CN113630992B - Preparation method of coated part, shell and electronic equipment - Google Patents

Preparation method of coated part, shell and electronic equipment Download PDF

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Publication number
CN113630992B
CN113630992B CN202010373071.1A CN202010373071A CN113630992B CN 113630992 B CN113630992 B CN 113630992B CN 202010373071 A CN202010373071 A CN 202010373071A CN 113630992 B CN113630992 B CN 113630992B
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layer
photoresist layer
photoresist
optical coating
substrate
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CN113630992A (en
Inventor
王雷
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The application provides a shell, which comprises a substrate layer, an optical coating layer and an ink layer, wherein the optical coating layer is formed on the surface of the substrate layer, the optical coating layer comprises at least one coating layer patterning area, and part of the surface of the substrate layer is exposed from a gap of the coating layer patterning area of the optical coating layer; the ink layer is formed on the surface of the optical coating layer and the surface of the substrate layer exposed from the optical coating layer. The application also provides a preparation method of the film-coated piece and electronic equipment.

Description

Preparation method of coated part, shell and electronic equipment
Technical Field
The application relates to the field of surface treatment, in particular to a preparation method of a coated piece, a shell and electronic equipment.
Background
The traditional electronic equipment has pure appearance color, is thin and low in smell, and is difficult to meet the demands of most consumers. At present, manufacturers adopt a multi-color, such as gradual-change, shell design, so that the electronic equipment is quite personal, has obvious distinction and is accepted by a plurality of users. However, the process of manufacturing the multicolor shell in the prior art is not mature, and the texture of the obtained multicolor film layer on the surface of the shell is poor and the multicolor change effect is monotonous.
Disclosure of Invention
The application provides a preparation method of a film-coated piece, a shell and electronic equipment, and the obtained multicolor film layer has better texture, is favorable for forming varied colors and has better appearance.
The application provides a preparation method of a coated piece, which comprises the following steps: providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite; forming a photoresist layer on the first surface of the substrate; removing part of the photoresist layer in the region through exposure and development, so that part of the first surface is exposed out of the photoresist layer; forming an optical coating layer on the first surface of the substrate exposed in the photoresist layer; removing the photoresist layer to expose part of the first surface of the substrate from the optical coating layer; and forming at least one ink layer on the optical coating layer and the first surface exposed to the optical coating layer to obtain a coating piece.
The application also provides a preparation method of the coated piece, which comprises the following steps: providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite; forming a photoresist layer on the first surface of the substrate; removing part of the photoresist layer in the region through exposure and development, so that part of the first surface is exposed out of the photoresist layer; forming an optical coating layer on the photoresist layer and the first surface exposed in the photoresist layer; and forming at least one ink layer on the optical coating layer to obtain a coating piece.
The application also provides a shell which is characterized by comprising a substrate layer, an optical coating layer and an ink layer, wherein the optical coating layer is formed on the surface of the substrate layer, the optical coating layer comprises at least one coating layer patterning area, and part of the surface of the substrate layer is exposed from a gap of the coating layer patterning area of the optical coating layer; the ink layer is formed on the surface of the optical coating layer and the surface of the substrate layer exposed from the optical coating layer.
The application also provides a shell which is characterized by comprising a substrate layer, a photoresistance layer, an optical coating layer and an ink layer; the photoresist layer comprises at least one photoresist layer patterning region, and part of the surface of the substrate layer is exposed from the gap of the photoresist layer patterning region of the photoresist layer; the optical coating layer is formed on the surface of the photoresist layer and the surface of the substrate layer exposed from the photoresist layer patterning area; the ink layer is formed on the surface of the optical coating layer.
The application also provides electronic equipment, which comprises the shell.
The optical coating layer or the photoresist layer of the embodiment of the application is provided with the patterned area, and the patterned area can realize specific decorative effect and color change effect by combining the ink layer through light refraction.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for preparing a coated member according to a first embodiment of the present application.
Fig. 2 is a schematic diagram of a reflectivity curve of an optical coating layer according to a first embodiment of the present application.
Fig. 3 is a schematic flow chart of a method for preparing a coated member according to a second embodiment of the present application.
Fig. 4 is a schematic cross-sectional view of a housing provided in a third embodiment of the present application.
Fig. 5 is a schematic cross-sectional view of a housing provided in a fourth embodiment of the present application.
Fig. 6 is a schematic structural diagram of an electronic device according to a fifth embodiment of the present application.
Fig. 7 is a schematic cross-sectional view of a substrate provided in example 1 of the present application.
Fig. 8 is a schematic cross-sectional view of a photoresist layer formed on the surface of the substrate provided in fig. 7.
Fig. 9 is a schematic cross-sectional view of the photoresist layer of fig. 8 after exposure development.
Fig. 10 is a front view schematically showing the photoresist layer of fig. 8 after exposure and development.
Fig. 11 is a schematic cross-sectional view of the photoresist layer of fig. 10 after an optical coating layer is formed on the surface thereof.
FIG. 12 is a schematic cross-sectional view of the photoresist layer of FIG. 11 after removing the optical coating layer from the surface of the photoresist layer.
Fig. 13 is a schematic cross-sectional view of the optical coating layer of fig. 12 after forming a marking layer, wherein the cross-sectional position of fig. 13 is different from the cross-sectional positions of other figures, and specifically, fig. 13 is taken along the marking layer and the other figures are taken along the area other than the marking layer.
Fig. 14 is a schematic cross-sectional view of the optical coating layer and the gap-forming ink layer of fig. 13.
FIG. 15 is a schematic cross-sectional view of the ink layer of FIG. 14 after ablation to form an imaging aperture.
Fig. 16 is a schematic cross-sectional view of a coated member obtained by forming an anti-fingerprint film layer on the other surface of the substrate of fig. 15.
Fig. 17 is a schematic front view of a coated member obtained by forming an anti-fingerprint film layer on the other surface of the substrate of fig. 15.
Fig. 18 is a schematic cross-sectional view of a coated member according to embodiment 2 of the present application.
Fig. 19 is a schematic structural diagram of a patterned region of a photoresist layer according to embodiment 3 of the present application.
Fig. 20 is a schematic structural diagram of a patterned region of a photoresist layer according to embodiment 4 of the present application.
Detailed Description
In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms first, second and the like in the description and in the claims and in the above-described figures are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
The method for manufacturing a coated member and the housing according to the embodiments of the present application are applicable to various electronic devices, for example, portable, mobile computing devices, wearable devices, etc. such as smart phones, notebook computers, tablet computers, game devices, etc., but the embodiments of the present application are not limited thereto.
