CN113594335B - Inorganic packaging ultraviolet LED lamp - Google Patents
Inorganic packaging ultraviolet LED lamp Download PDFInfo
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- CN113594335B CN113594335B CN202110843271.3A CN202110843271A CN113594335B CN 113594335 B CN113594335 B CN 113594335B CN 202110843271 A CN202110843271 A CN 202110843271A CN 113594335 B CN113594335 B CN 113594335B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 15
- 239000011147 inorganic material Substances 0.000 claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 15
- 230000005496 eutectics Effects 0.000 claims description 13
- 238000003980 solgel method Methods 0.000 claims description 9
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 11
- 238000007789 sealing Methods 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 abstract description 9
- 230000007774 longterm Effects 0.000 abstract description 4
- 239000011230 binding agent Substances 0.000 abstract 2
- 238000002347 injection Methods 0.000 description 23
- 239000007924 injection Substances 0.000 description 23
- 230000000712 assembly Effects 0.000 description 15
- 238000000429 assembly Methods 0.000 description 15
- 238000001035 drying Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910001020 Au alloy Inorganic materials 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000003353 gold alloy Substances 0.000 description 4
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 3
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- 238000003672 processing method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an inorganic packaging ultraviolet LED lamp, which comprises a substrate, wherein an LED chip assembly is arranged on the substrate, the exterior of the LED chip assembly is wrapped with an inorganic material for packaging, a groove structure is arranged between a lens body and a lens mounting groove, a filling cavity is formed between the lens body and the lens mounting groove, after an inorganic filler is filled into the filling cavity, the inorganic binder is filled into the groove, the formed inorganic binder improves the connection stability, and the lens body is prevented from easily falling off; meanwhile, the ultraviolet LED lamp made of inorganic materials prevents the performance attenuation of the organic adhesive caused by long-term deep ultraviolet radiation; when the inorganic filling material is not solidified and formed, the elastic rubber ring compresses the inorganic filling material, so that the inorganic filling material is more easily attached to the inner wall of the lens mounting groove and the outer wall of the lens body, and the whole sealing property is improved.
Description
Technical Field
The invention relates to an ultraviolet LED lamp, in particular to an inorganic packaging ultraviolet LED lamp.
Background
Organic silicon applied to the ultraviolet LED lamp bead can accelerate aging and attenuation when being irradiated by ultraviolet light, and the aging and attenuation speed of the LED can be effectively reduced by adopting inorganic packaging; the organic silicon adhesive is mostly used for bonding the lens and the substrate, and the organic material is accelerated to be oxidized by the short-wave high-energy ultraviolet excitation in the long-term service process, so that the performance is deteriorated, and finally the radiation intensity of the device is reduced;
the existing lens and the base are low in connection strength, low in sealing performance and low in material service life, so that a substitute material of an organic silicon adhesive is needed to be provided, the organic silicon adhesive does not contain any organic substance, the LED substrate and the lens can be bonded at the same time, the sealing performance is good, the air tightness inside an LED can be guaranteed, and the application field can be expanded to underwater, high-temperature and high-humidity environments.
Therefore, the existing ultraviolet LED lamp needs to be further improved.
Disclosure of Invention
The invention aims to provide an inorganic packaging ultraviolet LED lamp, which is bonded by inorganic materials, so that the service life is prolonged, the sealing property is improved, and the integral connection strength of the ultraviolet LED lamp is improved.
In order to achieve the purpose, the invention adopts the following scheme:
the utility model provides an inorganic encapsulation ultraviolet LED lamp, includes the base plate, be provided with the LED chip subassembly on the base plate, the outside parcel of LED chip subassembly has inorganic material to encapsulate, be provided with the lens mounting groove on the base plate, install the lens body in the lens mounting groove, the inside and outside surface of lens body tip is provided with a plurality of first inner groovings, lens mounting groove inner wall is provided with a plurality of second recesses, lens mounting groove edge is provided with the injecting glue chamfer, lens mounting groove one side is provided with the pressure plate subassembly, injecting glue chamfer inner wall is provided with the elastic rubber ring, form the packing cavity between lens mounting groove and the lens body after the installation, the base plate lower surface be provided with fill the heat radiation fin group of cavity intercommunication, it will to fill the cavity intussuseption to have inorganic filler lens body, base plate and heat radiation fin group connect.
