CN113637959A - 一种塑料件表面金属化处理方法 - Google Patents
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Abstract
本申请实施例示出了一种塑料件表面金属化处理方法，所述处理方法对塑料件表面中的复杂表面和简单表面区分处理，复杂表面采用化镀铜、化镀镍和化镀金的方式，简单表面采用选择性电镀方式，既能使塑料件表面金属化效果好，又能节约处理时间，降低生产成本。在处理方法中包括退化学镍处理，这样可以避免复杂表面被电镀，影响塑料件金属化效果。
Description
技术领域
本发明涉及塑料表面金属化技术领域，特别涉及一种塑料件表面金属化处理方法。
背景技术
随着激光直接成型技术(LDS)和选择性电镀工艺的不断发展，越来越多的塑料在通信、汽车、电子等领域被大规模应用，使得用户可以灵活的设计出复杂的塑料零件，将激光直接成型技术和选择性电镀工艺代替传统的电路板蚀刻、金属钣金和压铸等传统工艺。
目前，LDS可以对复杂造型塑料件表面进行金属化处理，但是LDS不仅工艺复杂，生产效率低，而且生产成本高昂。选择性电镀技术适合对简单造型的塑料件表面进行金属处理，生产周期比LDS的生产周期短，且生产成本比LDS成本低，但是选择性电镀的走线外需要额外的增加阻隔线，因此难以对一些复杂塑料件表面进行金属化处理。
因此，如何满足对不同设计的塑料件表面金属化的快速和低成本处理，成为本领域技术人员亟待解决的技术问题。
发明内容
本发明实施例提供一种塑料件表面金属化处理方法，以解决现有塑料件表面金属化周期长且成本高的问题。
本申请实施例示出了一种塑料件表面金属化处理方法，所述处理方法包括：
对塑料件表面进行粗化处理；
清洗粗化处理后的塑料件后，依次进行沉钯解胶和镀镍前处理；
将经过镀镍前处理后的塑料件，进行化镀镍；
将化镀镍的塑料件的表面分为复杂表面和简单表面，对复杂表面激光镭雕；
所述简单表面包括简单表面本体和阻隔线，所述阻隔线设置在所述简单表面本体的***，对简单表面本体进行激光镭雕；
对激光镭雕后的复杂表面和简单表面本体激光镭雕后的简单表面进行预镀铜；
采用蚀刻工艺对预镀铜后的复杂表面进行退化学镍处理；
对复杂表面依次进行化镀铜、化镀镍和化镀金；
对简单表面进行选择性电镀，选择性电镀包括电镀铜和电镀锡。
进一步地，所述对塑料件表面进行粗化处理的方法包括：
将金刚砂利用喷砂设备喷射到塑料件表面上，进行机械粗化。
进一步地，所述将经过镀镍前处理后的塑料件，进行化镀镍的镍层厚度≤1um。
进一步地，所述阻隔线的宽度至少为0.5mm。
进一步地，所述预镀铜的铜层厚度≥9um。
进一步地，对复杂表面依次进行化镀铜、化镀镍和化镀金中的铜层厚度在8-12um，镍层厚度在3-6um，金层厚度在5-8um。
进一步地，对简单表面依次进行电镀铜和电镀锡中的铜层厚度在5-8um，锡层厚度在5-8um。
由以上技术方案可见，本申请实施例示出了一种塑料件表面金属化处理方法，所述处理方法对塑料件表面中的复杂表面和简单表面区分处理，复杂表面采用化镀铜、化镀镍和化镀金的方式，简单表面采用选择性电镀方式，既能使塑料件表面金属化效果好，又能节约处理时间，降低生产成本。在处理方法中包括退化学镍处理，这样可以避免复杂表面被电镀，影响塑料件金属化效果。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例示出的一种塑料件表面金属化处理方法的流程图。
具体实施方式
为了使本技术领域的人员更好地理解本发明中的技术方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
现有的LDS工艺和选择性电镀技术中对塑料表面金属化的处理均有一定的局限性。LDS工艺的加工时间长、加工成本高；选择性电镀工艺无法对复杂外形进行加工。
参阅图1，本申请实施例示出了一种塑料件表面金属化处理方法，所述处理方法包括：
步骤S101、对塑料件表面进行粗化处理；
需要说明的是，本申请实施例中塑料件采用含金属离子的增强型聚苯硫醚通过注塑工艺成型得到塑料件，采用增强型聚苯硫醚制备的塑料件成品良率高，注塑稳定，不易出现缺料等注塑缺陷。增强型聚苯硫醚还包括聚苯硫醚和体积比为30％的玻璃纤维。增强型聚苯硫醚为Sabic公司的料号ER008655的产品。
进一步地，所述对塑料件表面进行粗化处理的方法包括：将金刚砂利用喷砂设备喷射到塑料件表面上，进行机械粗化。
具体的，采用60-80目的金刚砂对塑料件表面进行机械粗化处理，增加塑料件表面粗糙度，通过调节喷砂设备的喷射速度和气压等参数，使塑料件表面粗糙度满足使用要求，提高后续镀层附着力，防止出现镀层起皮、脱落等不良现象。
步骤S102、清洗粗化处理后的塑料件后，依次进行沉钯解胶和镀镍前处理；
具体的，对粗化处理后的塑料件通过超声波清洗去除表面残留的杂质。
沉钯解胶可以把金属钯吸附在塑料件表面，方便后续步骤中的选择性电镀。
对塑料件进行镀镍前处理的工艺为现有技术，镀镍前处理包括除油、酸洗和清洗等步骤。
步骤S103、将经过镀镍前处理后的塑料件，进行化镀镍；
具体的，对塑料件进行化镀镍，方便后续步骤中的选择性电镀工艺。
进一步地，所述将经过镀镍前处理后的塑料件，进行化镀镍的镍层厚度≤1um。
步骤S104、将化镀镍的塑料件的表面分为复杂表面和简单表面；对复杂表面激光镭雕；
由于塑料件应用广泛，所以需要对不同造型的塑料件做金属化处理。本申请实施例将化镀镍的塑料件表面分为复杂表面和简单表面，所述复杂表面为带有多次曲面或者狭小平面区域，由于简单表面采用选择性电镀方式，所以需要留有阻隔线，如果平面区域的面积不允许设置阻隔线，则认定平面区域为狭小平面区域。
具体的，对复杂表面进行激光镭射，可以激活所需走线区域金属粒子，所述走线区域即为塑料件金属化的位置。
步骤S105、所述简单表面包括简单表面本体和阻隔线，所述阻隔线设置在所述简单表面本体的***，对简单表面本体进行激光镭雕；
所述阻隔线将塑料件表面分为电镀区和非电镀区，所述复杂表面为非电镀区，所述简单表面本体为电镀区.
