水層，包覆發光二極體的第一不發光面及第二不發光面，防水層包含黏著膠材、基材、導光板的凹陷部分、電路板的一部分或其組合。 The invention provides a waterproof light-emitting module, comprising: a circuit board; a light-emitting diode, located above the circuit board, the light-emitting diode has a light-emitting surface, a first non-light-emitting surface and a second non-light-emitting surface; the light guide plate is adjacent to the light-emitting layer a light emitting surface of the polar body; and a waterproof layer covering the first non-light emitting surface and the second non-light emitting surface of the light emitting diode, the waterproof layer comprising an adhesive material, a substrate, a concave portion of the light guide plate, a part of the circuit board or Its combination.
根據本發明一實施例，防水層包含黏著膠材及基材，黏著膠材接觸電路板並包覆發光二極體的第一不發光面，基材接觸黏著膠材並包覆發光二極體的第二不發光面。 According to an embodiment of the invention, the waterproof layer comprises an adhesive material and a substrate, the adhesive material contacts the circuit board and covers the first non-light emitting surface of the light emitting diode, and the substrate contacts the adhesive material and encapsulates the light emitting diode. The second non-lighting surface.
根據本發明一實施例，防水層更包含雙面膠帶，基材透過雙面膠帶固定於導光板上。 According to an embodiment of the invention, the waterproof layer further comprises a double-sided tape, and the substrate is fixed to the light guide plate through the double-sided tape.
根據本發明一實施例，防水層包含單面膠帶、雙面膠帶及基材，基材透過雙面膠帶固定於電路板上，基材包覆發光二極體的第一不發光面，單面膠帶接觸基材並包覆發光二極體的第二不發光面。 According to an embodiment of the invention, the waterproof layer comprises a single-sided tape, a double-sided tape and a substrate, and the substrate is fixed on the circuit board through the double-sided tape, and the substrate covers the first non-light emitting surface of the light emitting diode, and the single side The tape contacts the substrate and covers the second non-illuminating surface of the light emitting diode.
根據本發明一實施例，基材更包覆發光二極體的發光面。 According to an embodiment of the invention, the substrate further covers the light emitting surface of the light emitting diode.
根據本發明一實施例，防水層包含雙面膠帶及基材，基材具有凹陷部分包覆發光二極體的第一不發光面及第二不發光面，且更包覆發光面，基材透過雙面膠帶固定於電路板上。 According to an embodiment of the invention, the waterproof layer comprises a double-sided tape and a substrate, the substrate has a first non-emitting surface and a second non-emitting surface that are recessed to cover the light-emitting diode, and further covers the light-emitting surface, and the substrate Secure to the board with double-sided tape.
根據本發明一實施例，防水層包含雙面膠帶及導光板的凹陷部分，導光板的凹陷部分包覆發光二極體的第 一不發光面及第二不發光面，且更包覆發光面，導光板透過雙面膠帶固定於電路板上。 According to an embodiment of the invention, the waterproof layer comprises a double-sided tape and a recessed portion of the light guide plate, and the recessed portion of the light guide plate covers the second portion of the light-emitting diode A non-illuminating surface and a second non-illuminating surface, and further covering the light emitting surface, the light guide plate is fixed on the circuit board through the double-sided tape.
根據本發明一實施例，防水層包含雙面膠帶及電路板的部分，電路板的部分包覆發光二極體的第一不發光面及第二不發光面，電路板的部分透過雙面膠帶固定於導光板上。 According to an embodiment of the invention, the waterproof layer comprises a double-sided tape and a portion of the circuit board, and the portion of the circuit board covers the first non-light emitting surface and the second non-light emitting surface of the light emitting diode, and the portion of the circuit board passes through the double-sided tape Fixed to the light guide plate.
根據本發明一實施例，防水層包含雙面膠帶及基材，基材包覆發光二極體的第一不發光面及第二不發光面，且更包覆電路板，基材透過雙面膠帶固定於導光板上。 According to an embodiment of the invention, the waterproof layer comprises a double-sided tape and a substrate, the substrate covers the first non-emitting surface and the second non-emitting surface of the LED, and further covers the circuit board, and the substrate passes through both sides. The tape is fixed to the light guide plate.
本發明更提供一種防水顯示裝置，包含：上述之防水發光模組；顯示面板，固定於導光板的第一表面上；以及保護層，固定於導光板的第二表面上，第二表面與第一表面彼此相對。 The present invention further provides a waterproof display device comprising: the waterproof light emitting module; the display panel fixed on the first surface of the light guide plate; and the protective layer fixed on the second surface of the light guide plate, the second surface and the first surface A surface is opposite to each other.
