CN113594340A - 一种灯珠焊盘与玻璃屏的电性连接工艺 - Google Patents
一种灯珠焊盘与玻璃屏的电性连接工艺 Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims abstract description 94
- 239000011324 bead Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 17
- 230000008569 process Effects 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 40
- 239000000956 alloy Substances 0.000 claims abstract description 40
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 40
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000003848 UV Light-Curing Methods 0.000 claims description 4
- 239000002808 molecular sieve Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
本发明公开一种灯珠焊盘与玻璃屏的电性连接工艺。本发明通过在玻璃基板的导电线路与LED灯珠的焊盘对应位置处设置液态金属合金,液态金属合金与玻璃基板相亲,可以浸润玻璃基板,从而保证在LED玻璃屏的正常工作中,液态金属合金可稳定粘附与玻璃基板上,实现对LED灯珠的电能及电信号的传递,并通过液态金属合金的张力保证与LED灯珠之间的吸附力,避免出现虚焊或脱落等情况,保证LED灯珠的正常使用。同时,液态金属合金具有较强的导电性能,在避免工作中发热的同时,可将LED灯珠工作所产生的热量导出,从而提高LED灯珠的使用寿命。
Description
技术领域
本发明涉及透明显示技术领域,尤其涉及一种灯珠焊盘与玻璃屏的电性连接工艺。
背景技术
LED玻璃屏,是应用透明导电技术,将LED结构层胶合在两层玻璃之间的高端定制光电玻璃,在保留了传统LED显示屏具有的容易控制、低压直流驱动、组合后色彩表现丰富、使用寿命长等优点的同时,提供通透质感、无导线外观和璀璨光芒。更是由于其在玻璃幕墙上应用的独特优势,被广泛应用于城市亮化工程、大屏幕显示***中。同时可以作为室内显示幕墙,被广泛应用于大型广场亮化、舞台布景、酒吧、高档歌舞厅、城市地标建筑、市政建筑、机场、汽车4S店、酒店、银行、品牌连锁店等,它既有LED玻璃显示屏既有显示屏的实用性,又有一定的美观性及隐蔽性。现有的LED玻璃屏中,LED灯的焊盘一般都是通过银胶的方式与玻璃进行电性连接,从而将电能或电信号传递给LED灯。然而,由于焊盘尺寸较小,而且在高温下银胶容易产生虚焊的情况,使得LED灯的焊盘与玻璃脱离,导致该点LED灯的正常工作受影响,从而影响LED玻璃屏的正常显示效果。而且,因为银胶中含有环氧树脂基体,而环氧树脂基体的电阻较高,长期通电工作容易产生大量热量,对LED灯珠的使用寿命产生一定的影响。
因此,现有技术存在缺陷,需要改进。
发明内容
本发明的目的是克服现有技术的不足,提供一种灯珠焊盘与玻璃屏的电性连接工艺。
本发明的技术方案如下:提供一种灯珠焊盘与玻璃屏的电性连接工艺,包括以下步骤:
步骤1:将导电浆料涂覆于玻璃基板上,并进行烤制成型,在玻璃基板上形成导电线路;
步骤2:在导电线路上设置若干预设位置;
步骤3:将具有玻璃亲和性的液态金属合金滴在预设位置对应的焊盘点上;
步骤4:将LED灯珠的底部贴附于玻璃基板上,使得LED灯珠上的焊盘与液态金属合金接触;
步骤5:将玻璃保护板通过中空工艺设置在玻璃基板靠近LED灯珠的一侧,使得玻璃保护板与玻璃基板封装一体形成透明显示屏。
进一步地,所述液态金属合金中含有金属镓。
进一步地,所述液态金属合金中含有金属铟。
进一步地,所述液态金属合金在0-2200℃的温度下为液态。
进一步地,导电浆料中包括石墨烯粉及银、铂、铑中的两种或全部的金属颗粒。
进一步地,所述步骤5的具体步骤如下:
步骤5.1:在玻璃基板与剥离保护板之间形成中空间隙,在中空间隙内对应玻璃基板与玻璃保护板的边缘之间填充一圈自带分子筛的软边条;
步骤5.2:在软边条的外侧填充一圈结构胶;
步骤5.3:在玻璃基板与玻璃保护板的中空间隙内充入惰性气体。
进一步地,所述LED灯珠通过UV固化胶粘附于玻璃基板上。
