CN113594050A - Method for repairing circuit substrate and transparent display screen - Google Patents
Method for repairing circuit substrate and transparent display screen Download PDFInfo
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- CN113594050A CN113594050A CN202110856370.5A CN202110856370A CN113594050A CN 113594050 A CN113594050 A CN 113594050A CN 202110856370 A CN202110856370 A CN 202110856370A CN 113594050 A CN113594050 A CN 113594050A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/485—Adaptation of interconnections, e.g. engineering charges, repair techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
Abstract
The invention provides a method for repairing a circuit substrate, wherein the circuit substrate comprises a transparent substrate and transparent conducting circuits arranged on one side or two sides of the transparent substrate, the line width of each transparent conducting circuit is a preset value, and the method comprises the following steps: providing a transparent repairing circuit and conductive adhesive; distributing conductive adhesive on the position to be repaired of the transparent conductive circuit; arranging a transparent repairing circuit on the conductive adhesive; and heating and pressing the transparent repairing circuit and the transparent substrate so that the conductive adhesive is electrically connected with the transparent repairing circuit and the transparent conductive circuit. In addition, the invention also provides a transparent display screen. The technical scheme of the invention is used for repairing the conducting circuit with smaller line width.
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a method for repairing a circuit substrate and a transparent display screen.
Background
The LED display screen has evolved into various products, such as transparent LED display screens, in the course of development. The transparent LED display screen is formed by arranging LED lamp beads on the transparent substrate. At present, in order to increase the transparency of an LED display screen, the line width of a power supply line of an LED lamp bead in the transparent LED display screen is generally designed to be smaller. However, if the short circuit occurs in the wire of the power supply line, it is difficult to repair the power supply line because the line width is small.
Disclosure of Invention
The invention provides a method for repairing a circuit substrate and a transparent display screen, which are used for repairing a conductive circuit with a smaller line width.
In a first aspect, an embodiment of the present invention provides a method for repairing a circuit substrate, where the circuit substrate includes a transparent substrate and transparent conductive traces disposed on one side or both sides of the transparent substrate, a line width of the transparent conductive trace is a preset value, and the method includes:
providing a transparent repairing circuit and conductive adhesive;
laying the conductive adhesive on the position to be repaired of the transparent conductive circuit;
arranging the transparent repairing circuit on the conductive adhesive; and
and heating and pressing the transparent repairing circuit and the transparent substrate so that the conductive adhesive is electrically connected with the transparent repairing circuit and the transparent conductive circuit.
Optionally, the transparent conductive circuit includes a plurality of conductive wires, the plurality of conductive wires are regularly or irregularly arranged to form a grid, at least one conductive wire is short-circuited to form the to-be-repaired portion, the transparent repair circuit includes at least one repair wire, and the repair wire is adapted to the conductive wire at the to-be-repaired portion.
Optionally, a plurality of the conductive wires are short-circuited to form the position to be repaired, the transparent repair line includes a plurality of the repair wires, and the plurality of the repair wires form a mesh shape identical to the conductive wires.
Optionally, the line width of the repair wire is the same as the line width of the transparent conductive line.
Optionally, the conductive adhesive includes an insulating adhesive material and a plurality of conductive particles, and the conductive particles can electrically connect the transparent repairing line and the transparent conductive line.
Optionally, after heating and pressing the transparent repair circuit and the transparent substrate, the repair method further includes:
and cooling the conductive adhesive to solidify the insulating adhesive material and fix the transparent repairing circuit on the transparent conductive circuit.
Optionally, the conductive adhesive is an anisotropic conductive adhesive film or an anisotropic conductive adhesive.
Optionally, the preset value is 1-2000 microns.
In a second aspect, an embodiment of the present invention provides a transparent display screen, where the transparent display screen includes:
the circuit substrate is formed by repairing the circuit substrate by the repairing method; and
and the light-emitting component is arranged on the circuit substrate, is electrically connected with the transparent conducting circuit and is used for providing a light source required by the display of the transparent display screen.
