CN113566448A - Cooling device for soft X-ray spectroscopy test - Google Patents
Cooling device for soft X-ray spectroscopy test Download PDFInfo
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- CN113566448A CN113566448A CN202110788513.3A CN202110788513A CN113566448A CN 113566448 A CN113566448 A CN 113566448A CN 202110788513 A CN202110788513 A CN 202110788513A CN 113566448 A CN113566448 A CN 113566448A
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- 238000001816 cooling Methods 0.000 title claims abstract description 89
- 238000012360 testing method Methods 0.000 title claims abstract description 27
- 238000000441 X-ray spectroscopy Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 58
- 238000005057 refrigeration Methods 0.000 claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000011065 in-situ storage Methods 0.000 abstract description 15
- 239000007788 liquid Substances 0.000 description 10
- 238000000862 absorption spectrum Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001420 photoelectron spectroscopy Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 238000002056 X-ray absorption spectroscopy Methods 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The invention relates to a cooling device for a soft X-ray spectroscopy test, which comprises a cooling module, a heat dissipation module and a control module, wherein the cooling module comprises a cooling unit and a semiconductor refrigerating piece connected with the control module, and the semiconductor refrigerating piece is positioned between the cooling unit and the heat dissipation module and embedded in the cooling unit; the control module is used for sending a refrigeration signal to the semiconductor refrigeration piece, and the semiconductor refrigeration piece is used for transmitting cold energy to the sample through the cooling unit according to the received refrigeration signal. The present invention can cool the sample under vacuum or near normal pressure (in-situ) atmosphere condition, and can provide the low temperature test condition required in soft X-ray spectroscopy test.
Description
Technical Field
The invention relates to the technical field of soft X-ray spectroscopy experimental instruments, in particular to a cooling device for soft X-ray spectroscopy tests.
Background
Traditional soft X-ray spectroscopy, including soft X-ray absorption spectroscopy, X-ray photoelectron spectroscopy devices, etc., can only work under vacuum conditions, and cannot detect the state of a sample under real conditions. In order to acquire the change of the electronic structure of the sample under the real condition, various in-situ devices are required to be introduced to realize the detection of absorption spectrum or photoelectron spectroscopy under the in-situ condition. Currently, the in-situ soft X-ray absorption spectrum is limited by small escape depth of electrons, so the in-situ soft X-ray absorption spectrum is generally based on the absorption spectrum of a fluorescence yield mode, but the surface-sensitive partial electron yield or Auger electron mode absorption spectrum is not well applied, which greatly hinders the exploration of surface information under the real condition of a sample. In recent decades, the photoelectron spectroscopy device can realize detection in an in-situ near-atmospheric gas environment along with the breakthrough of near-atmospheric technology. However, the working temperature of the existing soft X-ray spectroscopy test is usually above room temperature, while the low temperature test condition below room temperature requires the aid of a cooling device.
The low-temperature environment in the traditional ultrahigh vacuum system mainly adopts cooling media (such as water, liquid nitrogen and liquid helium) which are utilized to contact with the sample stage through a metal cold head, so that the purpose of cooling the sample is achieved. Such conventional cooling devices are generally expensive and for some test conditions that do not require too low a temperature, such devices need to be equipped with electrical heating to meet temperature control. Compared with the conventional cryogenic device of the cold head type ultrahigh vacuum system, in order to cool the sample or obtain a cooled liquid sample in an in-situ atmosphere environment, the temperature at the sample must be minimized, especially in the research of gases with high saturated vapor pressure such as water, ethanol vapor and the like, so that the low temperature and the atmosphere environment of the sample can be realized. In addition, in order to study liquid systems by soft X-ray spectroscopy, it is necessary to achieve a minimum temperature at the sample in order to condense the gas in the analysis chamber into a liquid on the sample surface, whereas if the cooling rod arrangement of a conventional ultra-high vacuum system is used, the temperature of the cold head of the sample rod is much lower than that of the sample in the in-situ atmosphere environment, so that the sample cannot be cooled or a liquid can be obtained at the sample.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a cooling device for soft X-ray spectroscopy test, which can be used for cooling a sample under an atmosphere condition in the in-situ soft X-ray test process.