110、210‧‧‧電路板 110, 210‧‧‧ circuit board
120、220‧‧‧發光二極體 120, 220‧‧‧Lighting diode
122‧‧‧接點 122‧‧‧Contacts
120e、220e‧‧‧發光面 120e, 220e‧‧‧ luminous surface
2201‧‧‧第一不發光面 2201‧‧‧The first non-illuminating surface
2202‧‧‧第二不發光面 2202‧‧‧second non-illuminating surface
130、230‧‧‧防水層 130, 230‧‧‧Waterproof layer
132‧‧‧第一防水層 132‧‧‧First waterproof layer
134‧‧‧第二防水層 134‧‧‧Second waterproof layer
136‧‧‧第三防水層 136‧‧‧ third waterproof layer
138‧‧‧第四防水層 138‧‧‧4th waterproof layer
232‧‧‧黏著膠材 232‧‧‧Adhesive
232d‧‧‧雙面膠帶 232d‧‧‧double-sided tape
232s‧‧‧單面膠帶 232s‧‧‧Single-sided tape
234‧‧‧基材 234‧‧‧Substrate
234a‧‧‧凹陷部分 234a‧‧‧ recessed part
240‧‧‧導光板 240‧‧‧Light guide plate
240a‧‧‧凹陷部分 240a‧‧‧ recessed part
2401‧‧‧第一表面 2401‧‧‧ first surface
2402‧‧‧第二表面 2402‧‧‧ second surface
200‧‧‧防水發光模組 200‧‧‧Waterproof lighting module
300‧‧‧顯示面板 300‧‧‧ display panel
400‧‧‧保護層 400‧‧‧Protective layer
502、504‧‧‧膠層 502, 504‧‧ ‧ adhesive layer
2-2’‧‧‧線段 2-2’‧‧‧ segments
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下： The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
第1圖繪示根據本發明數個實施例之一種防水發光二極體裝置的俯視示意圖。 FIG. 1 is a schematic top plan view of a waterproof light emitting diode device according to several embodiments of the present invention.
第2圖繪示根據本發明數個實施例之防水發光二極體裝置沿第1圖剖面線2-2’的剖面示意圖。 Fig. 2 is a cross-sectional view showing the waterproof light-emitting diode device according to a plurality of embodiments of the present invention taken along line 2-2' of Fig. 1.
第3圖繪示根據本發明數個實施例之防水發光二極體裝置的剖面示意圖。 3 is a cross-sectional view showing a waterproof light emitting diode device according to several embodiments of the present invention.
第4圖繪示根據本發明數個實施例之防水發光二極 體裝置的剖面示意圖。 4 is a diagram showing a waterproof light-emitting diode according to several embodiments of the present invention. Schematic diagram of the body device.
第5至14圖繪示根據本發明數個實施例之防水發光模組的剖面示意圖。 5 to 14 are cross-sectional views showing a waterproof light emitting module according to several embodiments of the present invention.
第15圖繪示根據本發明數個實施例之防水顯示裝置的剖面示意圖。 Figure 15 is a cross-sectional view showing a waterproof display device according to several embodiments of the present invention.
以下提供本揭露之多種不同的實施例或實例，以實現所提供之標的的不同技術特徵。下述具體實例的元件和設計用以簡化本揭露。當然，這些僅為示例，而非用以限定本揭露。舉例而言，說明書中揭示形成第一特徵結構於第二特徵結構之上方，其包括第一特徵結構與第二特徵結構形成而直接接觸的實施例，亦包括於第一特徵結構與第二特徵結構之間另有其他特徵結構的實施例，亦即，第一特徵結構與第二特徵結構並非直接接觸。此外，本揭露於各個實例中可能用到重複的參考符號及/或用字。這些重複符號或用字係為了簡化與清晰的目的，並非用以限定各個實施例及/或所述結構之間的關係。 Various different embodiments or examples of the disclosure are provided below to achieve different technical features of the subject matter provided. The elements and design of the specific examples described below are intended to simplify the disclosure. Of course, these are merely examples and are not intended to limit the disclosure. For example, the disclosure discloses forming a first feature structure over the second feature structure, including an embodiment in which the first feature structure is formed in direct contact with the second feature structure, and is also included in the first feature structure and the second feature. Embodiments having other features between the structures, i.e., the first feature is not in direct contact with the second feature. In addition, repeated reference symbols and/or words may be used in the various embodiments. These repeated symbols or words are not intended to limit the relationship between the various embodiments and/or the structures.
另外，空間相對用語，如「下」、「上」等，是用以方便描述一元件或特徵與其他元件或特徵在圖式中的相對關係。這些空間相對用語旨在包含除了圖式中所示之方位以外，裝置在使用或操作時的不同方位。裝置可被另外定位(例如旋轉90度或其他方位)，而本文所使用的空間相對敘述亦可相對應地進行解釋。 In addition, spatially relative terms such as "lower" and "upper" are used to describe the relative relationship of an element or feature to other elements or features in the drawings. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the drawings. The device can be otherwise positioned (e.g., rotated 90 degrees or other orientation), and the spatially relative descriptions used herein can also be interpreted accordingly.
