CN113614273B

CN113614273B - Vapor deposition device and method for manufacturing display device

Info

Publication number: CN113614273B
Application number: CN201980093754.7A
Authority: CN
Inventors: 藤原圣士; 武正杰
Original assignee: Sharp Corp
Current assignee: Sharp Corp
Priority date: 2019-03-25
Filing date: 2019-03-25
Publication date: 2023-08-01
Anticipated expiration: 2039-03-25
Also published as: CN113614273A; WO2020194469A1; JPWO2020194469A1; JP7124208B2

Abstract

A touch panel (601) provided in a vapor deposition device (600) is provided with a plurality of movable protrusions (652) that come into contact with a substrate (120) when the substrate (120) is separated from the touch panel (601).

Description

Vapor deposition device and method for manufacturing display device

Technical Field

The invention relates to a vapor deposition device and a method for manufacturing a display device.

Background

Patent documents 1 and 2 disclose vapor deposition apparatuses in which a substrate is disposed between a vapor deposition mask and a magnet, and the vapor deposition mask is brought into close contact with the substrate by the magnetic force of the magnet.

Prior art literature

Patent literature

Patent document 1 Japanese patent publication No. 6302150 (release of 2018, 03, 28) patent publication No. 6302150 "

Patent document 2 Japanese republic of patent (A1) "International publication No. W02017/154234 (International publication No. W02017/154234, 2017, 09, 14)"

Disclosure of Invention

The invention aims to solve the technical problems

However, in the conventional vapor deposition apparatus as described above, the substrate is separated from the vapor deposition mask and the touch panel after the vapor deposition process is performed, and is carried out from the vapor deposition apparatus.

However, in the conventional vapor deposition device as described above, when the substrate is separated from the touch panel, the substrate and the touch panel are sometimes brought into close contact with each other without separation. Therefore, in the conventional vapor deposition apparatus, after the substrate and the touch panel that are brought into close contact with each other from the vapor deposition mask are separated from each other above the vapor deposition mask, the substrate may separate from the touch panel due to its own weight, and the substrate may come into contact with the vapor deposition mask, thereby causing cracks in the substrate. As a result, the conventional vapor deposition apparatus has a problem that the manufacturing yield of the display device is lowered.

The present invention has been made in view of the above-described problems, and an object of the present invention is to realize a vapor deposition device and a method for manufacturing a display device, which can prevent a reduction in the manufacturing yield of the display device.

Solution to the problem

The vapor deposition device according to one embodiment of the present invention includes a vapor deposition source; an evaporation mask having a mask plate and a mask frame; a magnet for adhering the mask sheet to a substrate; a touch panel disposed between the substrate and the magnet; a lifting device for lifting the substrate relative to the vapor deposition mask; and an alignment device for aligning the vapor deposition mask with the substrate, wherein a plurality of protruding portions that come into contact with the substrate when the substrate and the touch panel are separated are provided on the touch panel.

The method for manufacturing a display device according to an embodiment of the present invention is a method for manufacturing a display device having a substrate, the method including a vapor deposition step of performing vapor deposition processing on the substrate using a vapor deposition mask, the vapor deposition step including a first step of pressing the substrate toward the vapor deposition mask side through a touch panel provided on the opposite side of the vapor deposition mask to the substrate; a film forming step of performing the vapor deposition treatment on the substrate to form a vapor deposited film on the substrate; and a second step of separating the touch panel from the substrate, wherein the touch panel is separated from the substrate via a plurality of protruding portions provided on the touch panel in the second step.

Effects of the invention

According to several aspects of the present invention, a vapor deposition device and a method for manufacturing a display device, which can prevent a reduction in the manufacturing yield of the display device, can be realized.

Drawings

Fig. 1 is a flowchart showing an example of a method of manufacturing a display device.

Fig. 2 is a sectional view showing the configuration of a display area of the display device.

Fig. 3 is a cross-sectional view along the longitudinal direction of the substrate, showing the schematic structure of the vapor deposition device of the comparative example.

Fig. 4 is an enlarged side view showing a schematic shape of a substrate-side surface of a touch panel provided in the vapor deposition device of the comparative example shown in fig. 3.

Fig. 5 is a flowchart schematically showing a vapor deposition process in the vapor deposition apparatus of the comparative example shown in fig. 3.

Fig. 6 is a cross-sectional view along the longitudinal direction of the substrate schematically showing a part of the vapor deposition process shown in fig. 5.

Fig. 7 is another cross-sectional view schematically showing a part of the vapor deposition process shown in fig. 5, along the longitudinal direction of the substrate.

Fig. 8 is another cross-sectional view schematically showing a part of the vapor deposition process shown in fig. 5, along the longitudinal direction of the substrate.

Fig. 9 is another cross-sectional view schematically showing a part of the vapor deposition process shown in fig. 5, along the longitudinal direction of the substrate.

Fig. 10 is another cross-sectional view schematically showing a part of the vapor deposition process shown in fig. 5, along the longitudinal direction of the substrate.

Fig. 11 is another cross-sectional view schematically showing a part of the vapor deposition process shown in fig. 5, along the longitudinal direction of the substrate.

Fig. 12 is a cross-sectional view taken along the longitudinal direction of a substrate of an example of a schematic configuration of a vapor deposition apparatus according to an embodiment of the present invention.

Fig. 13 is a perspective view showing a schematic configuration of the vapor deposition apparatus shown in fig. 12.

Fig. 14 is a block diagram showing an example of a schematic configuration of an alignment device included in the vapor deposition device shown in fig. 12.

Fig. 15 is a cross-sectional view and a plan view schematically showing the overlapping of the alignment mark, the imaging through hole, and the visual recognition hole shown in fig. 14.

Fig. 16 is a partial cross-sectional view showing an example of a schematic configuration of a touch panel that can be provided in the vapor deposition device shown in fig. 12.

Fig. 17 is a block diagram showing another example of the schematic configuration of an alignment device that can be provided in the vapor deposition device shown in fig. 12.

Fig. 18 is a flowchart schematically showing an example of the vapor deposition process in the vapor deposition apparatus shown in fig. 12.

Fig. 19 (a) is a cross-sectional view along the longitudinal direction of the substrate schematically showing the vapor deposition device shown in fig. 12 in an aligned state.

Fig. 19 (b) is a partial enlarged view of fig. 19 (a).

Fig. 20 (a) is a cross-sectional view along the longitudinal direction of the substrate, schematically showing a state in the process of separating the touch panel of the vapor deposition device shown in fig. 12.

Fig. 20 (b) is a partial enlarged view of fig. 20 (a).

Fig. 21 is a cross-sectional view taken along the longitudinal direction of the substrate of an example of a schematic configuration of a modification of the vapor deposition apparatus shown in fig. 12.

Fig. 22 is a cross-sectional view taken along the longitudinal direction of a substrate of an example of a schematic configuration of a vapor deposition device according to another embodiment of the present invention.

Fig. 23 is a plan view schematically showing an example of a substrate-side surface of a touch panel that can be provided with the vapor deposition device shown in fig. 22.

Fig. 24 is a cross-sectional view of AA of fig. 23.