As shown in fig. 1, a first embodiment of the present application provides a method for preparing a coated member, including:
s101, providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite;
s102, forming a photoresist layer on the first surface of the base material;
s103, removing part of the photoresist layer in the region through exposure and development, so that part of the first surface is exposed out of the photoresist layer;
s104, forming an optical coating layer on the first surface of the substrate exposed in the photoresist layer;
s105, removing the photoresist layer to expose part of the first surface of the substrate from the optical coating layer;
and S106, forming at least one ink layer on the optical coating layer and the first surface exposed to the optical coating layer to obtain a coating piece.
The application directly forms the photoresist layer on the surface of the base material, then makes the photoresist layer present different patterns through methods such as exposure, development and the like, and then forms the optical coating layer and the printing ink layer to realize specific decorative effect, so that the process is simpler, and rich colors and changing effects are easier to form; in addition, the application forms the optical coating layer on the first surface of the substrate exposed in the photoresist layer, and forms at least one ink layer on the optical coating layer and the first surface exposed in the optical coating layer, thereby obtaining a coating piece with a relatively flat surface and good texture.
Wherein, the material of the base material can be resin material, resin composite material, glass and the like; preferably, the material of the substrate is glass.
In some embodiments, the photoresist layer after exposure and development is an equal thickness film layer, i.e., the thickness of the photoresist layer after exposure and development is uniform.
In some embodiments, the exposed and developed photoresist layer includes at least one photoresist layer patterned region, where the pattern of the patterned region is, for example, a regular pattern such as a mesh point, a grid, etc., and the regular pattern may be, for example, a uniformly distributed pattern or a gradual change pattern, or the patterned region may also be an irregular artistic pattern such as a person, an animal, a landscape, an abstract line, etc.; etc.
In some embodiments, the photoresist layer may be formed by:
performing plasma treatment on the first surface of the substrate by using a plasma cleaning machine, so that the first surface is kept dry and clean;
coating a liquid photoresist on the first surface of the substrate by means of coating, spraying, spin coating or silk screen printing;
pre-curing the liquid photoresist on the first surface to obtain a photoresist layer; the pre-curing mode may be pre-baking at 100 deg.c for 5-8 min.
Wherein the thickness of the photoresist layer is below 5 microns, preferably 1.5 microns to 3 microns, and too thick can cause the increase of the dosage of the liquid photoresist and is unfavorable for exposure; too thin can increase process difficulty and easily cause uneven photoresist layer thickness.
When the first surface of the substrate is a 3D surface, the photoresist layer is preferably formed by coating, spraying, spin coating, or the like.
In some embodiments, the method of removing a portion of the photoresist layer by exposing and developing includes:
designing a required pattern on a computer;
the pattern is led into Laser Direct Imaging (LDI) equipment, and a computer is used for controlling a laser head so as to realize that the pattern is directly output and displayed on a photoresist layer, so that the photoresist layer corresponding to the laser head is exposed;
and removing part of the photoresist layer to expose part of the first surface from the photoresist layer.
In some embodiments, the photoresist layer is a negative photoresist, and the photoresist layer in the unexposed area is removed, so that a portion of the first surface is exposed from the photoresist layer.
In another embodiment, the photoresist layer is a positive photoresist, and the photoresist layer in the exposed area is removed to expose a portion of the first surface from the photoresist layer.
Wherein the wavelength of exposure is 365 nm to 395 nm; the exposure energy is 300 megajoules per square centimeter (mj/cm 2) to 600mj/cm 2 Specifically, the thickness of the photoresist can be flexibly adjusted; in a preferred embodiment, the exposure energy is preferably 300mj/cm 2 To 400mj/cm 2 。
The method of developing to remove the photoresist depends on the composition of the photoresist; one method for removing the positive photoresist may be: the exposed resist is washed away by a weakly basic aqueous solution, e.g. sodium carbonate Na 2 CO 3 (1-2% concentration) and potassium hydroxide KOH (0.1-0.2% concentration) to clean the exposed photoresist; wherein the water pressure of the aqueous solution is controlled to be 0.1 kg per square centimeter (kg/cm) 2 ) To 0.5kg/cm 2 The temperature is controlled between 25 ℃ and 30 ℃ and the time is controlled between 60 seconds and 90 seconds.
In the embodiment, the LDI process is adopted to expose the photoresist, a photomask required by the traditional yellow light process is not required, and the process is simpler; in addition, the traditional yellow light process adopts a photomask to make a product with a curved surface difficult to make, and the LDI process is adopted, is not influenced by the surface morphology of the substrate, can be suitable for the surface of a planar or curved substrate, and has a wide application range.
The optical coating layer generally covers the pattern gap of the photoresist layer and the surface of the photoresist layer after exposure and development at the same time in the step.
In some embodiments, the method for removing the photoresist layer after forming the optical coating layer to expose a portion of the first surface from the optical coating layer may include: spraying a release liquid onto the photoresist layer to dissolve the photoresist. The optical coating layer covering the surface of the photoresist layer is removed along with the removal of the photoresist layer, so that a patterned optical coating layer is formed.
In some embodiments, the stripping solution is potassium hydroxide KOH aqueous solution (0.8-1.2% concentration), and the water pressure of the aqueous solution is controlled to be 1.0kg/cm 2 To 1.2kg/cm 2 The temperature is controlled between 25 ℃ and 30 ℃ and the time is controlled between 100s and 150s.
In some embodiments, the patterned optical coating layer after removing the photoresist layer is also an equal thickness film layer, and the thickness of the optical coating layer is equal to the thickness of the photoresist layer.
Correspondingly, the patterned optical coating layer after removing the photoresist layer also comprises at least one coating layer patterning area complementary to the photoresist layer patterning area, i.e. the coating layer patterning area of the optical coating layer is also a regular pattern such as a mesh point, a grid, etc., and the regular pattern can be a uniformly distributed pattern or a gradual change pattern, or the patterning area can also be an irregular artistic pattern such as a person, an animal, a landscape, an abstract line, etc.; etc.; therefore, the coating layer patterning area of the optical coating layer enables the surface of the formed coating piece to present a specific decorative effect.
In some embodiments, the patterned area of the coating layer at least includes a dot area, and the distribution density of the network dots in the dot area gradually increases or decreases in at least one direction, that is, a gradient pattern, so that the surface of the obtained coated piece can exhibit a gradient color effect; for example, the distribution density of the network points gradually increases or decreases from the center to the edge of the first surface of the substrate, or the distribution density of the network points gradually increases or decreases from one side to the other side along the substrate; of course, this example is not limited thereto.
In other embodiments, the patterned area of the coating layer at least includes a grid area, and the size of the grid in the grid area, such as the width of the grid line, the size of the grid, etc., gradually increases or decreases in at least one direction, that is, a gradient pattern, so that the surface of the obtained coated member may also exhibit a gradient color effect; for example, the grid lines may be the same size, the width of the grid lines may be gradually increased or decreased from the center of the first surface of the substrate to the edge, or the width of the grid lines may be gradually increased or decreased from one side to the other side along the substrate; of course, this example is not limited thereto.