本發明提供一種防水發光二極體裝置。透過設置防水層包覆發光二極體的接點，可有效防止接點受水氣損害。以下將詳述防水發光二極體裝置的數個實施例。 The invention provides a waterproof light emitting diode device. By providing a waterproof layer covering the contacts of the light-emitting diode, the contact can be effectively prevented from being damaged by moisture. Several embodiments of the waterproof light-emitting diode device will be described in detail below.
第1圖繪示根據本發明數個實施例之一種防水發光二極體裝置的俯視示意圖。防水發光二極體裝置包含電路板110、發光二極體120以及防水層130。此防水發光二極體裝置亦可稱為防水燈條。需注意的是，雖然第1圖繪示的防水層130包覆單一發光二極體120的接點，但本技術領域通常知識者可理解的是，延長此防水層的結構，可同時包覆多個發光二極體的接點。 FIG. 1 is a schematic top plan view of a waterproof light emitting diode device according to several embodiments of the present invention. The waterproof LED device includes a circuit board 110, a light emitting diode 120, and a waterproof layer 130. The waterproof LED device can also be referred to as a waterproof light bar. It should be noted that although the waterproof layer 130 illustrated in FIG. 1 covers the contacts of the single light-emitting diode 120, it is generally understood by those skilled in the art that the structure of the waterproof layer can be coated at the same time. A junction of a plurality of light emitting diodes.
在一些實施例中，電路板110為軟性印刷電路板(flexible printed circuit,FPC)、硬質的印刷電路板(printed circuit board,PCB)或其組合。 In some embodiments, the circuit board 110 is a flexible printed circuit (FPC), a hard printed circuit board (PCB), or a combination thereof.
發光二極體120位於電路板110上方。發光二極體120可為頂發光或側發光。在一些實施例中，發光二極體為側發光，具有發光面120e，如第1圖所示。發光二極體120具有至少一接點122。接點122亦可稱為焊接點。在一些實施例中，發光二極體120的接點122介於發光二極體120的底面與電路板110之間。 The light emitting diode 120 is located above the circuit board 110. The light emitting diode 120 can be a top light or a side light. In some embodiments, the light emitting diode is side illuminating and has a light emitting surface 120e as shown in FIG. The light emitting diode 120 has at least one contact 122. Contact 122 may also be referred to as a solder joint. In some embodiments, the contacts 122 of the LEDs 120 are interposed between the bottom surface of the LEDs 120 and the circuit board 110.
接點122含金屬材料，容易受水氣損害。因此，本發明提供防水層130包覆發光二極體120的接點122，以防止接點122受水氣損害。在一些實施例中，防水層130包含黏著膠材、單面膠帶、雙面膠帶、塑膠基材或其組合。在一些實施例中，塑膠基材包含聚醯亞胺(Polyimide，PI)、 聚乙烯對苯二甲酸酯(Polyethylene Terephthalate，PET)、鐵氟龍(Teflon)、液晶高分子(Liquid Crystal Polymer，LCP)、聚乙烯(Polyethylene，PE)、聚丙烯(Polypropylene，PP)、聚苯乙烯(Polystyrene，PS)、聚氯乙烯(Polyvinyl Chloride，PVC)、尼龍(Nylon or Polyamides)、聚甲基丙烯酸甲酯(Polymethylmethacrylate，PMMA)、ABS塑膠(Acrylonitrile-Butadiene-Styrene)、酚樹脂(Phenolic Resins)、環氧樹脂(Epoxy)、聚酯(Polyester)、矽膠(Silicone)、聚氨基甲酸乙酯(Polyurethane，PU)、聚醯胺-醯亞胺(polyamide-imide，PAI)或其組合，但不限於此。 The contact 122 contains a metal material and is easily damaged by moisture. Therefore, the present invention provides the waterproof layer 130 covering the contacts 122 of the LEDs 120 to prevent the contacts 122 from being damaged by moisture. In some embodiments, the waterproof layer 130 comprises an adhesive, a single sided tape, a double sided tape, a plastic substrate, or a combination thereof. In some embodiments, the plastic substrate comprises Polyimide (PI), Polyethylene terephthalate (PET), Teflon, Liquid Crystal Polymer (LCP), Polyethylene (PE), Polypropylene (PP), Poly Polystyrene (PS), polyvinyl chloride (PVC), nylon (Nylon or Polyamides), polymethylmethacrylate (PMMA), ABS plastic (Acrylonitrile-Butadiene-Styrene), phenolic resin ( Phenolic Resins), Epoxy, Polyester, Silicone, Polyurethane (PU), Polyamide-imide (PAI) or combinations thereof , but not limited to this.