Optionally, the light-emitting assembly includes a plurality of lamp beads and at least one driving device, and the driving device is used for driving the lamp beads to emit light.
According to the method for repairing the circuit substrate and the transparent display screen, the transparent conductive circuit with the position to be repaired is repaired by the transparent repairing circuit and the conductive adhesive, wherein the repairing lead in the transparent repairing circuit is matched with the conductive lead at the position to be repaired. When the part to be repaired is formed by short circuit of a plurality of conductive leads, the plurality of repaired leads form a grid shape which is the same as the conductive leads. Therefore, the repairing of the position to be repaired is carried out through the transparent repairing circuit, and the whole repairing lead is matched with the conductive lead of the position to be repaired, so that the repairing lead can be well fused together, and the repaired circuit substrate has no obvious foreign body feeling.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a flowchart of a repairing method according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a repairing method according to an embodiment of the present invention.
Fig. 3 is a partially enlarged view of a portion a shown in fig. 2.
Fig. 4 is an exploded view of a circuit substrate according to an embodiment of the invention.
Fig. 5 is another exploded view of the circuit substrate according to the embodiment of the invention.
Fig. 6 is a schematic view of a circuit substrate according to an embodiment of the invention.
Fig. 7-10 are schematic diagrams of transparent conductive traces of the trace substrate shown in fig. 3.
Fig. 11 is a schematic view of a transparent display screen according to an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings (if any) are used for distinguishing between similar items and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances, in other words that the embodiments described are to be practiced in sequences other than those illustrated or described herein. Moreover, the terms "comprises," "comprising," and any other variation thereof, may also include other things, such as processes, methods, systems, articles, or apparatus that comprise a list of steps or elements is not necessarily limited to only those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.
It should be noted that the description relating to "first", "second", etc. in the present invention is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 4 in combination, fig. 1 is a flowchart of a repairing method according to an embodiment of the present invention, fig. 2 is a schematic diagram of the repairing method according to the embodiment of the present invention, and fig. 4 is an exploded schematic diagram of a circuit substrate according to the embodiment of the present invention. The method for repairing the circuit substrate is used for repairing a circuit which is arranged on the substrate and has a small line width. The wiring substrate 10 includes a transparent substrate 11, and transparent conductive wirings 12. In the present embodiment, the transparent substrate 11 is made of a transparent material. The transparent material includes, but is not limited to, polyethylene terephthalate (PET), etc.
The transparent conductive traces 12 are disposed on one side or both sides of the transparent substrate 11. In the present embodiment, the transparent conductive traces 12 are disposed on one side of the transparent substrate 11. The transparent conductive circuit 12 includes a plurality of conductive wires 120, and the plurality of conductive wires 120 are regularly or irregularly arranged to form a grid. The conductive wires 120 are regularly arranged to form a polygonal grid shape. Wherein polygons include, but are not limited to, squares, rhombuses, etc., and pentagons, hexagons, etc. For example, as shown in fig. 7-10, fig. 7 shows a square grid-shaped transparent conductive line 12, fig. 8 shows a diamond grid-shaped transparent conductive line 12, fig. 9 shows a hexagonal grid-shaped transparent conductive line 12, and fig. 10 shows an irregular grid-shaped transparent conductive line 12. In some possible embodiments, the grid-like shape formed by the conductive wires 120 is not limited thereto. In the present embodiment, the conductive wire 120 is made of a metal material. The metal material includes, but is not limited to, copper, silver, aluminum, nickel, iron, and the like. Preferably, the conductive wire 120 is made of copper.