In other embodiments, the coating layer patterned region comprises at least an irregular pattern region; the irregular pattern is an irregular art pattern of characters, animals, scenery, abstract lines and the like.
In some embodiments, the film-system structure of the optical coating layer may be silicon dioxide (SiO 2 ) And titanium pentoxide (Ti) 3 O 5 ) Multi-layer combination of (2), siO 2 And titanium dioxide (TiO) 2 ) Or, siO 2 And niobium oxide (NbO). Wherein the film can be deposited by vacuum plating at a lower vacuum level (e.g., about 2X 10 -4 Pa or so), sputtering the coating material on the photoresist layer side of the substrate. Different membrane systems can be designed as required.
In some embodiments, the film-based structure is SiO 2 +TiO 2 With reference to fig. 2, the film-based structure can achieve visual effects approaching that of ceramic black.
In other embodiments, other film structures may be selected, and film layers with different appearances may be obtained by stacking the film layers, or film structures with colors may be selected, so that the film coated member presents a specific color.
In some embodiments, the ink layer is formed by screen printing or spraying, and the ink layer is formed on the surface of the optical coating layer and the pattern gap of the optical coating layer.
The ink layer can completely cover the surface of the coating piece or can partially cover the surface of the coating piece; when the surface of the coating part is partially covered, for example, the following are: forming an ink layer comprising a window area, for example for light transmission of a camera area; the ink layer including the window region may be formed by masking or the like.
In some embodiments, the ink layer comprises a base color layer and a top coat layer formed on the surface of the base color layer away from the optical coating layer; the base coat layer and the finish coat layer can be of a single-layer or multi-layer structure.
In some embodiments, the base color layer may be, for example, a clear ink, preferably having a thickness of 10 microns to 15 microns.
In some embodiments, after silk-screening or spraying the ink of the base layer, the ink is typically cured at a temperature of 150 ℃ for a period of 30 minutes to 60 minutes.
In some embodiments, the topcoat layer may be, for example, a matte ink, with the thickness of the topcoat layer preferably being 5 microns to 10 microns.
In some embodiments, after silk-screening or spraying the ink of the topcoat layer, the ink is typically cured at a temperature of 150 ℃ for a period of 30 minutes to 60 minutes.
In some embodiments, the base color layer is made of a glossy ink, and the top paint layer is made of a matte ink, so that specific gorgeous and high-gloss colors can be realized, and the surface of the coated piece can have a higher dyne value (commonly called as dyne/cm, expressed as the magnitude of a surface tension coefficient), which is beneficial to the adhesion of the back adhesive in the subsequent processing step.
The colors of the base color layer and the finish layer can be black, gray, red and the like according to design requirements.
In the application, the optical coating layer comprises a coating layer patterning area, after the printing ink layer is formed, patterns corresponding to the coating layer patterning area are displayed on the coating piece, and the superposition of the optical coating layer and the printing ink layer is matched with refraction of light, and the like, so that specific color change is displayed on the coating piece; for example, when the patterned area of the coating layer is a graded lattice point or grid area, the superposition of the optical coating layer and the ink layer is matched with refraction of light, and the like, so that a graded color effect is displayed on the coated member.
In some embodiments, the method for preparing the coated member may further include the steps of:
Forming a marking layer on the surface of the base material.
In some embodiments, the identification layer may be formed by silk-screening or spraying; the identification layer may be, for example, a brand identification, a company identification, a brand identification, a product model identification, and the like.
In some embodiments, the identification layer is formed in the gap of the optical coating layer.
In some embodiments, after the ink layer is formed, the method for preparing the coated member may further include the steps of:
the laser ablates away a portion of the ink layer exposing the substrate layer beneath the ink layer, thereby forming a window area in the ink layer.
The window area is, for example, a position where a camera of the electronic device is located, and is formed to prevent the ink layer from shielding light of the camera.
It will be appreciated that if the ink layer containing the window area is formed directly in step S106, this step need not be performed.
In some embodiments, the method for preparing a coated article may further include the steps of:
an anti-fingerprint coating is formed on the second surface of the substrate.
In some embodiments, the anti-fingerprint coating is made of perfluoropolyether material; the anti-fingerprint coating can be formed by vapor deposition and the like.
In some embodiments, the anti-fingerprint coating has a thickness of 5 nanometers to 20 nanometers and a water contact angle of greater than 105 degrees.
The anti-fingerprint coating is used for enabling the second surface of the film plating piece to have excellent fingerprint resistance, so that the film plating piece can be conveniently applied to a shell of electronic equipment and the like.
As shown in fig. 3, a first embodiment of the present application provides a method for preparing a coated member, including:
s301, providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite;
s302, forming a photoresist layer on the first surface of the substrate;
s303, removing part of the photoresist layer in the region through exposure and development, so that part of the first surface is exposed out of the photoresist layer;
s304, forming an optical coating layer on the photoresist layer and the first surface exposed in the photoresist layer;
s305, forming at least one ink layer on the optical coating layer to obtain a coating piece.
The application directly forms the photoresist layer on the surface of the base material, then makes the photoresist layer present different patterns through methods such as exposure, development and the like, and then forms the optical coating layer and the printing ink layer to realize specific decorative effect, so that the process is simpler, and rich colors and changing effects are easier to form; in addition, in the embodiment, the photoresist layer after exposure and development is not removed, so that the photoresist layer can also play a role of a patterned ground color layer, and coated pieces with different colors and specific patterns can be formed; in addition, the application forms the optical coating layer on the surface of the photoresist layer and forms at least one ink layer on the optical coating layer, thereby obtaining a coating piece with a relatively flat surface and good texture.
Wherein, the material of the base material can be resin material, resin composite material, glass and the like; preferably, the material of the substrate is glass.
In some embodiments, the photoresist layer may be formed by:
performing plasma treatment on the first surface of the substrate by using a plasma cleaning machine, so that the first surface is kept dry and clean;
coating a liquid photoresist on the first surface of the substrate by means of coating, spraying, spin coating or silk screen printing;
pre-curing the liquid photoresist on the first surface to obtain a photoresist layer; the pre-curing mode may be pre-baking at 100 deg.c for 5-8 min.
Wherein the thickness of the photoresist layer is below 5 microns, preferably 1.5 microns to 3 microns, and too thick can cause the increase of the dosage of the liquid photoresist and is unfavorable for exposure; too thin can increase process difficulty and easily cause uneven photoresist layer thickness.
When the first surface of the substrate is a 3D surface, the photoresist layer is preferably formed by coating, spraying, spin coating, or the like.
In some embodiments, pigments such as pigments or dyes may be added to the liquid photoresist layer to make the photoresist layer exhibit a certain color, even if the photoresist layer is a colored photoresist layer, so that the finally formed coated member exhibits a certain color.