第2圖繪示根據本發明數個實施例之防水發光二極體裝置沿第1圖剖面線2-2’的剖面示意圖。如第2圖所示，防水層130圍繞並接觸發光二極體120的接點122，以防止接點122受水氣損害。在一些實施例中，防水層130包含黏著膠材，包覆整個接點122，但黏著膠材未包覆整個發光二極體120。在一些實施例中，防水層130未接觸發光二極體120的發光面120e，因此不會影響到發光二極體120的出光特性。 Fig. 2 is a cross-sectional view showing the waterproof light-emitting diode device according to a plurality of embodiments of the present invention taken along line 2-2' of Fig. 1. As shown in FIG. 2, the waterproof layer 130 surrounds and contacts the contacts 122 of the LEDs 120 to prevent the contacts 122 from being damaged by moisture. In some embodiments, the waterproof layer 130 includes an adhesive material that covers the entire joint 122, but the adhesive material does not cover the entire light emitting diode 120. In some embodiments, the waterproof layer 130 does not contact the light emitting surface 120e of the light emitting diode 120, and thus does not affect the light emitting characteristics of the light emitting diode 120.
第3圖繪示根據本發明數個實施例之防水發光二極體裝置的剖面示意圖。如第3圖所示，防水層130圍繞但未接觸發光二極體120的接點。防水層130包含第一防水層132、第二防水層134及第三防水層136，其構成一密閉 空間。詳細而言，第一防水層132黏著電路板110，並且圍繞接點132。第二防水層134位於第一防水層132上方。以上視角度(未繪示)而言，第二防水層134圍繞局部的發光二極體120。第三防水層136黏著第二防水層134及發光二極體120的頂面。 3 is a cross-sectional view showing a waterproof light emitting diode device according to several embodiments of the present invention. As shown in FIG. 3, the waterproof layer 130 surrounds but does not contact the contacts of the light-emitting diode 120. The waterproof layer 130 includes a first waterproof layer 132, a second waterproof layer 134, and a third waterproof layer 136, which constitute a sealed space. In detail, the first waterproof layer 132 adheres to the circuit board 110 and surrounds the contacts 132. The second waterproof layer 134 is located above the first waterproof layer 132. The second waterproof layer 134 surrounds the local light-emitting diode 120 in terms of the above viewing angle (not shown). The third waterproof layer 136 adheres to the top surface of the second waterproof layer 134 and the light emitting diode 120.
在一些實施例中，第一防水層132為雙面膠帶、黏著膠材或其組合。在一些實施例中，第二防水層134為塑膠基材。在一些實施例中，此塑膠基材的上表面及下表面不具黏性。在其他實施例中，塑膠基材可替換為其他具防水性的基材，如金屬基材或合金基材。在一些實施例中，第三防水層136為單面膠帶。 In some embodiments, the first waterproof layer 132 is a double sided tape, an adhesive tape, or a combination thereof. In some embodiments, the second waterproof layer 134 is a plastic substrate. In some embodiments, the upper and lower surfaces of the plastic substrate are non-tacky. In other embodiments, the plastic substrate can be replaced with other water repellent substrates, such as metal substrates or alloy substrates. In some embodiments, the third waterproof layer 136 is a single sided tape.
第4圖繪示根據本發明數個實施例之防水發光二極體裝置的剖面示意圖。如第4圖所示，防水層130圍繞整個發光二極體120。防水層130包含第一防水層132、第二防水層134、第三防水層136及第四防水層138，其構成一密閉空間。詳細而言，第一防水層132黏著電路板110，並且圍繞整個發光二極體120。第二防水層134及第四防水層138位於第一防水層132上方。以上視角度(未繪示)而言，第二防水層134及第四防水層138構成一環形，圍繞整個發光二極體120。第三防水層136黏著第二防水層134、第四防水層138及發光二極體120的頂面。在其他實施例(未繪示)中，第三防水層黏著第二防水層及第四防水層，但未黏著發光二極體的頂面。 4 is a cross-sectional view showing a waterproof light emitting diode device according to several embodiments of the present invention. As shown in FIG. 4, the waterproof layer 130 surrounds the entire light emitting diode 120. The waterproof layer 130 includes a first waterproof layer 132, a second waterproof layer 134, a third waterproof layer 136, and a fourth waterproof layer 138, which constitute a sealed space. In detail, the first waterproof layer 132 adheres to the circuit board 110 and surrounds the entire light emitting diode 120. The second waterproof layer 134 and the fourth waterproof layer 138 are located above the first waterproof layer 132. In the above viewing angle (not shown), the second waterproof layer 134 and the fourth waterproof layer 138 form a ring shape surrounding the entire LED body 120. The third waterproof layer 136 adheres to the top surface of the second waterproof layer 134, the fourth waterproof layer 138, and the light emitting diode 120. In other embodiments (not shown), the third waterproof layer adheres to the second waterproof layer and the fourth waterproof layer, but does not adhere to the top surface of the light-emitting diode.