Fig. 25 is a cross-sectional view along the longitudinal direction of the substrate schematically showing a state in which the vapor deposition device shown in fig. 22 is aligned.

Fig. 26 is a cross-sectional view along the longitudinal direction of the substrate, schematically showing a state in the process of separating the touch panel of the vapor deposition device shown in fig. 22.

Fig. 27 is a plan view schematically showing an example of a substrate-side surface of a touch panel that can be provided with a modification of the vapor deposition device shown in fig. 22.

Detailed Description

(method for manufacturing display device and Structure)

Hereinafter, "the same layer" means that it is formed of the same material in the same process (film forming process), and "the lower layer" means that it is formed in a process preceding the layer to be compared, and "the upper layer" means that it is formed in a process following the layer to be compared.

Fig. 1 is a flowchart showing an example of a method of manufacturing a display device. Fig. 2 is a cross-sectional view showing the configuration of the display area of the display device 2.

When manufacturing a flexible display device, as shown in fig. 1 and 2, first, a resin layer 12 is formed on a light-transmissive support substrate (e.g., mother glass) (step S1). Next, the barrier layer 3 is formed (step S2). Next, the TFT layer 4 is formed (step S3). Next, the top emission type light emitting element layer 5 is formed (step S4). Next, the sealing layer 6 is formed (step S5). Next, a surface film is attached to the sealing layer 6 (step S6).

Next, the support substrate is peeled off from the resin layer 12 by irradiation of laser light or the like (step S7). Next, the lower surface film 10 is stuck to the lower surface of the sealing layer 12 (step S8). Next, the laminate including the lower surface film 10, the resin layer 12, the barrier layer 3, the TFT layer 4, the light emitting element layer 5, and the sealing film 6 is cut to obtain a plurality of individual pieces (step S9). Next, a functional film 39 is attached to the obtained single sheet (step S10). Next, an electronic circuit board (for example, an IC chip and an FPC) is mounted on a part (terminal portion) of the outside (non-display area, frame area) of the display area where the plurality of sub-pixels are formed (step S11). Steps S1 to S11 are performed by a display device manufacturing apparatus (including a film forming apparatus that performs each of steps S1 to S5).

Examples of the material of the resin layer 12 include polyimide. Portions of the resin layer 12 may be replaced with two resin films (for example, polyimide films) and an inorganic insulating film sandwiched therebetween.

The barrier layer 3 is a layer that prevents penetration of foreign matter such as water and oxygen into the TFT layer 4 and the light-emitting element layer 5, and may be formed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminated film of these layers formed by a CVD method.

The TFT layer 4 includes a semiconductor film 15, an inorganic insulating film 16 (gate insulating film) which is higher than the semiconductor film 15, a gate electrode GE and a gate wiring GH which are higher than the inorganic insulating film 16, an inorganic insulating film 18 which is higher than the gate electrode GE and the gate wiring GH, a capacitor electrode CE which is higher than the inorganic insulating film 18, an inorganic insulating film 20 which is higher than the capacitor electrode CE, a source wiring SH which is higher than the inorganic insulating film 20, and a planarizing film 21 (interlayer insulating film) which is higher than the source wiring SH.

The semiconductor layer 15 is made of, for example, low Temperature Polysilicon (LTPS) or an oxide semiconductor (for example, an In-Ga-Zn-O semiconductor), and is configured as a transistor (TFT) so as to include the semiconductor layer 15 and the gate electrode GE. In fig. 2, the transistor is shown as a top gate structure, but may also be a bottom gate structure.

The gate electrode GE, the gate wiring GH, the capacitor electrode CE, and the source wiring SH are formed of, for example, a single-layer film or a stacked-layer film of a metal containing at least one of aluminum, tungsten, molybdenum, tantalum, chromium, titanium, and copper. The TFT layer 4 of fig. 2 includes a semiconductor layer and three metal layers thereon.

The inorganic insulating films 16, 18, and 20 may be formed of, for example, a silicon oxide (SiOx) film or a silicon nitride (SiNx) film formed by a CVD method, or a laminated film thereof. The planarizing film 21 may be composed of a coatable organic material such as polyimide, acrylic, or the like.

The light-emitting element layer 5 includes an anode 22 (anode) above the planarizing film 21, an insulating edge cover 23 covering the edge of the anode 22, an active layer 24 for EL (electroluminescence) above the edge cover 23, and a cathode 25 (cathode) above the active layer 24. The edge cover 23 is formed by, for example, coating an organic material such as polyimide or acrylic, and then patterning the material by photolithography.

Each subpixel includes an island-shaped anode 22, an active layer 24, and a cathode 25, and a qled, that is, a light emitting element ES (electroluminescent element) is formed in the light emitting element layer 5, and a subpixel circuit for controlling the light emitting element ES is formed in the TFT layer 4.

The active layer 24 is formed by stacking, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the lower layer side. The light-emitting layer is formed in an island shape in the opening (each sub-pixel) of the edge cover 23 by a vapor deposition method or an inkjet method. The other layers are formed in an island shape or an entire plane shape (common layer). In addition, one or more of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer is not formed.

The light-emitting layer of the QLED may be formed into an island-shaped light-emitting layer (corresponding to one subpixel) by applying a solvent in which quantum dots are diffused by inkjet.

The anode 22 is a reflective electrode made of, for example, a laminate of ITO (Indium Tin Oxide) and Ag (silver) or an Ag-containing alloy, or a material containing Ag or A1 (aluminum) to have light reflectivity. The Cathode (Cathode) 25 is a transparent electrode made of a light-transmitting conductive material such as a film of Ag, au, pt, ni, ir, a film of MgAg alloy, ITO, or IZO (Indium zinc Oxide: indium zinc oxide). In the case where the display device is of a bottom emission type rather than a top emission type, the lower surface film 10 and the resin layer 12 have light transmittance, the anode 22 is a transparent electrode, and the cathode 25 is a reflective electrode.

In the light emitting element ES, holes and electrons are recombined in the light emitting layer by a driving current between the anode 22 and the cathode 25, and light (fluorescence) is emitted during transition of excitons generated thereby from a conduction band level (conduction band) to a valence band level (valence band) of the quantum dot.

The sealing layer 6 has light transmittance, and includes an inorganic sealing film 26 covering the cathode 25, an organic buffer film 27 on the upper layer than the inorganic sealing film 26, and an inorganic sealing film 28 on the upper layer than the organic buffer film 27. The sealing layer 6 covering the light emitting element layer 5 prevents penetration of foreign substances such as water and oxygen into the light emitting element layer 5.

The inorganic sealing layers 26 and 28 are each an inorganic insulating film, and may be formed of, for example, a silicon oxide film, a silicon nitride film, or a silicon oxynitride film formed by a CVD method, or a laminated film of these layers. The organic buffer film 27 is a light-transmissive organic film having a planarizing effect, and may be made of a coatable organic material such as acrylic. Although the organic buffer film 27 may be formed by, for example, inkjet coating, a bank for blocking liquid droplets may be provided in the non-display region.

