CN113635565A - Processing technology of camera module optical component pasting material - Google Patents
Processing technology of camera module optical component pasting material Download PDFInfo
- Publication number
- CN113635565A CN113635565A CN202110905858.2A CN202110905858A CN113635565A CN 113635565 A CN113635565 A CN 113635565A CN 202110905858 A CN202110905858 A CN 202110905858A CN 113635565 A CN113635565 A CN 113635565A
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- Prior art keywords
- film
- self
- optical component
- processed
- camera module
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- 239000000463 material Substances 0.000 title claims abstract description 62
- 230000003287 optical effect Effects 0.000 title claims abstract description 45
- 238000005516 engineering process Methods 0.000 title claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 48
- 239000002313 adhesive film Substances 0.000 claims abstract description 37
- 238000003754 machining Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 abstract description 4
- 238000004804 winding Methods 0.000 description 8
- 239000012528 membrane Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
- B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
- B26D1/065—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates for thin material, e.g. for sheets, strips or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2628—Means for adjusting the position of the cutting member
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
- B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
- B29C66/02241—Cutting, e.g. by using waterjets, or sawing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Polarising Elements (AREA)
Abstract
The invention relates to a camera processing technology, and provides a camera module optical component pasting material processing technology, which comprises the following steps: s1: adjusting a cutting blade of the machining device; s2: loading and positioning a strip-shaped film to be processed, wherein the film to be processed comprises a micro-adhesive film and a self-carrying film, and the self-carrying film is adhered to the surface of the micro-adhesive film; s3: cutting the self-carried film along the length direction of the to-be-processed film by the cutting blade to obtain the to-be-processed film with two cutting traces along the length direction, and dividing the self-carried film into three areas; s4: removing the self-carried film in the middle area of the film to be processed, and reserving the self-carried films in the two side areas of the film to be processed; s5: and attaching the optical component attaching material to the area excluding the self-contained film so as to attach the optical component attaching material to the micro-adhesive film to obtain an optical component attaching material layer, so that the manual attaching cost can be saved, the efficiency is improved, and the material for manufacturing the edge pressing strip is saved.
Description
Technical Field
The invention relates to the technical field of camera processing, in particular to a processing technology of a camera module optical component pasting material.
Background
With the increasing popularization of intelligent equipment and the popularization of the 5G market, the number of cameras is more and more becoming the current main popularity from the original single camera shooting to the four-camera shooting or even the five-camera shooting of the 5G mobile phone. The processing requirements for the camera module are also stricter and stricter, but the current processing technology has a plurality of defects, for example, the processing technology of the camera module optical component pasting material needs to perform die cutting in the early stage, the current processing technology is generally completed by adopting a small hole sleeve position material laminating method, in the specific manufacturing process, a layer of sticky bottom supporting material is generally pasted below a main material, one side of the bottom supporting material needs to be wider than the main material by a certain position, and the wider position is used for manufacturing a positioning hole. In order to avoid the problem that the adhesive position of the wide area of the bottom supporting material is in direct contact with the die to cause the adhesive film and influence the phenomenon that the product is adhered together after being rolled and cannot be discharged normally, the two sides of the bottom supporting material are respectively adhered with one layer of non-adhesive material to prevent the die from being adhered. However, after the self-contained film of the bottom supporting material is removed, two blank pressing strips without viscosity are separately pasted, so that the manual pasting cost is increased, and the material is wasted.
Disclosure of Invention
The invention mainly aims to provide a processing technology of a camera module optical component pasting material, which reduces the cost.
Based on the above purpose, the invention provides a processing technology of a camera module optical component pasting material, comprising the following steps:
s1: adjusting a cutting blade of the machining device;
s2: loading and positioning a strip-shaped film to be processed, wherein the film to be processed comprises a micro-adhesive film and a self-carrying film, and the self-carrying film is adhered to the surface of the micro-adhesive film;
s3: cutting the self-carried film along the length direction of the to-be-processed film by the cutting blade to obtain the to-be-processed film with two cutting traces along the length direction, and dividing the self-carried film into three areas;
s4: removing the self-carried film in the middle area of the film to be processed, and reserving the self-carried films in the two side areas of the film to be processed;
s5: and attaching the optical component attaching material to the area excluding the self-contained film so as to attach the optical component attaching material to the micro-adhesive film, thereby obtaining the optical component attaching material layer.
