CN113629180B - Packaging method of miniature semiconductor refrigerator - Google Patents
Packaging method of miniature semiconductor refrigerator Download PDFInfo
- Publication number
- CN113629180B CN113629180B CN202110869860.9A CN202110869860A CN113629180B CN 113629180 B CN113629180 B CN 113629180B CN 202110869860 A CN202110869860 A CN 202110869860A CN 113629180 B CN113629180 B CN 113629180B
- Authority
- CN
- China
- Prior art keywords
- graphite jig
- solder paste
- ceramic plates
- steel mesh
- monomer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 98
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 48
- 239000010439 graphite Substances 0.000 claims abstract description 48
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 33
- 239000010959 steel Substances 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 16
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 239000000178 monomer Substances 0.000 claims description 25
- 230000001680 brushing effect Effects 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000012797 qualification Methods 0.000 abstract description 4
- 239000000428 dust Substances 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Abstract
The invention discloses a packaging method of a miniature semiconductor refrigerator, which is characterized in that an upper ceramic plate and a lower ceramic plate are cut into single ceramic plates, the single ceramic plates are arranged on a graphite jig, a steel mesh is adopted to brush the single ceramic plates in batches, and then the graphite jig loaded with a plurality of single ceramic plates is sent into attached particles of a chip laminating machine for welding, so that the problem of short circuit of the semiconductor refrigerator caused by metal dust generated by slicing can be avoided, the cost can be reduced, the efficiency is improved, and the product percent of pass is increased. Actual production verifies that the production efficiency of the method is improved by 200% compared with that of the traditional packaging method, and the product qualification rate is improved by 10% compared with that of the traditional packaging method.
Description
Technical Field
The invention belongs to the field of semiconductor refrigeration, and particularly relates to a packaging method of a miniature semiconductor refrigerator.
Background
TEC (Thermoelectric Cooler), i.e. semiconductor refrigerator: the device is a device for preparing cold energy by utilizing the thermoelectric effect of a semiconductor, and is also called a thermoelectric refrigerator. The semiconductor refrigerator has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight and the like, and is reliable in work, simple and convenient to operate and easy to adjust the cold quantity. Because the refrigeration coefficient of TEC is smaller and the electricity consumption is relatively larger, the TEC is mainly used for occasions with small cold consumption and small occupied space, such as cooling of certain elements in electronic equipment and radio communication equipment; some are also used in domestic refrigerators but are uneconomical. The semiconductor refrigerator can also be made into a zero point instrument for ensuring the zero point temperature in the thermocouple temperature measurement. The miniature semiconductor refrigerator has smaller size compared with the conventional semiconductor refrigerator, and is commonly used for digital products and the like.
The conventional packaging method of the miniature semiconductor refrigerator comprises the steps of dispensing solder paste on a lower ceramic plate, attaching particles on the lower ceramic plate through a surface mounting device, performing reflow soldering treatment, dispensing solder paste on the upper ceramic plate, covering the lower ceramic plate with the solder paste, and slicing after the reflow soldering treatment to complete packaging. However, this prior art has mainly the following drawbacks: 1. in the existing process flow, solder paste is needed to be applied to the upper and lower ceramic plates, so that the time cost is increased, and the production efficiency is reduced; 2. in the existing technological process, slicing is carried out when the packaging of the upper ceramic plate and the lower ceramic plate is finished, TEC short circuit can be caused by metal dust, and the qualification rate of products is reduced.
Disclosure of Invention
The invention provides a packaging method of a miniature semiconductor refrigerator, which has high universality, can be suitable for large-scale packaging and can effectively improve the production yield and the production efficiency.