The technical scheme adopted by the invention for solving the technical problems is as follows: the cooling device for the soft X-ray spectroscopy test comprises a cooling module, a heat dissipation module and a control module, wherein the cooling module comprises a cooling unit and a semiconductor refrigerating piece connected with the control module, and the semiconductor refrigerating piece is positioned between the cooling unit and the heat dissipation module and embedded in the cooling unit; the control module is used for sending a refrigeration signal to the semiconductor refrigeration piece, and the semiconductor refrigeration piece is used for transmitting cold energy to the sample through the cooling unit according to the received refrigeration signal.
The cooling unit comprises a cold end supply device and a bearing body, the cold end supply device is fixedly connected with the bearing body through a bearing pipe, the semiconductor refrigeration piece is embedded in the cold end supply device, and the semiconductor refrigeration piece transmits cold energy to a sample through the cold end supply device according to a received refrigeration signal.
The upper surface of semiconductor refrigeration piece is provided with the sheetmetal, go up the sheetmetal and be located the upper surface and the cold junction feeding device of semiconductor refrigeration piece between, it is used for transmitting the cold energy that semiconductor refrigeration piece sent to cold junction feeding device to go up the sheetmetal.
The bearing body and the bearing tube are both made of insulating materials, the insulating materials are PEEK materials or Vespel materials, and the requirements of samples needing insulation in the soft X-ray absorption spectrum testing process (such as soft X-ray absorption spectrum testing) can be met.
The lower surface of semiconductor refrigeration piece is provided with down the sheetmetal, the sheetmetal is located between semiconductor refrigeration piece's lower surface and the heat radiation module down, the sheetmetal is used for the heat energy transfer that sends the semiconductor refrigeration piece to the heat radiation module down.
The cooling module is also provided with a feedback unit connected with the control module, the feedback unit is used for collecting temperature data of the sample and sending the collected temperature data to the control module, the control module sends a refrigeration signal to the semiconductor refrigeration piece according to the received temperature data, and the semiconductor refrigeration piece transmits the cold energy to the sample through the cooling unit according to the received refrigeration signal.
The heat dissipation module is made of metal oxygen-free copper.
The cooling unit and the heat dissipation module are fixedly connected through bolts.
The cooling unit is also provided with a metal sheet for fixing the sample.
Advantageous effects
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects: the cooling device solves the problem that the cooling device cannot be used in-situ atmosphere in the soft X-ray spectroscopy test under the condition of near normal pressure (in-situ), namely, the cooling device can realize the cooling environment of a sample under the in-situ gas condition (from minus 50 ℃ to room temperature), and can form liquid on different samples under the condition of near normal pressure gas, thereby realizing the soft X-ray spectroscopy research of various solid-liquid interfaces.
Drawings
FIG. 1 is a schematic view of a cooling apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an external appearance of a cooling apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a cooling apparatus according to an embodiment of the present invention;
fig. 4 is a schematic view of a cooling apparatus according to an embodiment of the present invention in actual use.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Before describing the present invention in detail, a conventional semiconductor cooling device will be described as follows: the traditional semiconductor refrigerating piece works under atmospheric pressure, the hot end of the traditional semiconductor refrigerating piece can well transfer and release waste heat generated by the semiconductor refrigerating piece, but under the condition of nearly normal pressure (about one hundredth of atmospheric pressure), the waste heat generated by the hot end of the semiconductor refrigerating piece can not be released in time, so that the temperature of the semiconductor refrigerating piece is increased, the refrigerating effect is reduced, and even the semiconductor refrigerating piece is damaged, therefore, the problem is solved by effectively designing a heat dissipation part.
Referring to fig. 1 and 3, the present embodiment includes a cooling module, a heat dissipation module 6 and a control module, where the heat dissipation module 6 is made of metal oxygen-free copper, the heat dissipation module 6 may be matched with sample holders in various analysis systems, the cooling module is fixedly connected with the heat dissipation module 6, the cooling module includes a cooling unit and a semiconductor chilling plate 1 connected with the control module, the semiconductor chilling plate 1 is located between the cooling unit and the heat dissipation module 6 and embedded in the cooling unit, the semiconductor chilling plate 1 includes a chilling surface (a surface close to the cooling module) and a heat dissipation surface (a surface close to the heat dissipation module 6), the chilling surface is used for transferring cold energy, and the heating surface is used for transferring heat energy; the control module is used for sending a refrigeration signal to the semiconductor refrigeration piece 1, the semiconductor refrigeration piece 1 (namely the refrigeration surface of the semiconductor refrigeration piece 1) is used for transmitting cold energy to the sample 9 through the cooling unit according to the received refrigeration signal so as to realize the cooling of the sample 9, and the semiconductor refrigeration piece 1 (namely the heat dissipation surface of the semiconductor refrigeration piece 1) is also used for transmitting the sent heat energy to the heat dissipation module 6 for heat dissipation.