在一些實施例中，第一防水層132為雙面膠 帶、黏著膠材或其組合，黏著膠材可以是防水膠。在一些實施例中，第二防水層134為塑膠基材。第二防水層134可為透明或不透明的。在一些實施例中，第四防水層138為透明的塑膠基材。在一些實施例中，第四防水層138的材質為聚甲基丙烯酸甲酯。第四防水層138可接觸或不接觸發光面120e。在一些實施例中，第三防水層136為單面膠帶。在其他實施例(未繪示)中，第二防水層、第三防水層及第四防水層為相同材質，構成一體成形的防水殼。此防水殼可接觸或不接觸發光二極體的頂面。 In some embodiments, the first waterproof layer 132 is a double-sided tape The adhesive tape or the combination thereof may be a waterproof adhesive. In some embodiments, the second waterproof layer 134 is a plastic substrate. The second waterproof layer 134 can be transparent or opaque. In some embodiments, the fourth waterproof layer 138 is a transparent plastic substrate. In some embodiments, the fourth waterproof layer 138 is made of polymethyl methacrylate. The fourth waterproof layer 138 may or may not contact the light emitting surface 120e. In some embodiments, the third waterproof layer 136 is a single sided tape. In other embodiments (not shown), the second waterproof layer, the third waterproof layer, and the fourth waterproof layer are made of the same material, and constitute an integrally formed waterproof case. The waterproof case may or may not contact the top surface of the light emitting diode.
如第1至4圖所示，防水層130包覆接點122或整個發光二極體120，使環境水氣無法接觸接點122，以防止接點122受水氣損害。 As shown in FIGS. 1 to 4, the waterproof layer 130 covers the contacts 122 or the entire light emitting diode 120 so that the ambient moisture cannot contact the contacts 122 to prevent the contacts 122 from being damaged by moisture.
本發明另提供一種防水發光模組。此發光模組可應用於背光模組或前光模組。詳細而言，此發光模組包含導光板。導光板可位於顯示面板的背面上或顯示面上。以下將詳述防水發光模組的數個實施例。 The invention further provides a waterproof lighting module. The light emitting module can be applied to a backlight module or a front light module. In detail, the light emitting module includes a light guide plate. The light guide plate may be located on the back side of the display panel or on the display surface. Several embodiments of the waterproof lighting module will be described in detail below.
第5至14圖繪示根據本發明數個實施例之防水發光模組的剖面示意圖。防水發光模組包含電路板210、發光二極體220、導光板240及防水層230。防水層230係選自由黏著膠材、單面膠帶、雙面膠帶、基材、導光板的凹陷部分、電路板的一部分及其組合所構成的群組。基材可為塑膠基材、金屬基材、合金基材、其他合適的防水基材或其組合。在一些實施例(未繪示)中，防水發光模組包含多個發光二極體，而電路板及這些發光二極體構成燈條。為了清楚起 見，第5至14圖僅繪示單一發光二極體220。 5 to 14 are cross-sectional views showing a waterproof light emitting module according to several embodiments of the present invention. The waterproof light emitting module includes a circuit board 210, a light emitting diode 220, a light guide plate 240, and a waterproof layer 230. The waterproof layer 230 is selected from the group consisting of an adhesive tape, a single-sided tape, a double-sided tape, a substrate, a recessed portion of the light guide plate, a portion of the circuit board, and a combination thereof. The substrate can be a plastic substrate, a metal substrate, an alloy substrate, other suitable waterproof substrates, or a combination thereof. In some embodiments (not shown), the waterproof lighting module includes a plurality of light emitting diodes, and the circuit board and the light emitting diodes constitute a light bar. For clarity See, Figures 5 through 14 depict only a single light emitting diode 220.
請參照第5圖，防水發光模組包含電路板210、發光二極體220、導光板240及防水層230。 Referring to FIG. 5 , the waterproof light emitting module includes a circuit board 210 , a light emitting diode 220 , a light guide plate 240 , and a waterproof layer 230 .
發光二極體220位於電路板210上方。在一些實施例中，發光二極體220為側發光。發光二極體220具有發光面220e、第一不發光面2201及第二不發光面2202。發光面220e與第一不發光面2201彼此相對，第二不發光面2202連接於發光面220e與第一不發光面2201之間。如第5圖所示，第二不發光面2202亦可視為頂面。 The light emitting diode 220 is located above the circuit board 210. In some embodiments, the light emitting diode 220 is side illuminating. The light emitting diode 220 has a light emitting surface 220e, a first non-light emitting surface 2201, and a second non-light emitting surface 2202. The light emitting surface 220e and the first non-light emitting surface 2201 face each other, and the second non-light emitting surface 2202 is connected between the light emitting surface 220e and the first non-light emitting surface 2201. As shown in FIG. 5, the second non-light emitting surface 2202 can also be regarded as a top surface.