The lower surface film 10 is, for example, a PET film for realizing a display device excellent in flexibility by being adhered to the lower surface of the resin layer 12 after the support substrate is peeled off. The functional film 39 has at least one of an optical compensation function, a touch sensor function, and a protection function, for example.

Although the flexible display device has been described above, in the case of manufacturing the non-flexible display device, since formation of a resin layer, replacement of a base material, and the like are not generally required, for example, the lamination process of steps S2 to S5 is performed on a glass substrate, and thereafter, the process proceeds to step S9. In addition, in the case of manufacturing a non-flexible display device, instead of forming the sealing layer 6 or in addition thereto, a sealing member having light transmittance may be bonded by a sealing adhesive under a nitrogen atmosphere. The sealing member having light transmittance may be made of glass, plastic, or the like, and is preferably concave.

One embodiment of the present invention relates to, in particular, the vapor deposition process in step S4 in the method for manufacturing a display device (display device) described above. In addition, one embodiment of the present invention relates to a vapor deposition apparatus used in a vapor deposition process.

Comparative example

Fig. 3 is a cross-sectional view along the longitudinal direction of the substrate 1120, showing the schematic structure of the vapor deposition device 1100 of the comparative example. The vapor deposition apparatus 1100 includes a conveying mechanism for conveying the substrate 1120, a vacuum chamber, a control mechanism, and the like, which are not shown for the sake of simplicity. In the following drawings, illustration is omitted similarly.

As shown in fig. 3, the vapor deposition apparatus 1100 of the comparative example includes a vapor deposition source 1160; a mask holder 1113 for holding the vapor deposition mask 1110; a lifting device 1130 for holding the substrate 1120 in a lifting manner; a magnet 1140; and a touch panel 1101, the vapor deposition mask 1110 includes a mask sheet 1111 and a mask frame 1112.

Fig. 4 is an enlarged side view showing a schematic shape of a substrate-side surface 1104 of a touch panel 1101 provided in a vapor deposition apparatus 1100 of the comparative example shown in fig. 3.

As shown in fig. 4, the substrate-side surface 1104 of the touch panel 1101 of the comparative example is a smooth surface, in which no recess or no projection is provided on the flat surface 1150. Therefore, the touch panel 1101 can be in contact (surface contact) with the substrate 1120 as a whole with the substrate side surface 1104.

The touch panel 1101 is formed of, for example, a titanium alloy or stainless steel. In contrast, the substrate 1120 is, for example, a glass substrate. Therefore, the flexibility of the substrate 1120 is higher than that of the touch panel 1101.

Fig. 5 is a flowchart schematically showing a vapor deposition process in the vapor deposition apparatus 1100 of the comparative example shown in fig. 3. Fig. 6 to 11 are sectional views along the longitudinal direction of the substrate schematically showing portions of the vapor deposition process shown in fig. 5.

As shown in fig. 5, when the substrate 1120 is carried into the vapor deposition device 1100 (step S31), the substrate is sandwiched between the hook 1131 of the elevating device 1130 and the touch pad 1101. In the sandwiched state, the substrate 1120 is transported to a position directly above the vapor deposition mask 1110 so as to be separated from the vapor deposition mask 1110.

Next, as shown in fig. 6, the substrate 1120 is brought close to the vapor deposition mask 1110, and alignment is performed to align the substrate 1120 with respect to the vapor deposition mask 1110 (step S32). As shown in fig. 5, the alignment device for alignment first uses a camera to capture the alignment marks of the vapor deposition mask 1110 and the substrate 1120, and measures the offset amount of the alignment mark of the substrate 1120 relative to the alignment mark of the vapor deposition mask 1110 based on the captured data (step S33). Then, the determination unit determines whether or not the offset amount is within a threshold range (first allowable range) (step S34). When the shift amount is not within the threshold range (no), the control unit of the alignment device controls the shift amount 0 to be a target, and horizontally moves the substrate 1120 to the alignment driving mechanism (step S35). Next, the alignment device repeats steps S33, S34. When the amount of shift in step S34 is within the threshold range (yes), the alignment device ends the alignment (step S32).

During the alignment (step S32), the touch panel 1101 presses the substrate 1120 toward the mask sheet 1111 side by its own weight. Accordingly, the touch panel 1101 and the substrate 1120 are deflected together by their own weight so as to protrude downward in the gravitational direction.

In this comparative example, "alignment" means that (i) the amount of shift of the alignment mark of the substrate 1120 with respect to the alignment mark of the vapor deposition mask 1110 is measured in a state where the substrate 1120 is separated from the mask sheet 1111 of the vapor deposition mask 1110, (ii) whether or not the amount of shift is within a threshold value range is determined, and (iii) the substrate 1120 is moved in the horizontal direction by controlling with the amount of shift 0 as a target. Further, since the substrate 1120 is lowered onto the vapor deposition mask 1110 in a state where the substrate 1120 is in contact with the touch panel 1101 (step S36), the alignment (step S32) is also performed in a state where the substrate 1120 is in contact with the touch panel 1101.

As shown in fig. 7, after the alignment is completed, the substrate 1120 is lowered onto the vapor deposition mask 1110 in a state of being deflected together with the touch panel 1101 (step S36). During this time, the touch panel 1101 continues to press the substrate 1120 toward the vapor deposition mask 1110 due to its own weight.

Next, as shown in fig. 8, the magnet 1140 is brought close to the touch panel 1101 (step S37). Thereby, the magnetic force of the magnet 1140 acting on the masking sheet 1111 becomes large, and thus the masking sheet 1111 is lifted. Further, the touch panel 1101 continuously presses the substrate 1120 toward the vapor deposition mask 1110 due to its own weight. As a result, the mask sheet 1111 is in close contact with the substrate 1120. Then, alignment position confirmation is performed to confirm the position of the alignment mark (step S38). The alignment device for confirming the alignment position measures the offset by photographing the alignment mark with the camera (step S39), and determines whether the offset is within the threshold range (second allowable range) by the determination unit (step S40). If the threshold value is not within (no), the substrate 1120, the touch panel 1101, and the magnet 1140 are lifted, and the substrate 1120 is separated from the vapor deposition mask 1110 (step S41), and the alignment is returned to (step S32), and steps S35, S33, and S34 are performed again.

In this comparative example, "alignment position confirmation" means (i) measuring the amount of shift of the alignment mark of the substrate 1120 relative to the alignment mark of the vapor deposition mask 1110 in a state in which the hook 1131 of the lowering and raising device 1130 is in contact with the vapor deposition mask 1110, and (ii) determining whether the amount of shift is within the threshold value range. The threshold range in alignment position confirmation is wider than the threshold range in alignment.

In the state shown in fig. 8, the mask sheet 1111 of the vapor deposition mask 1110 is lifted up by the magnetic force of the magnet 1140, and the substrate 1120 is pressed by the weight of the touch panel 1101. Accordingly, the mask sheet 1111 is in close contact with the substrate 1120. When the threshold value is within the threshold value range in step S40 (yes), the vapor deposition material is vapor deposited on the substrate 1120 in such a state of close contact (step S42).

