CN113566804B - Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof - Google Patents
Four-mass optical-electromechanical three-axis gyroscope of three-dimensional photonic crystal and processing method thereof Download PDFInfo
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- CN113566804B CN113566804B CN202110638234.9A CN202110638234A CN113566804B CN 113566804 B CN113566804 B CN 113566804B CN 202110638234 A CN202110638234 A CN 202110638234A CN 113566804 B CN113566804 B CN 113566804B
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- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
Abstract
The invention discloses a four-mass optical-electromechanical three-axis gyroscope of a three-dimensional photonic crystal and a processing method thereof, wherein the gyroscope sequentially comprises a glass cap, a device layer and a glass substrate from top to bottom, and the glass cap and the glass substrate are bonded with the device layer through an anode; the device layer comprises a supporting outer frame, a central mass block positioned in the center of the supporting outer frame, four public mass blocks and a driving beam for connecting the four public mass blocks with the supporting outer frame, driving comb teeth are respectively arranged on the periphery of the central driving mass block and the upper parts and the lower parts of the four public mass blocks, the periphery of the four public mass blocks and the driving comb teeth are pulled through resonant beams, two sides of one side, close to the supporting outer frame, of the four public mass blocks are respectively connected with a Z-axis mechanical structure detection module comb tooth structure through the resonant beams, and the upper parts and the lower parts of the four public mass blocks are respectively covered with a three-dimensional photonic crystal structure layer; the invention realizes the measurement of the angular velocity of three axes in a single device and has simple structure.
Description
Technical Field
The invention relates to the fields of micro-electro-mechanical systems and inertial navigation, in particular to a four-mass optical-electro-mechanical three-axis gyroscope based on a three-dimensional photonic crystal and a processing method thereof.
Background
The Micro Electro Mechanical System (MEMS) gyroscope is a key device which is manufactured by adopting an MEMS processing technology and is used for measuring the angular velocity of the motion of an object, has the characteristics of small size, low power consumption, low cost, convenience for batch production and the like compared with the traditional inertial device, and has wide application prospects in various fields of space technology, geodetic survey, geological exploration, tunnel engineering, oil exploration, mine exploitation, ocean development, automobile industry, national defense industry and the like, so that great amounts of manpower and material resources are put into research in colleges and universities, research institutes and commercial institutions at home and abroad. At present, in the multi-flow micromechanical gyroscope on the market, the micromechanical gyroscope has poor precision and is obviously influenced by temperature and humidity, and the micromechanical gyroscope is difficult to be applied to a high-precision measurement system.
To this end, researchers have integrated various MEMS structures with micro-optical devices, and designed micro-opto-electro-mechanical (MOEMS) gyroscopes. Compared with an MEMS gyroscope for capacitance detection, the novel gyroscope inherits the advantages of small size, light weight, low cost, easy realization of system integration and batch production and the like of the MEMS gyroscope; meanwhile, an optical detection method is adopted to replace capacitance detection, so that the contradiction that the precision and the dynamic performance are difficult to consider is avoided, and the detection precision is higher; in addition, optical signals are adopted to replace electric signal detection, photoelectric separation can be achieved, and the adaptability of the MOEMS inertial device to the environments of radiation, high temperature, strong electromagnetic interference and the like is greatly improved.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects of the prior art, the invention aims to provide a four-mass optical-electromechanical three-axis gyroscope based on a three-dimensional photonic crystal and a processing method thereof.
The technical scheme is as follows: in order to realize the purpose, the invention adopts the following technical scheme:
a four-mass optical-electromechanical three-axis gyroscope based on three-dimensional photonic crystals comprises a glass cap, a device layer and a glass substrate from top to bottom in sequence, wherein the glass cap and the glass substrate are bonded with the device layer through an anode;
the device layer comprises a supporting outer frame, a central mass block positioned in the center of the supporting outer frame, four public mass blocks respectively positioned in a 0-degree position, a 90-degree position, a 180-degree position and a 270-degree position of the whole structure, and driving beams for connecting the four public mass blocks with the supporting outer frame, wherein driving comb teeth are respectively arranged on the periphery of the central driving mass block and the upper parts and the lower parts of the four public mass blocks, the periphery of the four public mass blocks and the driving comb teeth are pulled through resonant beams, two sides of one side, close to the supporting outer frame, of the four public mass blocks are respectively connected with a Z-axis mechanical structure detection module comb tooth structure through the resonant beams, and the upper parts and the lower parts of the four public mass blocks are respectively covered with a three-dimensional photonic crystal structure layer;
the glass cap is positioned right above the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass cap and used for detecting light;
the glass substrate is located under the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass substrate and used for detecting light.