導光板240鄰接發光二極體220的發光面220e。在一些實施例中，導光板240固定於電路板210上。在一些實施例中，透過雙面膠帶232d將導光板240固定於電路板210上。 The light guide plate 240 is adjacent to the light emitting surface 220e of the light emitting diode 220. In some embodiments, the light guide plate 240 is fixed to the circuit board 210. In some embodiments, the light guide plate 240 is secured to the circuit board 210 by a double sided tape 232d.
值得注意的是，第5圖的防水層230包含黏著膠材232及基材234。黏著膠材232接觸電路板210並包覆發光二極體220的第一不發光面2201。基材234接觸黏著膠材232並包覆發光二極體220的第二不發光面2202。在一些實施例中，防水層230更包含雙面膠帶232d，基材234透過雙面膠帶232d固定於導光板240上。在其他實施例中，黏著膠材232可替換為雙面膠帶。 It should be noted that the waterproof layer 230 of FIG. 5 includes an adhesive 232 and a substrate 234. The adhesive material 232 contacts the circuit board 210 and covers the first non-light emitting surface 2201 of the light emitting diode 220. The substrate 234 contacts the adhesive material 232 and covers the second non-light emitting surface 2202 of the light emitting diode 220. In some embodiments, the waterproof layer 230 further includes a double-sided tape 232d, and the substrate 234 is fixed to the light guide plate 240 through the double-sided tape 232d. In other embodiments, the adhesive 232 can be replaced with a double sided tape.
接下來，請參照第6圖。如第6圖所示，防水層230包含單面膠帶232s、雙面膠帶232d及基材234。基材234透過雙面膠帶232d固定於電路板210上。基材234包覆發光二極體220的第一不發光面2201，單面膠帶232s接觸 基材234並包覆發光二極體220的第二不發光面2202。在一些實施例中，單面膠帶232s更包覆導光板240的表面(未標示)。 Next, please refer to Figure 6. As shown in FIG. 6, the waterproof layer 230 includes a single-sided tape 232s, a double-sided tape 232d, and a substrate 234. The substrate 234 is fixed to the circuit board 210 through the double-sided tape 232d. The substrate 234 covers the first non-light emitting surface 2201 of the light emitting diode 220, and the single-sided tape 232s contacts The substrate 234 covers the second non-light emitting surface 2202 of the light emitting diode 220. In some embodiments, the single-sided tape 232s further covers the surface (not labeled) of the light guide plate 240.
至於第7圖，其類似於第6圖。兩者的差異在於，第7圖的防水層230更包含另一雙面膠帶232d，其位於單面膠帶232s與導光板240之間。在其他實施例中，此另一雙面膠帶232d可替換為單面膠帶或黏著膠材。 As for the seventh figure, it is similar to the sixth figure. The difference between the two is that the waterproof layer 230 of FIG. 7 further includes another double-sided tape 232d between the single-sided tape 232s and the light guide plate 240. In other embodiments, the other double-sided tape 232d can be replaced with a single-sided tape or an adhesive tape.
至於第8圖，其類似於第6圖。兩者的差異在於，第8圖的基材234更包覆發光二極體220的發光面220e。換言之，基材234介於發光二極體220的發光面220e與導光板240之間。 As for the eighth figure, it is similar to the sixth figure. The difference between the two is that the substrate 234 of FIG. 8 further covers the light-emitting surface 220e of the light-emitting diode 220. In other words, the substrate 234 is interposed between the light emitting surface 220e of the light emitting diode 220 and the light guide plate 240.
接下來，請參照第9圖，防水層230包含雙面膠帶232d及基材234。基材透過雙面膠帶232d固定於電路板210上。基材234具有凹陷部分234a。凹陷部分234a除了包覆發光二極體220的第一不發光面2201及第二不發光面2202之外，還包覆發光二極體220的發光面220e。在一些實施例中，凹陷部分234a接觸發光二極體220的發光面220e。在一些實施例中，防水層230更包含單面膠帶232s，其接觸基材234並覆蓋導光板240的表面(未標示)。在一些實施例中，另一雙面膠帶232d位於單面膠帶232s與導光板240之間。在其他實施例(未繪示)中，此另一雙面膠帶232d可替換為單面膠帶或黏著膠材。 Next, referring to FIG. 9, the waterproof layer 230 includes a double-sided tape 232d and a substrate 234. The substrate is fixed to the circuit board 210 through the double-sided tape 232d. The substrate 234 has a recessed portion 234a. The recessed portion 234a covers the light-emitting surface 220e of the light-emitting diode 220 in addition to the first non-light-emitting surface 2201 and the second non-light-emitting surface 2202 of the light-emitting diode 220. In some embodiments, the recessed portion 234a contacts the light emitting surface 220e of the light emitting diode 220. In some embodiments, the waterproof layer 230 further includes a single-sided tape 232s that contacts the substrate 234 and covers the surface (not labeled) of the light guide plate 240. In some embodiments, another double sided tape 232d is located between the single sided tape 232s and the light guide plate 240. In other embodiments (not shown), this other double-sided tape 232d can be replaced with a single-sided tape or an adhesive tape.