In some possible embodiments, the transparent conductive traces 12 are disposed on both sides of the transparent substrate 11 (as shown in fig. 5). The conductive wires 120 of the transparent conductive traces 12 disposed on both sides of the transparent substrate 11 may be arranged in the same or different grid shapes. For example, the conductive wires of the transparent conductive traces 12 disposed on both sides of the transparent substrate 11 are regularly arranged to form a square grid, or the conductive wires of the transparent conductive traces 12 disposed on one side of the transparent substrate 11 are regularly arranged to form a diamond grid, and the conductive wires of the transparent conductive traces 12 disposed on the other side of the transparent substrate 11 are irregularly arranged to form an irregular grid. Further, when the grid shapes formed by the conductive wire layout of the transparent conductive traces 12 disposed on both sides of the transparent substrate 11 are the same, the transparent conductive traces 12 disposed on both sides of the transparent substrate 11 may be completely overlapped on the transparent substrate 11 or may be disposed on the transparent substrate 11 in a staggered manner. The transparent substrate 11 is provided with a plurality of through holes 111, the through holes 111 are provided with electric conductors 112, and the transparent conductive traces 12 disposed on both sides of the transparent substrate 11 are electrically connected through the electric conductors 112. In other possible embodiments, the transparent conductive traces 12 disposed on both sides of the transparent substrate 11 may also be electrically connected by means of a bridge.
The transparent conductive traces 12 can be fixed to the transparent substrate 11 by pressing, so as to form the composite trace substrate 10. Preferably, when the conductive wire 120 is made of copper, the transparent conductive line 12 and the transparent substrate 11 form a composite copper substrate.
The line width of the transparent conductive circuit 12 is a predetermined value. Wherein the preset value is 1-2000 microns. It is understood that the line width of the conductive line 120 of the transparent conductive line 12 disposed on one side or both sides of the transparent substrate 11 may be any value between 1-2000 μm. When the transparent conductive traces 12 are disposed on two sides of the transparent substrate 11, the line widths of the conductive wires 120 of the transparent conductive traces 12 on the two sides may be the same or different, and are not limited herein.
The line width of the transparent conductive circuit 12 is 1-2000 μm, and when a problem occurs in the transparent conductive circuit 12, such as a short circuit occurs in the conductive wire 120, the repairing method provided by the present embodiment can be used for repairing. The repairing method specifically comprises the following steps.
Step S102, providing a transparent repairing circuit and conductive adhesive. In the present embodiment, the transparent repair line 14 includes at least one repair conductive line 140. The repair wire 140 is made of a metal material. The metal material includes, but is not limited to, copper, silver, aluminum, nickel, iron, and the like. Preferably, the repair wire 140 is made of the same metal material as the conductive wire 120. The line width of the repair wire 140 is the same as the line width of the transparent conductive line 12. That is, the line width of the repair wire 140 is the same as the line width of the conductive wire 120. The conductive paste 15 includes an insulating paste 151 and a plurality of conductive particles 152 (as shown in fig. 3), wherein the plurality of conductive particles 152 are wrapped in the insulating paste 151. Wherein the diameter of the conductive particles 152 is 3-5 microns. Preferably, the Conductive Paste 15 is Anisotropic Conductive Film (ACF) or Anisotropic Conductive Paste (ACP).
And step S104, laying conductive adhesive on the position to be repaired of the transparent conductive circuit. Wherein at least one conductive wire 120 is short-circuited to form a portion to be repaired 13. In the present embodiment, the conductive paste 15 may be in the form of a film, such as ACF, or a paste, such as ACP. When the conductive adhesive 15 is in a film shape, the conductive adhesive 15 is cut to match the size of the to-be-repaired position 13, and when the conductive adhesive 15 is arranged at the to-be-repaired position 13, the conductive adhesive 15 just covers the to-be-repaired position 13. When the conductive adhesive 15 is in a paste shape, the conductive adhesive 15 is coated on the to-be-repaired portion 13, so that the conductive adhesive 15 just covers the to-be-repaired portion 13. It is understood that when the repair-waiting part 13 is formed by short-circuiting one conductive wire 120, the conductive adhesive 15 is just covered on the position where the conductive wire 120 is short-circuited. In some possible embodiments, the site to be repaired 13 may also be formed by a short circuit of a portion of the conductive wire 120. For example, a short circuit between adjacent conductive wires 120 forms a larger area to be repaired 13 (as shown in fig. 6). Accordingly, when the conductive adhesive 15 is disposed at the position 13 to be repaired, the conductive adhesive 15 just covers the position where the conductive wire 120 is short-circuited.
