CN113635292B - Six-shaft mechanical arm for semiconductor cleaning equipment - Google Patents
Six-shaft mechanical arm for semiconductor cleaning equipment Download PDFInfo
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- CN113635292B CN113635292B CN202111199967.3A CN202111199967A CN113635292B CN 113635292 B CN113635292 B CN 113635292B CN 202111199967 A CN202111199967 A CN 202111199967A CN 113635292 B CN113635292 B CN 113635292B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- 238000007789 sealing Methods 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 18
- 238000007667 floating Methods 0.000 abstract description 6
- 238000007664 blowing Methods 0.000 abstract description 4
- 238000005406 washing Methods 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/008—Manipulators for service tasks
- B25J11/0085—Cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a six-axis manipulator for semiconductor cleaning equipment, which is provided with a support base, wherein the top of the support base is provided with a first shaft; the six-axis manipulator further comprises a movable plate, the section of the movable plate is of a "" shape structure, and a transverse plate of the "" shape movable plate is arranged on the inner side of the clamping plate through a through groove formed in the surface of the clamping plate; the valve plate is fixed at the other end of the guide rope, and a sealed fixing cavity is formed in the clamping plate; the bottom of the traction rope is fixedly connected with the upper end face of the valve plate, and a first air outlet hole and a second air outlet hole are respectively formed in the two sides of the connecting cavity. This six-axis manipulator for semiconductor cleaning equipment is after to semiconductor device accommodate device centre gripping, and the mode of accessible blowing blows off its inside ash floating, and it is convenient for subsequent washing to in the centre gripping process, be equipped with the spacing structure of semiconductor device accommodate device, guarantee to transport the phenomenon that the in-process can not appear dropping.
Description
Technical Field
The invention relates to the technical field of semiconductor cleaning equipment, in particular to a six-axis manipulator for semiconductor cleaning equipment.
Background
The cleaning of the surface of the semiconductor wafer requires the use of special cleaning equipment, in which manual cleaning is not sufficient to meet the requirements of precision and cleanliness, and therefore, a robot mechanism needs to be provided in the cleaning equipment instead of manual operation. Six manipulators can satisfy multi-angle and the required precision in the semiconductor cleaning process through more axial motion, for example, the utility model is CN 213647559U's a novel six manipulators … has solved current six manipulators and has not possessed the clearance structure on the processing axle, need clear up the operation anchor clamps of manipulator after some operations are accomplished in the mill, and artifical clearance is wasted time and energy, and has reduced the problem of production speed, has possessed the advantage of clearance processing axle. However, the novel six-axis manipulator still has the following disadvantages in the actual use process:
1. because the semiconductor wafer is firstly placed into the bearing flower basket in the cleaning process, the clamping force is usually limited in order to avoid damaging the semiconductor wafer in the bearing flower basket in the clamping process, and the semiconductor wafer is easy to drop in the conveying process, so that the traditional manipulator lacks a structure for keeping the flower basket stable after clamping;
2. because bear the weight of the basket of flowers before washing, its surface can the adhesion of different amount of dust, and rely on subsequent cleaning equipment to its clearance completely, consequently can increase the washing degree of difficulty and time, in the centre gripping process to bearing the weight of the basket of flowers, lack the structure that blows off to its surface ash floating.
Aiming at the problems, innovative design is urgently needed on the basis of the original six-axis manipulator.
Disclosure of Invention
The invention aims to provide a six-axis manipulator for a semiconductor cleaning device, which aims to solve the problems that the prior manipulator lacks a structure for blowing off floating dust on the surface of a device in a semiconductor device accommodating device in the process of clamping the semiconductor device accommodating device and is easy to fall off in the conveying process, so that the traditional manipulator lacks a structure for keeping the semiconductor device accommodating device stable after clamping.