In order to achieve the above purpose, the technical scheme adopted by the invention for solving the technical problems is as follows:
a packaging method of a miniature semiconductor refrigerator comprises the following steps:
(1) Slicing the lower ceramic plate with the patterned metal layer into single lower ceramic plates, and then mounting the single lower ceramic plates on a graphite jig;
(2) Attaching a steel mesh to a graphite jig, and brushing solder paste at solder paste brushing holes on the steel mesh so as to brush solder paste on the patterned metal layer of each ceramic piece below the single body;
(3) Attaching heat conducting particles to each monomer lower ceramic piece brushed with solder paste in batches, then welding, and inverting each monomer lower ceramic piece welded with the heat conducting particles on a wafer disc of a chip laminating machine;
(4) Slicing the upper ceramic plate with the patterned metal layer into single upper ceramic plates, and mounting the single upper ceramic plates on a graphite jig;
(5) Attaching a steel mesh to a graphite jig, and brushing solder paste at solder paste brushing holes on the steel mesh so as to brush solder paste on the patterned metal layer of the ceramic plate on each monomer;
(6) And correspondingly attaching the inverted monomer lower ceramic plates on the monomer upper ceramic plates with the solder paste in batches, and welding to obtain the miniature semiconductor refrigerator.
Preferably, in step (3), the batch adhesion of the heat conductive particles includes: and collecting the graphite jig loaded with the monomer lower ceramic plates with the solder paste by using a clip, then placing the clip on chip bonder equipment, conveying the graphite jig to a working position of the chip bonder by the chip bonder equipment, and attaching heat-conducting particles on each monomer lower ceramic plate.
Preferably, in the step (6), the attaching the inverted single lower ceramic chips to the single upper ceramic chips with the solder paste in a batch mode includes: and collecting the graphite jig loaded with the monomer upper ceramic plates by using a cartridge clip, then placing the cartridge clip on a chip laminating machine, grabbing the graphite jig in the cartridge clip by using the chip laminating machine, conveying the graphite jig to a working position of the chip laminating machine, and correspondingly attaching inverted monomer lower ceramic plates to the monomer upper ceramic plates with the brushed solder paste in batches.
Preferably, the graphite jig is provided with a plurality of limiting grooves for limiting the single ceramic wafer; the limiting grooves are regularly distributed on the graphite jig.
Preferably, the solder paste brushing holes on the steel mesh are arranged according to the position of the limit groove on the graphite jig and the patterned metal layer on the single ceramic sheet; and a plurality of solder paste brushing holes are formed in the area, facing the patterned metal layer of the single ceramic plate in each limiting groove, of the steel mesh.
Preferably, a plurality of protrusions or positioning grooves are formed in the edge of the graphite jig, and positioning holes or protrusions matched with the protrusions or the positioning grooves are formed in the corresponding positions of the steel mesh.
Preferably, in step (3) and step (6), the welding is reflow welding.
The beneficial effects of the invention are as follows:
according to the invention, the upper ceramic plate and the lower ceramic plate are cut into the single ceramic plates, the single ceramic plates are arranged on the graphite jig, the steel mesh is adopted to brush the single ceramic plates in batches, and then the graphite jig loaded with the single ceramic plates is sent into the chip mounter to attach particles and welded, so that the problem of short circuit of the semiconductor refrigerator caused by metal dust generated by slicing can be avoided, the cost can be reduced, the efficiency can be improved, and the product qualification rate can be increased. Actual production verifies that the production efficiency of the method is improved by 200% compared with that of the traditional packaging method, and the product qualification rate is improved by 10% compared with that of the traditional packaging method.
Drawings
Fig. 1 is a schematic diagram of the positions of a graphite jig, a steel mesh, and a monolithic ceramic wafer.
Fig. 2 is a clamping diagram of the graphite jig.
Fig. 3 is an exploded view of a micro semiconductor.
Reference numerals:
1. a graphite jig; 2. ceramic plates are arranged on the single bodies; 3. a steel mesh; 4. thermally conductive particles; 5. solder paste; 6. a ceramic sheet is arranged under the single body; 7. a cartridge clip; 8. patterning the metal layer.
Detailed Description
The invention is further described below in connection with the drawings and the specific preferred embodiments, but the scope of protection of the invention is not limited thereby.