在实际应用中，对简单表面本体进行激光镭雕，在简单表面本体的***留有阻隔线。
进一步地，所述阻隔线的宽度至少为0.5mm。
步骤S106、对激光镭雕后的复杂表面和简单表面本体激光镭雕后的简单表面进行预镀铜；
所述预镀铜工艺可以使后续对简单表面进行选择性电镀中电镀锡的锡层附着力更好。
进一步地，所述预镀铜的铜层厚度≥9um。
步骤S107、采用蚀刻工艺对预镀铜后的复杂表面进行退化学镍处理；
由于存在镍层的构面会被电镀上，所以去除非电镀区的镍层，可以避免非电镀区被电镀。
步骤S108、对复杂表面依次进行化镀铜、化镀镍和化镀金；
进一步地，对复杂表面依次进行化镀铜、化镀镍和化镀金中的铜层厚度在8-12um，镍层厚度在3-6um，金层厚度在5-8um。
步骤S109、对简单表面进行选择性电镀，选择性电镀包括电镀铜和电镀锡。
所述电镀锡是为了提高焊接的方便性。
进一步地，对简单表面依次进行电镀铜和电镀锡中的铜层厚度在5-8um，锡层厚度在5-8um。
本申请实施例避免了单独使用LDS工艺或者选择性电镀工艺的缺点，将塑料件表面分为简单表面和复杂表面，针对简单表面和复杂表面分别利用相应的金属化处理工艺，缩短了加工时间，并且降低了加工成本，解决了单独使用选择性电镀工艺无法对复杂表面进行加工的问题，具有广阔的应用前景。
由以上技术方案可见，本申请实施例示出了一种塑料件表面金属化处理方法，所述处理方法对塑料件表面中的复杂表面和简单表面区分处理，复杂表面采用化镀铜、化镀镍和化镀金的方式，简单表面采用选择性电镀方式，既能使塑料件表面金属化效果好，又能节约处理时间，降低生产成本。在处理方法中包括退化学镍处理，这样可以避免复杂表面被电镀，影响塑料件金属化效果。
本领域技术人员在考虑说明书及实践这里公开的申请后，将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本申请的真正范围和精神由上面的权利要求指出。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确流程，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。
Claims (7)
1.一种塑料件表面金属化处理方法，其特征在于，所述处理方法包括：
对塑料件表面进行粗化处理；
清洗粗化处理后的塑料件后，依次进行沉钯解胶和镀镍前处理；
将经过镀镍前处理后的塑料件，进行化镀镍；
将化镀镍的塑料件的表面分为复杂表面和简单表面，对复杂表面激光镭雕；
所述简单表面包括简单表面本体和阻隔线，所述阻隔线设置在所述简单表面本体的***，对简单表面本体进行激光镭雕；
对激光镭雕后的复杂表面和简单表面本体激光镭雕后的简单表面进行预镀铜；
采用蚀刻工艺对预镀铜后的复杂表面进行退化学镍处理；
对复杂表面依次进行化镀铜、化镀镍和化镀金；
对简单表面进行选择性电镀，选择性电镀包括电镀铜和电镀锡。
2.根据权利要求1所述的一种塑料件表面金属化处理方法，其特征在于，所述对塑料件表面进行粗化处理的方法包括：
将金刚砂利用喷砂设备喷射到塑料件表面上，进行机械粗化。
3.根据权利要求1所述的一种塑料件表面金属化处理方法，其特征在于，所述将经过镀镍前处理后的塑料件，进行化镀镍的镍层厚度≤1um。
4.根据权利要求1所述的一种塑料件表面金属化处理方法，其特征在于，所述阻隔线的宽度至少为0.5mm。
5.根据权利要求1所述的一种塑料件表面金属化处理方法，其特征在于，所述预镀铜的铜层厚度≥9um。
6.根据权利要求1所述的一种塑料件表面金属化处理方法，其特征在于，对复杂表面依次进行化镀铜、化镀镍和化镀金中的铜层厚度在8-12um，镍层厚度在3-6um，金层厚度在5-8um。
7.根据权利要求1所述的一种塑料件表面金属化处理方法，其特征在于，对简单表面依次进行电镀铜和电镀锡中的铜层厚度在5-8um，锡层厚度在5-8um。
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| JP2001007485A (ja) * | 1999-06-25 | 2001-01-12 | Hitachi Cable Ltd | プラスチック成型品に回路を形成した部品 |
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