采用上述方案,本发明通过在玻璃基板的导电线路与LED灯珠的焊盘对应位置处设置液态金属合金,液态金属合金与玻璃基板相亲,可以浸润玻璃基板,从而保证在LED玻璃屏的正常工作中,液态金属合金可稳定粘附与玻璃基板上,实现对LED灯珠的电能及电信号的传递,并通过液态金属合金的张力保证与LED灯珠之间的吸附力,避免出现虚焊或脱落等情况,保证LED灯珠的正常使用。同时,液态金属合金具有较强的导电性能,在避免工作中发热的同时,可将LED灯珠工作所产生的热量导出,从而提高LED灯珠的使用寿命。
附图说明
图1为本发明的流程框图。
具体实施方式
以下结合附图和具体实施例,对本发明进行详细说明。
请参阅图1,本发明提供一种灯珠焊盘与玻璃屏的电性连接工艺,包括以下步骤:
步骤1:将导电浆料涂覆于玻璃基板上,并进行烤制成型,在玻璃基板上形成导电线路。
步骤2:在导电线路上设置若干预设位置。
步骤3:将具有玻璃亲和性的液态金属合金滴在预设位置对应的焊盘点上。通过液态金属合金与玻璃基板相亲,可以浸润玻璃基板,从而稳固地粘附于玻璃基板上。而且在常温以及高温环境下,液态金属合金保持液态,以此保证液态金属合金与玻璃基板之间的稳定性,避免因高温而出现连接不稳定的情况,保证LED灯珠的正常连接使用。
步骤4:将LED灯珠的底部贴附于玻璃基板上,使得LED灯珠上的焊盘与液态金属合金接触。液态金属合金具有良好的导电性能,以此将电能及电信号分别传递至LED灯珠的焊盘处,满足LED灯珠的正常工作需求。同时,液态金属合金的电阻值较小,且导热性能好,在长时间的工作中产生及积累的热量较少,可以避免发热对LED灯珠的寿命造成影响,并且可将LED灯珠工作时所产生的热量导出,为LED灯珠提供一定的降温效果。而且液态金属合金表面具有张力,可以粘附于LED灯珠的焊盘上,保证LED灯珠与导电线路的连接效果,避免LED灯珠从导电线路上脱落,提高LED玻璃屏的显示工作的稳定性。
步骤5:将玻璃保护板通过中空工艺设置在玻璃基板靠近LED灯珠的一侧,使得玻璃保护板与玻璃基板封装一体形成透明显示屏。具体步骤如下:
步骤5.1:在玻璃基板与剥离保护板之间形成中空间隙,在中空间隙内对应玻璃基板与玻璃保护板的边缘之间填充一圈自带分子筛的软边条;
步骤5.2:在软边条的外侧填充一圈结构胶;
步骤5.3:在玻璃基板与玻璃保护板的中空间隙内充入惰性气体。
本步骤中,软边条自带分子筛可吸收玻璃基板与玻璃保护板之间的中空空间内的空气水分,保证中空空间内环境的干燥性,而且软边条的使用能够优化LED玻璃屏的绝缘性,从而保证显示屏使用的安全性。本步骤中使用的结构胶,在干燥后可变得柔软,而且耐腐蚀性强,从而保证玻璃基板与玻璃保护板封装的密封性,延长LED玻璃屏的使用寿命。
所述液态金属合金中含有金属镓或金属铟中的一种或两种金属成分。金属镓和金属铟都能浸润玻璃,沿玻璃表面扩展并相互附着,因此可以保证与玻璃基板之间的粘附性。同时,金属镓和金属铟的导电性能强,可满足电能与电信号的传递,并避免因内阻较大而导致发热升温的情况。并且,金属镓和金属铟对人体的毒性较低,加工及使用不会对人体健康产生影响。
所述液态金属合金在0-2200℃的温度下为液态,在常温以及高温环境下,液态金属合金保持液态,保证其表面张力不变,以此保证液态金属合金与玻璃基板之间的稳定性,避免因高温而出现连接不稳定的情况,保证LED灯珠的正常连接使用。
导电浆料中包括石墨烯粉及银、铂、铑中的两种或全部的金属颗粒。由于导电浆料中加入了银、铂、铑中的两种或三种金属,以此提高LED灯珠的焊盘与导电线路连接的牢固性,避免LED灯珠由玻璃基板上脱落。
所述LED灯珠通过UV固化胶粘附于玻璃基板上。UV固化胶具有固化速度快、无污染、粘接效果好、透光率高等特点,可同时保证美观性及粘接的稳固性,适合于LED玻璃屏的粘合使用需求。
综上所述,本发明通过在玻璃基板的导电线路与LED灯珠的焊盘对应位置处设置液态金属合金,液态金属合金与玻璃基板相亲,可以浸润玻璃基板,从而保证在LED玻璃屏的正常工作中,液态金属合金可稳定粘附与玻璃基板上,实现对LED灯珠的电能及电信号的传递,并通过液态金属合金的张力保证与LED灯珠之间的吸附力,避免出现虚焊或脱落等情况,保证LED灯珠的正常使用。同时,液态金属合金具有较强的导电性能,在避免工作中发热的同时,可将LED灯珠工作所产生的热量导出,从而提高LED灯珠的使用寿命。
以上仅为本发明的较佳实施例而已,并不用于限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (7)
1.一种灯珠焊盘与玻璃屏的电性连接工艺,其特征在于,包括以下步骤:
步骤1:将导电浆料涂覆于玻璃基板上,并进行烤制成型,在玻璃基板上形成导电线路;
步骤2:在导电线路上设置若干预设位置;
步骤3:将具有玻璃亲和性的液态金属合金滴在预设位置对应的焊盘点上;
步骤4:将LED灯珠的底部贴附于玻璃基板上,使得LED灯珠上的焊盘与液态金属合金接触;
步骤5:将玻璃保护板通过中空工艺设置在玻璃基板靠近LED灯珠的一侧,使得玻璃保护板与玻璃基板封装一体形成透明显示屏。
2.根据权利要求1所述的灯珠焊盘与玻璃屏的电性连接工艺,其特征在于,所述液态金属合金中含有金属镓。