Further, the outer side of each common mass block is connected with the mass block outer frame through a detection beam.
The invention also provides a method for measuring the angular velocity by using the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps:
when the four-mass optical-electromechanical three-axis gyroscope of the three-dimensional photonic crystal is stabilized in a driving mode, the four public mass blocks are driven by the driving beam to perform 'push-pull' motion, so that the capacitance in the driving comb teeth is changed, the capacitance is converted into voltage through an external circuit, and the angular velocity can be conveniently measured at any time;
when the X axis receives the angular velocity, the public mass block at the 0-degree position and the 180-degree position performs up-and-down resonant motion along the surface, and the measurement of the X axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Y axis receives the angular velocity, the public mass blocks at the 90-degree position and the 270-degree position perform up-and-down resonant motion along the surface, and the measurement of the Y axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Z axis receives the angular velocity, the four public mass blocks perform resonant motion in the plane, so that the comb tooth structure of the eight Z axis mechanical structure detection modules changes, and the angular velocity of the Z axis is obtained through measurement.
Further, the specific algorithm of the magnitude of the angular velocity is as follows:
let the angular velocity of the X-axis be omega x Angular velocity of Y-axis omega y Thus, the X-axis and Y-axis are subject to coriolis forces, respectively, of:
F cx ＝2m 1 Ω x x'+2m 2 Ω x x' (1)
F cy ＝2m 3 Ω y y'+2m 4 Ω y y' (2)
wherein m is 1 Mass of the common mass at 0 deg., m 1 Mass of the common mass at 180 DEG, m 3 Mass of a common mass at 90 DEG, m 4 Is the mass of the common mass at a position of 270 deg., x 'is the first derivative of the vector in the x direction and y' is the first derivative of the vector in the y direction;
according to the kinetic equation:
(m 1 +m 3 )x”+c x x'+k x x＝F cx (3)
(m 2 +m 4 )y”+c y y'+k y y＝F cy (4)
wherein, c x Damping coefficient, k, for the X-axis x Elastic coefficient of X-axis, c y Damping coefficient, k, for the Y-axis y The elastic coefficient of the Y axis is shown, x 'is the second derivative of the vector in the x direction, and Y' is the second derivative of the vector in the Y direction;
can be obtained from the equations (3) and (4)
Wherein B is x Is the amplitude of the X-axis and,
is the phase of the X axis, B y Amplitude of Y-axis
Is the phase of the Y axis, w x Is the vibration frequency of the X-axis, w y Is the vibration frequency of the Y axis, w d Xi X is the damping coefficient of the X-axis, xi Y is the damping coefficient of the Y-axis, t is the corresponding time, ax is the coefficient of the X-axis amplitude, ay is the coefficient of the Y-axis amplitude,
by simplification, the expression of the Coriolis force of the X axis and the Y axis can be obtained
Where Ω X is the angular velocity received on the X axis, Ω Y is the angular velocity received on the Y axis,
further, an expression of the acceleration of the Coriolis force can be obtained
By using the above formula and combining with the internal structure of the gyroscope, the relational expression of Coriolis acceleration, input angular velocity and transmittance is obtained:
wherein T is the transmittance, b 0 Is a node, E is the Young's modulus of the material, b x Width of the X-axis resonant beam, b y Width of the Y-axis resonance beam, h x Height h of the resonant beam for the X axis y Is the height of the Y-axis resonance beam, and rho is the mesoscopic press polish coefficient and is L x Length of the X-axis resonant beam, L y The length of the Y-axis resonance beam;
because the transmissivity and the angular velocity have a certain proportional relation, the magnitude of the input angular velocity can be obtained through the change of the transmissivity by substituting each parameter through the designed gyroscope.