Further, the cooling unit comprises a cold-end supply device 2 and a carrier 3, the cold-end supply device 2 and the carrier 3 are fixedly connected through a carrier pipe 5, the semiconductor refrigeration sheet 1 is embedded in the cold-end supply device 2, and the semiconductor refrigeration sheet 1 transmits cold energy to a sample 9 through the cold-end supply device 2 according to a received refrigeration signal; the supporting body 3 and the supporting tube 5 are both made of insulating materials, the insulating materials are PEEK materials or Vespel materials, the supporting body can be used for insulating the sample 9 and the heat dissipation module 6, and the testing requirement of the soft X-ray absorption spectrum is met.
Furthermore, a feedback unit connected with the control module is further arranged on the cooling module, the feedback unit is used for collecting temperature data of the sample 9 and sending the collected temperature data to the control module, and the control module adjusts the working voltage of the semiconductor refrigerating sheet 1 according to the received temperature data so as to change the temperature.
Further, an upper metal sheet 41 is arranged on the upper surface of the semiconductor refrigeration sheet 1, the upper metal sheet 41 is located between the upper surface (i.e., the refrigeration surface) of the semiconductor refrigeration sheet 1 and the cold end supply device 2, and the upper metal sheet 41 is used for transmitting the cold energy emitted by the semiconductor refrigeration sheet 1 to the cold end supply device 2; the lower metal sheet 42 is arranged on the lower surface of the semiconductor refrigeration sheet 1, the lower metal sheet 42 is usually a metal indium sheet or a metal gold sheet, the lower metal sheet 42 is located between the lower surface (namely a heat dissipation surface) of the semiconductor refrigeration sheet 1 and the heat dissipation module 6, and the lower metal sheet 42 is used for transferring heat energy emitted by the semiconductor refrigeration sheet 1 to the heat dissipation module 6; the upper metal sheet 41 makes the semiconductor refrigeration sheet 1 and the cold end supply device 2 contact more closely, and the lower metal sheet 42 makes the semiconductor refrigeration sheet 1 and the heat dissipation module 6 contact more closely.
Further, the cooling unit and the heat dissipation module 6 are fixed by bolts 7, when a sample is placed inside the supporting body 3, in order to prevent the sample from falling off, a plurality of metal sheets 8 are obviously arranged on the upper surface of the supporting body 3 to fix the sample, and fig. 2 shows an appearance structure schematic diagram of the cooling low-temperature device after being assembled.
Referring to fig. 4, when the cooling device is actually used, the cooling device is fixed on the soft X-ray spectroscopy test sample holder through the heat dissipation module 6 (i.e., metal oxygen-free copper), the sample holder with the cooling device is connected with the cooling sample rod, the cooling sample rod is connected with the cooling machine through the inlet pipe and the outlet pipe, the cooling device is cooled through the coolant liquid circulating in the inlet pipe and the outlet pipe, the coolant in the cooling machine can be water, ethanol or ethylene glycol so as to meet different temperature intervals, the cooling device and the cooling sample rod are located in an environment cavity close to normal pressure or vacuum, and the heat dissipation of the heat dissipation module 6 can be accelerated by using the cooling machine.
Therefore, the cooling device solves the problem that the cooling device for the soft X-ray spectroscopy test under the condition of near normal pressure (in situ) cannot be used in the in situ atmosphere, namely the cooling device can realize the cooling environment of the sample under the condition of in situ gas (from minus 50 ℃ to room temperature), and can form liquid on the surfaces of different samples under the condition of near normal pressure gas.