In some embodiments, the method of removing a portion of the photoresist layer by exposing and developing includes:
designing a required pattern on a computer;
the pattern is led into Laser Direct Imaging (LDI) equipment, and a computer is used for controlling a laser head so as to realize that the pattern is directly output and displayed on a photoresist layer, so that the photoresist layer corresponding to the laser head is exposed;
and removing part of the photoresist layer to expose part of the first surface from the photoresist layer.
In some embodiments, the photoresist layer is a negative photoresist, and the photoresist layer in the unexposed area is removed, so that a portion of the first surface is exposed from the photoresist layer.
In another embodiment, the photoresist layer is a positive photoresist, and the photoresist layer in the exposed area is removed to expose a portion of the first surface from the photoresist layer.
Wherein the wavelength of exposure is 365 nm to 395 nm; the exposure energy is 300 megajoules per square centimeter (mj/cm 2) to 600mj/cm 2 Specifically, the thickness of the photoresist can be flexibly adjusted; in a preferred embodiment, the exposure energy is preferably 300mj/cm 2 To 400mj/cm 2 。
The method of developing to remove the photoresist depends on the composition of the photoresist; one method for removing the positive photoresist may be: the exposed resist is washed away by a weakly basic aqueous solution, e.g. sodium carbonate Na 2 CO 3 (1-2% concentration) and potassium hydroxide KOH (0.1-0.2% concentration) to clean the exposed photoresist; wherein the water pressure of the aqueous solution is controlled to be 0.1 kg per square centimeter (kg/cm) 2 ) To 0.5kg/cm 2 The temperature is controlled between 25 ℃ and 30 ℃ and the time is controlled between 60 seconds and 90 seconds.
In the embodiment, the LDI process is adopted to expose the photoresist, a photomask required by the traditional yellow light process is not required, and the process is simpler; in addition, the traditional yellow light process adopts a photomask to make a product with a curved surface difficult to make, and the LDI process is adopted, is not influenced by the surface morphology of the substrate, can be suitable for the surface of a planar or curved substrate, and has a wide application range.
In some embodiments, the photoresist layer after exposure and development is an equal thickness film layer, i.e., the thickness of the photoresist layer after exposure and development is uniform.
In some embodiments, the exposed and developed photoresist layer includes at least one photoresist layer patterned region, where the pattern of the patterned region is, for example, a regular pattern such as a mesh point, a grid, etc., and the regular pattern may be, for example, a uniformly distributed pattern or a gradual change pattern, or the patterned region may also be an irregular artistic pattern such as a person, an animal, a landscape, an abstract line, etc.; etc.; the patterned area of the photoresist layer enables the surface of the formed coating piece to present a specific decorative effect.
In some embodiments, the patterned area of the photoresist layer includes at least one dot area, and the distribution density of the dots in the dot area is gradually increased or decreased in at least one direction, that is, a gradient pattern, so that the surface of the obtained coated member can exhibit a gradient color effect; for example, the distribution density of the network points gradually increases or decreases from the center to the edge of the first surface of the substrate, or the distribution density of the network points gradually increases or decreases from one side to the other side along the substrate; of course, this example is not limited thereto.
In some embodiments, the patterned area of the photoresist layer includes at least one grid area, and the size of the grid in the grid area, such as the width of the grid line, the size of the grid, etc., is gradually increased or decreased in at least one direction, that is, a gradient pattern, so that the surface of the obtained coated member may also exhibit a gradient color effect; for example, the grid lines may be the same size, the width of the grid lines may be gradually increased or decreased from the center of the first surface of the substrate to the edge, or the width of the grid lines may be gradually increased or decreased from one side to the other side along the substrate; of course, this example is not limited thereto.
In other embodiments, the photoresist layer patterned region comprises at least an irregular pattern region; the irregular pattern is an irregular art pattern of characters, animals, scenery, abstract lines and the like.
It is understood that the patterned region of the photoresist layer may include two or three of the above-mentioned dot region, grid region, and irregular pattern region.
In some embodiments, the optical coating layer fills the gaps of the photoresist layer and covers the surface of the photoresist layer.
In some embodiments, the surface of the optical coating layer is substantially planar, so as to facilitate the subsequent steps and the presentation of the pattern of the photoresist layer; of course, in other embodiments, the optical coating layer may also be curved or the like.
In some embodiments, the film system structure of the optical coating film can be SiO 2 +Ti 3 O 5 Multi-layer combination of (2) SiO 2 +TiO 2 Or SiO of a multi-layer combination of (2) 2 Multi-layer combination of +nbo. Wherein the film can be deposited by vacuum plating at a lower vacuum level (e.g., about 2X 10 -4 Pa or so), sputtering the coating material on the photoresist layer side of the substrate. Different membrane systems can be designed as required.
In some embodiments, the film-based structure is SiO 2 +TiO 2 With reference to fig. 2, the film-based structure can achieve visual effects approaching that of ceramic black.
In other embodiments, other film structures may be selected, and film layers with different appearances may be obtained by stacking the film layers, or film structures with colors may be selected, so that the film coated member presents a specific color.
In this embodiment, the optical coating layer covers the photoresist layer and the photoresist layer at the same time, and the photoresist layer can be used as a primer layer, and is matched with the optical coating layer to make the formed coated member exhibit specific color change.
In some embodiments, the color of the optical coating layer is different from the color of the photoresist layer.
In some embodiments, the ink layer is formed by silk screen printing or spraying, wherein the ink layer can completely cover the surface of the coating piece or can partially cover the surface of the coating piece; when the surface of the coating part is partially covered, for example, the following are: forming an ink layer comprising a window area, for example for light transmission of a camera area; the ink layer including the window region may be formed by masking or the like.
In some embodiments, the ink layer comprises a base color layer and a top coat layer formed on the surface of the base color layer away from the optical coating layer; the base coat layer and the finish coat layer can be of a single-layer or multi-layer structure.
In some embodiments, the base color layer may be, for example, a clear ink, preferably having a thickness of 10 microns to 15 microns.
In some embodiments, after silk-screening or spraying the ink of the base layer, the ink is typically cured at a temperature of 150 ℃ for a period of 30 minutes to 60 minutes.
In some embodiments, the topcoat layer may be, for example, a matte ink, with the thickness of the topcoat layer preferably being 5 microns to 10 microns.
In some embodiments, after silk-screening or spraying the ink of the topcoat layer, the ink is typically cured at a temperature of 150 ℃ for a period of 30 minutes to 60 minutes.
In some embodiments, the base color layer is made of a glossy ink, and the top paint layer is made of a matte ink, so that specific gorgeous and high-gloss colors can be realized, and the surface of the coated piece can have a higher dyne value (commonly called as dyne/cm, expressed as the magnitude of a surface tension coefficient), which is beneficial to the adhesion of the back adhesive in the subsequent processing step.