The invention also provides a processing method of the four-mass optical-mechanical-electrical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps of:
(1) Cleaning a silicon wafer, drying, uniformly coating photoresist on the upper surface of the silicon wafer, and photoetching an anchor point position by using a No. 1 mask after curing;
(2) Processing anchor points on the upper surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(3) Cleaning the silicon wafer (1), drying, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 2 mask after curing;
(4) Processing a mechanical structure on the lower surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(5) Depositing silicon nitride on the lower surface of the silicon wafer, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 3 mask after curing;
(6) Processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(7) Depositing silicon nitride on the upper surface of the silicon chip, uniformly coating photoresist on the upper surface of the silicon chip, and photoetching the three-dimensional photonic crystal structure by using a No. 4 mask after curing;
(8) After a three-dimensional photonic crystal structure is processed on a silicon nitride structure by Reactive Ion Etching (RIE), washing off residual photoresist by using an acetone solution for developing;
(9) Taking a clean glass substrate, uniformly coating photoresist on the surface of the glass substrate, and photoetching the substrate structure by using a No. 5 mask;
(10) Carrying out anodic bonding on the glass substrate in the step (9) and the lower surface of the silicon wafer (1) in the step (6);
(11) Taking clean glass, uniformly coating photoresist on the surface of the glass, and photoetching a cap structure by using a No. 6 mask;
(12) And (5) carrying out anodic bonding on the glass substrate in the step (11) and the upper surface of the silicon wafer (1) in the step (4) to obtain the four-mass optical-mechanical-electrical three-axis gyroscope based on the three-dimensional photonic crystal.
Has the advantages that: compared with the prior art, the invention provides a novel three-axis gyroscope by utilizing the form of combining the three-dimensional photonic crystal and the mechanical structure, and the gyroscope adopts a brand-new detection mode and a single-chip integration mode and has the characteristics of small volume, high precision, wide application range and the like.
Drawings
FIG. 1 is an exploded view of a four-mass opto-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal;
FIG. 2 is a top view of a mechanical structure of a four-mass opto-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal;
FIG. 3 is an overall structure diagram of a four-mass opto-electro-mechanical triaxial gyroscope device layer based on three-dimensional photonic crystals;
FIG. 4 is a four-mass opto-electro-mechanical triaxial gyroscope glass cap based on a three-dimensional photonic crystal;
FIG. 5 is a glass substrate structure diagram of a four-mass opto-electro-mechanical triaxial gyroscope based on three-dimensional photonic crystals;
FIG. 6 is a three-dimensional photonic crystal structure diagram of a four-mass photo-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal;
FIG. 7 is a four-mass photo-electro-mechanical triaxial gyroscope light detection method based on three-dimensional photonic crystals;
FIG. 8 is a flow chart of a four-mass opto-electro-mechanical triaxial gyroscope processing based on three-dimensional photonic crystals;
the device comprises a substrate, a substrate layer and a substrate, wherein 1, the substrate comprises a glass cap, 2, the device layer and 3, and the substrate layer comprises a glass substrate; 201. the system comprises a supporting outer frame, 202, a central mass block, 203, a common mass block, 204, driving beams, 205, driving combs, 206, resonant beams, 207, a Z-axis mechanical structure detection module comb structure, 208, a three-dimensional photonic crystal structure layer, 209, a mass block outer frame, 210, detection beams, 101, 301 and light guide holes.
Detailed Description
For better understanding of the present invention, the following embodiments are provided to further explain the technical solutions of the present invention in conjunction with the accompanying drawings, but the present invention is not limited to the following embodiments. The following are only preferred embodiments of the invention, it being noted that: it will be apparent to those skilled in the art that the location of each facility can be adjusted without departing from the principles of the invention, and such adjustments should be considered within the scope of the invention.
A four-mass optical-mechanical-electrical three-axis gyroscope based on three-dimensional photonic crystals sequentially comprises a glass cap 1, a device layer 2 and a glass substrate 3 from top to bottom, wherein the glass cap, the glass substrate and the device layer are bonded through an anode;
the device layer comprises a supporting outer frame 201, a central mass block 202 located in the center of the supporting outer frame, four public mass blocks 203 located in 0-degree position, 90-degree position, 180-degree position and 270-degree position of the whole structure respectively, and a driving beam 204 connecting the four public mass blocks with the supporting outer frame, wherein driving comb teeth 205 are arranged on the periphery of the central driving mass block and on the upper portions and the lower portions of the four public mass blocks respectively, the periphery of the four public mass blocks and the driving comb teeth are pulled through a resonance beam 206, two sides of one side, close to the supporting outer frame, of the four public mass blocks are connected with a Z-axis mechanical structure detection module comb tooth structure 207 through the resonance beam respectively, and the upper portions and the lower portions of the four public mass blocks are covered with three-dimensional photonic crystal structure layers 208 respectively;
the glass cap is positioned right above the device layer, and light guide holes 101 are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass cap and used for detecting light;
the glass substrate is located under the device layer, and light guide holes 301 are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass substrate and used for detecting light.