Further, the inorganic material, the lens body and the inorganic filling material are made of an inorganic material by a sol-gel method;
the substrate is made of AIN ceramic materials.
Further, the LED chip assembly comprises a connecting structure arranged on the substrate, and the connecting structure is connected with an LED chip.
Furthermore, the connecting structure is a metal layer which is repeatedly etched on the upper surface and the lower surface of the substrate and is convenient for eutectic connection with the LED chip.
Further, the lens mounting groove comprises an annular groove penetrating from the upper surface of the substrate to the lower surface of the substrate, the annular groove separates the substrate into an outer plate layer and an inner plate layer, and a plurality of connecting rods are connected between the outer plate layer and the inner plate layer;
the lens body comprises a glass lens, and a plurality of grooves used for being matched and installed with the connecting rods are formed in the edge of the lower end of the glass lens.
Furthermore, the plurality of first inner grooves are uniformly distributed along the height direction, and the plurality of second grooves are uniformly distributed along the height direction; the number of the first inner grooves is the same as that of the second inner grooves; the first inner grooves and the second grooves are arranged in one-to-one transverse alignment mode.
Further, the inner wall of the lens mounting groove is in a conical shape, the lower end of the lens body is in a conical shape, and the conical degrees between the lower end of the lens body and the lens body are the same.
Further, the pressing plate assembly comprises a pressing plate mounting hole arranged on one side of the lens mounting groove, and a pressing plate body is mounted on the pressing plate mounting hole.
Furthermore, the radiating fin group comprises a fin ring seat, a plurality of radiating fin bodies are uniformly distributed on the surface of the fin ring seat around the circumference of the center of the fin ring seat, a bottom mounting groove for mounting the lower end of the lens body is formed in the fin ring seat, and a plurality of third grooves are formed in the inner wall of the bottom mounting groove.
Furthermore, the substrate is provided with a through hole for facilitating the electrical connection of the upper metal layer and the lower metal layer.
In summary, compared with the prior art, the invention has the beneficial effects that:
the invention solves the defects in the existing ultraviolet LED lamp bead, and the structural arrangement of the invention has the following advantages that a groove structure is arranged between the lens body and the lens mounting groove, a filling cavity is formed between the lens body and the lens mounting groove, after the inorganic filler is filled into the filling cavity, the inorganic adhesive is filled into the groove, the formed inorganic adhesive improves the connection stability, and the lens body is prevented from easily falling off; meanwhile, the ultraviolet LED lamp made of inorganic materials prevents the performance attenuation of the organic adhesive caused by long-term deep ultraviolet radiation; when inorganic filler material not solidified the shaping, compress tightly inorganic filler material through the elastic rubber ring, make inorganic filler material paste more easily in lens mounting groove inner wall and lens body outer wall, the purpose that sets up of elastic rubber ring keeps paste all the time in order to make the inorganic filler material after the cooling lens mounting groove inner wall with lens body outer wall improves holistic leakproofness, simple structure, convenient to use.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is one of the exploded views of the present invention;
FIG. 3 is a second exploded view of the present invention;
FIG. 4 is one of the schematic internal components of the present invention;
FIG. 5 is a second schematic diagram of the internal components of the present invention;
FIG. 6 is a perspective view of the automated processing apparatus of the present invention;
FIG. 7 is a schematic view of the internal structure of the automated processing apparatus of the present invention;
FIG. 8 is an enlarged view of a portion of the invention at A in FIG. 7;
FIG. 9 is a schematic view of the components of the automated processing apparatus of the present invention;
FIG. 10 is a schematic view of a UV LED lamp processing method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to FIGS. 1-10, the present invention provides