Further, in the step S1, the cutting blade moves within an adjustment range of 6mm to 15mm, and the angle is adjusted within a range of 15 ° to 90 °.
Further, the processing equipment comprises two cutting blades and a control device for controlling the cutting blades, and the control device controls the two cutting blades to cut the self-contained film.
Further, in the step S3, the width of the two side areas of the three areas of the self-carrying film is in the range of 6mm to 15 mm.
And further, manufacturing a positioning hole at the specified position of the side close to the film to be processed.
Further, still include: and punching the optical component pasting material layer.
The invention has the beneficial effects that: through install adjustable cutting blade additional in processing equipment, will treat to process and cut out from taking the membrane in the membrane, get rid of the centre from taking the membrane and keeping the membrane from taking on both sides, avoid need get rid of whole from taking the membrane and paste two independent not sticky blank pressing strips when laminating optical components and parts pastes the material, practice thrift artifical laminating cost, not only raise the efficiency and practice thrift the material of preparation blank pressing strip.
Drawings
Fig. 1 is a schematic structural diagram of an optical component bonding material layer in an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solution of the present invention will be described in further detail with reference to specific embodiments.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present patent and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1, the processing technology of the camera module optical component pasting material provided by the invention comprises the following steps:
s1: adjusting a cutting blade of the machining device;
s2: loading and positioning a strip-shaped film to be processed, wherein the film to be processed comprises a micro-adhesive film 3 and a self-adhesive film 2, and the self-adhesive film 2 is adhered to the surface of the micro-adhesive film 3;
s3: cutting the self-carried film 2 along the length direction of the to-be-processed film by the cutting blade to obtain the to-be-processed film with two cutting traces along the length direction, and dividing the self-carried film 2 into three areas;
s4: removing the self-carried film 2 in the middle area of the film to be processed, and reserving the self-carried films 2 in the two side areas of the film to be processed;
s5: and attaching the optical component attaching material 1 to the area excluding the self-contained film 2 so as to attach the optical component attaching material 1 to the micro-adhesive film 3, thereby obtaining an optical component attaching material layer.
In the embodiment, the processing steps are completed by adopting optical component pasting material processing equipment, a cutting process is added to the original processing equipment, a cutting assembly is added, the cutting assembly comprises a cutting blade and a control device for controlling the cutting blade to cut, the control device at least comprises a support frame, a control motor, a clamping device and a moving track, the cutting blade is clamped by a clamping device, the clamping device is electrically connected with the control motor, the clamping device is arranged in the moving track and can slide in the moving track under the control of the control motor so as to control the cutting blade to cut, the cutting blade is provided with two cutting blades, the left and right movement adjusting range of the two cutting blades is 6-15 mm, the angle adjusting range is 15-90 degrees, before cutting, the position and the angle of the cutting blade are adjusted, so that the cutting blade is right to the self-carrying film 2 in the film to be processed and divides it into three areas.
As the step S2, a processing apparatus is loaded, that is, a film to be processed is loaded, and then positioned, the film to be processed is a long strip shape, and can be rolled up before being processed, the film to be processed includes a micro-adhesive film 3 and a self-adhesive film 2, wherein the micro-adhesive film 3 may be a PET film, one surface of which has adhesiveness, the self-adhesive film 2 is adhered to the surface having adhesiveness, that is, the self-adhesive film 2 is adhered to the surface of the micro-adhesive film 3, and the self-adhesive film 2 may be an easily torn film, or a PET film.