Further, the outer side of each of said common masses is connected to the outer mass frame 209 via sensing beams 210.
The invention also provides a method for measuring the angular velocity by using the four-mass optical-mechanical-electrical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps:
when the four-mass optical-electromechanical three-axis gyroscope of the three-dimensional photonic crystal is stabilized in a driving mode, the four public mass blocks are driven by the driving beam to perform 'push-pull' motion, so that the capacitance in the driving comb teeth is changed, the capacitance is converted into voltage through an external circuit, and the angular velocity can be conveniently measured at any time; in an initial state, the three-dimensional photonic crystal structures are arranged horizontally and vertically, the distances among the spherical photonic crystals are kept consistent, the path of a light path is shown in fig. 7 (a), when an angular velocity is generated on an X axis or a Y axis, the distances among the spherical photonic crystals of the three-dimensional photonic crystal structures are changed as shown in fig. 7 (b), so that the initial light path is changed, and the angular velocity can be obtained through the change of the light path.
When the X axis receives the angular velocity, the public mass block at the 0-degree position and the 180-degree position performs up-and-down resonant motion along the surface, and the measurement of the X axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Y axis receives the angular velocity, the public mass blocks at the 90-degree position and the 270-degree position perform up-and-down resonant motion along the surface, and the measurement of the Y axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Z axis receives the angular velocity, the four public mass blocks perform resonant motion in the plane, so that the comb tooth structure of the eight Z axis mechanical structure detection modules changes, and the angular velocity of the Z axis is obtained through measurement.
Further, the specific algorithm of the magnitude of the angular velocity is as follows:
let the angular velocity of the X-axis be omega x Angular velocity of Y-axis is Ω y Thus, the X-axis and Y-axis are subject to coriolis forces, respectively, of:
F cx ＝2m 1 Ω x x'+2m 2 Ω x x' (1)
F cy ＝2m 3 Ω y y'+2m 4 Ω y y' (2)
wherein m is 1 Mass of the common mass at 0 deg., m 1 Mass of a common mass block located at 180 DEG, m 3 Mass of a common mass at 90 DEG, m 4 For the mass of the common mass at the 270 ° position, x 'is the first derivative of the x-direction vector and y' is the first derivative of the y-direction vector;
according to the kinetic equation:
(m 1 +m 3 )y”+c y y'+k y y＝F cy (3)
(m 2 +m 4 )y”+c y y'+k y y＝F cy (4)
wherein, c x Damping coefficient, k, for the X-axis x Elastic coefficient of X-axis, c y Damping coefficient, k, for the Y-axis y Is the elastic coefficient of the Y axis, x "is the second derivative of the vector in the x direction, and Y" is the second derivative of the vector in the Y direction;
can be obtained from the equations (3) and (4)
Wherein B is x Is the amplitude of the X-axis and,
is the phase of the X axis, B y Amplitude of Y-axis
Is the phase of the Y axis, w x Is the vibration frequency of the X-axis, w y Is the vibration frequency of the Y axis, w d Xi X is the damping coefficient of the X axis, xi Y is the damping coefficient of the Y axis, t is the corresponding time, ax is the coefficient of the X axis amplitude, ay is the coefficient of the Y axis amplitude,
by simplification, the expression of the Coriolis force of the X axis and the Y axis can be obtained
Where Ω X is the angular velocity received on the X-axis, Ω Y is the angular velocity received on the Y-axis,
further, an expression of the acceleration of the Coriolis force can be obtained
And (3) obtaining a relational expression of Coriolis acceleration, input angular velocity and transmissivity by utilizing the above formula and combining with the internal structure of the gyroscope:
wherein T is the transmittance, b 0 Is a node, E is the Young's modulus of the material, b x Width of the X-axis resonance beam, b y Width of the Y-axis resonance beam, h x Is the height h of the X-axis resonant beam y Is the height of the Y-axis resonance beam, and rho is the mesoscopic press polish coefficient and is L x Length of the X-axis resonant beam, L y Is the length of the Y-axis resonant beam;
because the transmissivity and the angular speed have a certain proportional relation, the magnitude of the input angular speed can be obtained through the change of the transmissivity by substituting each parameter through a designed gyroscope.