The colors of the base color layer and the finish layer can be black, gray and the like according to design requirements.
In the application, the photoresist layer is not removed after development, an optical coating layer is directly formed on the photoresist layer and the surface of a substrate exposed to the photoresist layer, the photoresist layer comprises a photoresist layer patterning area, after an ink layer is formed, a pattern corresponding to the photoresist layer patterning area is displayed on the coating piece, and the photoresist layer, the optical coating layer, the ink layer are overlapped to match with refraction of light and the like, so that specific color change is displayed on the coating piece; for example, when the patterned area of the photoresist layer is a graded lattice point or grid area, the superposition of the photoresist layer, the optical coating layer and the ink layer is matched with refraction of light, and the like, so that a graded color effect is displayed on the coated member.
In some embodiments, the method for preparing the coated member may further include the steps of:
forming a marking layer on the surface of the base material.
In some embodiments, the identification layer may be formed by silk-screening or spraying; the identification layer may be, for example, a brand identification, a company identification, a brand identification, a product model identification, and the like.
In some embodiments, the marking layer is formed on a surface of the optical coating layer; for example, the surface of the optical coating layer corresponding to the gap of the photoresist layer may not protrude from the whole coating member, or the surface of the optical coating layer corresponding to the photoresist layer may slightly protrude from the whole coating member, so as to have a texture.
In some embodiments, after the ink layer is formed, the method for preparing the coated member may further include the steps of:
the laser ablates away a portion of the ink layer, forming a window area in the ink layer.
The window area is, for example, a position where a camera of the electronic device is located, and is formed to prevent the ink layer from shielding light of the camera.
It will be appreciated that if the ink layer containing the window area is directly formed in step S305, this step need not be performed.
In some embodiments, the method for preparing a coated article may further include the steps of:
an anti-fingerprint coating is formed on the second surface of the substrate.
In some embodiments, the anti-fingerprint coating is made of perfluoropolyether material; the anti-fingerprint coating can be formed by vapor deposition and the like.
In some embodiments, the anti-fingerprint coating has a thickness of 5 nanometers to 20 nanometers and a water contact angle of greater than 105 degrees.
The anti-fingerprint coating is used for enabling the second surface of the film plating piece to have excellent fingerprint resistance, so that the film plating piece can be conveniently applied to a shell of electronic equipment and the like.
The application also provides a shell manufactured by adopting the film plating piece obtained by the method of the first embodiment and the second embodiment, which is specifically as follows. The housing may be a housing of an electronic device, for example, a battery back cover of the electronic device.
As shown in fig. 4, a third embodiment of the present application provides a housing 100, wherein the housing 100 includes a substrate layer 10, an optical coating layer 20 and an ink layer 30; the optical coating layer 20 is formed on the surface of the substrate layer 10, the optical coating layer 20 includes at least one coating layer patterned region 21, and a portion of the surface of the substrate layer 10 is exposed from the gap between the coating layer patterned regions 21 of the optical coating layer 20; the ink layer 30 is formed on the surface of the optical coating layer 20 and the surface of the substrate layer 10 exposed from the optical coating layer 20.
In some embodiments, the patterned area 21 of the coating layer at least includes a dot area, and the distribution density of the dots in the dot area gradually increases or decreases in at least one direction, so that the surface of the housing 100 may exhibit a gradient color effect; for example, the distribution density of the network points gradually increases or decreases from the center to the edge of the first surface of the substrate, or the distribution density of the network points gradually increases or decreases from one side to the other side along the substrate; of course, this example is not limited thereto.
In other embodiments, the patterned area 21 of the coating layer includes at least a grid area, and the size of the grid in the grid area, such as the width of the grid line, the size of the grid, etc., gradually increases or decreases in at least one direction, so that the surface of the housing 100 may also exhibit a gradient color effect; for example, the grid lines may be the same size, the width of the grid lines may be gradually increased or decreased from the center of the first surface of the substrate to the edge, or the width of the grid lines may be gradually increased or decreased from one side to the other side along the substrate; of course, this example is not limited thereto.
In other embodiments, the coating layer patterned region 21 includes at least an irregular pattern region; the irregular pattern is an irregular art pattern of characters, animals, scenery, abstract lines and the like; the irregular pattern causes the surface of the case 100 to exhibit a specific decorative effect.
It will be appreciated that the patterned area 21 of the coating layer may also include two or three of the above-mentioned dot area, grid area, and irregular pattern area.
In some embodiments, the optical platingThe film structure of the film layer 20 can be SiO 2 +Ti 3 O 5 Multilayer combination, siO 2 +TiO 2 Multilayer combinations, or SiO 2 +nbo multilayer combination.
In some embodiments, the film-based structure is SiO 2 +TiO 2 The multilayer combination, whose reflectance curve is shown in fig. 2, allows visual effects approaching that of ceramic black to be achieved by the film-based structure.
In other embodiments, other film structures may be selected, and film layers with different appearances may be obtained by stacking the film layers, or film structures with colors may be selected, so that the film coated member presents a specific color.
In some embodiments, the ink layer 30 includes a primer layer 31 and a topcoat layer 32 formed on a side of the primer layer 31 remote from the optical coating layer 30; the primer layer 31 and the topcoat layer 32 may each have a single-layer or multi-layer structure.
In some embodiments, the under-color layer 31 may be, for example, a glossy ink, and the thickness of the under-color layer 31 is preferably 10 micrometers to 15 micrometers.
In some embodiments, the topcoat layer 32 may be, for example, a matte ink.
In some embodiments, the thickness of the topcoat layer 32 is less than the thickness of the basecoat layer 31; for example, the topcoat layer 32 preferably has a thickness of 5 microns to 10 microns.
In some embodiments, the base color layer 31 is a glossy ink, and the top color layer 32 is a matte ink, so that not only a specific gorgeous and high-gloss color can be realized, but also the surface of the shell 100 can have a higher dyne value, which is beneficial to the adhesion of the back glue on the inner surface of the shell.
In the present application, the optical coating layer 20 includes a coating layer patterned area 21, a pattern corresponding to the coating layer patterned area 21 can be displayed on the housing 100, and a specific color change can be displayed on the housing 100 due to refraction of light and the like combined by superposition of the optical coating layer 20 and the ink layer 30; for example, when the patterned coating region 21 includes a graded dot or grid region, the superposition of the optical coating layer 20 and the ink layer 30 can be matched with refraction of light, and the like, so that a graded color effect can be exhibited on the housing 100.
As shown in fig. 5, a fourth embodiment of the present application provides a housing 100a, wherein the housing 100a includes a substrate layer 10, a photoresist layer 40, an optical coating layer 20 and an ink layer 30; the photoresist layer 40 includes at least one photoresist layer patterned region 41, and a portion of the surface of the substrate layer 10 is exposed from the gap between the photoresist layer patterned regions 41 of the photoresist layer 40; the optical coating layer 20 is formed on the surface of the photoresist layer 40 and the surface of the substrate layer 10 exposed from the photoresist layer patterning region 41; the ink layer 30 is formed on the surface of the optical coating layer 20.