An inorganic packaging ultraviolet LED lamp comprises a substrate 1, wherein an LED chip assembly 2 is arranged on the substrate 1, inorganic materials 3 are wrapped outside the LED chip assembly 2 for packaging, a lens mounting groove 4 is formed in the substrate 1, a lens body 5 is mounted in the lens mounting groove 4, a plurality of first inner grooves 6 are formed in the inner side surface and the outer side surface of the end portion of the lens body 5, a plurality of second grooves 7 are formed in the inner wall of the lens mounting groove 4, an injection chamfer 8 is arranged at the edge of the lens mounting groove 4, a pressing plate assembly 9 is arranged on one side of the lens mounting groove 4, an elastic rubber ring 10 is arranged on the inner wall of the injection chamfer 8, a filling cavity 11 is formed between the lens mounting groove 4 and the mounted lens body 5, a heat dissipation fin group 12 communicated with the filling cavity 11 is arranged on the lower surface of the substrate 1, and the heat dissipation fin group 12 are connected through inorganic filling materials 13 in the filling cavity 11;
the structure principle is as follows:
the lens body 5 is installed in the lens installation groove 4, the lower part of the lens body is connected with the heat dissipation fin group 12, at the moment, the glue injection chamfer 8 is convenient to fill with inorganic bonding glue manufactured by a sol-gel method to form the inorganic filling material 13, the filling cavity 11 is filled with the inorganic filling material 13, the first inner grooves 6 and the second grooves 7 are filled with the inorganic filling material, after filling is completed, the pressing plate assembly 9 is installed, the pressing plate assembly 9 compresses and seals the inorganic filling material 13 to prevent bubbles from generating, the elastic rubber ring 10 with elasticity enables the inorganic filling material to be better attached to the inorganic filling material 13 under the pressure of the pressing plate assembly 9, the sealing performance is improved, meanwhile, the inorganic filling material 13 is enabled to be better attached to the surface of the lens body 5, the sealing performance is further improved, the molded inorganic filling material 13 connects the lens body 5, the substrate 1 and the heat dissipation fin group 12 into a whole, the heat conduction sol-gel method is utilized to improve the heat conduction effect of the heat dissipation fin group, and the heat conduction sol-gel method is utilized to reduce the heat conduction efficiency of the heat dissipation fin group, and reduce the heat conduction efficiency of the heat dissipation fin group.
As shown in fig. 1, the inorganic filler 13 is used to restrict the lens body 5 from separating from the lens mounting groove 4, thereby improving stability.
The inorganic material 3, the lens body 5 and the inorganic filling material 13 are made of an inorganic material by a sol-gel method;
the substrate 1 is made of an AIN ceramic material.
The LED chip assembly 2 comprises a connecting structure 201 arranged on the substrate 1, wherein an LED chip 202 is connected to the connecting structure 201.
The connecting structure 201 is a metal layer which is repeatedly etched on the upper surface and the lower surface of the substrate 1 and is convenient for eutectic connection with the LED chip 202.
The lens mounting groove 4 comprises an annular groove 401 which penetrates through the lower surface of the substrate 1 from the upper surface of the substrate 1, the substrate 1 is separated into an outer plate layer 402 and an inner plate layer 403 by the annular groove 401, and a plurality of connecting rods 404 are connected between the outer plate layer 402 and the inner plate layer 403;
the lens body 5 comprises a glass lens 501, and a plurality of grooves 502 used for being matched and installed with the connecting rods 404 are arranged at the lower end edge of the glass lens 501.
According to the invention, a plurality of first inner grooves 6 are uniformly distributed along the height direction, and a plurality of second grooves 7 are uniformly distributed along the height direction; the number of the first inner grooves 6 and the second grooves 7 is the same; the first inner grooves 6 and the second grooves 7 are arranged in one-to-one lateral alignment.
The inner wall of the lens mounting groove 4 is arranged in a conical shape, the lower end of the lens body 5 is arranged in a conical shape, and the conical degrees of the lens body and the lens body are the same.
The pressure plate assembly 9 comprises a pressure plate mounting hole 901 arranged at one side of the lens mounting groove 4, and a pressure plate body 902 is arranged on the pressure plate mounting hole 901.
The heat dissipating fin group 12 of the present invention includes a fin ring seat 121, a plurality of heat dissipating fin bodies 122 are uniformly distributed on the surface of the fin ring seat 121 around the center circumference of the fin ring seat 121, a bottom mounting groove 123 for mounting the lower end of the lens body 5 is formed on the fin ring seat 121, and a plurality of third grooves 124 are formed on the inner wall of the bottom mounting groove 123.
The substrate 1 of the present invention is provided with a through hole 100 for facilitating electrical connection between the upper and lower metal layers.