The invention also provides a processing method of the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal, which comprises the following steps:
(1) Cleaning a silicon wafer, drying, uniformly coating photoresist on the upper surface of the silicon wafer, and photoetching an anchor point position by using a No. 1 mask after curing;
(2) Processing anchor points on the upper surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(3) Cleaning the silicon wafer (1), drying, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 2 mask after curing;
(4) Processing a mechanical structure on the lower surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(5) Depositing silicon nitride on the lower surface of the silicon wafer, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 3 mask after curing;
(6) After a three-dimensional photonic crystal structure is processed on a silicon nitride structure by Reactive Ion Etching (RIE), washing off residual photoresist by using an acetone solution for developing;
(7) Depositing silicon nitride on the upper surface of the silicon chip, uniformly coating photoresist on the upper surface of the silicon chip, and photoetching the three-dimensional photonic crystal structure by using a No. 4 mask after curing;
(8) Processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(9) Taking a clean glass substrate, uniformly coating photoresist on the surface of the glass substrate, and photoetching the substrate structure by using a No. 5 mask;
(10) Carrying out anodic bonding on the glass substrate in the step (9) and the lower surface of the silicon wafer (1) in the step (6);
(11) Taking clean glass, uniformly coating photoresist on the surface of the glass, and photoetching a cap structure by using a No. 6 mask;
(12) And (3) carrying out anodic bonding on the glass substrate in the step (11) and the upper surface of the silicon wafer (1) in the step (4) to obtain the four-mass optical-electro-mechanical triaxial gyroscope based on the three-dimensional photonic crystal.
Claims (5)
1. A four-mass optical-mechanical-electrical three-axis gyroscope based on three-dimensional photonic crystals is characterized in that: the device comprises a glass cap, a device layer and a glass substrate from top to bottom in sequence, wherein the glass cap and the glass substrate are bonded with the device layer through an anode;
the device layer comprises a supporting outer frame, a central mass block positioned in the center of the supporting outer frame, four public mass blocks respectively positioned in a 0-degree position, a 90-degree position, a 180-degree position and a 270-degree position of the whole structure, and driving beams for connecting the four public mass blocks with the supporting outer frame, wherein driving comb teeth are respectively arranged on the periphery of the central driving mass block and the upper parts and the lower parts of the four public mass blocks, the periphery of the four public mass blocks and the driving comb teeth are pulled through resonant beams, two sides of one side, close to the supporting outer frame, of the four public mass blocks are respectively connected with a Z-axis mechanical structure detection module comb tooth structure through the resonant beams, and the upper parts and the lower parts of the four public mass blocks are respectively covered with a three-dimensional photonic crystal structure layer;
the glass cap is positioned right above the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass cap and used for detecting light;
the glass substrate is located under the device layer, and light guide holes are formed in the positions, corresponding to the three-dimensional photonic crystal structure layers of the public mass blocks of the device layer, of the glass substrate and used for detecting light.
2. The four-mass opto-electro-mechanical triaxial gyroscope based on a three-dimensional photonic crystal according to claim 1, wherein: the outer side of each public mass block is connected with the mass block outer frame through a detection beam.
3. A method of angular velocity measurement with the four-mass opto-electro-mechanical triaxial gyroscope based on three-dimensional photonic crystals as claimed in any of claims 1 to 2, characterized in that: the method comprises the following steps:
when the four-mass optical-electromechanical three-axis gyroscope of the three-dimensional photonic crystal is stabilized in a driving mode, the four public mass blocks are driven by the driving beam to perform 'push-pull' motion, so that the capacitance in the driving comb teeth is changed, the capacitance is converted into voltage through an external circuit, and the angular velocity can be conveniently measured at any time;
when the X axis receives the angular velocity, the public mass block at the 0-degree position and the 180-degree position performs up-and-down resonant motion along the surface, and the measurement of the X axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Y axis receives the angular velocity, the public mass blocks located at the 90-degree position and the 270-degree position do out-of-plane resonant motion, and the measurement of the Y-axis angular velocity is realized by detecting the change of light intensity at one side of the light through hole;
when the Z axis receives the angular velocity, the four public mass blocks perform resonant motion in the plane, so that the comb tooth structure of the eight Z axis mechanical structure detection modules changes, and the angular velocity of the Z axis is measured.