The invention provides a packaging method of a miniature semiconductor refrigerator, which comprises the following steps:
(1) Slicing the lower ceramic plate provided with the patterned metal layers 8 into single lower ceramic plates 6, arranging the patterned metal layers 8 on each single lower ceramic plate 6, and then mounting the single lower ceramic plates 6 on the graphite jig 1, as shown in fig. 1;
(2) Attaching a steel mesh 3 to the graphite jig 1 and positioning the steel mesh 3, wherein solder paste brushing holes are formed in the steel mesh 3 in the areas corresponding to the patterned metal layers 8 of the lower ceramic plates 6, solder paste 5 is brushed at the solder paste brushing holes of the steel mesh 3 corresponding to the lower ceramic plates 6, and the solder paste 5 falls onto the patterned metal layers 8 of the lower ceramic plates 6 from the holes so as to brush the solder paste 5 to the patterned metal layers 8 of the lower ceramic plates 6;
(3) Attaching heat conducting particles 4 to each monomer lower ceramic piece 6 with the solder paste 5 in batches, performing reflow soldering, and inversely placing each monomer lower ceramic piece 6 with the heat conducting particles 4 soldered on a wafer disc of a chip mounter;
(4) Slicing the upper ceramic plate provided with the patterned metal layers 8 into single upper ceramic plates 2, wherein each single upper ceramic plate 2 is provided with the patterned metal layer 8, and the single upper ceramic plates 2 are arranged on the graphite jig 1;
(5) Attaching a steel mesh 3 to the graphite jig 1, positioning the steel mesh 3 and the graphite jig, brushing tin paste 5 at tin paste brushing holes of the ceramic plates 2 on the corresponding monomers on the steel mesh 3, and enabling the tin paste 5 to fall onto the patterned metal layer 8 of the ceramic plates 2 on the corresponding monomers from the holes so as to brush tin paste 5 on the ceramic plates 2 on the corresponding monomers;
(6) And correspondingly attaching the inverted single lower ceramic plates 6 on the single upper ceramic plates 2 brushed with the solder paste 5 in batches, and performing reflow soldering to obtain the miniature semiconductor refrigerator.
In step (3), the batch of attached heat conductive particles 4 includes: the graphite jig 1 loaded with the single-body lower ceramic sheets 6 brushed with the solder paste 5 is collected by using the cartridge clip 7, as shown in fig. 2, then the cartridge clip 7 is placed on the chip mounter, the graphite jig 1 is conveyed to the working position of the chip mounter by the chip mounter, and then the heat conducting particles 4 are attached to the single-body lower ceramic sheets 6.
In the step (6), the attaching the inverted single lower ceramic chips 6 to the single upper ceramic chips 2 with the solder paste 5 in batches includes: the graphite jig 1 loaded with the single-body upper ceramic plates 2 is collected by the cartridge clip 7, then the cartridge clip 7 is placed on the chip laminating machine equipment, the graphite jig 1 in the cartridge clip 7 is grabbed by the chip laminating machine and conveyed to the equipment working position, and the inverted single-body lower ceramic plates 6 are correspondingly attached to the single-body upper ceramic plates 2 with the brushed solder paste 5 in batches.
The graphite jig 1 is provided with a plurality of limiting grooves for limiting the single ceramic wafer, as shown in fig. 3; the limiting grooves are regularly distributed on the graphite jig 1.
The holes on the steel mesh 3 are arranged according to the positions of the limit grooves on the graphite jig 1 and the patterned metal layers 8 on the single ceramic plates; the steel mesh 3 is provided with a plurality of holes in the area of the patterned metal layer 8 of the single ceramic sheet facing each limit groove, as shown in fig. 3. The arrangement mode can ensure that the solder paste 5 just can meet the requirement that the solder paste 5 falls to the specific position of the patterned metal layer 8 of the single ceramic chip through the holes on the steel mesh 3 when the solder paste 5 is brushed, so that the accuracy of the brushing position of the solder paste 5 and the consistency of the solder paste 5 positions of the upper single ceramic chip and the lower single ceramic chip can be ensured, and the packaging quality, the yield and the consistency of the miniature semiconductor can be ensured.
The edge of the graphite jig 1 and the edge of the steel mesh 3 are provided with a plurality of protrusions or positioning grooves, and the corresponding position of the steel mesh 3 is provided with a plurality of positioning holes or protrusions matched with the protrusions or grooves, as shown in fig. 3. When the tin paste 5 needs to be brushed, the steel mesh 3 can be attached to the graphite jig 1, and the graphite jig 1 and the steel mesh 3 are limited by the matched protrusions, holes or grooves, protrusions, and the two are accurately positioned, so that the steel mesh 3 is prevented from running when the tin paste 5 is brushed later, and the consistency and the yield of the final product are improved.