In other possible embodiments, the repair site 13 may also be formed by a break or defect of the conductive wire 120, which is not limited herein.
And step S106, arranging the transparent repairing circuit on the conductive adhesive. After the conductive adhesive 15 is disposed or coated on the portion to be repaired 13, the transparent repair line 14 is disposed on a side of the conductive adhesive 15 away from the circuit substrate 10. Wherein, the repairing wire 140 is matched with the conductive wire 120 of the position to be repaired 13. For example, if the location to be repaired 13 is formed by short-circuiting one conductive wire 120, the transparent repair line 14 includes one repair wire 140, and the length of the repair wire 140 is matched with the length of the short-circuited portion of the conductive wire 120. It is understood that the length of the repair wire 140 may be equal to the length of the short-circuited portion of the conductive wire 120, or may be longer than the length of the short-circuited portion of the conductive wire 120, so that the repair wire 140 can better replace the conductive wire 120 at the location to be repaired 13.
If the conductive wires 120 are short-circuited to form the portion to be repaired 13, the transparent repair line 14 correspondingly includes a plurality of repair wires 140. The plurality of repair wires 140 are formed in the same mesh shape as the conductive wires 120. It is understood that, in order to make the repair wire 140 have good conformity with the conductive wire 120, the plurality of repair wires 140 are formed in the same mesh shape as the conductive wire 120 of the site to be repaired 13.
And S108, heating and pressing the transparent repairing circuit and the transparent substrate so that the conductive adhesive is electrically connected with the transparent repairing circuit and the transparent conductive circuit. In the present embodiment, the conductive particles 152 can electrically connect the transparent repair line 14 and the transparent conductive line 12. When heated, the insulating adhesive material 151 in the conductive adhesive 15 melts. While the transparent repair line 14 and the transparent substrate 11 are bonded, the conductive paste 15 interposed between the transparent repair line 14 and the transparent substrate 11 is pressed, and the conductive particles 152 in the conductive paste 15 are flattened, thereby forming an electrical connection between the transparent repair line 14 and the transparent conductive line 12.
Step S110, cooling the conductive adhesive to solidify the insulating adhesive material and fix the transparent repair circuit to the transparent conductive circuit. In this embodiment, the insulating glue 151 is cured after cooling, and the transparent repair line 14 can be fixed to the transparent conductive line 12 while being cured. Preferably, the insulating rubber material 151 is transparent.
In the above embodiment, the transparent conductive circuit having the position to be repaired is repaired by using the transparent repairing circuit and the conductive adhesive, wherein the repairing wire in the transparent repairing circuit is matched with the conductive wire at the position to be repaired. When the part to be repaired is formed by short circuit of a plurality of conductive leads, the plurality of repaired leads form a grid shape which is the same as the conductive leads. Therefore, the repairing of the position to be repaired is carried out through the transparent repairing circuit, and the whole repairing lead is matched with the conductive lead of the position to be repaired, so that the repairing lead can be well fused together, and the repaired circuit substrate has no obvious foreign body feeling.
The conductive adhesive comprises conductive particles and an insulating adhesive material, wherein the conductive particles can enable the transparent conductive circuit and the transparent repairing circuit to be electrically connected, and the insulating adhesive material can enable the transparent repairing circuit to be fixed on the transparent conductive circuit, so that the transparent conductive circuit can be repaired. Meanwhile, the diameter of the conductive particles is small, the insulating glue material is transparent, the transparency of the circuit substrate cannot be influenced visually, and the thickness of the circuit substrate cannot be greatly influenced.