As shown in fig. 9, after the vapor deposition is completed, the magnet 1140 is lifted up, and the magnet 1140 is separated from the touch panel 1101 (step S43). Thus, the magnetic force from the magnet 1140 acting on the vapor deposition mask 1110 is weakened, and thus the mask sheet 1111 does not come into close contact with the substrate 1120.

Next, as shown in fig. 10, the magnet 1140 is further lifted to lift the touch panel 1101, thereby separating the touch panel 1101 from the substrate 1120 (step S44). Thus, the touch panel 1101 does not press the substrate 1120. Then, as shown in fig. 11, the substrate 1120 is lifted (step S45), and the substrate 1120 is carried out (step S46).

Accordingly, there is a need for other structures and methods that can easily separate a substrate from a touch pad. The embodiments of the present invention can realize a vapor deposition device and a method for manufacturing a display device, which are different from the second comparative example and can easily separate a substrate from a touch panel.

In such vapor deposition apparatus 1100, when the substrate 1120 is separated from the touch panel 1101 in step S44, the substrate 1120 and the touch panel 1101 may be in close contact with each other without separation. Therefore, in the vapor deposition apparatus 1100, after the substrate 1120 and the touch panel 1101 that are in close contact with each other are separated from the vapor deposition mask 1110 to the upper side of the vapor deposition mask 1110, the substrate 1120 may be separated from the touch panel 1101 by its own weight and may be dropped. The dropped substrate 1120 may contact the vapor deposition mask 1110, and cracks may occur in the substrate 1120. As a result, the conventional vapor deposition apparatus 1100 has a problem that the manufacturing yield of the display device is reduced.

First embodiment

Hereinafter, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, the shape, size, relative configuration, etc. shown in the drawings are merely examples, and the scope of the present invention should not be construed as being limited thereto.

Fig. 12 is a cross-sectional view taken along the longitudinal direction of the substrate 120 of an example of the schematic configuration of the vapor deposition device 600 according to the first embodiment of the present invention. The vapor deposition apparatus 600 includes a conveying mechanism for conveying the substrate 120, a vacuum chamber, a control mechanism, and the like, which are not shown for simplicity. In fig. 12, a movable protrusion 652 as a convex portion is shown in an enlarged view. The movable protrusion 652 is also shown in the drawings described below in an enlarged manner.

Fig. 13 is a perspective view showing a schematic configuration of the vapor deposition device 600 shown in fig. 12. For simplicity of illustration, only the magnet 140, the touch panel 601, the substrate 120, the vapor deposition mask 110, and the hook 131 are shown, and illustration of other structures is omitted.

As shown in fig. 12 and 13, the vapor deposition apparatus 600 includes a vapor deposition source 160 for vaporizing or sublimating a vapor deposition material; an evaporation mask 110 including a mask sheet 111 and a mask frame 112; a magnet 140 for bringing the mask sheet 111 into close contact with the substrate 120; a touch panel 601 disposed between the substrate 120 and the magnet 140; a lifting device 130 for lifting and lowering the substrate 120 relative to the vapor deposition mask 110; and an alignment device 170 (see fig. 14 described later) for aligning the vapor deposition mask 110 with the substrate 120 using a camera 171 (imaging unit).

The lifting device 130 includes a plurality of hooks 131 (supporting members) provided around the substrate 120 and a plurality of hook driving mechanisms 132 (driving mechanisms) corresponding to the hooks 131. Each hook 131 is provided around the substrate 120, and supports the substrate 120 by abutting the tip 131a against a non-vapor deposition region other than the vapor deposition surface of the substrate 120. Each hook driving mechanism 132 is coupled to the corresponding hook 131, and can drive the corresponding hook 131 and the other hooks 131 in the lifting direction independently. The hook driving mechanism 132 includes a driving member such as a motor, for example.

The mask holder 112 is provided with a plurality of recesses 115 capable of accommodating the distal ends 131a of the hooks 131. The tip portions 131a are accommodated in the recesses 115, respectively, so as not to interfere with the contact between the substrate 120 and the mask sheet 111.

The magnet 140 comprises a permanent magnet and/or an electromagnet. The size of the magnets is preferably the same as the substrate 120 or larger than the substrate 120. The magnet 140 can be lifted and lowered by a magnet driving mechanism 142 via an arm 141.

The touch panel 601 is a sheet member that is elastically deformable. Touch panel 601 is formed of, for example, a titanium alloy or stainless steelThe thickness of the touch panel 601 is, for example, 5mm to 15mm. The touch panel 601 is coupled to the magnet 140 so that the touch panel 601 is movable in the lifting direction with respect to the magnet 140. More specifically, as shown in FIG. 19 As illustrated in fig. 20, the touch panel 601 is lifted from the magnet 140 so that the touch panel 601 can press the substrate 120 toward the mask plate 111 by its own weight. As an example, on the upper surface of the touch panel 601, the T-shaped connecting piece 161 is engaged with the lower end of the T-shaped vertical bar in side view, the connecting through-hole 144 is provided in the magnet 140, and the touch panel 601 is suspended from the magnet 140 so that the T-shaped vertical bar of the connecting piece 161 passes through the connecting through-hole 144. The vapor deposition device 600 may further include a driving mechanism for lifting and lowering the touch panel 601 independently of the magnet 140.

The touch panel 601 is provided with a movable protrusion 652 and a protrusion driving mechanism 653 (driving mechanism), the details of which will be described later.

The substrate 120 is a transparent substrate such as a glass substrate. The substrate 120 is a substrate to be vapor deposited, and is the target of vapor deposition processing in the vapor deposition apparatus 600. The center portion of the vapor deposition surface of the substrate 120 on the vapor deposition mask 110 side is a vapor deposition region, and the peripheral portion of the vapor deposition surface is a non-vapor deposition region. The vapor deposition region is used as a region for abutting the distal end portion 131a of the hook portion 131 and a region for providing an alignment mark.

(alignment device)

Fig. 14 is a block diagram showing an example of a schematic configuration of the alignment device 170 provided in the vapor deposition device 600 shown in fig. 12.

As shown in fig. 14, the alignment device 170 includes a camera 171, an alignment drive mechanism 172, a storage device 173, and an alignment control mechanism 180.

The camera 171 is disposed above the magnet 140 so as to be able to capture alignment marks, which will be described later, provided at each corner of the vapor deposition mask 110 and the substrate 120. The camera 171 may be provided at two respective corners for photographing for alignment and for photographing for alignment position confirmation. The camera 171 preferably adjusts the depth of field so that both the alignment mark can be photographed at the alignment and the alignment position confirmation, and is provided one at each corner.

The alignment driving mechanism 172 moves the substrate 120 supported by the plurality of hooks 131 in the longitudinal direction and the short side direction of the substrate 120 in the alignment and alignment position confirmation. Instead of the alignment device 170, a mechanism for moving the plurality of hooks 131 in the long side direction and the short side direction of the substrate 120 may be added to the elevating device 130 by providing an alignment driving mechanism 172.