In order to achieve the purpose, the invention provides the following technical scheme: a six-axis manipulator for semiconductor cleaning equipment is provided with a supporting base, wherein a first axis is arranged at the top of the supporting base, the top of the first axis is rotatably connected with one end of a second axis, a third axis is arranged at the other end of the second axis and is mutually connected with a fifth axis through a fourth axis, a sixth axis is arranged at the end head of the fifth axis, and a clamping plate is arranged at the end head of the sixth axis;
the six-axis manipulator further comprises a movable plate, the section of the movable plate is of a "" shape structure, a transverse plate of the "" shape movable plate is arranged on the inner side of the clamping plate through a through groove formed in the surface of the clamping plate, the movable plate forms a sliding structure through the through groove and the clamping plate, one end of the bottom of the movable plate is fixedly connected with the inner wall of the clamping plate through a second spring, a partition plate is fixed in the clamping plate, the other end of the bottom of the movable plate is fixedly connected with one end of a guide rope, a fixing hole is formed in the clamping plate, the transverse plate of the movable plate is in sliding connection with the partition plate, and meanwhile, the transverse plate of the movable plate after moving penetrates through the fixing hole;
the valve plate is fixed at the other end of the guide rope, a sealed fixed cavity is formed in the clamping plate, the valve plate is arranged in the fixed cavity, an air transmission cavity is formed in the side wall of the clamping plate, the bottom of the air transmission cavity is fixedly connected with the movable plate through a connecting pipe, a slow flow cavity is formed in the vertical plate of the movable plate, and a sucker is mounted on the side face of the vertical plate of the movable plate;
the bottom of the traction rope is fixedly connected with the upper end face of the valve plate, the top of the traction rope is connected with the movable block, a connecting cavity is formed in the clamping plate, the movable block is arranged in the connecting cavity, a first air outlet hole and a second air outlet hole are formed in two sides of the connecting cavity respectively, the top of the connecting cavity is connected with one end of the connecting channel, and a gas pipe is arranged at the other end of the connecting channel;
the edge of the valve plate is tightly attached to the inner wall of the fixed cavity, the valve plate is longitudinally and slidably connected with the fixed cavity, the fixed cavity is communicated with the connecting pipe through the air transmission cavity, and after the guide rope is pulled, the valve plate can be pulled to slide downwards in the fixed cavity to generate suction force and the suction force is transmitted into the connecting pipe through the air transmission cavity;
the connecting pipe is of a spring pipe structure, the connecting pipe is communicated with the sucker through the slow flow cavity, suction in the connecting pipe can be transmitted into the sucker through the slow flow cavity, and then the sucker is adsorbed on the side face of the semiconductor device accommodating device;
the movable block penetrates through the inside of the movable block, a rotating structure is formed by the movable block through the movable shaft and the clamping plate, the section of the movable block is of an L-shaped structure, meanwhile, the rotating range of the movable block is 0-90 degrees, when the valve plate moves downwards, the movable block can be pulled to rotate through the traction rope, and the communication of different air outlet holes is realized;
the third springs for driving the movable blocks to reset are wound at the two ends of the movable shaft, the sealing blocks made of rubber are adhered to the side faces of the two ends of each movable block, the thickness of each sealing block is equal to the shortest distance between each movable block and the corresponding connecting cavity, the movable blocks in the initial state can seal the second air outlet, and the movable blocks which are pulled to rotate 90 degrees can seal the first air outlet;
first exhaust vent and second exhaust vent are the slope and set up downwards, and both are opposite with the connected state in chamber to it is linked together through interface channel and gas-supply pipe to connect the chamber, during first exhaust vent air-out, can blow off the dust around the grip block, and during second exhaust vent air-out, can blow off the device surface ash on the semiconductor device storage device of centre gripping and the inside.
Preferably, the both sides of grip block all are provided with the limiting plate, and limiting plate and grip block constitute rotating-structure, can protect the semiconductor device accommodating device both sides of centre gripping through the limiting plate, prevent the phenomenon that drops appearing transporting the in-process to can drive its rotation after semiconductor device accommodating device and limiting plate contact, and then guarantee limiting plate and semiconductor device accommodating device's laminating nature.
Preferably, the side of limiting plate passes through first spring and grip block interconnect, and the limiting plate is provided with 2 groups about the vertical axis symmetry of grip block to 2 adjacent limiting plate parallel arrangement, limiting plate after the rotation when not receiving thrust, through the resilience of first spring, can resume initial position, so that follow-up to other semiconductor device accommodate device spacing.