Please refer to fig. 11, which is a schematic diagram of a transparent display according to an embodiment of the invention. The transparent display screen 1000 is a flexible display screen and can be installed on glass or a wall surface with a radian. The transparent display screen 1000 includes a circuit substrate 10 and a light emitting element 20. The circuit board 10 is formed by repairing the circuit board according to the method for repairing the circuit board described in the above embodiment. Since the transparent display screen 1000 adopts all technical solutions of all the embodiments described above, at least all the beneficial effects brought by the technical solutions of the embodiments described above are achieved, and are not described in detail herein.
The light emitting element 20 is disposed on the circuit substrate 10 and electrically connected to the transparent conductive trace 11 for providing a light source required by the transparent display panel 1000 for displaying. It is understood that the transparent conductive lines 11 in the transparent display panel 1000 include transparent repair lines repaired with transparent conductive line circuits to be repaired. The light emitting assembly 20 includes a plurality of lamp beads 21 and at least one driving device 22, and the driving device 22 is used for driving the lamp beads 21 to emit light. The lamp beads 21 are LED lamp beads, and the plurality of lamp beads 31 are arranged in a matrix. The driving device 22 includes, but is not limited to, a single Chip, an Integrated Circuit Chip (IC Chip), and the like.
When the transparent conductive circuit 12 is disposed on one side of the transparent substrate 11, the light emitting assembly 20 includes a plurality of driving devices 22, and the plurality of driving devices 22 and the plurality of beads 21 are disposed in a one-to-one correspondence. The plurality of lamp beads 21 are arranged on one side of the transparent conducting wire line 12 far away from the transparent substrate 11 and are electrically connected with the transparent conducting wire line 12.
When the transparent conductive traces 12 are disposed on both sides of the transparent substrate 11, the light emitting device 20 may include one driving device 22, or may include several driving devices 22. The plurality of lamp beads 21 are arranged on one side of the transparent conducting circuits 12 on the two sides, which is far away from the transparent substrate 11, and are respectively and electrically connected with the transparent conducting circuits 12 on the two sides. When the light emitting assembly 20 includes one driving device 22, one driving device 22 is electrically connected to all of the lamp beads 21. When the light emitting assembly 20 includes a plurality of driving devices 22, each driving device 22 is disposed corresponding to the light beads 21.
In the above embodiment, the transparent conductive circuits are disposed on two sides of the transparent substrate, so as to form a transparent display screen with two sides capable of displaying pictures, so that the application scene of the transparent display screen is wider, and the practicability is higher. All lamp beads are driven by one driving device, so that the manufacturing cost can be greatly reduced. When the driving devices and the lamp beads are arranged in a one-to-one correspondence mode, each driving device drives the lamp beads to emit light independently, if one driving device breaks down, only the corresponding lamp beads cannot work normally, and other lamp beads cannot be influenced, so that the operation of the transparent display screen is effectively guaranteed. Therefore, the appropriate transparent display screen can be selected to work according to actual requirements.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, insofar as these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is intended to include these modifications and variations.
The above-mentioned embodiments are only examples of the present invention, which should not be construed as limiting the scope of the present invention, and therefore, the present invention is not limited by the claims.
Claims (10)
1. A method for repairing a circuit substrate is characterized in that the circuit substrate comprises a transparent substrate and transparent conducting circuits arranged on one side or two sides of the transparent substrate, the line width of each transparent conducting circuit is a preset value, and the method comprises the following steps:
providing a transparent repairing circuit and conductive adhesive;
laying the conductive adhesive on the position to be repaired of the transparent conductive circuit;
arranging the transparent repairing circuit on the conductive adhesive; and
and heating and pressing the transparent repairing circuit and the transparent substrate so that the conductive adhesive is electrically connected with the transparent repairing circuit and the transparent conductive circuit.