As described in step S3, when the film to be processed is moved and conveyed in the longitudinal direction thereof, the cutting blade is set, and when the film to be processed passes through the cutting blade, the cutting blade cuts and cuts the film to be processed, at this time, the film to be processed is moved and conveyed in the longitudinal direction thereof, so that the cutting blade cuts the film 2 along the longitudinal direction of the film to be processed, and the film to be processed having two cutting traces in the longitudinal direction is obtained, the two cutting traces divide the film 2 into three regions, and in the three regions, the width of the two regions near the edge ranges from 6mm to 15 mm.
As described in step S4, after the self-adhesive film 2 is cut, the self-adhesive film 2 in the middle area of the film to be processed is removed by the processing equipment, and the self-adhesive films 2 in the two side areas of the film to be processed are retained, that is, the micro-adhesive film 3 in the middle area is exposed, so as to be used for adhering the optical component adhering material 1. The width of the intermediate area can be set according to the actual situation, and is not limited here, and can be realized by adjusting the cutting blade.
As described above in step S5, the optical component bonding material 1 is bonded to the area excluding the self-contained film 2, that is, the optical component bonding material 1 is bonded to the intermediate area by the processing equipment, so that the optical component bonding material 1 is bonded to the exposed micro-adhesive film 3, thereby obtaining an optical component bonding material layer, which includes the bottom micro-adhesive film 3, the optical component bonding material 1 on the micro-adhesive film 3, and the self-contained film 2, wherein the self-contained film 2 is located in the two areas near the edge, and the optical component bonding material 1 is located in the intermediate area, as shown in fig. 1.
In one embodiment, the optical component bonding material layer is punched, that is, the optical component bonding material 1 is pressed against the micro-adhesive film 3 to be bonded with the micro-adhesive film or rolled up along the length direction as required, so that the adhesive film is not generated due to the protection of the self-contained film 2 at the two sides, and the rolling is neat. In addition, the corresponding shape can be punched through processing equipment according to actual needs.
In one embodiment, the positioning holes are made at the designated positions of the side edges of the film to be processed, namely the positioning holes are made at the corresponding positions of the two areas of the side edges.
According to the processing technology of the camera module optical component pasting material, the adjustable cutting blade is additionally arranged in the processing equipment, the self-contained film 2 in the film to be processed is cut, the middle self-contained film 2 is removed, and the self-contained films 2 on the two sides are reserved, so that the phenomenon that the whole self-contained film 2 is removed and two blank holders without viscosity are singly pasted when the optical component pasting material 1 is pasted is avoided, the manual pasting cost is saved, the efficiency is improved, and the blank holder manufacturing material is saved.
In this embodiment, the optical component adhesive material processing device includes a cutting assembly, a removing assembly, a feeding assembly, a winding assembly and a control assembly, the control assembly includes a controller and a display screen, each parameter of the processing device is displayed on the display screen, and an instruction can be input, each assembly is controlled by the controller to operate, the removing assembly is used for removing the self-contained film, the removing assembly includes a motor, a winding drum, a film lifter and a second support frame, the winding drum and the film lifter are all arranged on the second support frame, the motor controls the winding drum to rotate, the film lifter includes a manipulator for peeling the self-contained film 2, the manipulator is provided with a sucker for sucking the self-contained film, when the cut film to be processed is conveyed to the position below the removing assembly, the manipulator sucks the self-contained film 2, tears the self-contained film and sends the torn film to the winding drum, the motor controls the winding drum to rotate, and the self-contained film 2 is wound up, thereby removing the film 2 from the belt and, at the same time, conveying the film to be processed removed from the belt 2 to the charging assembly. The material adding component comprises a material adding cylinder, the optical component pasting material 1 is coiled on the material adding cylinder, when the film to be processed is conveyed to a station, the material adding component enables the optical component pasting material 1 to be attached to a micro-adhesive film 3 exposed after the self-adhesive film 2 is removed, then the micro-adhesive film is transmitted to the winding component, and the winding component winds the micro-adhesive film.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. The processing technology of the camera module optical component pasting material is characterized by comprising the following steps of:
s1: adjusting a cutting blade of the machining device;
s2: loading and positioning a strip-shaped film to be processed, wherein the film to be processed comprises a micro-adhesive film and a self-carrying film, and the self-carrying film is adhered to the surface of the micro-adhesive film;
s3: cutting the self-carried film along the length direction of the to-be-processed film by the cutting blade to obtain the to-be-processed film with two cutting traces along the length direction, and dividing the self-carried film into three areas;
s4: removing the self-carried film in the middle area of the film to be processed, and reserving the self-carried films in the two side areas of the film to be processed;
s5: and attaching the optical component attaching material to the area excluding the self-contained film so as to attach the optical component attaching material to the micro-adhesive film, thereby obtaining the optical component attaching material layer.