4. The method of angular velocity measurement of a four-mass opto-electro-mechanical tri-axial gyroscope based on three-dimensional photonic crystals as claimed in claim 3, wherein: the specific algorithm of the magnitude of the angular velocity is as follows:
let the angular velocity of the X-axis be omega x Angular velocity of Y-axis is Ω y Thus, the respective coriolis forces experienced by the X and Y axes are:
F cx ＝2m 1 Ω x x'+2m 2 Ω x x' (1)
F cy ＝2m 3 Ω y y'+2m 4 Ω y y' (2)
wherein m is 1 Mass of the common mass at 0 deg., m 1 Mass of a common mass block located at 180 DEG, m 3 Mass of a common mass at 90 DEG, m 4 Is the mass of the common mass at 270 deg. 'is the first derivative of the x-direction vector and y' is the first derivative of the y-direction vector;
according to the kinetic equation:
(m 1 +m 3 )x”+c x x'+k x x＝F cx (3)
(m 2 +m 4 )y”+c y y'+k y y＝F cy (4)
wherein, c x Damping coefficient, k, for the X-axis x Elastic coefficient of X-axis, c y Damping coefficient, k, for the Y-axis y Is the elastic coefficient of the Y axis, x 'is the second derivative of the vector in the x direction, and Y' is the second derivative of the vector in the Y direction;
can be obtained from the equations (3) and (4)
Wherein B is x Is the amplitude of the X-axis and,
is the phase of the X axis, B y Is the amplitude of the Y-axis and,
is the phase of the Y axis, w x Is the vibration frequency of the X axis, w y Is the vibration frequency of the Y axis, w d Xi X is the damping coefficient of the X axis, xi Y is the damping coefficient of the Y axis, t is the corresponding time, ax is the coefficient of the X axis amplitude, ay is the coefficient of the Y axis amplitude,
by simplification, the expression of the Coriolis force of the X axis and the Y axis can be obtained
Where Ω X is the angular velocity received on the X-axis, Ω Y is the angular velocity received on the Y-axis,
further, an expression of the acceleration of the Coriolis force can be obtained
By using the above formula and combining with the internal structure of the gyroscope, the relational expression of Coriolis acceleration, input angular velocity and transmittance is obtained:
wherein T is the transmittance, b 0 Is a node, E is the Young's modulus of the material, b x Width of the X-axis resonance beam, b y Width of the Y-axis resonance beam, h x Is the height h of the X-axis resonant beam y Is the height of the Y-axis resonant beam, and ρ is the mesoscopic press optical coefficient and is L x Length of the X-axis resonant beam, L y Is the length of the Y-axis resonant beam;
because the transmissivity and the angular speed have a certain proportional relation, the magnitude of the input angular speed can be obtained through the change of the transmissivity by substituting each parameter through a designed gyroscope.
5. The method for processing the four-mass optical-electromechanical three-axis gyroscope based on the three-dimensional photonic crystal as claimed in any one of claims 1 to 2, wherein the method comprises the following steps:
(1) Cleaning a silicon wafer, drying, uniformly coating photoresist on the upper surface of the silicon wafer, and photoetching an anchor point position by using a No. 1 mask after curing;
(2) Processing anchor points on the upper surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(3) Cleaning the silicon wafer (1), drying, uniformly coating photoresist on the lower surface of the silicon wafer (1), and after curing, photoetching a mechanical structure by using a No. 2 mask;
(4) Processing a mechanical structure on the lower surface of the silicon wafer (1) by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(5) Depositing silicon nitride on the lower surface of the silicon wafer, uniformly coating photoresist on the lower surface of the silicon wafer (1), and photoetching a mechanical structure by using a No. 3 mask after curing;
(6) Processing a three-dimensional photonic crystal structure on a silicon nitride structure by Reactive Ion Etching (RIE), and washing off residual photoresist by using an acetone solution for development;
(7) Depositing silicon nitride on the upper surface of the silicon chip, uniformly coating photoresist on the upper surface of the silicon chip, and photoetching the three-dimensional photonic crystal structure by using a No. 4 mask after curing;
(8) After a three-dimensional photonic crystal structure is processed on a silicon nitride structure by Reactive Ion Etching (RIE), washing off residual photoresist by using an acetone solution for developing;
(9) Taking a clean glass substrate, uniformly coating photoresist on the surface of the glass substrate, and photoetching the substrate structure by using a No. 5 mask;
(10) Carrying out anodic bonding on the glass substrate in the step (9) and the lower surface of the silicon wafer (1) in the step (6);
(11) Taking clean glass, uniformly coating photoresist on the surface of the glass, and photoetching a cap structure by using a No. 6 mask;
(12) And (5) carrying out anodic bonding on the glass substrate in the step (11) and the upper surface of the silicon wafer (1) in the step (4) to obtain the four-mass optical-mechanical-electrical three-axis gyroscope based on the three-dimensional photonic crystal.
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