An automatic device applied to processing of ultraviolet LED lamps comprises a conveying track 1001, a plurality of lifting devices 1002 are arranged on the conveying track 1001, a lamp group mounting seat 1003 is arranged on each lifting device 1002, a drying device 1004 is arranged on one side of the conveying track 1001, a support 1005 is connected to one side of each drying device 1004, an upper top plate 1006 is arranged on each support 1005, a lifting mechanism 1007 is arranged on each upper top plate 1006, lower bottom plates 1015 are arranged below the upper top plates 1006 at intervals, a connecting rod is connected between each upper top plate 1006 and the corresponding lower bottom plate 1015, a plurality of gel output assemblies 1008 and arc-shaped sliding assemblies 1009 are uniformly distributed on the lower surface of the lower bottom plate 1015 around the center circumference of the lower bottom plate 1015, an arc-shaped nozzle group 1010 is arranged on each arc-shaped sliding assembly 1009, a conveying structure 1011 for conveying gel is arranged between each arc-shaped nozzle group 1010 and the gel output assembly 1008, a pressing ring assembly 1012 capable of moving up and down is arranged on the lower bottom plate 1015, an alternate control 1013 for controlling a plurality of the arc-shaped sliding assemblies 1009 and the pressing ring assembly 1009, the arc-shaped sliding assembly 1013 is connected between each arc-shaped sliding assembly 1009, and a plurality of arc-shaped sliding assembly 1009, and a movable connecting rod assembly 1009 is arranged between the arc-shaped sliding assembly 1013 for alternately controlling a feeding stroke increasing linkage assembly 1014, and a movable stroke increasing linkage assembly 1009, and a movable stroke assembly 1009, and a rotating stroke increasing linkage assembly 1009 is alternately arranged between the arc-increasing linkage assembly 1014;
the processing principle of the automatic processing equipment is as follows: the lamp group mounting seats 1003 are used for placing ultraviolet LED lamp assemblies, at the moment, the conveying rails 1001 drive the lamp group mounting seats 1003 to move, when the lamp group mounting seats move to the position below a lower base plate 1015, the lifting mechanisms 1007 are controlled to move upwards, the arc sliding assemblies 1009 are driven to move inwards by controlling the connecting rod assemblies 1013 in turn in the upwards moving process, the arc sliding assemblies 1009 drive the corresponding arc nozzle groups 1010 to move towards the position of a filling cavity 11 to be processed, the arc nozzle groups 1010 form an annular filling ring and are mounted above the filling cavity 11, the arc nozzle groups 1010 align to the positions of the glue injection chamfers 8 to perform glue injection work, inorganic gel filling is performed on the filling cavity 11, the arc nozzle groups 1010 are conveyed through the gel output assemblies 1008, after the filling and glue injection are completed, the lifting mechanisms 1007 descend to drive the arc sliding assemblies to reset and contract, and the gel output assemblies 1008 are controlled to stop outputting;
at this time, the pressing plate body 902 is installed at the position of the glue injection chamfer 8;
in the process that the lifting mechanism 1007 continues to descend, the plurality of arc-shaped sliding assemblies 1009 are reset and contracted, the compression ring assembly 1012 realizes a downward pressing action, the compression action is carried out on the compression plate body 902, so that the inorganic gel prepared by the sol-gel sol method in the compression ring assembly is better attached to the inner wall of the lens mounting groove 4 and the outer wall of the lens body 5, the sealing performance is improved, meanwhile, the compressed elastic rubber ring 10 is outwards pressed, and the inorganic gel prepared by the sol-gel sol method is further attached to the inner wall of the lens mounting groove 4 and the outer wall of the lens body 5;
the connecting rod assemblies 1013 are controlled in turn to adopt a relatively stable structural arrangement, so that the pressing ring assemblies 1012 and the plurality of arc-shaped sliding assemblies 1009 realize alternate glue injection and pressing actions;
the movable stroke distance-increasing assembly 1014 is used for ensuring that the arc-shaped sliding assembly 1009 has enough stroke to move to the upper surface of the lens mounting groove 4 and compress the pressure plate body 902;
after the steps are finished, the conveying rail 1001 drives the ultraviolet LED lamp with the glue injection finished to move into the drying device 1004 to achieve drying work, the size of the inorganic filling material 13 is reduced after the inorganic filling material 13 is cooled, the elastic rubber ring 10 plays a role of automatic ejection in order to guarantee that the inorganic filling material 13 is always attached to the inner wall of the lens mounting groove 4 and the outer wall of the lens body 5, and the inorganic filling material 13 after shrinkage is guaranteed to be always attached to the inner wall of the lens mounting groove 4 and the outer wall of the lens body 5, so that the sealing performance is improved.