The above description is only of the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. While the invention has been described in terms of preferred embodiments, it is not intended to be limiting. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present invention or equivalent embodiments using the method and technical solution disclosed above without departing from the spirit and technical solution of the present invention. Therefore, any simple modification, equivalent substitution, equivalent variation and modification of the above embodiments according to the technical substance of the present invention, which do not depart from the technical solution of the present invention, still fall within the scope of the technical solution of the present invention.
Claims (5)
1. The packaging method of the miniature semiconductor refrigerator is characterized by comprising the following steps of:
(1) Slicing the lower ceramic plate with the patterned metal layer into single lower ceramic plates, and then mounting the single lower ceramic plates on a graphite jig; a plurality of limiting grooves for limiting the single ceramic wafer are formed in the graphite jig; the limiting grooves are regularly distributed on the graphite jig; the solder paste brushing holes on the steel mesh are arranged according to the positions of the limit grooves on the graphite jig and the patterned metal layers on the single ceramic plates; the steel mesh is provided with a plurality of solder paste brushing holes in the area of the patterned metal layer of the single ceramic sheet opposite to each limit groove;
(2) Attaching a steel mesh to a graphite jig, and brushing solder paste at solder paste brushing holes on the steel mesh so as to brush solder paste on the patterned metal layer of each ceramic piece below the single body;
(3) Attaching heat conducting particles to each monomer lower ceramic piece brushed with solder paste in batches, then welding, and inverting each monomer lower ceramic piece welded with the heat conducting particles on a wafer disc of a chip laminating machine;
(4) Slicing the upper ceramic plate with the patterned metal layer into single upper ceramic plates, and mounting the single upper ceramic plates on a graphite jig;
(5) Attaching a steel mesh to a graphite jig, and brushing solder paste at solder paste brushing holes on the steel mesh so as to brush solder paste on the patterned metal layer of the ceramic plate on each monomer;
(6) And correspondingly attaching the inverted monomer lower ceramic plates on the monomer upper ceramic plates with the solder paste in batches, and welding to obtain the miniature semiconductor refrigerator.
2. The method of packaging a micro semiconductor refrigerator of claim 1, wherein in step (3), the mass attaching of the heat conductive particles comprises: and collecting the graphite jig loaded with the monomer lower ceramic plates with the solder paste by using the cartridge clip, placing the cartridge clip on chip bonder equipment, conveying the graphite jig to a working position of the chip bonder by the chip bonder equipment, and attaching heat-conducting particles on each monomer lower ceramic plate.
3. The method of packaging a micro semiconductor refrigerator according to claim 1, wherein in the step (6), the step of attaching the inverted single lower ceramic wafer onto the solder-plated single upper ceramic wafer in a batch manner includes: and collecting the graphite jig loaded with the monomer upper ceramic plates by using a cartridge clip, placing the cartridge clip on chip laminating machine equipment, grabbing the graphite jig in the cartridge clip by using the chip laminating machine, conveying the graphite jig to an equipment working position, and correspondingly attaching inverted monomer lower ceramic plates to the monomer upper ceramic plates with the brushed tin paste in batches.
4. The packaging method of the miniature semiconductor refrigerator according to claim 1, wherein a plurality of protrusions or positioning grooves are formed in the edge of the graphite jig, and positioning holes or protrusions matched with the protrusions or the positioning grooves are formed in corresponding positions of the steel mesh.
5. The method of packaging a micro semiconductor refrigerator of claim 1, wherein in step (3) and step (6), the soldering is reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110869860.9A CN113629180B (en) | 2021-07-30 | 2021-07-30 | Packaging method of miniature semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110869860.9A CN113629180B (en) | 2021-07-30 | 2021-07-30 | Packaging method of miniature semiconductor refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113629180A CN113629180A (en) | 2021-11-09 |
| CN113629180B true CN113629180B (en) | 2024-03-29 |
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| CN202110869860.9A Active CN113629180B (en) | 2021-07-30 | 2021-07-30 | Packaging method of miniature semiconductor refrigerator |
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