至於第10圖，其類似於第9圖。兩者的差異在於，第10圖的基板234的頂面(未標示)是傾斜的。詳細而 言，基板234的頂面自靠近導光板240的一側往遠離導光板240的一側向上傾斜延伸。在一些實施例中，單面膠帶232s直接接觸導光板240的表面(未標示)。 As for the tenth figure, it is similar to the nineth figure. The difference between the two is that the top surface (not shown) of the substrate 234 of Fig. 10 is inclined. Detailed The top surface of the substrate 234 extends obliquely upward from a side close to the light guide plate 240 toward a side away from the light guide plate 240. In some embodiments, the single-sided tape 232s directly contacts the surface (not labeled) of the light guide plate 240.
接下來，請參照第11圖，防水層230包含雙面膠帶232d及導光板240的凹陷部分240a。導光板240透過雙面膠帶232d固定於電路板210上。導光板240的凹陷部分240a除了包覆發光二極體220的第一不發光面2201及第二不發光面2202之外，還包覆發光二極體220的發光面220e。在一些實施例中，防水層230更包含單面膠帶232s覆蓋導光板240的表面(未標示)。 Next, referring to FIG. 11, the waterproof layer 230 includes a double-sided tape 232d and a recessed portion 240a of the light guide plate 240. The light guide plate 240 is fixed to the circuit board 210 through the double-sided tape 232d. The recessed portion 240a of the light guide plate 240 covers the light emitting surface 220e of the light emitting diode 220 in addition to the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the light emitting diode 220. In some embodiments, the waterproof layer 230 further includes a single-sided tape 232s covering the surface (not labeled) of the light guide plate 240.
至於第12圖，其類似於第11圖。兩者的差異在於，第12圖的導光板240的頂面(未標示)是傾斜的。詳細而言，導光板240的頂面自靠近發光面220e的一側往背對發光面220e的一側向上傾斜延伸。 As for Fig. 12, it is similar to Fig. 11. The difference between the two is that the top surface (not shown) of the light guide plate 240 of Fig. 12 is inclined. In detail, the top surface of the light guide plate 240 extends obliquely upward from the side close to the light emitting surface 220e toward the side facing away from the light emitting surface 220e.
請參照第13圖，防水層230包含雙面膠帶232d及電路板210的一部分210a。如第13圖所示，電路板210凹折成U型，電路板210的此部分210a呈L型。呈L型的此部分210a包覆發光二極體220的第一不發光面2201及第二不發光面2202。此部分210a的末端透過雙面膠帶232d固定於導光板240上。在其他實施例中，電路板的此延伸部分210a可凹折成任何形狀，只要能包覆發光二極體220的第一不發光面2201及第二不發光面2202即可。 Referring to FIG. 13, the waterproof layer 230 includes a double-sided tape 232d and a portion 210a of the circuit board 210. As shown in Fig. 13, the circuit board 210 is concavely folded into a U shape, and the portion 210a of the circuit board 210 is L-shaped. The portion 210a of the L-shape covers the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the LED 220. The end of this portion 210a is fixed to the light guide plate 240 through the double-sided tape 232d. In other embodiments, the extended portion 210a of the circuit board can be concavely folded into any shape as long as the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the light emitting diode 220 can be covered.
請參照第14圖，發光二極體220位於電路板210上方，發光二極體220為頂發光。發光二極體220具有發光 面220e、第一不發光面2201及第二不發光面2202。第一不發光面2201與第二不發光面2202彼此相對，發光面220e連接於第一不發光面2201與第二不發光面2202之間。發光面220e亦可稱為頂面。導光板240鄰接發光二極體220的發光面220e。 Referring to FIG. 14, the LED 220 is located above the circuit board 210, and the LED 220 is top-emitting. Light-emitting diode 220 has light The surface 220e, the first non-light emitting surface 2201, and the second non-light emitting surface 2202. The first non-light emitting surface 2201 and the second non-light emitting surface 2202 are opposite to each other, and the light emitting surface 220e is connected between the first non-light emitting surface 2201 and the second non-light emitting surface 2202. The light emitting surface 220e may also be referred to as a top surface. The light guide plate 240 is adjacent to the light emitting surface 220e of the light emitting diode 220.