The conveying rail 1001 continuously sends out the dried ultraviolet LED lamp, and the ultraviolet LED lamp is ejected out from the lamp group mounting base 1003 through the ejection mechanism 1000.
The lamp group mounting seat 1003 is internally provided with an ejection mechanism 1000 for automatically ejecting out the molded LED lamp.
The drying device 1004 of the present invention includes a drying box 1041 wrapped on one side of the conveying track 1001, a heating wire 1042 is disposed in the drying box 1041, a heating device 1043 is disposed on an outer wall of the drying box 1041, and an output end of the heating device 1043 is in heat conduction connection with the heating wire 1042.
The gel output assembly 1008 comprises a fixing plate 1081 arranged on the lower base plate 1015, an output pipe 1082 is arranged on the fixing plate 1081, a heating module 1084 is sleeved outside the output pipe 1082, and one end of the output pipe 1082 is connected with a gel storage tank 1083.
The arc-shaped sliding assembly 1009 comprises an arc-shaped rail 1091 arranged on the fixing plate 1081, and an arc-shaped sliding piece 1092 is movably arranged in the arc-shaped rail 1091;
the arc length of the arcuate track 1091 of the invention is greater than 90.
The conveying structure 1011 of the present invention includes an inner conveying pipe disposed in the arc-shaped sliding member 1092, one end of the inner conveying pipe is communicated with the arc-shaped nozzle group 1010, and an outer conveying pipe is disposed between the other end of the inner conveying pipe and the output pipe 1082.
The arc-shaped nozzle group 1010 comprises an arc-shaped bracket 1100, wherein a plurality of nozzles 1200 are uniformly distributed on the arc-shaped bracket 1100 along the arc-shaped path of the arc-shaped bracket 1100, and the nozzles 1200 are communicated with an inner conveying pipe;
a plurality of the arcuate nozzle blocks 1010 of the present invention form a complete annulus.
The pressing ring assembly 1012 comprises a plurality of guide holes 1121 formed in the lower base plate 1015, guide rods 1122 are movably arranged in the guide holes 1121, and an annular pressing plate 1123 is arranged at the lower end of each guide rod 1122.
The movable stroke distance-increasing assembly 1014 comprises a transverse track 1141 arranged on the surface of the lower base plate 1015 above the arc-shaped sliding part 1092, the path extension line of the transverse track 1141 passes through the center of the lower base plate 1015, a distance-increasing slide block 1142 is movably arranged on the transverse track 1141, a first hinged seat 1143 is arranged on the upper surface of the distance-increasing slide block 1142, a second hinged seat 1144 is arranged on the lower surface of the distance-increasing slide block 1144, a third hinged seat 1145 is arranged on the surface of the arc-shaped sliding part 1092 corresponding to the lower part of the distance-increasing slide block 1143, a first distance-increasing connecting rod 1146 is hinged on the first hinged seat 1143, and a second distance-increasing connecting rod 1147 is hinged between the second hinged seat 1144 and the third hinged seat 1145.
The rotation control link assembly 1013 of the present invention comprises a plurality of first hinged ends 1131 uniformly distributed on the surface of the lifting mechanism 1007 around the center circumference of the output end of the lifting mechanism 1007, wherein the first hinged ends 1131 are hinged with first driving links 1132, the number of the first hinged ends 1131 is the same as the number of the gel output assemblies 1008, and the first hinged ends are vertically aligned one by one, a second hinged end 1133 is fixedly arranged on the surface of the upper plate 1006 on one side of the first driving links 1132, the second hinged end 1133 is outwardly offset relative to the first hinged end 1131 on the corresponding side, a second driving link 1134 is hinged on the second hinged end 1133, the outer end of the first driving link 1132 is hinged with the middle part of the second driving link 1134, the lower end of the second driving link 1134 is hinged with the outer end of the first distance increasing link 1146, a third driving link 1135 is hinged on the middle part of the first driving link 1132, a plurality of the upper ends of the guiding rods 1122 are provided with connecting ring 1136 for connection, and the lower end of the third driving link 1135 is hinged with the upper surface of the connecting ring 1136.