Claims (9)
1. A cooling device used in a soft X-ray spectroscopy test is characterized by comprising a cooling module, a heat dissipation module (6) and a control module, wherein the cooling module comprises a cooling unit and a semiconductor refrigerating sheet (1) connected with the control module, and the semiconductor refrigerating sheet (1) is positioned between the cooling unit and the heat dissipation module (6) and embedded in the cooling unit; the control module is used for sending a refrigeration signal to the semiconductor refrigeration piece (1), and the semiconductor refrigeration piece (1) is used for transmitting cold energy to the sample (9) through the cooling unit according to the received refrigeration signal.
2. The cooling device for use in soft X-ray spectroscopy test according to claim 1, wherein the cooling unit comprises a cold end supply device (2) and a carrier (3), the cold end supply device (2) and the carrier (3) are fixedly connected through a carrier tube (5), the semiconductor chilling plate (1) is embedded in the cold end supply device (2), and the semiconductor chilling plate (1) transfers cold energy to the sample (9) through the cold end supply device (2) according to a received chilling signal.
3. The cooling device for use in soft X-ray spectroscopy test according to claim 2, wherein the upper surface of the semiconductor chilling plate (1) is provided with an upper metal sheet (41), the upper metal sheet (41) is located between the upper surface of the semiconductor chilling plate (1) and the cold end supply device (2), and the upper metal sheet (41) is used for transferring the cold energy emitted by the semiconductor chilling plate (1) to the cold end supply device (2).
4. The cooling device for use in soft X-ray spectroscopy tests according to claim 2, characterized in that the carrier (3) and the carrier tube (5) are both made of an insulating material, which is a PEEK material or a Vespel material.
5. The cooling device for use in soft X-ray spectroscopy test according to claim 1, wherein the lower surface of the semiconductor chilling plate (1) is provided with a lower metal sheet (42), the lower metal sheet (42) is located between the lower surface of the semiconductor chilling plate (1) and the heat dissipation module (6), and the lower metal sheet (42) is used for transferring heat energy emitted by the semiconductor chilling plate (1) to the heat dissipation module (6).
6. The cooling device for use in soft X-ray spectroscopy testing of claim 1, wherein the cooling module is further provided with a feedback unit connected to the control module, the feedback unit is configured to collect temperature data of the sample (9) and send the collected temperature data to the control module, the control module sends a cooling signal to the semiconductor chilling plate (1) according to the received temperature data, and the semiconductor chilling plate (1) transfers cooling energy to the sample (9) through the cooling unit according to the received cooling signal.
7. Cooling device for use in soft X-ray spectroscopy tests according to claim 1, characterized in that the heat sink module (6) is made of metal oxygen free copper.
8. The cooling device for use in soft X-ray spectroscopy testing according to claim 1, wherein the cooling unit and the heat sink module (6) are fixedly connected by means of bolts (7).
9. Cooling device for use in soft X-ray spectroscopy tests according to claim 1, characterized in that the cooling unit is further provided with a metal sheet (8) for fixing a sample (9).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110788513.3A CN113566448A (en) | 2021-07-13 | 2021-07-13 | Cooling device for soft X-ray spectroscopy test |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110788513.3A CN113566448A (en) | 2021-07-13 | 2021-07-13 | Cooling device for soft X-ray spectroscopy test |
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| CN106597519A (en) * | 2016-11-29 | 2017-04-26 | 华中科技大学 | Foreign particle concentration measuring system for J-TEXT Tokamak device |
| CN107807454A (en) * | 2017-12-04 | 2018-03-16 | 中国科学院上海微***与信息技术研究所 | A kind of realization device and implementation method of the quasi- Gauss collimated laser beam of Terahertz |
| CN110470595A (en) * | 2019-09-11 | 2019-11-19 | 湖北理工学院 | Material surface icing intensity on-line measurement device and icing process real-time monitoring system |
| CN111024732A (en) * | 2019-12-31 | 2020-04-17 | 安徽微宇仪器科技有限公司 | Dynamic in-situ gas phase reaction tank for soft X-ray spectroscopy experiment |
| CN213209964U (en) * | 2020-09-23 | 2021-05-14 | 中国科学院上海高等研究院 | Device for improving CCD resolution |
| CN112433188A (en) * | 2020-11-27 | 2021-03-02 | 中国科学院深圳先进技术研究院 | Cooling system for radio frequency coil and magnetic resonance imaging equipment |
| CN113533493A (en) * | 2021-05-11 | 2021-10-22 | 宣城开盛新能源科技有限公司 | Glow discharge mass spectrum high-purity gallium testing method |
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