The threshold range in the alignment and the alignment position confirmation is stored in the storage device 173. In addition, the storage device 173 may be disposed outside the alignment device 170. Alternatively, instead of the storage device 173, the threshold ranges may be stored in the first determination unit 181 and the second determination unit 182.

The alignment control mechanism 180 is realized by hardware such as a CPU (central processing unit: central processing unit) and an MPU (micro processor unit). The alignment control mechanism 180 shown in fig. 14 (a) includes a first determination unit 181 that performs determination in alignment (step S32) (step S34); a second determination unit 182 that performs determination in the alignment position confirmation (step S38) in the close contact state (step S40); and a control unit 186 for controlling the alignment drive mechanism 172 and the camera 171.

(alignment mark and imaging through hole)

Fig. 15 is a (a) cross-sectional view and (b) plan view schematically showing the overlapping of the alignment marks 114 and 125, the imaging through-hole 106, and the visual confirmation hole 143 shown in fig. 14.

As shown in fig. 14, alignment marks 114 (mask alignment marks) and alignment marks 125 (substrate alignment marks) are provided at the corners of the mask frame 112 and the substrate 120. As shown in fig. 15, the alignment mark 125 of the substrate 120 is provided at a position corresponding to the alignment mark 114 of the mask frame 112. Since the substrate 120 is transparent, the camera 171 can capture the alignment marks 114 of the mask frame 112 across the substrate 120.

As shown in fig. 14, imaging through holes 106 and visual recognition holes 143 are provided at the corners of the touch panel 601 and the magnet 140. As shown in fig. 15, the imaging through hole 106 and the visual inspection hole 143 are provided at positions overlapping with the alignment marks 114 of the mask frame 112. Therefore, as shown in fig. 15, the camera 171 can capture the alignment marks 114 and 125 of the mask frame 112 and the substrate 120 through the imaging through-hole 106 and the visual recognition hole 143 via the touch panel 601 and the magnet 140.

(touch pad)

Fig. 16 is a partial cross-sectional view showing an example of a schematic configuration of a touch panel 601 that can be provided in the vapor deposition device 600 shown in fig. 12. Fig. 17 is a partial cross-sectional view showing another example of the schematic structure of a touch panel 601 that can be provided in the vapor deposition device 600 shown in fig. 12. Fig. 16 and 17 (a) show the abutting state, and fig. 16 and 17 (b) show the separated state.

As shown in fig. 16 and 17, the touch panel 601 includes a movable protrusion 652 and a protrusion driving mechanism 653 for moving the movable protrusion 652, and an opening 654 for allowing the movable protrusion 652 to come in and out is provided on the substrate side surface 604 of the touch panel 601 on the substrate 120 side.

The movable protrusion 652 may penetrate the chuck side surface 605 of the touch panel 601 as shown in fig. 16, or may not penetrate the chuck side surface 605 of the touch panel 601 as shown in fig. 17. The movable protrusion 652 may be switched between (i) a state in which it protrudes from the substrate-side surface 604 toward the substrate 120 and in which the head top 652a is in contact with the substrate 120, and (ii) a separated state in which it is housed in the opening 654 of the touch panel 601 and separated from the substrate 120. Although not shown, the movable protrusion 652 may extend and retract.

Thus, when separating the touch panel 601 from the substrate 120, the movable protrusion 652 is switched from the separated state to the contact state, and the precise contact ratio of the substrate 120 with respect to the touch panel 601 can be aligned Film formation (step S32->S36) is lowered. By reducing the degree of close contact, separation of the substrate 120 and the touch panel 601 can be prevented, and further separation of the substrate 120 and the touch panel 601 can be preventedAfter being lifted up, the substrate 120 is separated from the touch panel 601, and the substrate 120 is brought into contact with the vapor deposition mask 110, whereby cracks are generated in the substrate 120. As a result, in the vapor deposition apparatus 600 of the present embodiment, the reduction in the manufacturing yield of the vapor deposition process of the substrate 120 can be prevented, and therefore, the reduction in the manufacturing yield of the display device having the substrate 120 can be prevented.

The protrusion driving mechanism 653 drives the movable protrusion 652 in the abutting state as shown in fig. 16 and 17 (a) and in the separated state as shown in fig. 16 and 17 (b). The protrusion driving mechanism 653 includes, for example, one driving mechanism main body 653a including a driving member (not shown) such as a motor, and one or more coupling members 653b for coupling the plurality of movable protrusions 652 to the one driving mechanism main body 653 a. The protrusion driving mechanism 653 can drive the movable protrusion 652 as described above by operating the coupling member 653b through the driving mechanism main body 653 a. However, the protrusion driving mechanism 653 is not limited to this, and may include, for example, a plurality of driving mechanism main bodies 653a and a plurality of or a plurality of coupling members 653b for coupling one or more movable protrusions 652 to the corresponding driving mechanism main bodies 653 a. The driving mechanism main body 653a of the protrusion driving mechanism 653 may be provided outside the touch panel 601 (chuck side) as shown in fig. 16, or inside the touch panel 601 as shown in fig. 17, but may be provided on a member other than the touch panel 601, although not shown.

Further, the touch panel 601 and the movable protrusion 652 are preferably connected to a grounding wire. Preferably, at least the substrate-side surface 604 of the touch panel 601 and the head top 652a of the movable protrusion 652 are grounded through the wiring. Such grounding prevents the substrate 120 from being attached to the touch panel 601 by static electricity. As a result, when separating the touch panel 601 from the substrate 120, the substrate 120 and the touch panel 601 can be more reliably prevented from being separated, and a reduction in the manufacturing yield of the display device having the substrate 120 can be more reliably prevented.

Further, it is more preferable that the touch panel 601 and the movable protrusion 652 be capable of switching between the grounded state and the ungrounded state. By this switching, when it is desired to increase the degree of close contact of the touch panel 601 with the substrate 120, the touch panel 601 and the movable protrusion 652 can be brought into a non-grounded state, and an electrostatic force that pulls the substrate 120 toward the touch panel 601 can be used. On the other hand, when it is desired to reduce the degree of close contact of the touch panel 601 with the substrate 120, the touch panel 601 and the movable protrusion 652 can be brought into a grounded state, and the electrostatic force that pulls the substrate 120 toward the touch panel 601 can be eliminated.

(vapor deposition treatment)

Fig. 18 is a flowchart schematically showing an example of the vapor deposition process in the vapor deposition apparatus 600 shown in fig. 12. Fig. 19 (a) is a cross-sectional view along the longitudinal direction of the substrate 120 schematically showing a state of the vapor deposition device 600 shown in fig. 12 in alignment, and fig. 19 (b) is a partially enlarged view of fig. 19 (a). Fig. 20 (a) is a cross-sectional view along the longitudinal direction of the substrate 120, schematically showing a state in the process of separating the touch panel of the vapor deposition device 600 shown in fig. 12, and fig. 20 (b) is a partially enlarged view of fig. 20 (a).

In the present embodiment and the embodiments described below, "alignment" means that in a state in which the substrate 120 is separated from the mask sheet 111 of the vapor deposition mask 110, (i) the amount of displacement of the alignment mark 125 of the substrate 120 relative to the alignment mark 114 of the vapor deposition mask 110 is measured, (ii) whether or not the amount of displacement is within a threshold value range is determined, (i) the substrate 120 is controlled to be moved in the horizontal direction with the amount of displacement 0 as a target.