The reason why the photoresist layer 40 is named as photoresist is that: the photoresist layer 40 is formed by exposing and developing photoresist, that is, the material of the photoresist layer 40 is a material having photosensitive property, such as a positive photoresist material or a negative photoresist material.
The pattern of the patterned area 41 of the photoresist layer may be, for example, a regular pattern such as a mesh point or a grid, and the regular pattern may be, for example, a uniformly distributed pattern or a gradual change pattern, or the patterned area may be an irregular artistic pattern such as a person, an animal, a landscape, an abstract line, etc.; etc.
In some embodiments, the patterned photoresist layer region 41 includes at least a dot region, and the distribution density of the dots in the dot region gradually increases or decreases in at least one direction, so that the surface of the casing 100a may exhibit a gradient color effect; for example, the distribution density of the network points gradually increases or decreases from the center to the edge of the first surface of the substrate, or the distribution density of the network points gradually increases or decreases from one side to the other side along the substrate; of course, this example is not limited thereto.
In other embodiments, the photoresist layer patterned region 41 includes at least a grid region, and the size of the grid in the grid region, such as the width of the grid line, the size of the grid, etc., gradually increases or decreases in at least one direction, so that the surface of the housing 100a may also exhibit a gradient color effect; for example, the grid lines may be the same size, the width of the grid lines may be gradually increased or decreased from the center of the first surface of the substrate to the edge, or the width of the grid lines may be gradually increased or decreased from one side to the other side along the substrate; of course, this example is not limited thereto.
In other embodiments, the photoresist layer patterned region 41 comprises at least an irregular pattern region; the irregular pattern is an irregular art pattern of characters, animals, scenery, abstract lines and the like; the irregular pattern causes the surface of the case 100a to exhibit a specific decorative effect.
It will be appreciated that the patterned photoresist layer region 41 may include two or three of the above-described dot regions, grid regions, and irregular pattern regions.
In some embodiments, pigments or dyes are added to the photoresist layer 40, so that the photoresist layer 40 presents a color different from a conventional photoresist (the conventional photoresist is usually colorless, white or gray), such as a color, and further, a partial area of the housing 100a presents a specific color.
In some embodiments, the film structure of the optical coating layer 20 may be SiO 2 +Ti 3 O 5 Multilayer combination, siO 2 +TiO 2 Multilayer combinations, or SiO 2 +nbo multilayer combination.
In some embodiments, the film-based structure is SiO 2 +TiO 2 The multilayer combination, whose reflectance curve is shown in fig. 2, allows visual effects approaching that of ceramic black to be achieved by the film-based structure.
In other embodiments, other film structures may be selected, and film layers with different appearances may be obtained by stacking the film layers, or film structures with colors may be selected, so that the film coated member presents a specific color.
In some embodiments, the ink layer 30 includes a primer layer 31 and a topcoat layer 32 formed on a surface of the primer layer 31 remote from the optical coating layer 20; the primer layer 31 and the topcoat layer 32 may each have a single-layer or multi-layer structure.
In some embodiments, the under-color layer 31 may be, for example, a glossy ink, and the thickness of the under-color layer 31 is preferably 10 micrometers to 15 micrometers.
In some embodiments, the topcoat layer 32 may be, for example, a matte ink, with the thickness of the topcoat layer 32 preferably ranging from 5 microns to 10 microns.
In some embodiments, the base color layer 31 is a glossy ink, and the top color layer 32 is a matte ink, so that not only a specific gorgeous and high-gloss color can be realized, but also the surface of the shell 100a can have a higher dyne value, which is beneficial to the adhesion of the back adhesive on the inner surface of the shell.
In the present application, the photoresist layer 40 includes a photoresist layer patterned area 41, a pattern corresponding to the photoresist layer patterned area 41 can be displayed on the housing 100a, and the photoresist layer 40, the optical coating layer 20, the ink layer 30, and the like, which are superimposed to match with refraction of light, can display a specific color change on the housing 100 a; for example, when the patterned photoresist layer region 41 includes a graded dot or grid region, the graded color effect can be exhibited on the housing 100a by the refraction of light and the like in combination with the superposition of the photoresist layer 40, the optical coating layer 20, and the ink layer 30.
Referring to fig. 6, a fifth embodiment of the present application provides an electronic device including a housing 100 (100 a) according to the third or fourth embodiment.
In some embodiments, the housing 100 (100 a) may be a battery back cover of the electronic device; the electronic device may further include a battery that may be housed within the housing 100 (100 a).
The electronic device is, for example, a smart phone, a notebook computer, a tablet computer, a game device and other portable, mobile computing device, wearable device and the like.
The technical scheme in the embodiment of the application will be described below with reference to specific embodiments.
Example 1
The embodiment provides a method for preparing a coated member, which comprises the following steps:
(1) As shown in fig. 7, a substrate 510 is provided, wherein the substrate 510 includes a first surface 511 and a second surface 512 opposite to each other;
(2) As shown in fig. 8, a photoresist layer 520 is formed on the first surface 511 of the substrate 510, and the photoresist layer 520 is a positive photoresist;
(3) As shown in fig. 9, the photoresist layer 520 in the exposed region is removed by exposing and developing, so that a portion of the first surface 511 is exposed from the photoresist layer 520;
referring to fig. 10, the photoresist layer 520 is formed at a middle position of the substrate 510 and extends from an upper end to a lower end of the substrate 510, the photoresist layer 520 includes a middle region 521 and two patterned regions 522 formed at two sides of the middle region 521 in a length direction, the two patterned regions 522 are grid regions, the grid arrangement density of the grid regions is uniform (i.e., the density is the same), the patterned regions 522 are connected with the middle region 521, and in this embodiment, the width of the patterned regions 522 is smaller than the width of the middle region 521.
(4) As shown in fig. 11, an optical coating layer 530 is formed on the surface of the photoresist layer 520 and the first surface 511 of the substrate 510 exposed in the photoresist layer 520;
wherein the film system structure of the optical coating layer 530 is SiO 2 +TiO 2 The multilayer combination, the reflectance profile of which is shown in FIG. 2, provides visual effects approaching that of ceramic black.
(5) As shown in fig. 12, the photoresist layer 520 is removed to expose a portion of the first surface 511 of the substrate 510 from the optical coating layer 530;
in this embodiment, the optical coating layer covering the surface of the photoresist layer is removed along with the removal of the photoresist layer, so that the coverage area of the optical coating layer 530 is complementary to the coverage area of the photoresist layer 520; specifically, the optical coating layer 530 includes two patterned areas 532 formed on two sides of the length direction of the groove 530, where the two patterned areas 532 are dot areas, and the dot arrangement density of the dot areas is uniform (i.e., the density is the same), in this embodiment, the width of the patterned areas 532 is smaller than the width of the groove 531.