Compared with the prior art, the invention has the beneficial effects that: according to the six-axis manipulator for the semiconductor cleaning equipment, after the semiconductor device accommodating device is clamped, floating ash in the semiconductor device accommodating device can be blown off in an air blowing mode, convenience is provided for subsequent cleaning, and in the clamping process, a structure for limiting the semiconductor device accommodating device is arranged, so that the phenomenon of falling off in the conveying process is avoided;
1. after the semiconductor device accommodating device is clamped, two sides of the semiconductor device accommodating device can be in contact with the movable plate and push the movable plate to move, the stability of the two sides of the semiconductor device accommodating device can be guaranteed through the resilience of the second spring, the other two sides of the semiconductor device accommodating device can be in contact with the limiting plate and drive the limiting plate to rotate, the stability of the other two sides of the semiconductor device accommodating device can be guaranteed through the resilience of the first spring, and the phenomenon of falling off in the conveying process is prevented;
2. the movable plate can move while pulling the guide rope to synchronously move, and the valve plate is pulled to move downwards in the fixed cavity, so that suction force can be generated when the valve plate moves downwards, the suction force can enter the inside of the connecting pipe through the gas transmission cavity and enter the inside of the sucking disc through the slow flow cavity, the sucking disc can be tightly adsorbed on the side surface of the semiconductor device accommodating device, the phenomenon that the semiconductor device accommodating device deflects in the conveying process is prevented, and meanwhile, the connecting pipe is of a spring pipe structure, the movement of the movable plate is not influenced, and the gas is convenient to convey;
3. the movable block of initial condition can carry out the shutoff to the second exhaust vent, wind-force from the gas-supply pipe input can be followed first exhaust vent and blown to the grip block around like this, and blow off dust around it, can stimulate the movable block anticlockwise rotation through the haulage rope in the time of valve plate downstream, after the movable block rotates 90, can play the shutoff to first exhaust vent, wind-force just can blow off from the second exhaust vent like this, and blow off the ash on the device in the semiconductor device accommodate device, it is convenient for subsequent washing to provide, simultaneously the movable block is after not receiving the pulling force, the normal position can be restoreed through the resilience performance of third spring.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a front view of the clamping plate of the present invention;
FIG. 3 is a schematic front sectional view of the clamping plate of the present invention;
FIG. 4 is a front view of the movable block of the present invention;
FIG. 5 is a schematic perspective view of a movable block according to the present invention;
FIG. 6 is a schematic structural view of the movable plate of the present invention after moving;
FIG. 7 is a schematic front sectional view of the movable plate according to the present invention;
FIG. 8 is a schematic top view of the clamping plate according to the present invention.
In the figure: 1. a support base; 2. a first shaft; 3. a second shaft; 4. a third axis; 5. a fourth axis; 6. a fifth shaft; 7. a sixth axis; 8. a clamping plate; 81. a limiting plate; 82. a first spring; 9. a movable plate; 10. a through groove; 11. a second spring; 12. a partition plate; 13. a guide rope; 14. a fixing hole; 15. a valve plate; 16. a fixed cavity; 17. an air delivery cavity; 18. a connecting pipe; 19. a slow flow cavity; 20. a suction cup; 21. a hauling rope; 22. a movable block; 221. a movable shaft; 222. a third spring; 223. a sealing block; 23. a connecting cavity; 24. a first air outlet; 25. a second air outlet hole; 26. a connecting channel; 27. a gas delivery pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-8, the present invention provides a technical solution: a six-axis manipulator for semiconductor cleaning equipment is provided with a supporting base 1, wherein a first shaft 2 is arranged at the top of the supporting base 1, the top of the first shaft 2 is rotatably connected with one end of a second shaft 3, a third shaft 4 is arranged at the other end of the second shaft 3, the third shaft 4 is mutually connected with a fifth shaft 6 through a fourth shaft 5, a sixth shaft 7 is arranged at the end head of the fifth shaft 6, and a clamping plate 8 is arranged at the end head of the sixth shaft 7;