A processing method of an inorganic packaging ultraviolet LED lamp comprises the steps of firstly, arranging a conveying rail 1001, and placing an LED chip assembly 2 on the conveying rail 1001;
secondly, sleeving a lens body 5 outside the LED chip assembly 2, connecting a radiating fin group 12 below the LED chip assembly 2, forming a filling cavity between the lens body 5 and the LED chip assembly 2, sleeving an elastic rubber ring 10 on the outer wall of the lens body 5, sending the LED chip assembly 2 and the lens body 5 to a pressing step and an adhesive injection step, and controlling the pressing step and the adhesive injection step by a single chip microcomputer to perform timed intermittent feeding work;
step three, injecting glue, namely injecting glue into the filling cavity by using glue injection equipment, wherein the glue injection material is an inorganic glue injection material, and the inorganic glue injection material is used as a heat-conducting medium among the heat-radiating fin group 12, the lens body 5 and the LED chip assembly 2 for heat radiation;
step four, a pressing step, namely sleeving a pressing plate assembly 9 outside the lens body 5 subjected to glue injection for pressing the glue injection inlet, wherein the elastic rubber ring 10 contracts under pressure;
step five, starting the conveying track 1001, and conveying the LED chip assembly 2 and the lens body 5 which are subjected to the tightening step and the glue injection step into a drying device 1004 for drying;
and sixthly, drying the inorganic glue injection material, cooling, shrinking the cooled inorganic glue injection material, and popping up the elastic rubber ring 10 at the moment to enable the inorganic glue injection material to be always attached to the surface of the LED chip component 2 and the surface of the lens body 5.
Step seven, arranging an ejection mechanism 1000 for ejecting the processed LED lamp out, wherein the ejection mechanism 1000 ejects the LED lamp out of the conveying track 1001.
The conveying rail 1001 is also provided with a plurality of lamp group mounting seats 1003 which are convenient for mounting the LED chip components 2, and the conveying rail 1001 is connected with a single chip microcomputer to control intermittent conveying of the single chip microcomputer.
According to the invention, the surface of the LED chip component 2 is provided with a lens mounting groove 4 which is convenient for the lens body 5 to be embedded in, the inner wall of the lens mounting groove 4 and the lens body 5 are provided with anti-skidding grooves, and the formed inorganic glue injection material is in a plurality of T-shaped clamping structures and is clamped between the lens mounting groove 4 and the lens mounting groove 4 to prevent falling.
The inorganic glue injection material provided by the invention is an inorganic material prepared by a Sol-Gel Sol-Gel method, and the sealing property and the attenuation speed are improved.
The lens body 5 is manufactured by adopting a micro-imprinting technology, the lens body 5 is a sol-gel glass lens, a sol-gel material is adopted to form a lens shape by adopting the micro-imprinting technology, and then the sol-gel glass lens can be solidified into the sol-gel glass lens by simple one-time ultraviolet exposure.
The lens body 5 of the invention has a deep ultraviolet radiation transmittance of more than 90%.
According to the invention, metal layers are etched on the upper surface and the lower surface of the substrate 1 of the LED chip assembly 2, the LED chip 202 is eutectic to the surfaces of the metal layers, and meanwhile, a plurality of through holes are processed on the substrate 1, so that the upper metal layer and the lower metal layer are electrically connected through a plurality of through hole connecting conductive wires.
The substrate 1 is made of AIN ceramic material.
The eutectic material adopts a tin-gold alloy material.
The eutectic crystal adopts a flip chip bonding packaging technology.
Development of inorganic substitute material for organic silicon adhesive
The organic silicon adhesive substitute material researched by the project does not contain any organic substance, can be used for adhering the LED substrate and the lens, has perfect sealing property, can ensure the air tightness inside the LED, and can be applied to underwater, high-temperature and high-humidity environments. There are many inorganic materials that can substitute for silicone adhesives, but there are not many that can be applied in the field of LED packaging, and there are 3 aspects to consider the replacement work of materials: sealing property, adhesive property and light transmission property of the replacement material. The inorganic alternative material of the current key test of the project is sol-gel material.
The electrode of the AIN ceramic substrate wiring layer is matched with the chip contact electrode, the wiring layer is optimized in manufacturing process, the size of the wiring layer is optimized, and excellent metal is selected, so that the chip and the ceramic substrate are well welded. The wiring of the ceramic substrate is manufactured, wherein metal layers are evaporated and sputtered on the substrate, photoresist is coated on the metal layers, and then the metal electrode wiring layer is etched through the procedures of exposure, development, corrosion and the like. The metal salient points with lower hardness and uniformity are obtained by optimizing the salient point manufacturing and annealing process, so that the bonding yield is improved. Since the ceramic substrate is an insulator, in order to electrically connect the metal layers on the upper and lower surfaces of the ceramic substrate, a through hole needs to be formed between the ceramic insulator bodies between the two metal layers.