(6) As shown in fig. 13, a logo pattern 550 is printed on the first surface 511 exposed from the groove 531 of the optical coating layer 530.
(7) As shown in fig. 14, an ink layer 540 is formed on the surface of the optical coating layer 530 and the first surface 511 exposed to the optical coating layer 530.
The ink layer 540 includes a primer layer 541 and a topcoat layer 542 formed on a surface of the primer layer 541 away from the optical coating layer 530.
The base color layer is bright black ink, and the finish paint layer is matte black ink; the thickness of the primer layer is 12 microns, and the thickness of the finish layer is 8 microns.
(8) As shown in fig. 15, the ink layer 540 is laser ablated, so that a portion of the first surface 511 is exposed from the ink layer 540, forming a camera hole 560;
(9) As shown in fig. 16 and 17, an anti-fingerprint film 570 is formed on the second surface 512, so as to obtain the coated member 500.
In this embodiment, the whole of the plating member 500 is black, and the position corresponding to the groove 531 is light (similar to gray), and the position from the groove 531 to both sides in the length direction is gradually changed to black (similar to gray to black, the gradually changed region is the region corresponding to the patterned region 532), so that the color is gradually deepened, and then is dark, and the appearance of the whole plating member 500 is very bright.
The coated member 500 (see fig. 16 and 17) obtained in this embodiment also belongs to the protection scope of this embodiment; the coated member 500 of the present embodiment can be used as a case of an electronic device, thereby giving the electronic device a cool appearance.
The details of this embodiment, which are not mentioned, are described in the foregoing embodiments, and are not repeated here.
Example 2
The present embodiment provides a method for producing a coated member, which is substantially the same as that of embodiment 1, except that: after forming the optical coating layer 530 on the surface of the photoresist layer 520 and the first surface 511 of the substrate 510 exposed in the photoresist layer 520, the photoresist layer 520 is not removed; instead, as shown in fig. 18, an ink layer 540 is directly formed on the surface of the optical coating layer 530.
The photoresist layer 520 is formed at the middle position of the substrate 510 and extends from the upper end to the lower end of the substrate 510, the photoresist layer 520 includes a middle region 521 and two patterned regions 522 formed at two sides of the middle region 521 in the length direction, the two patterned regions 522 are grid regions, the grid arrangement density of the grid regions is uniform (i.e., the density is the same), the patterned regions 522 are connected with the middle region 521, and in this embodiment, the width of the patterned regions 522 is smaller than the width of the middle region 521; red pigment is added into the photoresist; thereby rendering red (other embodiments are not limited to red, and may be blue, yellow, green, etc., for example).
Wherein the film system structure of the optical coating layer 530 is SiO 2 The film structure described above, with reference to fig. 2, can achieve visual effects approaching that of ceramic black.
The ink layer 540 includes a primer layer 541 and a topcoat layer 542 formed on a surface of the primer layer 541 away from the optical coating layer 530.
The base color layer is bright black ink, and the finish paint layer is matte black ink; the thickness of the primer layer is 12 microns, and the thickness of the finish layer is 8 microns.
In this embodiment, the whole of the plating member 500 is black, and the colors of the photoresist layer, the optical plating layer 530 and the ink layer 540 are superimposed corresponding to the position of the photoresist layer, so that the plating member is black and red, and gradually changes from the position corresponding to the middle area 521 of the photoresist layer to both sides in the length direction thereof (similar to the gradual change from black to black, the gradual change area is the area corresponding to the patterned area 522), and the color gradually deepens, and then becomes dark and black.
The details of this embodiment, which are not mentioned, are described in the foregoing embodiments, and are not repeated here.
Example 3
The present embodiment provides a method for producing a coated member, which is substantially the same as that of embodiment 1, except that: as shown in fig. 19, the whole photoresist layer after exposure and development is patterned, that is, the whole photoresist layer is a patterned area, the patterned area is a grid area, and the width of the grid lines of the grid area gradually increases from one side of the substrate to the other side; correspondingly, the optical coating layer after the photoresist layer is removed is also patterned as a whole, the pattern of the optical coating layer is a dot pattern, and the dot arrangement density of the dot pattern gradually decreases from one side of the substrate to the other side; the whole obtained film-coated piece shows gradual change effect, and the color gradually becomes lighter from one side of the base material to the other side.
The details of this embodiment, which are not mentioned, are described in the foregoing embodiments, and are not repeated here.
Example 4
The present embodiment provides a method for producing a coated member, which is substantially the same as that of embodiment 1, except that: as shown in fig. 20, the whole photoresist layer after exposure and development is patterned, that is, the whole photoresist layer is a patterned area, and the patterned area is an irregular artistic pattern; correspondingly, the whole optical coating layer after the photoresist layer is removed is patterned, and the pattern of the optical coating layer is also an irregular artistic pattern; the color of the area of the obtained film plating piece corresponding to the optical film plating layer is dark, and the color of the area of the film plating piece corresponding to the optical film plating layer is relatively light, so that the film plating piece integrally shows two contrast colors, and the two contrast colors integrally shows the effect of artistic patterns.
The details of this embodiment, which are not mentioned, are described in the foregoing embodiments, and are not repeated here.
It is noted that reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Finally, it should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the above-mentioned preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present application without departing from the spirit and scope of the technical solution of the present application.

Claims (14)

1. A preparation method of a coated piece comprises the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite;
forming a photoresist layer on the first surface of the substrate;
removing part of the photoresist layer in the region through exposure and development, so that part of the first surface is exposed out of the photoresist layer;
forming an optical coating layer on the first surface of the substrate exposed in the photoresist layer;
removing the photoresist layer to expose part of the first surface of the substrate from the optical coating layer; a kind of electronic device with high-pressure air-conditioning system
Forming at least one ink layer on the optical coating layer and the first surface exposed to the optical coating layer to obtain a coating piece;
wherein the thickness of the photoresist layer is 1.5-3 microns, and the method for removing the photoresist layer in partial areas through exposure and development comprises the following steps:
Designing a required pattern on a computer;
the pattern is led into laser direct imaging equipment, a computer is used for controlling a laser head so as to realize direct output and display of the pattern on a photoresist layer, and the photoresist layer corresponding to the laser head is exposed, wherein the wavelength of exposure is 365 nanometers to 395 nanometers; the exposure energy is 300mj/cm 2 To 600mj/cm 2 ；
Removing part of the photoresist layer to expose part of the first surface from the photoresist layer;
the method for removing the positive photoresist comprises the following steps of: 1-2% Na is selected 2 CO 3 And the mixed aqueous solution of KOH with the concentration of 0.1-0.2 percent is used for cleaning and removing the exposed photoresistance; wherein the water pressure of the aqueous solution is controlled to be 0.1kg/cm 2 To 0.5kg/cm 2 The temperature is controlled between 25 ℃ and 30 ℃ and the time is controlled between 60 seconds and 90 seconds.