In the present embodiment and the embodiments described below, the "alignment position confirmation" refers to (i) measuring the amount of shift of the alignment mark 125 provided on the substrate 120 with respect to the alignment mark 114 of the vapor deposition mask 110 in a state where the entire surface of the substrate 120 is in contact with the mask sheet 111, and (ii) determining whether or not the amount of shift is within a threshold value range. The threshold range in alignment position confirmation is wider than the threshold range in alignment.

As shown in fig. 18, the alignment device 170 (see fig. 14) performs alignment after the substrate is carried in (step S31) (step S32). The alignment device 170 for alignment first photographs the alignment marks 114 and 125 of the mask frame 112 and the substrate 120 with the camera 171, and measures the amount of shift of the alignment mark 125 of the substrate 120 with respect to the alignment mark 114 of the vapor deposition mask 110 based on the photographed data (step S33). Then, the first determination unit 181 determines whether or not the offset amount is within the threshold range (first allowable range) (step S34). If the amount is not within the threshold range (no), the control unit 186 of the alignment control mechanism 180 of the alignment device 170 controls the offset amount 0 to be a target, and horizontally moves the substrate 120 to the alignment drive mechanism 172 (step S35). Next, the alignment device 170 repeats steps S33 and S34. When the amount of shift in step S34 is within the threshold range (yes), the alignment device 170 ends the alignment (step S32).

As shown in fig. 19, between the alignment (step S32), the movable protrusion 652 is in a separated state, and the touch panel 601 presses the substrate 120 toward the mask sheet 111 by its own weight. Accordingly, the substrate-side surface 604 of the touch panel 601 is in contact (surface contact) with the substrate 120. Thus, between the alignment (step S32), since the substrate-side surface 604 of the touch panel 601 is in contact (surface contact) with the substrate 120, the degree of close contact of the substrate 120 with respect to the touch panel 601 is high. Accordingly, during this period, the touch panel 601 can suppress the deflection of the substrate 120.

Then, the deposition process (step S42) of forming a deposition film on the substrate 120 by performing the deposition apparatus 600 using the substrate 120 and the touch panel lowering (step S36), the magnet 140 lowering (step S37), the alignment position checking (step S38), and the deposition mask 110 to deposit the deposition film on the substrate 120 is performed in a state in which the movable protrusion 652 is separated and the touch panel 601 presses the substrate 120 toward the mask sheet 111 by its own weight. In other words, steps S32 to S42 are performed while the touch panel 601 presses the substrate 120 toward the vapor deposition mask 110 by its own weight (first step).

After the film formation, the vapor deposition device 600 grounds the touch panel 601 and the movable protrusion 652 (step S71, grounding step). Since the substrate 120 is also grounded through the substrate-side surface 604 of the touch panel 601, the electrostatic force pulling the substrate 120 toward the touch panel 601 disappears, and the degree of close contact of the substrate 120 with respect to the touch panel 601 decreases. At this time, since the magnet separation (step S43) described later has not yet been performed, the close contact degree of the mask sheet 111 with respect to the substrate 120 is high.

Next, when the magnets are separated (step S43), the mask sheet 111 lifted by the magnetic force from the magnets 140 is deflected so as to hang down. At this time, although the close contact degree of the mask sheet 111 with respect to the substrate 120 is high, the close contact degree of the touch panel 601 with respect to the substrate 120 is low, and thus the substrate 120 easily follows the mask sheet 111. By making the substrate 120 follow the mask plate 111, the close contact degree of the substrate 120 with respect to the touch panel 601 is further reduced.

As shown in fig. 20, the protrusion driving mechanism 653 then drives the movable protrusion 652 so that the grounded movable protrusion 652 is switched from the separated state to the contact state (step S72). The movable protrusion 652 protrudes from the substrate-side surface 604 and abuts against the substrate 120. As a result, the substrate side surface 604 of the touch panel 601 is separated from the substrate 120 via the movable protrusion 652, and the touch panel 601 is in contact (point contact or line contact) with the substrate 120 at the head top 652a of the movable protrusion 652. Therefore, the degree of close contact of the substrate 120 with respect to the touch panel 601 is further reduced as compared with the case of performing surface contact as shown in fig. 19. In addition, since the movable protrusion 652 is grounded, generation of electrostatic force that pulls the substrate 120 toward the touch panel 601 is prevented.

Next, the vapor deposition device 600 lifts the touch panel 601 by further lifting the magnet 140 (step S44). At this time, in steps S71, S43, S72, as described above, since the degree of close contact of the substrate 120 with respect to the touch panel 601 is reduced, the touch panel 601 is prevented from being separated from the substrate 120. Therefore, only the touch panel 601 is lifted up in a state where the substrate 120 is placed on the vapor deposition mask 110. Therefore, the substrate 120 can be prevented from being lifted up and dropped together with the touch panel 601 in a state of being in close contact with the vapor deposition mask 110, and cracks can be prevented from being generated in the substrate 120.

In this way, in the present embodiment, the touch panel separation (second step) of separating the touch panel 601 from the substrate 120 is completed in two stages of step S72 and step S44. As a result, the occurrence of cracks on the substrate 120 can be prevented as described above. Further, in the present embodiment, the touch panel 601 and the movable protrusion 652 are grounded before the magnet is separated (step S43) (step S71). As a result, the occurrence of cracks on the substrate 120 as described above can be more reliably prevented.

Then, the vapor deposition apparatus 600 lifts the substrate 120 and separates the substrate 120 from the vapor deposition mask 110 (step S45, third step), and carries out the substrate 1120 (step S46), and during this time, the protrusion driving mechanism 653 drives the movable protrusion 652 to be accommodated inside the touch panel 601, thereby switching the movable protrusion 652 from the contact state to the separation state (step S73). Further, step S72 may be performed in a period from the separation of the touch panel (step S44) to the carry-in of the next substrate 120 (step S31).

(modification)

Although the vapor deposition device 600 has been described above as an example in which one touch panel 601 is provided, the example according to the first embodiment is not limited to this. In the vapor deposition device 600, the touch panel may be a plurality of sheet members.

Fig. 21 is a cross-sectional view taken along the longitudinal direction of the substrate 120, showing an example of a schematic configuration of a modification of the vapor deposition device 600 shown in fig. 12.

As shown in fig. 21, the vapor deposition device 600 may include four touch panels 601a, 601b, 601c, and 601c. The touch panel 601a has a movable protrusion 652 on a substrate-side surface corresponding to a first end portion in the longitudinal direction of the substrate 120.

The touch panel 601b has a movable protrusion 652 on a substrate-side surface corresponding to a second end portion (opposite to the first end portion) of the substrate 120 in the longitudinal direction. The two touch pads 601c and 601c each have a movable protrusion 652 on a substrate side surface corresponding to an intermediate portion (between the first end portion and the second end portion) in the longitudinal direction of the substrate 120.