The ultraviolet LED chip is eutectic flip-chip welded in the ultraviolet LED device through metal with good electric conduction and heat conduction performance, so that the use of the traditional solid crystal organic glue is avoided; and when the electrical connection of the ultraviolet LED chip is ensured, heat can be conducted to the ceramic base, so that the heat conducting property of the device is improved, and the stability and the service life of the device are improved.
In the project, tin-gold alloy is used as an eutectic material, the eutectic point is as high as 282 ℃, the eutectic point is a relatively stable metal compound, and secondary reflow soldering can be ensured. The tin-gold alloy is good in heat conductivity and electric conductivity, the heat conductivity coefficient is about 57.3W/mK, metal connection is achieved through an eutectic welding process, and the heat conductivity of the tin-gold alloy is far superior to that of heat-conducting silver paste.
Aiming at the high-current working characteristics of the deep ultraviolet LED, the heat dissipation mechanism of the high-power ultraviolet LED is researched. By adopting the eutectic flip-chip bonding packaging technology, the contact layer from the chip to the external environment can be reduced as much as possible, so that the thermal resistance is reduced, and the problem of material mismatching is reduced. And by matching with an external refrigerator, the deep ultraviolet LED chip can keep continuous high-brightness luminescence for a long time at a lower temperature, and the reliability and stability of the LED light source are ensured. The material and design of the substrate and the arrangement density of the chips also influence the heat dissipation of the LED, and even in the inorganic packaging process, the substrate adopting which base material can better optimize the heat dissipation of the high-density deep ultraviolet LED needs to be selected through a series of experiments.
The final light-emitting lens of the LED module is also manufactured by a sol-gel process and a micro-imprinting technology, a sol-gel glass lens is made of a sol-gel material and is formed into a lens shape by the micro-imprinting technology, then the sol-gel glass lens can be solidified into the sol-gel glass lens through simple one-time ultraviolet exposure, and the transmittance of the sol-gel glass to deep ultraviolet radiation exceeds 90%.
The sol-gel bonding material with high air tightness applied to the deep ultraviolet LED packaging is developed to replace organic bonding glue, so that the performance attenuation of the organic bonding glue caused by long-term exposure to deep ultraviolet radiation is avoided; the metal-hard glass lens structure of the deep ultraviolet LED is usually manufactured by adopting a high-temperature welding process, and the sol-gel process and the micro-imprinting technology are adopted in the project, so that a sol-gel glass optical lens with high deep ultraviolet transmittance can be manufactured for the deep ultraviolet LED light source module at normal temperature and normal pressure; through the metal that electrically conductive heat conductivility is good, with deep ultraviolet LED chip eutectic flip-chip welding in ceramic substrate, avoided traditional organic solid crystal to glue the use, and when guaranteeing deep ultraviolet LED chip electrical connection, can conduct the heat to ceramic substrate, increased the heat conductivility of device to improve the stability and the life-span of device.
While there have been shown and described what are at present considered to be the fundamental and essential features of the invention and advantages thereof, it will be understood by those skilled in the art that the invention is not limited by the details of the foregoing embodiments, which are provided as an illustration of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as hereinafter claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides an inorganic encapsulation ultraviolet LED lamp, includes base plate (1), be provided with LED chip module (2), its characterized in that on base plate (1): LED chip subassembly (2) outside parcel has inorganic material (3) to encapsulate, be provided with lens mounting groove (4) on base plate (1), install lens body (5) in lens mounting groove (4), lens body (5) tip inside and outside surface is provided with a plurality of first inner groovy (6), lens mounting groove (4) inner wall is provided with a plurality of second recess (7), lens mounting groove (4) edge is provided with injecting glue chamfer (8), lens mounting groove (4) one side is provided with clamp plate subassembly (9), injecting glue chamfer (8) inner wall is provided with elastic rubber ring (10), form between lens body (5) after lens mounting groove (4) and the installation and fill cavity (11), base plate (1) lower surface be provided with fill the fin group (12) of cavity (11) intercommunication, it will to fill in cavity (11) intussuseption and be filled with inorganic filler material (13) lens body (5), base plate (1) and heat fin group (12) connect.