2. The method of claim 1, wherein the optical coating comprises at least one patterned coating region, and the pattern in the patterned coating region is a regular pattern or an irregular artistic pattern.
3. A preparation method of a coated piece comprises the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite;
Forming a photoresist layer on the first surface of the substrate;
removing part of the photoresist layer in the region through exposure and development, so that part of the first surface is exposed out of the photoresist layer;
forming an optical coating layer on the photoresist layer and the first surface exposed in the photoresist layer; a kind of electronic device with high-pressure air-conditioning system
Forming at least one ink layer on the optical coating layer to obtain a coating piece;
wherein the thickness of the photoresist layer is 1.5-3 microns, and the method for removing the photoresist layer in partial areas through exposure and development comprises the following steps:
designing a required pattern on a computer;
the pattern is led into laser direct imaging equipment, a computer is used for controlling a laser head so as to realize direct output and display of the pattern on a photoresist layer, and the photoresist layer corresponding to the laser head is exposed, wherein the wavelength of exposure is 365 nanometers to 395 nanometers; the exposure energy is 300mj/cm 2 To 600mj/cm 2 ；
Removing part of the photoresist layer to expose part of the first surface from the photoresist layer;
the method for removing the positive photoresist comprises the following steps of: 1-2% Na is selected 2 CO 3 And the mixed aqueous solution of KOH with the concentration of 0.1-0.2 percent is used for cleaning and removing the exposed photoresistance; wherein the water pressure of the aqueous solution is controlled to be 0.1kg/cm 2 To 0.5kg/cm 2 The temperature is controlled between 25 ℃ and 30 ℃ and the time is controlled between 60 seconds and 90 seconds.
4. The method of claim 3, wherein the photoresist layer comprises at least one photoresist layer patterned region, and the pattern in the photoresist layer patterned region is a regular pattern or an irregular artistic pattern.
5. The method of producing a coated article according to any one of claims 3 to 4, further comprising, after forming at least one ink layer on the optical coating layer and on the first surface exposed to the optical coating layer, the steps of:
the laser ablates away a portion of the ink layer, forming a window area in the ink layer.
6. The shell is characterized by comprising a substrate layer, an optical coating layer and an ink layer, wherein the optical coating layer is formed on the surface of the substrate layer, the optical coating layer comprises at least one coating layer patterning area, and part of the surface of the substrate layer is exposed from a gap of the coating layer patterning area of the optical coating layer; the ink layer is formed on the surface of the optical coating layer and the surface of the substrate layer exposed from the optical coating layer, wherein the surface of the substrate layer forming the optical coating layer is a first surface;
The optical coating layer is formed on the surface of a substrate exposed in the photoresist layer by forming a photoresist layer on the surface of the substrate layer and removing a part of the photoresist layer by exposing and developing, wherein the thickness of the photoresist layer is 1.5 to 3 micrometers, and the method for removing a part of the photoresist layer by exposing and developing comprises the following steps:
designing a required pattern on a computer;
the pattern is led into laser direct imaging equipment, a computer is used for controlling a laser head so as to realize direct output and display of the pattern on a photoresist layer, and the photoresist layer corresponding to the laser head is exposed, wherein the wavelength of exposure is 365 nanometers to 395 nanometers; the exposure energy is 300mj/cm 2 To 600mj/cm 2 ；
Removing part of the photoresist layer to expose part of the first surface from the photoresist layer;
the method for removing the positive photoresist comprises the following steps of: 1-2% Na is selected 2 CO 3 And the mixed aqueous solution of KOH with the concentration of 0.1-0.2 percent is used for cleaning and removing the exposed photoresistance; wherein the water pressure of the aqueous solution is controlled to be 0.1kg/cm 2 To 0.5kg/cm 2 The temperature is controlled between 25 ℃ and 30 ℃ and the time is controlled between 60 seconds and 90 seconds.
7. The housing of claim 6 wherein the pattern in the patterned area of the coating is a graduated regular pattern or an irregular artistic pattern.
8. The housing of claim 7 wherein the patterned coating layer region comprises at least a dot region and wherein the distribution density of dots in the dot region increases or decreases gradually in at least one direction.
9. The shell is characterized by comprising a substrate layer, a photoresist layer, an optical coating layer and an ink layer; the photoresist layer comprises at least one photoresist layer patterning region, and part of the surface of the substrate layer is exposed from the gap of the photoresist layer patterning region of the photoresist layer; the optical coating layer is formed on the surface of the photoresist layer and the surface of the substrate layer exposed from the photoresist layer patterning area; the ink layer is formed on the surface of the optical coating layer, wherein the surface of the substrate layer, on which the optical coating layer is formed, is a first surface;
wherein the thickness of the photoresist layer is 1.5 to 3 micrometers, the optical coating layer is formed on the surface of the substrate exposed in the photoresist layer by forming the photoresist layer on the surface of the substrate layer and removing partial areas of the photoresist layer by exposure and development, and the method for removing partial areas of the photoresist layer by exposure and development comprises the following steps:
Designing a required pattern on a computer;
the pattern is led into laser direct imaging equipment, a computer is used for controlling a laser head so as to realize direct output and display of the pattern on a photoresist layer, and the photoresist layer corresponding to the laser head is exposed, wherein the wavelength of exposure is 365 nanometers to 395 nanometers; the exposure energy is 300mj/cm 2 To 600mj/cm 2 ；
Removing part of the photoresist layer to expose part of the first surface from the photoresist layer;
the method for removing the positive photoresist comprises the following steps of: 1-2% Na is selected 2 CO 3 And the mixed aqueous solution of KOH with the concentration of 0.1-0.2 percent is used for cleaning and removing the exposed photoresistance; wherein the water pressure of the aqueous solution is controlled to be 0.1kg/cm 2 To 0.5kg/cm 2 The temperature is controlled between 25 ℃ and 30 ℃ and the time is controlled between 60 seconds and 90 seconds.
10. The housing of claim 9, wherein the pattern in the patterned region of the photoresist layer is a graded regular pattern or an irregular artistic pattern.
11. The housing of claim 10, wherein the patterned photoresist layer region comprises at least a dot region, and wherein the distribution density of dots in the dot region increases or decreases gradually in at least one direction.
12. The housing according to any one of claims 9 to 11, wherein the photoresist layer is a colored photoresist layer.
13. The housing of any one of claims 9 to 11, wherein the ink layer comprises a base color layer and a top coat layer formed on a surface of the base color layer remote from the optical coating layer, the base color layer being a glossy ink, and the top coat layer being a matte ink.
14. An electronic device comprising a housing as claimed in any one of claims 6 to 13.
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