Second embodiment

An embodiment of the present invention will be described in detail below with reference to the drawings. For convenience of explanation, members having the same functions as those described in the above embodiments are given the same reference numerals, and the explanation thereof will not be repeated.

Fig. 22 is a cross-sectional view taken along the longitudinal direction of the substrate 120 of an example of the schematic configuration of the vapor deposition device 700 according to the first embodiment of the present invention.

As shown in fig. 22, a vapor deposition device 700 according to the second embodiment is different from the vapor deposition device 600 according to the first embodiment in that the vapor deposition device includes a touch panel 701 provided with a fixed protrusion 751 in addition to a movable protrusion 752 and a protrusion driving mechanism 753. Other configurations of the vapor deposition device 700 of the second embodiment are the same as those of the vapor deposition device 700 of the first embodiment.

Fig. 23 is a plan view schematically showing an example of a substrate-side surface 704 of a touch panel 701 that can be provided with the vapor deposition device 700 shown in fig. 22. In fig. 23, the movable projection 752 and the fixed projection 751 are shown in large scale. The movable projection 752 and the fixed projection 751 are also shown in the drawings described later in a similar manner. Fig. 24 is a sectional view AA of fig. 23, where fig. 24 (a) shows a state of contact of the movable protrusion 752, and fig. 24 (b) shows a state of separation of the movable protrusion 752.

As shown in fig. 23, a fixed protrusion 751 and an opening 754 for allowing the movable protrusion 752 to come in and go out are provided on the substrate side surface 704 of the touch panel 701 on the substrate 120 side.

The fixing protrusion 751 is fixedly provided at least in a partial region of the substrate-side surface 704. The fixing protrusions 751 are preferably provided only in the peripheral region 755 in the substrate-side surface 704. The peripheral region 755 corresponds to a peripheral portion of the substrate 120 supported from below by the front end portion of the hook 131 in the descending (step S32 and step S36) from the alignment to the substrate 120. Therefore, in the peripheral region 755, even if the close contact degree between the touch panel 701 and the substrate 120 is low, the touch panel is precisely alignedThe substrate 120 is also difficult to peel off from the touch panel 701 during the substrate lowering.

The movable protrusion 752 is provided at least in a partial region of the substrate-side surface 704. The movable protrusion 752 is preferably disposed in at least a central region 756 of the substrate side surface 704. The central region 756 is surrounded by the peripheral region 755, and corresponds to a central portion of the substrate 120 that is not supported from below by the tip portion of the hook 131 in the descending (step S32 and step S36) from the alignment to the substrate 120. Therefore, in the peripheral region 755, even if the close contact degree between the touch panel 701 and the substrate 120 is low, the touch panel is precisely alignedThe substrate 120 is also easily peeled from the touch panel 701 during the substrate lowering.

The arrangement of the fixed protrusion 751 and the movable protrusion 752 is not limited to the arrangement shown in fig. 24. The height of the movable protrusion 752 from the substrate side surface 704 in the abutting state may be the same as or lower than the height of the fixed protrusion 751 from the substrate side surface 704, or higher than the height of the fixed protrusion 751.

As shown in fig. 24, the protrusion driving mechanism 753 drives the movable protrusion 752 in a separated state as shown in fig. 24 (a) and in a contact state as shown in fig. 24 (b). The protrusion driving mechanism 753 includes, for example, one driving mechanism main body 753a including a driving member (not shown) such as a motor, and one or a plurality of coupling members 753b for coupling the plurality of movable protrusions 652 to the one driving mechanism main body 653 a.

Further, the touch panel 701 and the movable protrusion 752 are preferably connected to a grounding wire. Preferably, at least the head top 751a of the fixed protrusion 751 and the head top 752a of the movable protrusion 752 are grounded through the wiring. Further, it is more preferable that the touch panel 701 and the movable protrusion 752 can switch between the grounded state and the ungrounded state.

(vapor deposition treatment)

The vapor deposition device 700 according to the present embodiment performs vapor deposition processing on the substrate 120 in a vapor deposition process (see fig. 18) similar to the vapor deposition device 600 according to the above embodiment.

Fig. 25 is a cross-sectional view along the longitudinal direction of the substrate 120 schematically showing a state in which the vapor deposition device 700 shown in fig. 22 is aligned. In fig. 25, the movable protrusion 752 and the fixed protrusion 751 are illustrated to be large, so that the touch panel 701 is illustrated to be significantly deflected at the boundary portion between the peripheral region 755 and the central region 756, but the touch panel 701 is substantially flat in practice.

As shown in fig. 25, between the alignment (step S32), the movable protrusion 752 is in a separated state, and the touch panel 701 presses the substrate 120 toward the mask sheet 111 side by its own weight. Accordingly, the substrate-side surface 704 of the touch panel 701 is in contact (point contact or line contact) with the substrate 120 at the peripheral region 755 by the head top 751a of the fixing projection 751, and in contact (surface contact) with the substrate 120 at the central region 756. Then, the substrate 120 and the touch panel are lowered (step S36), the magnet 140 is lowered (step S37), the alignment position is checked (step S38), and the film forming step (step S42) is performed in a state in which the movable protrusion 752 is separated and the touch panel 701 presses the substrate 120 toward the mask sheet 111 by its own weight. During the pressing of the touch panel 701 against the mask sheet 111 of the substrate 120 (first step), the central portion of the substrate 120 can be brought into close contact with the touch panel 701, and therefore the touch panel 701 can suppress the deflection of the substrate 120.

Fig. 26 (a) is a cross-sectional view along the longitudinal direction of the substrate 120, schematically showing a state in the process of separating the touch panel of the vapor deposition device 700 shown in fig. 22.

As shown in fig. 26, before the touch panel 601 is lifted (step S44), the protrusion driving mechanism 753 drives the movable protrusion 752 so that the grounded movable protrusion 752 is switched from the separated state to the contact state (step S72). As a result, as in the first embodiment, the occurrence of cracks on the substrate 120 can be prevented.

In the second embodiment, the fixing protrusion 751 always abuts against the substrate 120 while the substrate 120 is pressed against the mask sheet 111 by the touch panel 701, as compared with the first embodiment. Therefore, when the touch panel is lifted, the central region 756 of the touch panel 701 is easily changed from the surface contact to the point contact or the line contact starting from the peripheral region 755 provided with the fixing protrusions 751.

(modification)

Although the vapor deposition device 700 has been described above as an example in which one touch panel 701 is provided, the example according to the second embodiment is not limited to this. In the vapor deposition device 700, the touch panel may be a plurality of sheet members.

Fig. 27 is a plan view schematically showing an example of the substrate-side surfaces of touch panels 701a, 701b, 701c of a modification example that can be provided in vapor deposition device 700 shown in fig. 22.

As shown in fig. 27, the vapor deposition device 700 may include three touch panels 701a, 701b, 701c. The touch panel 701a has a fixing protrusion 751 corresponding to a first end portion in the longitudinal direction of the substrate 120. The touch panel 701b has a fixing protrusion 751 corresponding to a second end portion (opposite to the first end portion) in the longitudinal direction of the substrate 120. The touch panel 701c has two fixed protrusions 751 and movable protrusions 752 corresponding to a middle portion (between the first end portion and the second end portion) in the longitudinal direction of the substrate 120.