2. The process for processing the camera module optical component bonding material according to claim 1, wherein in the step S1, the moving adjustment range of the cutting blade is 6mm to 15mm, and the angle adjustment range is 15 ° to 90 °.
3. The process for processing the camera module optical component pasting material as claimed in claim 1, wherein the processing equipment comprises two cutting blades and a control device for controlling the cutting blades, and the control device controls the two cutting blades to cut the self-contained film.
4. The process for processing the camera module optical component bonding material according to claim 1, wherein in the step S3, the width of the two adjacent areas of the three areas of the self-adhesive film is 6mm to 15 mm.
5. The process for processing the camera module optical component bonding material according to claim 4, wherein a positioning hole is formed at a designated position of the side edge of the film to be processed.
6. The process for processing the camera module optical component pasting material as claimed in claim 1, further comprising:
and punching the optical component pasting material layer.
Priority Applications (1)
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CN202110905858.2A CN113635565A (en) | 2021-08-06 | 2021-08-06 | Processing technology of camera module optical component pasting material |
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CN202110905858.2A CN113635565A (en) | 2021-08-06 | 2021-08-06 | Processing technology of camera module optical component pasting material |
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Citations (6)
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CN105578713A (en) * | 2015-12-11 | 2016-05-11 | 苏州米达思精密电子有限公司 | Manufacturing method of hole-carrying reinforcing sheet support plate |
CN106141429A (en) * | 2015-04-28 | 2016-11-23 | 西酉电子科技(上海)有限公司 | The technique of waste material in a kind of ferrite product hole getting rid of laser |
CN107323060A (en) * | 2017-06-21 | 2017-11-07 | 浙江星星科技股份有限公司 | The processing method that a kind of three layers of divide-body mobile phone panel protects pad pasting |
CN109548290A (en) * | 2018-11-30 | 2019-03-29 | 安庆华璟电子科技有限公司 | A kind of new method of the micro- mucous membrane fitting FPC flexible circuit board of PET |
CN109943241A (en) * | 2019-03-01 | 2019-06-28 | 在贤电子(苏州)有限公司 | High stability shading rubber belt and its processing method |
CN113150702A (en) * | 2021-04-29 | 2021-07-23 | 业成科技(成都)有限公司 | Optical film assembly, processing method thereof and electronic equipment |
-
2021
- 2021-08-06 CN CN202110905858.2A patent/CN113635565A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106141429A (en) * | 2015-04-28 | 2016-11-23 | 西酉电子科技(上海)有限公司 | The technique of waste material in a kind of ferrite product hole getting rid of laser |
CN105578713A (en) * | 2015-12-11 | 2016-05-11 | 苏州米达思精密电子有限公司 | Manufacturing method of hole-carrying reinforcing sheet support plate |
CN107323060A (en) * | 2017-06-21 | 2017-11-07 | 浙江星星科技股份有限公司 | The processing method that a kind of three layers of divide-body mobile phone panel protects pad pasting |
CN109548290A (en) * | 2018-11-30 | 2019-03-29 | 安庆华璟电子科技有限公司 | A kind of new method of the micro- mucous membrane fitting FPC flexible circuit board of PET |
CN109943241A (en) * | 2019-03-01 | 2019-06-28 | 在贤电子(苏州)有限公司 | High stability shading rubber belt and its processing method |
CN113150702A (en) * | 2021-04-29 | 2021-07-23 | 业成科技(成都)有限公司 | Optical film assembly, processing method thereof and electronic equipment |
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Application publication date: 20211112 |