the six-axis manipulator further comprises a movable plate 9, the section of the movable plate 9 is of a "" shape structure, a transverse plate of the "" shape movable plate 9 is arranged on the inner side of the clamping plate 8 through a through groove 10 formed in the surface of the clamping plate 8, the movable plate 9 forms a sliding structure through the through groove 10 and the clamping plate 8, one end of the bottom of the movable plate 9 is fixedly connected with the inner wall of the clamping plate 8 through a second spring 11, a partition plate 12 is fixed in the clamping plate 8, the other end of the bottom of the movable plate 9 is fixedly connected with one end of a guide rope 13, a fixing hole 14 is formed in the clamping plate 8, the transverse plate of the movable plate 9 is in sliding connection with the partition plate 12, and meanwhile, the transverse plate of the movable plate 9 after moving passes through the fixing hole 14;
the valve plate 15 is fixed at the other end of the guide rope 13, a sealed fixed cavity 16 is formed in the clamping plate 8, the valve plate 15 is arranged in the fixed cavity 16, an air conveying cavity 17 is formed in the side wall of the clamping plate 8, the bottom of the air conveying cavity 17 is fixedly connected with the movable plate 9 through a connecting pipe 18, a slow flow cavity 19 is formed in the vertical plate of the movable plate 9, and a sucker 20 is installed on the side face of the vertical plate of the movable plate 9;
Limiting plates 81 are arranged on two sides of the clamping plate 8, and the limiting plates 81 and the clamping plate 8 form a rotating structure; the side surfaces of the limiting plates 81 are connected with each other through the first springs 82 and the clamping plate 8, 2 groups of the limiting plates 81 are symmetrically arranged about the vertical axis of the clamping plate 8, and 2 adjacent limiting plates 81 are arranged in parallel;
as shown in fig. 1 to 3, 6 and 8, after the semiconductor device accommodating apparatus contacts the clamping plate 8, two sides of the semiconductor device accommodating apparatus can contact the movable plate 9 and push the movable plate to slide, so as to limit two sides of the semiconductor device accommodating apparatus, and the other two sides of the semiconductor device accommodating apparatus can contact the limiting plate 81 and push the limiting plate 81 to rotate, so as to limit the other two sides of the semiconductor device accommodating apparatus, and the limiting plate 81 can return to the original position through the resilience of the first spring 82 when not pushed;
the edge of the valve plate 15 is tightly attached to the inner wall of the fixed cavity 16, the valve plate 15 is longitudinally connected with the fixed cavity 16 in a sliding manner, and the fixed cavity 16 is communicated with a connecting pipe 18 through an air conveying cavity 17; the connecting pipe 18 is of a spring pipe structure, and the connecting pipe 18 is communicated with the sucking disc 20 through the slow flow cavity 19;
as shown in fig. 3 and fig. 6-7, the valve plate 15 is pulled by the guide rope 13 to move downwards, the valve plate 15 after moving downwards can generate suction force, and the suction force can be transmitted into the connecting pipe 18 through the air transmission cavity 17 and finally enters the slow flow cavity 19 to suck out air in the suction cup 20, so that the suction cup 20 is stably adsorbed on the side surface of the semiconductor device accommodating device, and the phenomenon of offset in the conveying process is prevented;
the movable shaft 221 penetrates through the inside of the movable block 22, the movable block 22 forms a rotating structure through the movable shaft 221 and the clamping plate 8, the section of the movable block 22 is of an L-shaped structure, and meanwhile, the rotating range of the movable block 22 is 0-90 degrees; the third spring 222 for driving the movable block 22 to reset is wound on each of the two ends of the movable shaft 221, the sealing blocks 223 made of rubber are adhered on the lateral surfaces of the two ends of the movable block 22, and the thickness of each sealing block 223 is equal to the shortest distance between the movable block 22 and the connecting cavity 23; the first air outlet hole 24 and the second air outlet hole 25 are obliquely and downwards arranged, the communication state of the first air outlet hole and the second air outlet hole is opposite to that of the connecting cavity 23, and the connecting cavity 23 is communicated with the air conveying pipe 27 through a connecting channel 26;
as shown in fig. 4-6, when the valve plate 15 moves downwards, the pulling rope 21 can be used for pulling the movable block 22 to rotate 90 degrees, so that the second air outlet 25 is communicated with the connecting cavity 23, the second air outlet 25 can be ventilated after the semiconductor device accommodating device is clamped, at the moment, the first air outlet 24 is in a blocking state, and the sealing block 223 can ensure the sealing performance of the air outlet in the blocking process and blow off floating ash of devices in the semiconductor device accommodating device, so that the subsequent cleaning treatment can be carried out.