[ summary ]

The vapor deposition device according to the first aspect of the present invention includes a vapor deposition source; an evaporation mask having a mask plate and a mask frame; a magnet for adhering the mask sheet to a substrate; a touch panel disposed between the substrate and the magnet; a lifting device for lifting the substrate relative to the vapor deposition mask; and an alignment device for aligning the vapor deposition mask with the substrate, wherein a plurality of protruding portions that come into contact with the substrate when the substrate and the touch panel are separated are provided on the touch panel.

In the vapor deposition device according to the second aspect of the present invention, in the first aspect, the plurality of convex portions may include movable protruding portions that can protrude from a substrate-side surface of the touch panel on the substrate side toward the substrate.

The vapor deposition device according to the third aspect of the present invention may be configured such that in the second aspect, the vapor deposition device further includes a driving mechanism that drives the movable protrusion in either one of a contact state in which the movable protrusion contacts the substrate and a separation state in which the movable protrusion is separated from the substrate.

In the vapor deposition device according to the fourth aspect of the present invention, in any one of the first to third aspects, the touch panel may be provided with a fixing protrusion fixed to the substrate-side surface so as to always contact the substrate.

In the vapor deposition device according to the fifth aspect of the present invention, in the fourth aspect, the fixing projection may be provided only in a peripheral region of the substrate-side surface.

In the vapor deposition device according to a sixth aspect of the present invention, in any one of the first to fifth aspects, the movable protrusion may be provided at least in a central region of the substrate-side surface.

The vapor deposition device according to a seventh aspect of the present invention may be configured such that in any one of the first to sixth aspects, the touch panel is a sheet member that is elastically deformable.

In the vapor deposition device according to an eighth aspect of the present invention, the touch panel may be a plurality of sheet members in any one of the first to seventh aspects.

In the vapor deposition device according to a ninth aspect of the present invention, in any one of the first to eighth aspects, the touch panel and the convex portion may be connected to a grounding wire.

A method for manufacturing a display device according to a tenth aspect of the present invention is a method for manufacturing a display device having a substrate, the method including a vapor deposition step of performing vapor deposition processing on the substrate using a vapor deposition mask, the vapor deposition step including a first step of pressing the substrate toward the vapor deposition mask side through a touch panel provided on an opposite side of the vapor deposition mask with respect to the substrate;

a film forming step of performing the vapor deposition treatment on the substrate to form a vapor deposited film on the substrate; and a second step of separating the touch panel from the substrate, wherein the touch panel is separated from the substrate via a plurality of protruding portions provided on the touch panel in the second step.

In the vapor deposition device according to a tenth aspect of the present invention, the vapor deposition step may further include a third step of separating the substrate from the vapor deposition mask, and the third step may be performed after the second step.

In the vapor deposition device according to a twelfth aspect of the present invention, in the eleventh aspect, the fixing protrusion fixed to the substrate-side surface of the touch panel in the first step may be in contact with the substrate so that the fixing protrusion is always in contact with the substrate.

In the vapor deposition device according to a thirteenth aspect of the present invention, in the twelfth aspect, the fixing projection may be in contact with the substrate in the film formation step.

In the vapor deposition device according to a fourteenth aspect of the present invention, in any one of the tenth to thirteenth aspects, a grounding step of grounding the touch panel and the convex portion may be performed between the film formation step and the second step.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the claims, and embodiments in which the technical means disclosed in the different embodiments are appropriately combined are also included in the technical scope of the present invention. Further, new features can be formed by combining the technical means disclosed in the respective embodiments.

2 display device (display device)

600. 700 vapor deposition device

601. 701, 701a, 701b, 701c touch pad

110 vapor plating mask

111 mask sheet

112 mask frame

113 mask holder

120 substrate

130 lifting device

140 magnet

160 vapor deposition source

604. 704 substrate side surface

652. 752 movable protrusion

652a, 751a, 752a head top

653. 753 projecting part driving mechanism (driving mechanism)

654. 754 opening

751 fixing projection

755 peripheral region

756 central region

Claims

1. An evaporation device, comprising:

a vapor deposition source;

an evaporation mask having a mask sheet and a mask frame;

a magnet for bonding the mask sheet to a substrate;

a touch panel disposed between the substrate and the magnet;

a lifting device for lifting the substrate relative to the vapor deposition mask; and

an alignment device for performing alignment of the vapor deposition mask and the substrate, wherein,

the touch panel is provided with a plurality of convex parts which are contacted with the substrate when the substrate and the touch panel are separated,

the plurality of convex portions include movable protruding portions capable of protruding from a substrate-side surface of the substrate side of the touch panel toward the substrate,

the apparatus further includes a driving mechanism that drives the movable protrusion in either one of an abutting state with the substrate and a separated state with the substrate.

2. The vapor deposition device according to claim 1, wherein the touch panel is provided with a fixing projection fixed to the substrate-side surface so as to always abut against the substrate.

3. The vapor deposition device according to claim 2, wherein the fixing projection is provided only in a peripheral region in the substrate-side surface.

4. The vapor deposition device according to any one of claims 1 to 3, wherein the movable protrusion is provided at least in a central region in the substrate-side surface.

5. The vapor deposition device according to any one of claims 1 to 3, wherein the touch panel is a sheet member capable of elastic deformation.

6. The vapor deposition device according to any one of claims 1 to 3, wherein the touch panel is a plurality of sheet members.

7. The vapor deposition device according to any one of claims 1 to 3, wherein the touch panel and the convex portion are connected to a grounding wire.

8. A method for manufacturing a display device having a substrate, the method comprising

A vapor deposition step of performing vapor deposition processing on the substrate using a vapor deposition mask,

in the vapor deposition step,

a first step of pressing the substrate toward the vapor deposition mask by a touch panel provided on the opposite side of the vapor deposition mask to the substrate;

a film forming step of performing the vapor deposition treatment on the substrate to form a vapor deposited film on the substrate; and

A second step of separating the touch panel from the substrate,

in the second step, the touch panel is separated from the substrate via a plurality of protruding portions provided on the touch panel,

in the second step, a driving mechanism that drives the movable protrusion switches the movable protrusion from a separated state in which the movable protrusion is separated from the substrate to an abutting state in which the movable protrusion abuts against the substrate.

9. The method of manufacturing a display device according to claim 8, wherein the vapor deposition step further includes a third step of separating the substrate from the vapor deposition mask,

the third process is performed after the second process.

10. The method of manufacturing a display device according to claim 9, wherein in the first step, a fixing protrusion fixed to a substrate-side surface of the touch panel on the substrate side is brought into contact with the substrate such that the fixing protrusion is always in contact with the substrate.

11. The method of manufacturing a display device according to claim 10, wherein in the film forming step, the fixing projection is in contact with the substrate.

12. The method for manufacturing a display device according to any one of claims 8 to 11, wherein a grounding step of grounding the touch panel and the convex portion is performed between the film forming step and the second step.