2. The inorganic packaging ultraviolet LED lamp of claim 1, wherein: the inorganic material (3), the lens body (5) and the inorganic filling material (13) are made of an inorganic material by a sol-gel method;
the substrate (1) is made of AIN ceramic materials.
3. The inorganic encapsulated ultraviolet LED lamp of claim 2, wherein: the LED chip assembly (2) comprises a connecting structure (201) arranged on the substrate (1), and an LED chip (202) is connected to the connecting structure (201).
4. The inorganic encapsulated ultraviolet LED lamp of claim 3, wherein: the connecting structure (201) is a metal layer which is repeatedly etched on the upper surface and the lower surface of the substrate (1) and is convenient for eutectic connection with the LED chip (202).
5. The inorganic encapsulated ultraviolet LED lamp of claim 4, wherein: the lens mounting groove (4) comprises an annular groove (401) which penetrates through the lower surface of the substrate (1) from the upper surface of the substrate (1), the substrate (1) is separated into an outer plate layer (402) and an inner plate layer (403) by the annular groove (401), and a plurality of connecting rods (404) are connected between the outer plate layer (402) and the inner plate layer (403);
the lens body (5) comprises a glass lens (501), and a plurality of grooves (502) used for being matched and mounted with the connecting rods (404) are formed in the edge of the lower end of the glass lens (501).
6. The inorganic packaging ultraviolet LED lamp of claim 5, wherein: the first inner grooves (6) are uniformly distributed along the height direction, and the second grooves (7) are uniformly distributed along the height direction; the number of the first inner grooves (6) and the second grooves (7) is the same; the first grooves (6) and the second grooves (7) are arranged in one-to-one transverse alignment.
7. The inorganic encapsulated ultraviolet LED lamp of claim 6, wherein: the inner wall of the lens mounting groove (4) is in a conical shape, the lower end of the lens body (5) is in a conical shape, and the conical degrees between the lens body and the lens body are the same.
8. The inorganic encapsulated ultraviolet LED lamp of claim 7, wherein: the pressing plate assembly (9) comprises a pressing plate mounting hole (901) formed in one side of the lens mounting groove (4), and a pressing plate body (902) is mounted on the pressing plate mounting hole (901).
9. The inorganic encapsulated ultraviolet LED lamp of any one of claims 1-8, wherein: the radiating fin group (12) comprises a fin ring seat (121), a plurality of radiating fin bodies (122) are uniformly distributed on the surface of the fin ring seat (121) around the circumference of the center of the fin ring seat (121), a bottom mounting groove (123) for mounting the lower end of the lens body (5) is formed in the fin ring seat (121), and a plurality of third grooves (124) are formed in the inner wall of the bottom mounting groove (123).
10. The inorganic packaging ultraviolet LED lamp of claim 4, wherein: the substrate (1) is provided with a through hole (100) which is convenient for the electrical connection of the upper metal layer and the lower metal layer.
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|---|---|---|---|---|
| CN205376574U (en) * | 2016-01-19 | 2016-07-06 | 闵卫 | Novel LED encapsulation |
| CN109888079A (en) * | 2019-01-22 | 2019-06-14 | 圆融光电科技股份有限公司 | A kind of deep-UV light-emitting diode encapsulation |
| CN210296410U (en) * | 2019-08-21 | 2020-04-10 | 福建省信达光电科技有限公司 | Ultraviolet LED luminescent device packaging structure |
| CN111969090A (en) * | 2020-08-27 | 2020-11-20 | 宁波昇特微电子科技有限公司 | Deep ultraviolet chip epitaxial chip packaging structure device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970539A (en) * | 2018-09-28 | 2020-04-07 | 光宝光电(常州)有限公司 | Light emitting unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205376574U (en) * | 2016-01-19 | 2016-07-06 | 闵卫 | Novel LED encapsulation |
| CN109888079A (en) * | 2019-01-22 | 2019-06-14 | 圆融光电科技股份有限公司 | A kind of deep-UV light-emitting diode encapsulation |
| CN210296410U (en) * | 2019-08-21 | 2020-04-10 | 福建省信达光电科技有限公司 | Ultraviolet LED luminescent device packaging structure |
| CN111969090A (en) * | 2020-08-27 | 2020-11-20 | 宁波昇特微电子科技有限公司 | Deep ultraviolet chip epitaxial chip packaging structure device |
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