2. The method for repairing a circuit substrate according to claim 1, wherein the transparent conductive traces comprise a plurality of conductive wires, the plurality of conductive wires are regularly or irregularly arranged to form a grid, at least one conductive wire is short-circuited to form the portion to be repaired, the transparent repairing trace comprises at least one repairing wire, and the repairing wire is adapted to the conductive wire at the portion to be repaired.
3. The method for repairing a circuit substrate according to claim 2, wherein the electrically conductive wires are short-circuited to form the portion to be repaired, the transparent repair wire comprises a plurality of the repair wires, and the plurality of the repair wires are formed in the same mesh shape as the electrically conductive wires.
4. The method for repairing a circuit substrate according to claim 2, wherein the line width of the repair wire is the same as the line width of the transparent conductive line.
5. The method for repairing a circuit substrate according to claim 1, wherein the conductive paste comprises an insulating paste material and a plurality of conductive particles, and the conductive particles are capable of electrically connecting the transparent repair circuit and the transparent conductive traces.
6. The method for repairing a circuit substrate according to claim 5, wherein after heating and bonding the transparent repair circuit and the transparent substrate, the method further comprises:
and cooling the conductive adhesive to solidify the insulating adhesive material and fix the transparent repairing circuit on the transparent conductive circuit.
7. The method of repairing a circuit substrate according to claim 6, wherein the conductive adhesive is an anisotropic conductive film or an anisotropic conductive adhesive.
8. The method of repairing a circuit substrate according to claim 1, wherein the predetermined value is 1 to 2000 μm.
9. A transparent display screen, comprising:
a wiring substrate formed by repairing the wiring substrate according to any one of claims 1 to 8; and
and the light-emitting component is arranged on the circuit substrate, is electrically connected with the transparent conducting circuit and is used for providing a light source required by the display of the transparent display screen.
10. The transparent display screen of claim 9, wherein the light emitting assembly comprises a plurality of light beads and at least one driving device, and the driving device is used for driving the light beads to emit light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110856370.5A CN113594050A (en) | 2021-07-28 | 2021-07-28 | Method for repairing circuit substrate and transparent display screen |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110856370.5A CN113594050A (en) | 2021-07-28 | 2021-07-28 | Method for repairing circuit substrate and transparent display screen |
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| CN113594050A true CN113594050A (en) | 2021-11-02 |
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| CN202110856370.5A Pending CN113594050A (en) | 2021-07-28 | 2021-07-28 | Method for repairing circuit substrate and transparent display screen |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533800A (en) * | 2009-04-16 | 2009-09-16 | 友达光电股份有限公司 | A repairing method for transmission line |
| US20140353013A1 (en) * | 2013-05-30 | 2014-12-04 | Nanchang O-Film Tech Co., Ltd. | Transparent conductive film |
| KR20170021417A (en) * | 2015-08-17 | 2017-02-28 | 엔젯 주식회사 | Transparent display board applicable to large area and flexible substrate and method for manufacturing the same |
| CN113035086A (en) * | 2021-04-25 | 2021-06-25 | 深圳市蝉翼科技有限公司 | Flexible transparent LED display screen and display |
-
2021
- 2021-07-28 CN CN202110856370.5A patent/CN113594050A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533800A (en) * | 2009-04-16 | 2009-09-16 | 友达光电股份有限公司 | A repairing method for transmission line |
| US20140353013A1 (en) * | 2013-05-30 | 2014-12-04 | Nanchang O-Film Tech Co., Ltd. | Transparent conductive film |
| KR20170021417A (en) * | 2015-08-17 | 2017-02-28 | 엔젯 주식회사 | Transparent display board applicable to large area and flexible substrate and method for manufacturing the same |
| CN113035086A (en) * | 2021-04-25 | 2021-06-25 | 深圳市蝉翼科技有限公司 | Flexible transparent LED display screen and display |
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