如第14圖所示，防水層230包含雙面膠帶232d及基材234。基材234凹折成U型。基材234除了包覆導光板240的第一不發光面2201及第二不發光面2202之外，還包覆電路板210的底面(未標示)。基材234的兩個末端透過雙面膠帶232d固定於導光板240的兩側(未標示)上。在其他實施例中，基材234可凹折成任何形狀，只要能包覆發光二極體220的第一不發光面2201、第二不發光面2202以及電路板210即可。 As shown in FIG. 14, the waterproof layer 230 includes a double-sided tape 232d and a substrate 234. The substrate 234 is concavely folded into a U shape. The substrate 234 covers the bottom surface (not labeled) of the circuit board 210 in addition to the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the light guide plate 240. The two ends of the substrate 234 are fixed to both sides (not labeled) of the light guide plate 240 through the double-sided tape 232d. In other embodiments, the substrate 234 can be concavely folded into any shape as long as the first non-light emitting surface 2201, the second non-light emitting surface 2202, and the circuit board 210 of the light emitting diode 220 can be covered.
如第5至14圖所示，發光二極體220被防水層230完整包覆住，故可防止水氣損害發光二極體220。 As shown in FIGS. 5 to 14, the light-emitting diode 220 is completely covered by the waterproof layer 230, so that moisture can be prevented from damaging the light-emitting diode 220.
本發明更提供一種防水顯示裝置。第15圖繪示根據本發明數個實施例之防水顯示裝置的剖面示意圖。如第15圖所示，防水顯示裝置包含防水發光模組200、顯示面板300以及保護層400。 The invention further provides a waterproof display device. Figure 15 is a cross-sectional view showing a waterproof display device according to several embodiments of the present invention. As shown in FIG. 15, the waterproof display device includes the waterproof light emitting module 200, the display panel 300, and the protective layer 400.
防水發光模組200可例如為第5至14圖所示的防水發光模組。第15圖的防水發光模組200係以第6圖所示的防水發光模組為例。 The waterproof light emitting module 200 can be, for example, the waterproof light emitting module shown in FIGS. 5 to 14. The waterproof light-emitting module 200 of Fig. 15 is exemplified by the waterproof light-emitting module shown in Fig. 6.
顯示面板300固定於導光板240的第一表面2401上。在一些實施例中，顯示面板300為液晶顯示面板 (Liquid crystal display panel)、有機發光顯示面板(Organic light emitting display panel)或電泳顯示面板(Electrophoretic display panel)。在一些實施例中，顯示面板300透過膠層502固定於導光板240的第一表面2401上。在一些實施例中，膠層502為光學膠(optically clear adhesive；OCA)。 The display panel 300 is fixed on the first surface 2401 of the light guide plate 240. In some embodiments, the display panel 300 is a liquid crystal display panel. (Liquid crystal display panel), an organic light emitting display panel or an electrophoretic display panel. In some embodiments, the display panel 300 is fixed to the first surface 2401 of the light guide plate 240 through the adhesive layer 502. In some embodiments, the glue layer 502 is an optically clear adhesive (OCA).
保護層400固定於導光板240的第二表面2402上。第二表面2402與第一表面2401彼此相對。在一些實施例中，保護層400為抗眩膜(anti-glare film；AG film)或保護面板(cover lens)。在一些實施例中，保護層400透過膠層504固定於導光板240的第二表面2402上。在一些實施例中，膠層504為光學膠。 The protective layer 400 is fixed on the second surface 2402 of the light guide plate 240. The second surface 2402 and the first surface 2401 are opposed to each other. In some embodiments, the protective layer 400 is an anti-glare film (AG film) or a cover lens. In some embodiments, the protective layer 400 is fixed to the second surface 2402 of the light guide plate 240 through the adhesive layer 504. In some embodiments, the glue layer 504 is an optical glue.
如第15圖所示，由於防水發光模組200中設置有防水層230包覆發光二極體220，因此可防止水氣損害發光二極體220。 As shown in FIG. 15, since the waterproof layer 230 is provided in the waterproof light-emitting module 200 to cover the light-emitting diode 220, the moisture can be prevented from damaging the light-emitting diode 220.
以上扼要地提及多種實施例的特徵，因此熟悉此技藝之人士可較好了解本揭露的各方面。熟悉此技藝之人士應意識到，為了落實相同的目的及/或達到在此提出的實施例的相同優點，其可輕易使用本揭露以做為設計或修改其他製程及結構的基礎。熟悉此技藝之人士亦應了解的是，這些均等的構造不背離本揭露之精神及範圍，以及其人可在此進行各種改變、取代、及替代而不背離本揭露之精神及範圍。 The various features of the various embodiments are apparent to those skilled in the art. Those skilled in the art will recognize that the present disclosure may be readily utilized as a basis for designing or modifying other processes and structures for the same purpose and/or to achieve the same advantages of the embodiments set forth herein. It should be understood by those skilled in the art that the present invention may be made without departing from the spirit and scope of the disclosure.
Claims (4)
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| US10670257B2 (en) | 2017-08-15 | 2020-06-02 | E Ink Holdings Inc. | Waterproof light emitting module |
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| TWI711786B (en) | 2020-04-30 | 2020-12-01 | 元太科技工業股份有限公司 | Lighting module and display device |
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| TW201910687A (en) | 2019-03-16 |
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