The working principle is as follows: as shown in fig. 1-3, 6 and 8, the clamping plate 8 can be driven by the driving of the different axes of the manipulator to clamp the semiconductor device accommodating apparatus, when the semiconductor device accommodating apparatus contacts with the clamping plate 8, two sides of the semiconductor device accommodating apparatus can contact with the movable plate 9 and push the same to slide, the movable plate 9 slides in the through groove 10 and the partition plate 12 and drives the second spring 11 to be in a stretching state, and then the resilience of the second spring 11 can clamp the semiconductor device accommodating apparatus, so as to limit two sides of the semiconductor device accommodating apparatus, meanwhile, the other two sides of the semiconductor device accommodating apparatus can contact with the limiting plate 81 and push the limiting plate 81 to rotate, the limiting plate 81 can be driven by the resilience of the first spring 82 to be attached to the semiconductor device accommodating apparatus, so as to limit the other two sides of the semiconductor device accommodating apparatus, ensuring stability in conveyance after the clamping;
as shown in fig. 3 and fig. 6-7, after the movable plate 9 moves, the movable plate can pass through the inside of the fixing hole 14, the guide rope 13 is pulled to move, and the valve plate 15 is pulled to move downwards by the guide rope 13, the valve plate 15 after moving downwards can generate suction force, and the suction force can be transmitted to the gas transmission cavity 17, and then enters the slow flow cavity 19 through the connecting pipe 18, and finally the air in the suction cup 20 is sucked out, so that the suction cup 20 is stably adsorbed on the side surface of the semiconductor device accommodating device, and the phenomenon of offset in the conveying process is prevented, and the connecting pipe 18 is of a spring pipe structure, so that the movable plate can be contracted after being pushed, the movement of the movable plate 9 is not influenced, and the gas is convenient to transmit;
as shown in fig. 4-6, when the valve plate 15 moves downward, the pulling rope 21 can be pulled to move, the movable block 22 is pulled to rotate 90 ° counterclockwise, the movable block 22 in the initial state blocks the second air outlet 25, so that the wind power input through the air pipe 27 can enter the connecting cavity 23 through the connecting channel 26 and be blown out through the first air outlet 24, which plays a role of blowing away dust around the clamping plate 8, and the movable block 22 after rotating 90 ° can block the first air outlet 24, so as to realize the communication between the second air outlet 25 and the connecting cavity 23, so that the second air outlet 25 can be ventilated after clamping the semiconductor device accommodating device, and the floating dust on the surface of the semiconductor device accommodating device can be blown off, so as to facilitate the subsequent cleaning treatment, and simultaneously, when the movable block 22 blocks the air outlet, the sealing block 223 can be contacted with the air outlet, and then guarantee the leakproofness of shutoff, after the centre gripping to semiconductor device storage device was accomplished, the resilience fly leaf 9 of second spring 11 resumes the normal position, and the resilience of rethread third spring 222 drives movable block 22 and rotates 90 along the pointer to drive valve plate 15 and resume the normal position, wind-force can continue to blow off from first exhaust vent 24, makes things convenient for follow-up centre gripping to other semiconductor device storage device like this.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (3)
1. A six-axis manipulator for semiconductor cleaning equipment is provided with a supporting base (1), wherein a first shaft (2) is arranged at the top of the supporting base (1), the top of the first shaft (2) is rotatably connected with one end of a second shaft (3), a third shaft (4) is arranged at the other end of the second shaft (3), the third shaft (4) is connected with a fifth shaft (6) through a fourth shaft (5), a sixth shaft (7) is arranged at the end of the fifth shaft (6), and a clamping plate (8) is arranged at the end of the sixth shaft (7);
it is characterized in that the six-axis manipulator further comprises a movable plate (9), the section of the movable plate (9) is of a "" shape structure, and the horizontal plate of the "" shaped movable plate (9) is arranged at the inner side of the clamping plate (8) through a through groove (10) arranged on the surface of the clamping plate (8), the movable plate (9) and the clamping plate (8) form a sliding structure through the through groove (10), one end of the bottom of the movable plate (9) is fixedly connected with the inner wall of the clamping plate (8) through a second spring (11), a partition plate (12) is fixed in the clamping plate (8), and the other end of the bottom of the movable plate (9) is fixedly connected with one end of the guide rope (13), and the clamping plate (8) is provided with a fixing hole (14), and the transverse plate of the movable plate (9) is connected with the partition plate (12) in a sliding way, meanwhile, the horizontal plate of the movable plate (9) passes through the fixing hole (14);