3.根据权利要求1所述的灯珠焊盘与玻璃屏的电性连接工艺,其特征在于,所述液态金属合金中含有金属铟。
4.根据权利要求1所述的灯珠焊盘与玻璃屏的电性连接工艺,其特征在于,所述液态金属合金在0-2200℃的温度下为液态。
5.根据权利要求1所述的灯珠焊盘与玻璃屏的电性连接工艺,其特征在于,导电浆料中包括石墨烯粉及银、铂、铑中的两种或全部的金属颗粒。
6.根据权利要求1所述的灯珠焊盘与玻璃屏的电性连接工艺,其特征在于,所述步骤5的具体步骤如下:
步骤5.1:在玻璃基板与剥离保护板之间形成中空间隙,在中空间隙内对应玻璃基板与玻璃保护板的边缘之间填充一圈自带分子筛的软边条;
步骤5.2:在软边条的外侧填充一圈结构胶;
步骤5.3:在玻璃基板与玻璃保护板的中空间隙内充入惰性气体。
7.根据权利要求1所述的灯珠焊盘与玻璃屏的电性连接工艺,其特征在于,所述LED灯珠通过UV固化胶粘附于玻璃基板上。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114038606A (zh) * | 2021-11-05 | 2022-02-11 | 巨晶(广东)光电科技有限公司 | 一种透明显示屏的液态金属石墨烯复合导电浆料 |
CN114828401A (zh) * | 2022-04-08 | 2022-07-29 | 百为智能科技(广州)有限公司 | 一种基于大尺寸中空型玻璃基板的灯珠线路制备方法及显示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984510A (zh) * | 2010-08-20 | 2011-03-09 | 符建 | 基于液态金属基底的软性连接的led装置 |
CN106097913A (zh) * | 2016-08-18 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | 一种透明玻璃基显示屏及其制备工艺 |
CN106927698A (zh) * | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | Led透明发光玻璃的制造方法及led透明发光玻璃 |
US20190327839A1 (en) * | 2016-02-03 | 2019-10-24 | Wuhan Huashang Green Technology Co., Ltd. | Highly conductive transparent glass-based circuit board |
CN112530306A (zh) * | 2020-12-24 | 2021-03-19 | 赵泽宇 | 一种透明玻璃显示屏 |
-
2021
- 2021-07-30 CN CN202110873355.1A patent/CN113594340A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984510A (zh) * | 2010-08-20 | 2011-03-09 | 符建 | 基于液态金属基底的软性连接的led装置 |
US20190327839A1 (en) * | 2016-02-03 | 2019-10-24 | Wuhan Huashang Green Technology Co., Ltd. | Highly conductive transparent glass-based circuit board |
CN106097913A (zh) * | 2016-08-18 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | 一种透明玻璃基显示屏及其制备工艺 |
CN106927698A (zh) * | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | Led透明发光玻璃的制造方法及led透明发光玻璃 |
CN112530306A (zh) * | 2020-12-24 | 2021-03-19 | 赵泽宇 | 一种透明玻璃显示屏 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114038606A (zh) * | 2021-11-05 | 2022-02-11 | 巨晶(广东)光电科技有限公司 | 一种透明显示屏的液态金属石墨烯复合导电浆料 |
CN114828401A (zh) * | 2022-04-08 | 2022-07-29 | 百为智能科技(广州)有限公司 | 一种基于大尺寸中空型玻璃基板的灯珠线路制备方法及显示装置 |
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