the valve plate (15) is fixed at the other end of the guide rope (13), a sealed fixed cavity (16) is formed in the clamping plate (8), the valve plate (15) is arranged in the fixed cavity (16), an air conveying cavity (17) is formed in the side wall of the clamping plate (8), the bottom of the air conveying cavity (17) is fixedly connected with the movable plate (9) through a connecting pipe (18), a slow flow cavity (19) is formed in the vertical plate of the movable plate (9), and a sucker (20) is installed on the side face of the vertical plate of the movable plate (9);
the bottom of the traction rope (21) is fixedly connected with the upper end face of the valve plate (15), the top of the traction rope (21) is connected with the movable block (22), a connecting cavity (23) is formed in the clamping plate (8), the movable block (22) is arranged in the connecting cavity (23), two sides of the connecting cavity (23) are respectively provided with a first air outlet hole (24) and a second air outlet hole (25), the top of the connecting cavity (23) is connected with one end of the connecting channel (26), the other end of the connecting channel (26) is provided with an air pipe (27), and the connecting channel (26) is arranged on the clamping plate (8);
the edge of the valve plate (15) is tightly attached to the inner wall of the fixed cavity (16), the valve plate (15) is longitudinally connected with the fixed cavity (16) in a sliding manner, and the fixed cavity (16) is communicated with the connecting pipe (18) through the air conveying cavity (17);
the connecting pipe (18) is of a spring pipe structure, and the connecting pipe (18) is communicated with the sucking disc (20) through the slow flow cavity (19);
a movable shaft (221) penetrates through the inside of the movable block (22), the movable block (22) forms a rotating structure through the movable shaft (221) and the clamping plate (8), the section of the movable block (22) is of an L-shaped structure, and meanwhile, the rotating range of the movable block (22) is 0-90 degrees;
third springs (222) driving the movable blocks (22) to reset are wound on two ends of the movable shaft (221), sealing blocks (223) made of rubber are adhered to the side faces of two ends of each movable block (22), and the thickness of each sealing block (223) is equal to the shortest distance between each movable block (22) and the corresponding connecting cavity (23);
first exhaust vent (24) and second exhaust vent (25) are the slope and set up downwards, and both are opposite with the connected state who connects chamber (23) to it is linked together through interface channel (26) and air-supply pipe (27) to connect chamber (23).
2. The six-axis robot for a semiconductor cleaning apparatus according to claim 1, characterized in that: limiting plates (81) are arranged on two sides of the clamping plate (8), and the rotating structures are formed by the limiting plates (81) and the clamping plate (8).
3. The six-axis robot for a semiconductor cleaning apparatus according to claim 2, characterized in that: the side of the limiting plate (81) is connected with the clamping plate (8) through a first spring (82), the limiting plates (81) are symmetrically arranged with 2 groups about the vertical axis of the clamping plate (8), and the adjacent 2 limiting plates (81) are arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111199967.3A CN113635292B (en) | 2021-10-14 | 2021-10-14 | Six-shaft mechanical arm for semiconductor cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111199967.3A CN113635292B (en) | 2021-10-14 | 2021-10-14 | Six-shaft mechanical arm for semiconductor cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113635292A CN113635292A (en) | 2021-11-12 |
| CN113635292B true CN113635292B (en) | 2021-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111199967.3A Active CN113635292B (en) | 2021-10-14 | 2021-10-14 | Six-shaft mechanical arm for semiconductor cleaning equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114347054A (en) * | 2021-12-31 | 2022-04-15 | 曾淑梅 | Industrial robot based on big data |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1166988A1 (en) * | 1983-12-28 | 1985-07-15 | Подольский Ордена Ленина И Ордена Трудового Красного Знамени Механический Завод Им.М.И.Калинина Производственного Объединения "Подольскшвеймаш" | Manipulator grip |
| CN206913171U (en) * | 2017-07-26 | 2018-01-23 | 陈少梅 | A kind of industrial machinery handgrip |
| CN111360791B (en) * | 2020-03-27 | 2021-05-07 | 江苏瑞伯特智能科技股份有限公司 | Stable form intelligent manufacturing mechanical arm with secondary limiting function |
| CN111546364B (en) * | 2020-05-18 | 2021-07-27 | 日照易捷工具制造有限公司 | Multifunctional manipulator for intelligent manufacturing |
| CN213647559U (en) * | 2020-10-28 | 2021-07-09 | 浙江东亘金属科技有限公司 | Novel six-shaft mechanical arm |
| CN113104581B (en) * | 2021-04-02 | 2022-12-27 | 珠海市有兴精工机械有限公司 | Energy-saving linkage clamping and sucking device |
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- 2021-10-14 CN CN202111199967.3A patent/CN113635292B/en active Active
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| CN113635292A (en) | 2021-11-12 |
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